ClassOne Technology, global provider of advanced semiconductor plating tools, announced the sale of a second Solstice® S8 system to i3 Microsystems (i3M), a wholly-owned subsidiary of defense industry supplier i3 Electronics headquartered in Binghamton, NY. The eight-chambered Solstice S8 configuration includes ClassOne’s proprietary CopperMax™ chamber for advanced copper plating. The announcement was made jointly by ClassOne CEO, Byron Exarcos, and i3 VP/General Manager, Robert Nead.

"We brought in the first Solstice S8 to replace our wet benches and automate our plating processes,” said Nead. “And the tool’s high performance and flexibility have served us extremely well. With eight chambers, the Solstice is able to handle both plating and surface preparation processes. We’re now adding solvent strip and UBM etch capabilities to our first Solstice, and we are configuring our second Solstice to match. Bottom line, we've been very pleased with the Solstice and also with ClassOne's customer service, both of which are strongly supporting our ongoing growth.”

“A key feature of i3M’s Solstice S8 configuration is that it includes our proprietary CopperMax™ electroplating chamber,” said Exarcos. “This unique chamber is designed to deliver class-leading copper plating quality while at the same time reducing plating consumables costs. It gives users the ability to routinely achieve exceptional levels of copper plating feature quality and also cut copper chemistry additives costs by as much as 95%.

Solstice presently serves many of the world’s leading defense contractors and is emerging as the electroplating and wafer surface preparation system of choice for meeting the exacting requirements of the defense and aerospace industries.

The ClassOne Solstice S8 is an eight-chambered system for high-performance, fully-automated electroplating and surface preparation. The Solstice platform also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, the tool’s unique Plating-Plus™ capability also enables it to handle many surface preparation functions, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility serves to streamline process production and can reduce the number of different tools a user needs to purchase.

• Read more about Defense Industry Supplier i3 Microsystems Places Repeat Order for ClassOne’s Solstice Electroplating System

SANTA ROSA, Calif., – March 23, 2021 – PNI Sensor, the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications, has announced new Dismounted Soldier Tracking (DST) technology that determines a soldier’s precise location, even when GPS is compromised or denied.

PNI has spent seven years of internal research and development perfecting the highest-accuracy, lowest-power sensor fusion algorithms for wearables and smartphones. DST is the result of this combined expertise. DST location technology stays accurate over time and through a wide range of conditions, so its data can be trusted to deliver precise results in mission-critical scenarios.

Ubiquitous Tracking - PNI’s advanced DST inertial tracking technology provides unparalleled accuracy and offers step-by-step tracking for soldiers, both indoors and outdoors.

Unmatched Direction of Motion - DST technology determines direction of motion independent of the soldier’s body pose or dynamic movement in any direction (forward, backward, sideways).

Self-contained - No additional infrastructure required and optimized for low size, weight, power, and cost (SWaP-C). The DST module can be body worn.

“PNI has operated in the soldier-portable domain for more than thirty years and our compass technology is used in U.S. Army laser rangefinders, enhanced night vision goggles, and other mission critical applications that require high accuracy, consistency and reliability in the field,” said Robin Stoecker, vice president of sales and marketing at PNI Sensor. “We are committed to delivering world-class positioning, navigation and timing capabilities that enhance combat overmatch for modern warfighters.”

Evaluation Kit Availability
DST technology is made in the U.S.A, ITAR-free, and fully customizable to mission specifications. Engineering samples are available now. To purchase a DST evaluation kit, please contact PNI Sales or your regional PNI representative.
For product specifications and more information, visit Dismounted Soldier Tracking.

About PNI Sensor
With over 30 years of experience, PNI is the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications. PNI’s sensors and algorithms serve as the cornerstone of successful IoT projects and other mission-critical applications where pinpoint location, accuracy, and low power consumption are essential. Building on decades of patented sensor and algorithm development, PNI offers the industry’s highest-performance geomagnetic sensor in its class, location and motion coprocessors, high-performance modules, sensor fusion algorithms, and complete sensor systems. To learn more, please visit www.pnicorp.com.

• Read more about PNI Sensor’s New Dismounted Soldier Tracking Technology Provides Precise Location in GPS-denied Environments

ESPOO, Finland, 22nd of March 2021 – During the past year, organizations worldwide have been forced to adapt to new ways of working and serving their customers due to the covid-19 pandemic and the related restrictions to travel and logistics. Picosun Group has significantly reinforced its local service units globally and established its PicoSupport™ Center.

PicoSupport™ Center provides on-site support and planned service items such as ALD system installations and preventive maintenance visits conducted by highly experienced, trained and certified field service engineers. It also takes care of customers’ Helpdesk and Emergency Service operations.

At the core of PicoSupport™ Center’s Helpdesk are state-of-the-art remote support tools taking advantage of augmented/mixed reality, live video, screensharing and remote connection applications. In accordance with Industry 4.0, these tools allow safe and on-time service delivery no matter the physical location or time zone of the customer. They also offer an endlessly upgradeable platform for further embedding of e.g. remote training and e-learning modules with full virtual reality environments.

Today, the remote support tools are already widely implemented in Picosun’s customer base. The remote applications are used for a number of services ranging from system inspections and troubleshooting to software upgrades, bug fixes and process optimizations.

“I’m very proud to say that we have been able to adapt to the changing environment by employing new ways of interaction to ensure continued customer satisfaction. The feedback on the new remote support applications has been very positive. Customers find them easy to use and have benefitted from them in terms of faster reaction times and lower costs compared to traditional on-site services,” says Timo Malinen, VP, Service Business Area of Picosun Group.

“As our customers’ trusted strategic ALD partner we are committed to top-notch and uninterrupted services, despite of the changes in the world we operate in. We are looking forward to further enhance and develop the ways with which we can ensure smooth and trouble-free operations together with our customers,” Malinen concludes.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Timo Malinen
VP, Service Business Area, Picosun Group
Tel: +358 40 5011860
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun trusts in augmented reality for refined customer support

Monozukuri Technologies, the first EDA company to market a proven IC/package co-design tool today became the newest member of the Electronic System Design Alliance, a SEMI Technology Community.

Founded in 2015, Monozukuri –– the Japanese word for “making things” –– specializes in IC, packaging and EDA solutions. Its GENIOTM IC and Package Co-Design Tool manages the I/O planning and optimization phase of physical implementation of complex 2.5D and 3D ICs, including floor planning, I/O planning and end-to-end interconnect planning combined with cross-hierarchical pathfinding optimization.

“Becoming a member of the ESD Alliance is an imperative for any company providing tools to EDA and system design,” notes Monozukuri’s Founder and CEO Anna Fontanelli. “As a member, we’ll participate in industry events and ESD Alliance initiatives, network with peers and gain valuable into market dynamics.”

“A warm welcome to Monozukuri, a company widely viewed as a European innovator that is led by an experienced female entrepreneur,” says Bob Smith, executive director of the ESD Alliance. “It is great to see companies like Monozukuri coming to market with new EDA innovations. We fully expect it to become a notable member of the semiconductor and electronic system design community.”

By joining the ESD Alliance, a SEMI Technology Community, Monozukuri also becomes a member of SEMI, the global industry association.

About Monozukuri
Monozukuri’s mission is to conquer 2.5D and 3D design challenges for next-generation electronic products by delivering innovative, groundbreaking EDA software solutions and methodologies. The GENIO™ technology was developed under the H2020 HIPER project. HIPER redefines the co-design of heterogeneous microelectronic systems by providing an improved level of automation in three-dimensional interconnect optimization. For a more information, go to www.monozukuri.eu.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow the ESD Alliance:
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

• Read more about Monozukuri Joins ESD Alliance

Carlsbad, CA, USA – Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, are pleased to announce they will showcase many new dispensing, conformal coating, selective soldering, and surface treatment products and technologies at two events: Productronica China (Hall E6 booth #6202) and SEMICON China (Hall N4, booth #4022), both held at the Shanghai New International Expo Centre, Shanghai, China, March 17 – 20, 2021.

Nordson Electronics Solutions product lines for printed circuit board assembly are on exhibit at Productronica China, including:
• Conformal Coating - ASYMTEK Panorama™ R-Line, featuring Select Coat® SL-940 and FX-940UV Inspection system. This line provides flexibility and convenience to manufacturers who are transitioning to an automated conformal coating process.
• Fluid Dispensing – Two ASYMTEK platforms and one new valve family are featured at this show. The new Forte™ MAX System demonstrates dual-jet dispensing with two IntelliJet® jet valves including real-time skew correction - ideal for multi-up, panelized or patterned parts. The award-winning Spectrum™ II dispensing system performs tilt jetting for dispensing accurately into hard-to-reach areas. Also featured is the new Vortik® Progressive Cavity Pump for two-component fluids, which utilizes the award-winning ARC™ Technology software for ensuring easy set-up and accurate mix ratios.
• Selective Soldering - The SELECT Integra® 508.3PD 2seg multi-station includes concurrent fluxing, preheating with dual fluxers and solder pots, and can solder two singulated boards in a parallel mode in-line with two segmented conveyors.
• Plasma Surface Treatment – The popular MARCH AP-1000 is a cost- and space-efficient vacuum plasma treatment machine for treating all types of parts and components. It is completely self-contained including pump, chamber, control electronics, and requires minimal floor space.

On exhibit for semiconductor packaging at SEMICON China 2021 is the ASYMTEK Vantage dispensing system and IntelliJet® Jetting system, demonstrating dispensing for the highest levels of precision and speed.

We look forward to seeing you in Shanghai at either event!

https://www.nordson.com/en/divisions/electronics-solutions
High-resolution image: https://ndsn.tech/4cd

About Nordson Electronics Solutions
Nordson Electronics Solutions offers products to customers for precision automated fluid dispensing, conformal coating, plasma surface treatment, and selective soldering. Consisting of complementary product lines – ASYMTEK, MARCH, and SELECT – we deliver to semiconductor packaging, printed circuit board assembly, and other precision assembly operations. Our passion is helping customers take their processes further faster, with best-in-class technologies, dedicated global sales and support teams, and unmatched consultative applications expertise.

About Nordson Corporation
Nordson Corporation (NASDAQ: NDSN) is one of the world’s leading producers of precision dispensing equipment that applies adhesives, sealants, coatings and other materials to a broad range of consumer and industrial products during manufacturing operations. The company also manufactures equipment used in the testing and inspection of electronic components as well as technology-based systems for curing and surface treatment processes. Headquartered in Westlake, Ohio, Nordson has direct operations and sales support offices in more than 30 countries.

• Read more about Nordson Electronics Solutions to Showcase Printed Circuit Board Assembly and Semiconductor Packaging Equipment at Productronica China and SEMICON China Tradeshows

FREMONT, Calif. – Mar 15, 2021 – YES (Yield Engineering Systems, Inc.), a preferred provider of material modification and surface enhancement solutions for the semiconductor, life science and display markets, today announced that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding. The new system will be utilized in bringing next-generation HBM (high bandwidth memory) to market. It is scheduled for delivery in the second quarter of 2021 to support the customer’s R&D activities and initial production demands.

“This order marks an important milestone for YES, as it is a validation of our efforts to serve the memory market. This new VertaBond system will enable our valued customer’s most advanced HBM development and pilot production,” said Alex Chow, Asia Sales President & General Manager at YES. “We are very pleased and look forward to working with them to meet their exciting technology roadmap.”

“YES has long been a leader in cutting-edge solutions for polyimide cure and wafer-to-wafer bonding applications utilizing novel vacuum technologies. We are pleased to introduce the VertaBond system for wafers and panels, which is based on this core competence, to customers with demanding 3D stacking and heterogenous integration applications in logic, memory and other critical areas,” said Dr. Zia Karim, Sr. VP and CTO at YES.

About VertaBond
VertaBond is YES’s new vacuum-based wafer-to-wafer and die-to-wafer bonding system. Its superior temperature uniformity and low vacuum environment work together to improve the properties of bonding interfaces and eliminate voids which can cause yield loss and performance degradation. Vacuum technology enables void-free bonding in less time, reduces thermal budget, and provides excellent bonding strength and particle performance.

About YES
YES (Yield Engineering Systems, Inc.) is a leading manufacturer of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

VertaBond™ and the YES logo are trademarks of YES (Yield Engineering Systems, Inc.).

• Read more about YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer