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2026 FlexTech Request for Proposals (RFP)

View all the topics, guidelines, and timeline for the 2026 FlexTech RFP:

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Watch FlexTech 2026 RFP Webinar Recording

SEMI FlexTech has R&D funding available through public private partnerships to fund research for flexible hybrid electronics. This webinar explains the newly announced request for proposals (RFP) for 2026. Specifically, overview of SEMI programs, RFP topics, requirements, and proposal instructions will be described for the recently announced RFP. An informational question-and-answer segment was conducted at the end.

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Funding Program

Since 1993, SEMI FlexTech has funded over 200 projects in R&D, with a total public/private investment in excess of U.S. $220 million. FlexTech solicits proposals from the flexible electronics industry for candidate projects which will receive funding. 

R&D Programs Contract History

SEMI-FlexTech Contract History
SEMI-NBMC Contract History
NextFlex Contract History
SEMI-MSIG Contract History

Development Agreement Award Process

Through a competitive bid process supported by the Technical Advisory Council and Industry Governing Council, project proposals are selected for available funds. The typical funding is structured as a 50/50 cost share with the industry participant. Please see the Contract History links above for more information on the projects that have been funded to date.

R&D projects are supported for the development of innovative new equipment & process technology for front-end and back-end manufacturing process steps; new materials and components; and for software, hardware and design analysis for factory automation and CIM operation.

The technical program is funded with the assistance of the U.S. Army Research Laboratory (ARL). Each year the ARL provides funding to FlexTech for allocation to the technical projects of interest. The mission of ARL is to enable technologies that will meet future Army combat needs and solve the critical technical barriers that limit the performance, reliability, functionality and affordability of battlefield systems. The partnership funds technology advancements in the supply chain that will meet the military and consumer needs.  For an example of a FlexTech project, read this blog.

The FlexTech Technical Advisory Council (TAC) establishes the content and priority for the elements of the technical program. They have maintained an emphasis on creating next generation capability for flexible and printed electronics, while assuring optimized cost-of-ownership.

Member companies provide corporate resources to lead and to staff the project teams responsible for:

  • Request for Proposal topics and target requirements
  • Proposal selection defining the statement of work in concert with the chosen supplier
  • Development program oversight
  • Beta-site evaluation of the developed equipment/materials

Proposals for awards are selected from the RFP responses based upon factors such as innovation, level of risk, cost effectiveness, performance history and the ability to provide a substantial cost share.

The award process is typically done in two stages. The first stage is submission of a white paper proposal which is evaluated and selected by the Technical Advisory Council. These white papers are then offered the opportunity to submit full proposals. The final proposals are evaluated by the Technical Advisory Council and then recommendations are presented to the Industry Governing Council. The Industry Governing Council reviews the recommendations and conducts their own evaluations before making the final selections.

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The Impact of Flexible and Printed Electronics