microCETI™ supports all laser processes in microLED display manufacturing with up to several orders of magnitude higher transfer rates; multiple system orders already received

Chemnitz, Germany, May 12, 2021—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today introduced microCETI™—the first laser micromachining platform that supports all laser processes in microLED display manufacturing with the high throughput and precision, and low cost of ownership, needed for volume production requirements.

The microCETI platform is available in three different configurations, enabling cost-effective transfer, lift-off and repair of microLED devices. Its high speed enables the transfer of hundreds of millions of microLEDs per hour without having to apply mechanical forces – up to several orders of magnitude faster than other approaches – while the on-the-fly square-beam laser enables transfer of nearly any shape and size of microLED. 3D-Micromac has already received multiple system orders for the microCETI platform from leading microLED chip manufacturers in North America and Asia for laser lift-off and transfer processing.

A Promising Display Technology Enabled By Laser Micromachining
MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime and low power consumption. However, the microLED fabrication process is vastly more complex than LCD and OLED manufacturing, and faces several technical challenges that must be overcome before microLEDs can be readily available in the mass market.

Among these challenges is detaching and transferring the processed microLED chips from the donor or growth (e.g., sapphire) substrate to an intermediate substrate for subsequent testing, allowing the expensive growth substrate to be repurposed for future use. Another challenge is to quickly and precisely transfer the chips to the final glass backplane, which for a typical 4K display involving tens of millions of microLED chips could take hundreds of hours using traditional pick-and-place transfer methods. Technologies are also needed that can detect and repair/replace defective microLEDs during the manufacturing process, since a pixel yield rate of 99.9999 percent is required to produce a full-HD desktop display. The microCETI platform from 3D-Micromac supports all laser processes in microLED display manufacturing, with the ability to address precisely these challenges.

According to Uwe Wagner, CEO of 3D-Micromac, “MicroLEDs have enormous potential for future displays across a wide range of applications and end devices, including indoor and outdoor signage, smart watches, augmented and virtual reality headsets, and automotive heads-up displays. As a leader in laser micromachining, 3D-Micromac has extensive experience applying innovative laser technology to new and emerging applications to support their volume-production requirements. Our new microCETI platform provides a high-throughput, versatile and cost-effective laser micromachining process that is ideally suited for the production of microLEDs. We look forward to working with microLED device and display manufacturers to accelerate the adoption of this exciting and promising display technology.”

The microCETI platform is available in one of three configurations:
• LIFT: unique laser transfer process for nearly every microLED material and shape
• LLO: on-the-fly laser lift-off suitable for customer related microLED material
• REPAIR: Single-die-repair process at every step of the microLED production route

The microCETI platform features a high-precision UV-wavelength laser with high repetition rate and an advanced positioning system for three stages (donor stage, substrate stage and mask stage) and up to 16 axes to transfer every microLED with sub-two-micron positioning accuracy and nanometer-scale repeatability. microCETI supports donor wafer sizes ranging from 50mm (2 inches) up to 200mm (8 inches) as well as intermediate/transfer wafers and backplane substrates up to 350mm x 350mm. In addition to microLEDs, the microCETI platform is also suitable for standard LED and miniLED processing.

Product Availability and Further Information
3D-Micromac is currently accepting orders for the microCETI platform. More information on microCETI, including our latest white paper “Laser technologies for microLED production,” can be found at https://3d-micromac.com/laser-induced-forward-transfer/microceti-lift/.

About 3D-Micromac
Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

• Read more about 3D-Micromac eliminates critical process bottlenecks to microLED display manufacturing with new laser micromachining platform

ESPOO, Finland, 19th of May 2021 – Picosun Group has further optimized its PICOSUN® Sprinter ALD system processes successfully for semiconductor, display and IoT component manufacturing lines.

PICOSUN® Sprinter ALD system Al2O3 process results showed excellent thickness uniformity even at low 90 °C deposition temperature. At 300 °C temperature the results were at record-breaking level (About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
Web: www.picosun.com

• Read more about PICOSUN® Sprinter demonstrates record-breaking batch film quality

Round Rock, Texas – May 19, 2021 – Odyssey Technical Solutions, world leader in RF, DC, and microwave repairs, is pleased to announce it has been selected as partners for repair services of all QEI semiconductor products. QEI is a leader in RF delivery systems located in Williamstown, New Jersey, that has made significant gains in the semiconductor market worldwide, after many successful years within the broadcast industry. With a history spanning twenty years and nearly 100,000 successful repairs, Odyssey was the clear choice for partnership with QEI.

“To support our global systems installed base, we chose Odyssey to be our partners for repair in the US, Europe, and Asia. We, at QEI, believe this first-of-its-kind relationship was the right way to grow and support our critical customers and to meet their expectations. QEI could have chosen to set up service centers worldwide; but we preferred to work with a professional service organization like Odyssey, who could help us achieve an immediate quality repair loop worldwide,” remarked QEI representative, Scott Ivins.

Eric Nail, vice president of Odyssey added, “We are very pleased to align ourselves with QEI; as they gain design wins, we gain repair customers for the future. To establish a relationship between manufacturer and the repair process is smart business for a seamless customer experience. With our locations in Round Rock, Singapore, and our newest in Nijmegen, The Netherlands, Odyssey is well positioned to provide QEI customers the highest quality repair service worldwide.”

For more information about QEI, visit www.qei-rf.com.

For more information about Odyssey Technical Solutions, call +1.512.989.7007, email [email protected], or visit our website at www.odysseyrf.com.

Download photo and text at https://odyssey.repair/QEI-Partners.

About Odyssey Technical Solutions
Odyssey Technical Solutions’ technology center is a state-of-the-art repair facility located in Round Rock, Texas. The engineering staff consists of highly skilled professionals working in a meticulously maintained facility, specializing in RF Generators, Automatch Networks, DC Power Supplies, and Microwave Generators / Power Supplies. Odyssey’s reputation for quick turnaround times and customer satisfaction has provided it the opportunity to become involved with an array of different processes and equipment within the industry. The Odyssey team is engaged, motivated, customer focused, and current with the latest advancements in process and equipment engineering. Services include repair, refurbishment, core exchanges, process and equipment engineering, and equipment sales. Odyssey is an ISO 9001:2015 and ANSI/ESD S20.20 Certified company, and a US veteran-owned company.

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• Read more about QEI Partners with Odyssey Technical Solutions for Repair Services of Semiconductor Products

Rochester, N.Y.—May 13, 2021—Dalian Linton NC Machine Co. Ltd. has opened a more than 70,000 square meter research and design center and manufacturing base in Xishan, Wuxi, China. This comes just eight years after obtaining the exclusive license to use the Kayex brand name and becoming the one and only owner of Kayex technology. The opening of the new facility brings the annual CZ grower equipment production capacity of Linton to more than 2,000 units per year.

“Over the years, we’ve taken the proprietary Kayex technology we were entrusted with and added engineering and service expertise, supported by a strong manufacturing infrastructure and sales team,” explains Ron Kramer, director of business development for Linton. “Since taking over the Kayex brand, we have tripled in size as a company and introduced nine new models of grower, as well as several updates and retrofits. The completion of this new facility in Wuxi enables us to conduct research, design and manufacturing of our CZ process growers under one roof, expediting product delivery to customers.”

Linton’s research and development is heavily customer-driven, aimed at both the development of new machines and technologies and supporting the Kayex technology still used in the marketplace. Among the most recent releases are retrofits to support the older Kayex growers. As the sole owner of the Kayex technology, Linton is the only company able to truly develop retrofits, upgrades or replacement parts for these machines. In the past couple of years, the company has developed a targeted retrofit image processing system, as well as a more comprehensive retrofit of the legacy consoles.

The Linton facility in Wuxi represents an investment of more than $432 million U.S dollars. Saws and other wafer processing equipment continue to be manufactured in the facility in Dalian, China, for efficient production of that line as well.

Linton Crystal Technologies is the world leader in the design, development and manufacture of equipment for producing monocrystalline ingots for the semiconductor and solar industries. The company specializes in silicon and produces equipment for materials such as germanium and gallium arsenide. They also provide technical support, process engineering support and replacement parts to help clients get businesses off the ground, improve productivity and continue to innovate.

For more information about Linton Crystal Technologies, visit www.lintoncrystal.com.

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• Read more about Linton Expands in China, Offers Increased Capacity Just Eight Years After Acquiring Kayex

HAYWARD, CA May 3, 2021: Gel-Pak, a division of Delphon and leading manufacturer of protective device carrier and film products for the semiconductor and optoelectronics industries announces its collaboration with BAE Systems on an innovative new product called the Lid/Clip Super System (LCS2™).

The patent pending LCS2 product is designed to prevent thin semiconductor components from migrating out of the pockets of waffle pack chip trays during shipping and handling.

“The new LCS2 product has the potential to save semiconductor manufacturers millions of dollars in costs associated with yield loss, rework labor and RMA’s caused by die migration” said Darby Davis, VP of Sales and Marketing for Delphon.

Shipping today’s thin semiconductor die in industry standard waffle packs presents a challenge for many semiconductor manufacturers. Thin devices packaged in these chip trays have a tendency to migrate, causing costly Component-Out-Of-Pocket (COOP) damage to occur.

Together Gel-Pak and BAE Systems studied the root causes of COOP and created this unique solution. The LCS2 product, designed to work with industry standard waffle pack trays, consists of pad and interleaf materials integrated into a static dissipative gold lid along with a highly engineered single piece clip that uniformly compresses the tray and lid together to seal each waffle pack pocket. This lid/lip system has been shown to eliminate thin die migration issues.

About Gel-Pak
Founded in 1980, Gel-Pak manufactures a line of proprietary gel and elastomer based device carriers and films that offer solutions for applications where damage during handling must be avoided. The company's unique elastomer technology serves as the basis of its Gel-Box™, Gel-Tray®, Gel-Slide®, E-Film™ and patented Vacuum Release (VR) products. These products effectively immobilize devices during shipping and in-process handling. For further information on Gel-Pak's product line, please refer to the website at www.gelpak.com

About Delphon
Delphon is a materials incubator and advanced manufacturing center known for solving unique product development and manufacturing challenges. By combining unique materials and proprietary technologies in its state-of-the-art cleanroom lab, Delphon partners with customers to move ideas quickly into novel products. Its well-known brands Gel-Pak, UltraTape and TouchMark are innovators of solutions for diverse markets including semiconductors, data storage, advanced medical devices, optical, photonics, aerospace, defense, automotive and telecom. For further information regarding Delphon’s capabilities, please refer to the website at www.delphon.com

About BAE Systems
BAE Systems provides some of the world’s most advanced, technology-led defense, aerospace, and security solutions. The company employs a skilled workforce of more than 81,000 employees worldwide and has operations in 30 U.S. states. Working with customers and local partners, BAE Systems develops, engineers, manufactures, and supports products and systems to deliver military capability, protect national security and people, and keep critical information and infrastructure secure.

Video: https://www.gelpak.com/wp-content/uploads/2021/04/LCS2_Animation_No_Ren…

• Read more about Gel-Pak Collaborates with BAE Systems on Innovative Packaging Solution for Thin Semiconductor Devices

The new Beneq K.K. subsidiary is located in Yokohama and offers sales, marketing and customer support services across the country.

Yokohama, Japan – Beneq has opened a new wholly owned subsidiary in Japan. The local team consists of experienced sales, marketing and engineering professionals from semiconductor and other ALD customer markets. Beneq K.K. will act as the first point of contact for customers in Japan, and provide local field services, training, and other technical support.

In recent years Beneq saw rapidly increasingly demand for its Beneq TransformTM, C-series, and P-series equipment products and services in Japan. Manufacturers of power semiconductors, radio frequency (RF) devices, image sensors, and lithium-ion batteries find a growing number of applications using ALD. Beneq’s products are also used in coating large or complex shapes, such as semiconductor equipment parts and in optical coatings. With the addition of local presence, the company is in a stronger position than ever to serve customer needs and requirements.

“In today’s global business environment, Beneq wishes to be locally present in all key markets including Japan. Beneq understands our Japanese customers’ preference to work with companies that offer local presence and long-term commitment.” says Jukka Nieminen, President of Beneq. “After decades of business experience in Japan through representatives, Beneq is committed to staying in the Japanese market with its 100% owned subsidiary Beneq KK. The office is dedicated to serving Beneq ALD customers locally in Japan.”

About Beneq
Beneq is the home of ALD, offering a wide portfolio of equipment products and development services. Today Beneq leads the market with innovative solutions for advanced R&D (TFS 200, R2), flexible high-volume manufacturing (BENEQ TransformTM), ultra-fast high precision spatial ALD coatings (C2R), roll-to-roll thin film coating of continuous webs (Genesis ALD), and specialized batch production for thicker film stacks (P400, P800). Headquartered in Espoo, Finland Beneq is dedicated to making ALD technology accessible for researchers and enabling technology mega trends through engineered ALD materials solutions.

• Read more about Beneq expands customer operations in Japan