The SEMI Smart Manufacturing Global Executive Committee delivered an insightful Smart Manufacturing Roadmap in a remarkable union of minds and industries.
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Provides high-level graphs and tables, down to quarterly details, and analyzes global semiconductor facilities and production lines using 300mm wafers in a 12-year report format.
SEMI 3D1 - Terminology for Through Silicon via Geomet...
Clear and commonly accepted definitions are needed for efficient communication and to prevent misunderstanding between buyers and vendors of metrology equipment and manufacturing services.
SEMI T26 - Specification for Electronic Supply Chain...
The purpose of this Specification is to define a secure, decentralized, traceability system based on Distributed Ledger Technology (DLT) that can be shared by all members of the electronics supply cha
SEMI A2 - Specification for Surface Mount Assembler...
The purpose of this Standard is to provide a standardized automation interface specification to be used for the equipment control in an assembly line for printed circuit board (PCB) that uses surface
SEMI A5 - Specification for Factory Operation Extension...
This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help ident