The IOSS WID120 Wafer ID Reader is the latest generation of advanced Wafer ID Readers. It was designed to close the gap between easy usability and highest flexibility. With up to 18 different light modes, the IOSS WID120 decodes OCR, Barcode, DataMatrix and QR-Code markings on any kind of wafer, regardless of the wafer material. Thanks to its fully automatic light control and intelligent configurations handling, the IOSS WID120 is able to tweak itself and improve your read rates drastically. The guided teaching process makes it very easy for everyone to setup the camera. Already known functions as master/slave functionality and database connection are still available with this new model. Picture export via FTP is now also possible.

• Read more about IOSS WID120 Wafer ID Reader

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, today welcomed back nine members of its Governing Council along with newly elected member Aki Fujimura, D2S’ CEO.

Simon Segars, CEO of Arm, continues as the Governing Council chair.

Returning Governing Council members who will serve a two-year term that runs through 2023:
• Dr. Aart de Geus, chairman and co-CEO of Synopsys, Inc.
• Dean Drako, president and CEO at IC Manage
• Dr. John Kibarian, president and CEO of PDF Solutions, Inc.
• Prakash Narain, president and CEO from Real Intent
• Joe Sawicki, executive vice president of Siemens EDA
• Simon Segars, CEO of Arm
• Babak Taheri, CEO/CTO of Silvaco
• Lip-Bu Tan, CEO of Cadence Design Systems
• Bob Smith, executive director of the ESD Alliance

“It’s a pleasure to welcome back members of our Governing Council and new member Aki Fujimura,” remarks Smith. “We accomplished a great many items on our goals list for the last term and I look forward to completing even more in the new term.”

The current slate of Governing Council members was elected by more than 90% of eligible members companies casting ballots during the voting period that ended May 14.

About the Electronic System Design Alliance
The ESD Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry.

Follow the ESD Alliance
www.semi.org/en/communities/esda
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

All trademarks and registered trademarks are the property of their respective owners.

• Read more about ESD Alliance Names 10-Member Governing Council to Two-Year Term

microCETI™ supports all laser processes in microLED display manufacturing with up to several orders of magnitude higher transfer rates; multiple system orders already received

Chemnitz, Germany, May 12, 2021—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today introduced microCETI™—the first laser micromachining platform that supports all laser processes in microLED display manufacturing with the high throughput and precision, and low cost of ownership, needed for volume production requirements.

The microCETI platform is available in three different configurations, enabling cost-effective transfer, lift-off and repair of microLED devices. Its high speed enables the transfer of hundreds of millions of microLEDs per hour without having to apply mechanical forces – up to several orders of magnitude faster than other approaches – while the on-the-fly square-beam laser enables transfer of nearly any shape and size of microLED. 3D-Micromac has already received multiple system orders for the microCETI platform from leading microLED chip manufacturers in North America and Asia for laser lift-off and transfer processing.

A Promising Display Technology Enabled By Laser Micromachining
MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime and low power consumption. However, the microLED fabrication process is vastly more complex than LCD and OLED manufacturing, and faces several technical challenges that must be overcome before microLEDs can be readily available in the mass market.

Among these challenges is detaching and transferring the processed microLED chips from the donor or growth (e.g., sapphire) substrate to an intermediate substrate for subsequent testing, allowing the expensive growth substrate to be repurposed for future use. Another challenge is to quickly and precisely transfer the chips to the final glass backplane, which for a typical 4K display involving tens of millions of microLED chips could take hundreds of hours using traditional pick-and-place transfer methods. Technologies are also needed that can detect and repair/replace defective microLEDs during the manufacturing process, since a pixel yield rate of 99.9999 percent is required to produce a full-HD desktop display. The microCETI platform from 3D-Micromac supports all laser processes in microLED display manufacturing, with the ability to address precisely these challenges.

According to Uwe Wagner, CEO of 3D-Micromac, “MicroLEDs have enormous potential for future displays across a wide range of applications and end devices, including indoor and outdoor signage, smart watches, augmented and virtual reality headsets, and automotive heads-up displays. As a leader in laser micromachining, 3D-Micromac has extensive experience applying innovative laser technology to new and emerging applications to support their volume-production requirements. Our new microCETI platform provides a high-throughput, versatile and cost-effective laser micromachining process that is ideally suited for the production of microLEDs. We look forward to working with microLED device and display manufacturers to accelerate the adoption of this exciting and promising display technology.”

The microCETI platform is available in one of three configurations:
• LIFT: unique laser transfer process for nearly every microLED material and shape
• LLO: on-the-fly laser lift-off suitable for customer related microLED material
• REPAIR: Single-die-repair process at every step of the microLED production route

The microCETI platform features a high-precision UV-wavelength laser with high repetition rate and an advanced positioning system for three stages (donor stage, substrate stage and mask stage) and up to 16 axes to transfer every microLED with sub-two-micron positioning accuracy and nanometer-scale repeatability. microCETI supports donor wafer sizes ranging from 50mm (2 inches) up to 200mm (8 inches) as well as intermediate/transfer wafers and backplane substrates up to 350mm x 350mm. In addition to microLEDs, the microCETI platform is also suitable for standard LED and miniLED processing.

Product Availability and Further Information
3D-Micromac is currently accepting orders for the microCETI platform. More information on microCETI, including our latest white paper “Laser technologies for microLED production,” can be found at https://3d-micromac.com/laser-induced-forward-transfer/microceti-lift/.

About 3D-Micromac
Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

• Read more about 3D-Micromac eliminates critical process bottlenecks to microLED display manufacturing with new laser micromachining platform

ESPOO, Finland, 19th of May 2021 – Picosun Group has further optimized its PICOSUN® Sprinter ALD system processes successfully for semiconductor, display and IoT component manufacturing lines.

PICOSUN® Sprinter ALD system Al2O3 process results showed excellent thickness uniformity even at low 90 °C deposition temperature. At 300 °C temperature the results were at record-breaking level (About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
Web: www.picosun.com

• Read more about PICOSUN® Sprinter demonstrates record-breaking batch film quality

Round Rock, Texas – May 19, 2021 – Odyssey Technical Solutions, world leader in RF, DC, and microwave repairs, is pleased to announce it has been selected as partners for repair services of all QEI semiconductor products. QEI is a leader in RF delivery systems located in Williamstown, New Jersey, that has made significant gains in the semiconductor market worldwide, after many successful years within the broadcast industry. With a history spanning twenty years and nearly 100,000 successful repairs, Odyssey was the clear choice for partnership with QEI.

“To support our global systems installed base, we chose Odyssey to be our partners for repair in the US, Europe, and Asia. We, at QEI, believe this first-of-its-kind relationship was the right way to grow and support our critical customers and to meet their expectations. QEI could have chosen to set up service centers worldwide; but we preferred to work with a professional service organization like Odyssey, who could help us achieve an immediate quality repair loop worldwide,” remarked QEI representative, Scott Ivins.

Eric Nail, vice president of Odyssey added, “We are very pleased to align ourselves with QEI; as they gain design wins, we gain repair customers for the future. To establish a relationship between manufacturer and the repair process is smart business for a seamless customer experience. With our locations in Round Rock, Singapore, and our newest in Nijmegen, The Netherlands, Odyssey is well positioned to provide QEI customers the highest quality repair service worldwide.”

For more information about QEI, visit www.qei-rf.com.

For more information about Odyssey Technical Solutions, call +1.512.989.7007, email [email protected], or visit our website at www.odysseyrf.com.

Download photo and text at https://odyssey.repair/QEI-Partners.

About Odyssey Technical Solutions
Odyssey Technical Solutions’ technology center is a state-of-the-art repair facility located in Round Rock, Texas. The engineering staff consists of highly skilled professionals working in a meticulously maintained facility, specializing in RF Generators, Automatch Networks, DC Power Supplies, and Microwave Generators / Power Supplies. Odyssey’s reputation for quick turnaround times and customer satisfaction has provided it the opportunity to become involved with an array of different processes and equipment within the industry. The Odyssey team is engaged, motivated, customer focused, and current with the latest advancements in process and equipment engineering. Services include repair, refurbishment, core exchanges, process and equipment engineering, and equipment sales. Odyssey is an ISO 9001:2015 and ANSI/ESD S20.20 Certified company, and a US veteran-owned company.

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• Read more about QEI Partners with Odyssey Technical Solutions for Repair Services of Semiconductor Products

Rochester, N.Y.—May 13, 2021—Dalian Linton NC Machine Co. Ltd. has opened a more than 70,000 square meter research and design center and manufacturing base in Xishan, Wuxi, China. This comes just eight years after obtaining the exclusive license to use the Kayex brand name and becoming the one and only owner of Kayex technology. The opening of the new facility brings the annual CZ grower equipment production capacity of Linton to more than 2,000 units per year.

“Over the years, we’ve taken the proprietary Kayex technology we were entrusted with and added engineering and service expertise, supported by a strong manufacturing infrastructure and sales team,” explains Ron Kramer, director of business development for Linton. “Since taking over the Kayex brand, we have tripled in size as a company and introduced nine new models of grower, as well as several updates and retrofits. The completion of this new facility in Wuxi enables us to conduct research, design and manufacturing of our CZ process growers under one roof, expediting product delivery to customers.”

Linton’s research and development is heavily customer-driven, aimed at both the development of new machines and technologies and supporting the Kayex technology still used in the marketplace. Among the most recent releases are retrofits to support the older Kayex growers. As the sole owner of the Kayex technology, Linton is the only company able to truly develop retrofits, upgrades or replacement parts for these machines. In the past couple of years, the company has developed a targeted retrofit image processing system, as well as a more comprehensive retrofit of the legacy consoles.

The Linton facility in Wuxi represents an investment of more than $432 million U.S dollars. Saws and other wafer processing equipment continue to be manufactured in the facility in Dalian, China, for efficient production of that line as well.

Linton Crystal Technologies is the world leader in the design, development and manufacture of equipment for producing monocrystalline ingots for the semiconductor and solar industries. The company specializes in silicon and produces equipment for materials such as germanium and gallium arsenide. They also provide technical support, process engineering support and replacement parts to help clients get businesses off the ground, improve productivity and continue to innovate.

For more information about Linton Crystal Technologies, visit www.lintoncrystal.com.

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• Read more about Linton Expands in China, Offers Increased Capacity Just Eight Years After Acquiring Kayex