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June 30, 2021

We will review the key developments in this paradigm change and the implications these have on Flexible Hybrid Electronics especially the use of bare dielets, fine pitch interconnects and novel substrate materials.

The area of Flexible Hybrid Electronics (FHE) has also developed and is making a significant impact in the area of medical and wellness electronics.  The first generation of these devices have, for most part, adapted Printed Circuit Board (PCB) technology by using thinner PCBs and assembling either thinned or thin pack

Time

10:00 am - 12:00 pm

Add to Calendar 2021-06-30 10:00:00 2021-06-30 12:00:00 Flexible Electronics Master Class #7 FOWLP We will review the key developments in this paradigm change and the implications these have on Flexible Hybrid Electronics especially the use of bare dielets, fine pitch interconnects and novel substrate materials. The area of Flexible Hybrid Electronics (FHE) has also developed and is making a significant impact in the area of medical and wellness electronics.  The first generation of these devices have, for most part, adapted Printed Circuit Board (PCB) technology by using thinner PCBs and assembling either thinned or thin pack Virtual, Online, United States SEMI.org contact@semi.org America/Los_Angeles public
Location

Virtual, Online,
United States

In the last few years, electronics packaging has rightfully emerged from the shadows of CMOS scaling to make a significant impact in high performance and mobile appliance computing.  

In this course, we will review the key developments in this paradigm change and the implications these have on Flexible Hybrid Electronics especially the use of bare dielets, fine pitch interconnects and novel substrate materials.

The area of Flexible Hybrid Electronics (FHE) has also developed and is making a significant impact in the area of medical and wellness electronics.  The first generation of these devices have, for most part, adapted Printed Circuit Board (PCB) technology by using thinner PCBs and assembling either thinned or thin packaged “older” generation of chips on to these platforms, typically with coarse printed wiring to connect a small number of such chips.

This approach, while immensely useful to get  the field going, needs to adapt and borrow from the both silicon and advanced packaging technology trends, so that we can advance this trend to the next level. The key paradigm challenges ahead are: scaling  FHE in general – this includes the adoption of dielet (chiplet) technology in more advanced CMOS nodes including edge-AI, higher performance interconnects, flexible high-density energy storage, wireless communication and advanced ergonomics and all of these at lower cost and higher reliability.

In this talk we will address these challenges and outline a possible technology roadmap to achieve these goals in the next few years.

 

Featured Speakers

Subramanian S. Iyer
Subramanian S. Iyer, PhD
Distinguished Chancellor's Professor & Charles P. Reames Endowed Chair
UCLA

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi (gsamadi@semi.org) with a picture of your student ID to receive your discount code. 

Flexible Hybrid Master Classes are offered on many topics!  Visit this page for entire list and links to more detailed information on each one.