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SEMI Europe actively contributes to EU-funded initiatives, including Horizon and Erasmus programmes, capitalising on its global member base and its role as the voice of the microelectronics industry. These activities enable SEMI to connect industry, research, and policy stakeholders while advancing European competitiveness and technological leadership.

Current project portfolio:

  • HiCONNECTS - Heterogeneous Integration for Connectivity and Sustainability (2023 - 2026)
  • ECSA - European Chips Skills Academy (2023 - 2027)
  • ECDA - European Chips Diversity Alliance (2024 - 2027)
  • RESCHIP4EU (2024 - 2028)
  • GENESIS - Generate in Europe a Sustainable Industry for Semiconductor (2025 - 2028)
  • FOCAL - Functional Composition of Post-Quantum Cryptosystems at Large (2025 - 2028)
  • ICOS² - International Cooperation on Semiconductor Innovation and Supply Chain Resilience (2026 - 2029)
  • JASMINE - Europe–Japan cooperation for technological sovereignty in the semiconductor sector (2026 - 2028)
  • ReSiLient - Securing Europe's Silicon & SiC Supply Chain (2026 - 2030)

 

If you are looking for collaboration opportunities or want to connect with SEMI's research team, please reach out to [email protected]

HiCONNECTS

HiCONNECTS - Heterogeneous Integration for Connectivity and Sustainability

HiCONNECTS is a Chips JU funded project with 66 consortium members, to enable both wired/wireless networks and edge/cloud data centers of the future to operate with high performance and reliability. The HiCONNECTS project develops the next generation of electronic components and systems heterogeneous integration core technology solutions for energy-efficient, high-performance wireless/wired cloud and edge computing and automotive radar in support of the next radio frequency and IT technology evolution.

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ECSA

European Chips Skills Academy

The European Chips Skills Academy is a new initiative to help tackle the skills and talent shortages in Europe’s electronics industry and propel its growth.

The academy will expand on the Microelectronics Pact for Skills and the EU Chips Act to support the microelectronics ecosystem in Europe to attract new talent and foster microelectronics industry collaboration with key education, training and certification providers to boost European competitiveness.

The initiative is backed by 30 partners which include vocational and educational training providers, research organizations, certification agencies and industry participants.

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European Chips Diversity Alliance

The European Chips Diversity Alliance (ECDA) is a consortium of 11 partners to form an innovative and robust partnership between academia and industry in the microelectronics sector. The goal of the project is to enhance diversity, equity, and inclusion and to lower barriers to participation for under-represented groups to promote growth and competitiveness in the European microelectronics industry.

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RESCHIP4EU

Reinforcing Skills in Chips Design for Europe (RESCHIP4EU) aims to support the excellence of EU higher education by designing and delivering a double-degree master’s program in Embedded Systems Design with several specializations related to the holistic design of embedded platforms safer, greener, smarter, and more efficient and a minor in Innovation and Entrepreneurship.

The consortium consists of 13 partners from 8 countries who have the complementary expertise needed to support the implementation of the project and enable its longer-term sustainability.

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GENESIS - GENErate in Europe a Sustainable Industry for Semiconductor

GENESIS (GENErate in Europe a Sustainable Industry for Semiconductors) is a Horizon Europe – Chips JU, State Secretariat for Education, Research and Innovation SERI and member states coordinated by CEA-Leti with 58 partners. It targets sustainable semiconductor manufacturing through PFAS-alternate materials, real-time emissions and waste sensors, and recycling technologies for scarce materials. Structured into four technical and supporting work packages, it aims for a reduction in hazardous chemicals and a drop in emissions and waste, enhancing Europe’s chip-sector circularity and environmental footprint .

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FOCAL - Functional Composition of Post Quantum Cryptosystems at Large

FOCAL is a Horizon Europe Research & Innovation Action coordinated by the University of Cyprus. The project accelerates Europe’s transition to quantum-safe communication networks and critical infrastructures by developing an end-to-end framework for integrating post-quantum cryptography (PQC) across heterogeneous environments, from cloud and telecom systems to highly constrained IoT and edge devices. FOCAL introduces a crypto-agile, composable PQC architecture that leverages hardware reconfigurability, lightweight distributed Trusted Execution Environments (TEEs), and ML-enabled network interoperability. The project also establishes assessment methodologies for PQC readiness, contributing directly to Europe’s cybersecurity standards and long-term digital resilience.

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JASMINE EU

JASMINE

JASMINE (Japan and EU Semiconductors: Mutual Innovation & Excellence) is a Horizon Europe Coordination and Support Action (CSA) designed to strengthen strategic cooperation between the European Union and Japan in the semiconductor sector. In alignment with the European Chips Act, the project aims to enhance the resilience, sustainability, and competitiveness of the EU semiconductor ecosystem by leveraging Japan’s complementary strengths in materials science, manufacturing equipment, and advanced packaging. Over an 18-month period, JASMINE will conduct a comprehensive mapping of semiconductor value chains, identify joint research and innovation (R&I) priorities, and propose coordinated investment and regulatory strategies.

The project will also foster talent development through staff exchange programs, job fairs, and academic-industry collaborations, while promoting alignment in Life Cycle Assessment (LCA) methodologies to support sustainable semiconductor manufacturing. By facilitating bilateral and multilateral partnerships, JASMINE seeks to deliver strategic recommendations and a roadmap for future EU-Japan collaboration, contributing to Europe’s goal of increasing its global semiconductor market share to 20% by 2030. The initiative brings together major leading institutions and companies across Europe and Japan, creating a robust framework for innovation, policy alignment, and long-term industrial cooperation.

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ReSiLient

ReSiLient is a Horizon Europe Research and Innovation Action advancing a circular and resilient European silicon and silicon carbide ecosystem. Coordinated by SINTEF, the approximately €12M project brings together 15 partners over four years to develop an end-to-end approach for recovering and reintegrating raw, waste, and device-derived materials across the semiconductor lifecycle, including the secure recycling of end-of-life devices without exposing proprietary designs.

By combining advanced hydrogen-plasma refining, CO₂ sequestration strategies, and harmonised best practices, ReSiLient establishes and upscales integrated, sustainable primary and secondary production routes that reduce import dependency, cut emissions, and strengthen Europe’s strategic autonomy. The project further demonstrates the industrial applicability and market relevance of these solutions, maximising competitiveness, sustainability, and exploitation potential across the European semiconductor value chain.

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ICOS²

ICOS² is a Horizon Europe Coordination and Support Action advancing Europe’s strategic positioning in the global semiconductor landscape by strengthening international cooperation. Building on the foundations of the ICOS initiative (icos-semiconductors.eu), the project brings together 25 partners over 36 months with a €2M budget to mobilise a multi-actor ecosystem and a broad stakeholder network.

ICOS² delivers robust intelligence, a verifiable evidence base, and actionable policy recommendations to support the European Commission and Member States in shaping effective international semiconductor partnerships. Through the development and validation of cooperation frameworks, the project reinforces Europe’s capacity to engage globally, while translating analysis into concrete actions that enhance resilience, competitiveness, and strategic influence in semiconductor value chains.

Completed projects:

  • IMOCO4.E - Intelligent Motion Control under Industry4.E
  • ECoVEM – European Centre of Vocational Excellence in Microelectronics
  • Pack4EU
  • METIS - Microelectronics Training, Industry and Skills
  • Pact for Skills