MILPITAS, Calif. – April 1, 2021 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the inclusion of initiatives to strengthen U.S. semiconductor manufacturing and research and calls for investment in the Biden Administration’s American Jobs Plan. In addition to calling on Congress to invest $50 billion in semiconductor manufacturing and research, in line with the bipartisan CHIPS for America Act, the plan lists semiconductors as a field of focus in its call for an investment of another $50 billion in the National Science Foundation (NSF).

“Reversing the 50% decline in the U.S. share of semiconductor manufacturing capacity over the past 20 years requires bold action, and the Biden administration’s support for significant funding to bolster the industry in its American Jobs Plan is an important step forward,” said Ajit Manocha, SEMI president and CEO. “Funding the authorized CHIPS For America Act provisions and enacting an investment tax credit to support investment in the U.S. semiconductor supply chain will make the United States a globally competitive location for new semiconductor facilities. The plan’s focus on addressing workforce development in the industry is encouraging as well, as the competition for talent is intensifying to support projected growth.”

About SEMI 

SEMI^® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Applauds Initiatives to Bolster Semiconductor Manufacturing and Research in American Jobs Plan

The first approvals for Corona vaccines were granted late last year. Worldwide, vaccination of people against the virus began. Currently, 552 million people all over the world have already been vaccinated (source: www.ourworldindata.org, figures as of March 28, 2021). Vacuum technology is also needed to produce and transport the vaccines. Cooling the vaccines, for example, plays an essential role in global distribution. A customer of Busch Vacuum Solutions manufactures special vaccine refrigerators and temperature-controlled transport boxes for vaccines. And is thus making an important contribution to the global fight against the pandemic.

In contrast to conventional vaccines, the logistics of Corona vaccines present a whole new challenge. The first approved vaccine comes from the German pharmaceutical company BioNTech and its American partner company Pfizer. To cool this vaccine, conventional refrigerators, such as those used for flu vaccines, are not sufficient. The Corona vaccine must be stored and transported at minus 70 degrees Celsius. So that it retains its full effectiveness.

In building the special refrigeration units, the Belgian company relies entirely on vacuum technology from Busch Vacuum Solutions. Vacuum is used to fill the cooling circuits of the refrigeration units with special gases. Due to the worldwide pandemic, the demand for these cooling units has risen sharply in recent months, and Busch was able to meet the expanded requirements by supplying additional vacuum pumps. These cooling units and transport equipment are sold worldwide and are used in the distribution of the vaccine around the globe. An essential product to ensure that the COVID-19 vaccine reaches vaccination centers intact and patients worldwide can receive the much-needed vaccination.

• Read more about Vacuum technology enables optimum cooling of Corona vaccines

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that it has received a volume purchase order for the VertaCure™ XP from Taiwan-based OSAT Powertech Technology, Inc. The systems, which will be utilized for flip chip and wafer-level-packaging in high volume manufacturing, will be delivered in the first half of 2021 to address growing production demands.

“In addition to the throughput benefits, excellent particle performance and complete, reliable curing that PTI can expect to achieve by using the YES vacuum process, these VertaCure XP systems will allow PTI to develop new applications that broaden the range of solutions they can offer to their customers,” explained Alex Chow, Asia Sales President & General Manager at YES. “As advanced packaging technology requirements evolve, OSATs will continue to play an important role in the supply chain,” Chow continued. “This major win further confirms YES’s ability to deliver operational flexibility, technology leadership and highest economic value for customers.”

“We are excited to partner with PTI to provide the consumer electronic market with new technologies that make products smaller and smarter,” added Rezwan Lateef, President of YES. “As the advanced packaging market continues to expand, YES remains focused on being the preferred supplier of material modification and surface enhancement solutions.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred supplier of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

• Read more about YES Secures VertaCure™ XP Volume Purchase Order from Powertech Technology Inc.

ESPOO, Finland, 30th of March 2021 – Picosun Group reports strong growth and a positive operating profit from its fiscal year 1.1.2020-31.12.2020.

Fiscal year 2020 in short*
• Order intake grew by 48,4% and was €40,9M (€27,5M)
• Turnover grew by 38,6% and was €37,6M (€27,1M)
• Operating profit was €0,9M (€-0,3M), which is 2,5% (-1,1%) of the turnover

A bigger portion of the new order intake and turnover, compared to previous years, consisted of sales of machines meant for production in the industry and medical sector. The growth was especially strong in Asia and Europe. Service business represented 16% (12%) of 2020 order intake.

“Despite the COVID-19 challenges we were able to continue on our growth path as planned. The pandemic led to increased investments in the medical sector. Also, remote work and the increased interest in entertainment applications grew the demand of production machines in electronics and semiconductor industries”, states Jussi Rautee, CEO of Picosun Group.

New investments in medical industry

Picosun has been involved in product development for the medical sector for some time. Protecting for example medical implants with ALD from the corrosive environment of the human body, and vice versa, is of utmost importance considering the safety, correct operation, and lifetime of the implant.

The company established a new business area, PicoMedical, in response to the increased interest and needs of the medical and healthcare ALD segments. PicoMedical’s order intake in 2020 constituted 10% of the company’s new order intake.

”We in Picosun believe that ALD will disrupt the medical industry the same way it did in the semiconductor industry. Our aim is to be the forerunner in this development”, says Jussi Rautee.

Almost a fifth of company’s turnover to research and development

During 2020 Picosun Group continued investing in its R&D functions. The company invested 18% of its turnover to various research and development activities. During 2020 Picosun filed 16 new patent applications at the European Patent Office, and 34 patent applications in various countries were granted to Picosun.

The company brought a number of significant new products to the semiconductor market. PICOSUN® Sprinter, a high throughput ALD production module for 300 mm wafers, was launched late 2020. PICOSUN® Morpher product family, designed for 200 mm wafers, grew with Morpher P (PE-ALD). For easy, intuitive and user-friendly operations of the whole PICOSUN® ALD cluster, the company launched its unified control software PicoOS™.

“Our commitment to meet our customers’ needs proactively and ensuring their future success resulted in the development work and launches that took place in 2020. This is part of ongoing work that we are continuing this year. We are also further developing ways to be in contact with our customers. Last year we took into use the leading remote support tools, taking advantage of e.g. augmented reality, that allow safe and on-time service delivery no matter the physical location of the customer”, says Jussi Rautee.

*Numbers in the brackets are 2019 non-audited consolidated numbers based on management reports.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:

Mr. Kustaa Poutiainen
Chairman of the Board
Tel: +358 400 424 506
Email: [email protected]

Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]

• Read more about Picosun Group demonstrates strong growth in 2020

BERLIN, Germany ─ March 30, 2021 ─ SEMI today announced its participation as an industry expert in a study by researchers in Coventry University’s Institute for Future Transport and Cities’ (IFTC) Systems Security Group (SSG) to examine drivers of computer hardware security adoption among businesses and consumers.

The UK government’s Economic and Social Research Council (ESRC)-funded Discribe (Digital Security by Design Social Science) Hub awarded SSG more than £100,000 last year for the project. Discribe aims to broaden the deployment of cybersecurity technology and help protect economies worldwide against cyberattacks. TechWorks, UK’s Deep Tech Hub, will also serve as an industry expert body in the project.

“With hardware security critically important to semiconductor innovation, SEMI is pleased to partner with the SSG team on this initiative,” said Laith Altimime, president of SEMI Europe. “The SSG cybersecurity project promises to arm the electronics value chain with best practices it can follow to strengthen the security of electronics.”

Professor Siraj Shaikh, Director of Research at IFTC and leader of SSG, will oversee the project with support by co-investigators Dr. Simon Parkin of TU Delft (Netherlands) and Dr. Muhammad Azmat of Aston University (UK). The project will promote commercial adoption of secure technology by identifying the greatest costs to businesses and understanding the reasons businesses choose not to implement cybersecurity. The findings promise to shed light on cybersecurity vulnerabilities for technology manufacturers, enabling them to better address security gaps in future designs.

“IFTC is committed to Discribe’s goal of mass adoption of cybersecurity by technology providers,” Shaikh said. “Digital security is vital to driving innovation in mobility and artificial intelligence (AI). We look forward to working to build public trust in these technologies to help ensure their widespread adoption.”

About Institute for Future Transport and Cities (IFTC)
The Institute for Future Transport and Cities develops pioneering mobility solutions. From accelerating the progression towards zero-carbon transport and developing inclusive design practices to ensuring the safe implementation of autonomous transport solutions, IFTC is central to solving global mobility challenges. IFTC works closely with industry to ensure that its research has real-world applications, maintaining close relationships with leading businesses within the transport sector.

About IFTC’s Systems Security Group (SSG)
The Group’s core mission is to research and engineer secure and resilient cyber-physical systems for the automotive and transport industry, working in collaboration with partners in industry, academia, and government. The SSG does this by detecting and modelling emerging threats, validating novel solutions for automotive security and resilience.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]
www.semi.org/eu

• Read more about SEMI Joins UK Initiative to Promote Cybersecurity Adoption

Pawtucket, RI, USA – Technic has announced the newest addition to its Semcon line of equipment for wafer-level deposition. The Semcon® Fountain is the latest development in the highly successful Semcon series of wafer plating tools by Technic. Expanding on the popularity of the Semcon 1000 for single wafer R&D processing and small-scale production, the Semcon Fountain offers additional options and features. One significant feature is a chamber design with a solution sparger that more closely resembles a full-scale production tool. The Semcon Fountain’s unique design orients the wafer in a more favorable horizontal position, mimicking most of the semiconductor mass production electroplating tools.

The Semcon Fountain is capable of processing wafers up to 300 mm and utilizes a variety of wafer “cups” for different size wafers. The Semcon Fountain can achieve optimum processing for each application by adjusting the sparger, solution flow, and shielding. Each diameter-different cup allows for maximum tool flexibility by being able to run different wafer sizes using a single plating cell, making it extremely versatile and economical. The Semcon Fountain is ideal when setting up an electroplating process for the first time, or when introducing a new metal plating bath to an already existing electroplating process.

“We could not be happier with the performance and versatility of the Semcon Fountain. We are currently operating in several locations including our R&D labs in Asia and the US for customer evaluations. The Semcon Fountain has performed with excellent results on a variety of substrates including Si, GaAs, InP, and others.”

- Anthony Gallegos
Technic Global Product Manager for Semiconductor Technology

Learn more about Technic Semiconductor products at https://www.technic.com/applications/semiconductor/semiconductor-electr… or contact us at (401) 781-6100

About Technic
For over 75 years, Technic has been a global supplier of specialty chemicals, custom finishing equipment, engineered powders, and analytical control systems to the semiconductor, electronic component, printed circuit board, industrial finishing, and decorative industries. Technic is also a major supplier of engineered metal powders to the solar industry.

• Read more about Technic announces new flexible R&D wafer plater that closely resembles a full-scale production tool

ClassOne Technology, global provider of advanced semiconductor plating tools, announced the sale of a second Solstice® S8 system to i3 Microsystems (i3M), a wholly-owned subsidiary of defense industry supplier i3 Electronics headquartered in Binghamton, NY. The eight-chambered Solstice S8 configuration includes ClassOne’s proprietary CopperMax™ chamber for advanced copper plating. The announcement was made jointly by ClassOne CEO, Byron Exarcos, and i3 VP/General Manager, Robert Nead.

"We brought in the first Solstice S8 to replace our wet benches and automate our plating processes,” said Nead. “And the tool’s high performance and flexibility have served us extremely well. With eight chambers, the Solstice is able to handle both plating and surface preparation processes. We’re now adding solvent strip and UBM etch capabilities to our first Solstice, and we are configuring our second Solstice to match. Bottom line, we've been very pleased with the Solstice and also with ClassOne's customer service, both of which are strongly supporting our ongoing growth.”

“A key feature of i3M’s Solstice S8 configuration is that it includes our proprietary CopperMax™ electroplating chamber,” said Exarcos. “This unique chamber is designed to deliver class-leading copper plating quality while at the same time reducing plating consumables costs. It gives users the ability to routinely achieve exceptional levels of copper plating feature quality and also cut copper chemistry additives costs by as much as 95%.

Solstice presently serves many of the world’s leading defense contractors and is emerging as the electroplating and wafer surface preparation system of choice for meeting the exacting requirements of the defense and aerospace industries.

The ClassOne Solstice S8 is an eight-chambered system for high-performance, fully-automated electroplating and surface preparation. The Solstice platform also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, the tool’s unique Plating-Plus™ capability also enables it to handle many surface preparation functions, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility serves to streamline process production and can reduce the number of different tools a user needs to purchase.

• Read more about Defense Industry Supplier i3 Microsystems Places Repeat Order for ClassOne’s Solstice Electroplating System

SANTA ROSA, Calif., – March 23, 2021 – PNI Sensor, the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications, has announced new Dismounted Soldier Tracking (DST) technology that determines a soldier’s precise location, even when GPS is compromised or denied.

PNI has spent seven years of internal research and development perfecting the highest-accuracy, lowest-power sensor fusion algorithms for wearables and smartphones. DST is the result of this combined expertise. DST location technology stays accurate over time and through a wide range of conditions, so its data can be trusted to deliver precise results in mission-critical scenarios.

Ubiquitous Tracking - PNI’s advanced DST inertial tracking technology provides unparalleled accuracy and offers step-by-step tracking for soldiers, both indoors and outdoors.

Unmatched Direction of Motion - DST technology determines direction of motion independent of the soldier’s body pose or dynamic movement in any direction (forward, backward, sideways).

Self-contained - No additional infrastructure required and optimized for low size, weight, power, and cost (SWaP-C). The DST module can be body worn.

“PNI has operated in the soldier-portable domain for more than thirty years and our compass technology is used in U.S. Army laser rangefinders, enhanced night vision goggles, and other mission critical applications that require high accuracy, consistency and reliability in the field,” said Robin Stoecker, vice president of sales and marketing at PNI Sensor. “We are committed to delivering world-class positioning, navigation and timing capabilities that enhance combat overmatch for modern warfighters.”

Evaluation Kit Availability
DST technology is made in the U.S.A, ITAR-free, and fully customizable to mission specifications. Engineering samples are available now. To purchase a DST evaluation kit, please contact PNI Sales or your regional PNI representative.
For product specifications and more information, visit Dismounted Soldier Tracking.

About PNI Sensor
With over 30 years of experience, PNI is the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications. PNI’s sensors and algorithms serve as the cornerstone of successful IoT projects and other mission-critical applications where pinpoint location, accuracy, and low power consumption are essential. Building on decades of patented sensor and algorithm development, PNI offers the industry’s highest-performance geomagnetic sensor in its class, location and motion coprocessors, high-performance modules, sensor fusion algorithms, and complete sensor systems. To learn more, please visit www.pnicorp.com.

• Read more about PNI Sensor’s New Dismounted Soldier Tracking Technology Provides Precise Location in GPS-denied Environments

ESPOO, Finland, 22nd of March 2021 – During the past year, organizations worldwide have been forced to adapt to new ways of working and serving their customers due to the covid-19 pandemic and the related restrictions to travel and logistics. Picosun Group has significantly reinforced its local service units globally and established its PicoSupport™ Center.

PicoSupport™ Center provides on-site support and planned service items such as ALD system installations and preventive maintenance visits conducted by highly experienced, trained and certified field service engineers. It also takes care of customers’ Helpdesk and Emergency Service operations.

At the core of PicoSupport™ Center’s Helpdesk are state-of-the-art remote support tools taking advantage of augmented/mixed reality, live video, screensharing and remote connection applications. In accordance with Industry 4.0, these tools allow safe and on-time service delivery no matter the physical location or time zone of the customer. They also offer an endlessly upgradeable platform for further embedding of e.g. remote training and e-learning modules with full virtual reality environments.

Today, the remote support tools are already widely implemented in Picosun’s customer base. The remote applications are used for a number of services ranging from system inspections and troubleshooting to software upgrades, bug fixes and process optimizations.

“I’m very proud to say that we have been able to adapt to the changing environment by employing new ways of interaction to ensure continued customer satisfaction. The feedback on the new remote support applications has been very positive. Customers find them easy to use and have benefitted from them in terms of faster reaction times and lower costs compared to traditional on-site services,” says Timo Malinen, VP, Service Business Area of Picosun Group.

“As our customers’ trusted strategic ALD partner we are committed to top-notch and uninterrupted services, despite of the changes in the world we operate in. We are looking forward to further enhance and develop the ways with which we can ensure smooth and trouble-free operations together with our customers,” Malinen concludes.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Timo Malinen
VP, Service Business Area, Picosun Group
Tel: +358 40 5011860
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun trusts in augmented reality for refined customer support