Upcoming Events
Recent Events
FlexTech Master Classes Available
Class Number | Name | Original Date | Instructor |
| FTMC001 | Flexible Power Sources | July 2020 | Brian Berland, ITN Energy |
| FTMC002 | AI in Thin-Film Manufacturing | August 2020 | Cornell University |
| FTMC003 | Hybrid Integration for Flexible Electronics | September 2020 | Robert Street, PARC |
| FTMC005 | Flexible Batteries | April 2021 | J. Devin MacKenzie, Univ. of Washington |
| FTMC006 | AI Enhanced Microfabrication and Printed Electronics | May 2021 | Cornell University |
| FTMC007 | FHE 2.0 based on Fan-Out Wafer Packaging | June 2021 | Subramanian Iyer, UCLA |
| FTMC008 | Printing, Curing & Characterization Methods for Printable Conductors | September 2021 | Mike Mastropietro, ACI Materials |
| FTMC009 | Optimizing Design and Fabrication of FHE for Medical and Industrial Application | October 2021 | Mark Poliks, Binghamton Univ. |
| FTMC010 | Environmental Sustainability for FHE & Microelectronics | November 2021 | Toni Mattila, Biz Finland |
| FTMC011 | The Next Generation of Printed Electronics | June 22, 2022 | J. Devin MacKenzie, Univ. of Washington |
| FTMC012 | Additive Manufacturing and Robotics | October 19, 2022 | Greg Whiting & Robert MacCurdy, Univ. of Colorado, Bolder |
| FTMC013 | FHE Market & Forecast | November 16, 2022 | Dr. Matthew Dyson, ID TechEx |
| FTMC014 | How to Write & Protect Your Patent | December 7, 2022 | Harvey Kauget, Burr & Forman LLP |
| FTMC015 | Fundamentals of Electrochemical, Aptameric-based Sensors | November 2, 2023 | Dr. Jack Ly, UES |
| FTMC016 | Introduction to Hybrid Bonding for Advanced Packaging | November 8, 2023 | Dr. Arsalan Alam, AMD |
FTMC017 | Perspectives on Biosensor Applications | April 24, 2024 | Dr. Michael Brothers, Eqlipse Technologies |
| FTMC018 | Biohybrid Sensing Systems for Volatile Organic Compounds | May 15, 2024 | Dr. Elizabeth Steele, UES |
| FTMC020 | The Intersection of Law, Ethics and Technology: AI Governance in MedTech and Semiconductors | September 18, 2024 | Jenny Colgate & Martin Zoltick, Rothwell Figg |
FTMC021 | Navigating the Legal Landscape: AI Litigation Risks in Semiconductor and Medtech | September 25, 2024 | Jenny Colgate & Mark Rawls, Rothwell Figg |
FTMC022 | How to Protect Your Valuable IP in the Microelectronics Industry | October 20, 2024 | Brian Rosenbloom, Rothwell Figg |
FTMC023 | Best Practices for Semiconductor Patent Portfolio Management | November 6, 2024 | Michael Jones, Rothwell Figg |
FEMC024 | TPLC Advisory Program: Piloting a New Approach | Postponed, TBD | Kimberly Knish, April Marrone, FDA’s Center for Devices and Radiological Health |
| FlexTech RFP 2025—Government Funded R&D Program Webinar | June 24, 2025 | Gity Samadi SEMI | |
EDMC001 | ESD Alliance Master Class: Introduction to Chip Design and EDA | June 25, 2025 | Paul Cohen SEMI/ESD Alliance |
FEMC025 | Enabling Next-Generation Medical Devices: Graphene Device Manufacturing | September 10, 2025 | Jesús de la Fuente Graphenea, Carolina Aguilar INBRAIN |
FEMC026 | Innovations in Magnetic Materials: Application in Biomedical Engineering | October 29, 2025 | Renata Saha Dupont |
FEMC027 | Digital Twin Models for Semiconductor Manufacturing Unit Process | November 5, 2025 | Ben Davaji , Northeastern University Peter Doerschuk, Cornell University |
FEMC028 | Development, Scaling, and Transition of Novel Chemicals & Materials | November 12, 2025 | Larry Takiff Akita Innovations |
FEMC029 | Digital Twins for Printed Electronics: How Can AI Learn FHE Printing? | June 10, 2026 | Ben Davaji Northeastern University |
FEMC030 | High Throughput Material Development for Extreme Environmental Printed Electronics | August 26, 2026 | Shenqiang (Shen) Ren University of Maryland, College Park |
FEMC031 | Advancing Printed Electronics Technology: From Macroelectronics to Quantum Devices | September 30, 2026 | J. Devin MacKenzie, University of Washington |