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Breker Verification Systems, the leading provider of advanced test content synthesis solutions, today unveiled the Breker Integrity FASTApps™ Portfolio, a library of automated test generation intellectual property (IP) elements targeting difficult-to-verify processor core and system-on-chip (SoC) scenarios.

The FASTApps provide commercial-grade, high-coverage verification for RISC-V processor cores and the SoC platforms that use them.

“The RISC-V Open ISA concept, while powerful, introduces verification challenges to engineering teams unfamiliar with processor complexities,” observes David Kelf, Breker’s CEO, an active RISC-V Consortium member involved with a public effort to improve RISC-V verification methodologies. “By automating test content generation, Breker’s years of verification experience can be encapsulated and applied across many projects, driving high test coverage with a minimal level of effort.”

Breker’s new Integrity FASTApps, ideal for the verification of processors based on the RISC-V Open Instruction Set Architecture (ISA) provide specific test sets for both processor core integrity and the System-on-Chip (SoC) that encompass these cores.
The Processor Core Integrity FASTApps include commonplace, but hard-to-verify scenarios such as load store integrity, random instruction testing, register-to-register hazards, conditionals and branches, exceptions, async. interrupts, privilege level switching, core security, exception testing (memory protection and machine-code integrity), virtual memory/paging and core coherency.

In addition, the SoC Integrity FASTApps include random memory and register tests, system interrupt testing (external, timing and software interrupts), multi-core execution, memory ordering, atomic operations, system coherency, system paging and memory management unit (MMU) operations, system security and power management.

Also available are apps for end-to-end multi-IP SoC testing and early firmware testing for RISC-V.

The FASTApps make full use of the Breker Test Suite Synthesis technology. Features include seamless portability across the entire verification flow and execution platforms, coverage-driven and pre-execution randomization for enhanced use models, powerful debug and performance profiling capability, and concurrent test set. They integrate fully with the Breker TrekApps such as the system coherency, security, power domain, networking and other system verification IP tests for fully comprehensive SoC and core-level verification.

Availability and Pricing
The Breker Integrity FASTApps for RISC-V as well as Arm and X86 based systems are available today.
Pricing is available upon request. Special introductory pricing applies to the FASTApps.
For more information, visit the Breker website or email [email protected].

Breker at the RISC-V Summit
Breker executives and technical staff will be part of the RISC-V Summit program held Tuesday, December 13, and Wednesday, December 14, at the San Jose Convention McEnery Center in San Jose, Calif.
John Sotiropoulos, principal engineer at Breker, will present “The New Verification Ecosystem that Supports RISC-V Verification for all Adopters” with Lee Moore, consulting engineer at Imperas Software, December 13 at 4:20 p.m. P.S. T.
Adnan Hamid, Breker’s CTO, will address “RISC-V SoC and Processor Integrity: Dealing with Unique RISC-V Integrity Issues” December 14 at 12:10 p.m. P.S.T.
Send email to [email protected] to arrange a meeting.

About Breker Verification Systems
Breker Verification Systems is a leading provider of Portable Stimulus solutions, a standard means to specify verification intent and behaviors reusable across target platforms. It is the first company to introduce graph-based verification and the synthesis of powerful test sets from intent-based, abstract scenario models based on AI planning algorithms. Breker’s Test Suite Synthesis and TrekApp library allows the automated generation of high-coverage, powerful test cases for deployment into a variety of UVM, SoC and Post-Silicon verification environments. Case studies that feature Altera (now Intel), Analog Devices, Broadcom, IBM, Huawei and other companies leveraging Breker’s solutions are available on the Breker website. Breker is privately held and works with leading semiconductor companies worldwide.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

microMIRA™ provides highly uniform, force-free lift-off of material layers at high speeds;
more than ten 3D-Micromac laser systems sold for microLED applications to date

Chemnitz, Germany, November 7, 2022—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets, today announced that a leading optical solutions provider has purchased multiple microMIRA™ Laser Lift-Off (LLO) systems from 3D-Micromac for use in the production of microLED devices. The customer will install the new microMIRA systems in pilot- and production lines at its state-of-the-art LED chip factory in Asia.

Laser Lift-Off an Enabling Process for microLEDs
MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime, and low power consumption. Potential applications include very large displays for indoor and outdoor use, as well as high-resolution displays for augmented reality (AR) and virtual reality (VR) wearable devices.

However, the microLED fabrication process is vastly more complex than LCD and OLED manufacturing, and faces several technical challenges that must be overcome before microLEDs can be readily available in the mass market. Among these challenges is detaching and transferring the processed microLED chips from the donor or growth substrate (e.g., sapphire) to an intermediate substrate for subsequent testing without damaging the expensive growth substrate, allowing it to be repurposed for future use. The microMIRA system from 3D-Micromac precisely addresses this task with superior performance.

3D-Micromac’s microMIRA system provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The system is capable of processing different substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.

According to Uwe Wagner, CEO of 3D-Micromac, “This multiple system order is a testament to our ability to provide innovative and enabling laser micromachining solutions for industrial applications serving both mature and emerging markets. It also represents an important milestone for 3D-Micromac as we continue to expand our product offerings and services into the display industry, addressing the production needs for exciting new display technologies, including microLEDs. To date, 3D-Micromac has sold more than 10 laser processing systems for microLED applications, including our industry-benchmark microMIRA laser-lift-off system as well as our recently introduced microCETI™ micromachining platform.”

The microMIRA LLO system has been used successfully in mass production by electronics manufacturers globally for years. In addition to gallium nitride (GaN) lift-off from glass and sapphire substrates in microLED display manufacturing, the microMIRA system can also be used for layer separation in semiconductor and sensor manufacturing, as well as for laser annealing and crystallization for surface modification.

More information on microMIRA, including our latest white paper “Laser technologies for microLED production,” can be found at https://3d-micromac.com/laser-lift-off/micromira/.

About 3D-Micromac
Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

• Total income of EUR 4.3 million in Q3 2022, a year-over-year growth of 19%
• Order book value has further grown since the beginning of the quarter
• New investments to increase capacity and capabilities

Deventer, October 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the third quarter of 2022. The total income for the quarter was EUR 4.3 million, which is 19% higher than the total income in the third quarter of 2021 (EUR 3.6 million). The test operations department is continuing to grow with existing and new customers. The total income for the first nine months of 2022 was EUR 11.6 million, which is 6% higher than the total income for the first nine months of 2021 (EUR 10.9 million). Due to long-term contracts and increasing demand from new customers, the value of the order book is higher than at the beginning of the quarter. This generates a good basis for the upcoming quarters.

“We are very pleased with the high total income throughout the year and especially with the third quarter, which drew the highest quarterly total in the last 20 years”, says Martin Sallenhag, CEO of RoodMicrotec. “We keep investing in new equipment to be able to support the increasing demands from our customers. During 2022, we have purchased new handlers and testers as well as new equipment for the Qualification and Failure Analysis department.”

Outlook
RoodMicrotec expects the total income in 2022 to be in the range of EUR 15.0 million to EUR 15.6 million with a positive result before tax. The current situation in the world regarding lead-times for wafers and packaging as well as shipment delays may impact the ability to achieve the expected total income. The war in Ukraine as well as the current energy crisis could also have an impact on the business but in the short term we don’t see any significant impacts. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any impact.

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, political situation, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

Financial calendar
January 26, 2023 Publication (preliminary) annual total income 2022
April 13, 2023 Trading update for the first quarter of 2023
April 20, 2023 Publication annual report 2022
April 20, 2023 Conference call for press and analysts
June 6, 2023 Annual general meeting of shareholders
July 20, 2023 Publication interim report 2023
July 20, 2023 Conference call for press and analysts
October 19, 2023 Trading update for the third quarter of 2023

Audit
The financial data in this press release have not been audited.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well established as a highly valued partner for many companies worldwide. The Company provides full turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions, the English version shall prevail.

Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, launches the new Plasma Enhanced Atomic Layer Deposition (PEALD) system, "AD-800LP". The main target of the system is gate oxide film deposition for next-generation power devices of silicon carbide (SiC) and gallium nitride (GaN) materials, which will play important role toward carbon neutral.

The plasma enhanced ALD system "AD-800LP" is a multi-purpose R&D system equipped with a unique ICP plasma source called "Tornado ICP", in addition to the conventional thermal ALD capability. AD-800LP enables various film deposition such as oxide or nitride films by Tornado ICP, which is Samco's proprietary plasma technology and is different from remote plasma. Tornado ICP enables stable plasma discharge even in the high-pressure range during ALD deposition.

“We are also considering a cluster ALD system that can connect multiple reaction chambers for production” says Tsukasa Kawabe, President and COO of Samco. “The launch of the AD-800LP will greatly enhance our presence in the world ALD equipment market.” Tsukasa adds.

As a global mid-sized company, Samco has successfully delivered numerous dry etch systems and plasma enhanced CVD systems for the electronic device field, mainly for compound semiconductors such as SiC, GaN, and GaAs, not only in Japan but also in the United States, Europe, Taiwan, Korea, China, Southeast Asia, India, and other countries.

The new Research Center for Nano Thin Films & Materials, which opened in February 2022, conducts research and development of unique thin film deposition, including ALD system. Samco will continue to utilize our "thin-film technology" to develop unique products and expand sales globally.

AD-800LP system photo

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including BAW filters, SiC power devices, GaN RF devices, GaAs VCSELs, InP lasers, microLEDs, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samcointl.com/.

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]

HATFIELD, Pa. (USA) September 13, 2022 — Brooks Instrument, a world leader in precision fluid measurement and control technology, has launched a Korean-language website to provide its Asia-Pacific customers with better access to resources, including in-depth product info, technical documentation, white papers, service assistance and technical support.

The new www.BrooksInstrument.com/Ko-Kr website launch follows the recent opening of a new Brooks Instrument manufacturing and engineering center in Yongin, Gyeonggi Province, which significantly increased the company’s operational footprint in Korea. Building on more than two decades of operations in Korea, the local-language website further illustrates the company’s long-term commitment to the region, especially for the fast-growing semiconductor manufacturing sector.

“With our Yongin facility, we increased our ability to provide rapid repair, maintenance and calibration support to customers in the region and added another resource to help mitigate supply chain disruptions. With this new website, we’re further strengthening our commitment to support our partners in the Asia-Pacific region,” said Hans Sundstrom, Global Semiconductor Business Unit Manager for Brooks Instrument.

The website leverages best practices in design and navigation to help customers more easily access information they need and minimize project delays or disruptions. Key features of the new website include:

• Sitewide Korean language support to make it easier for customers to explore the Brooks Instrument catalog of products and documentation
• A “quick find” feature to easily locate products and documentation by name or model number
• Fully optimized site layout with simplified access to key products, technical information, guides and support services
• Specific industry sections with helpful application information for areas such as semiconductor manufacturing, life sciences and more

"We developed the new website as a platform to better serve our local customers,” said Jason Lee, Korea Country Manager at Brooks Instrument. “By adding native-language functionality, we’re further removing barriers to access as we continue to show customers how valuable their partnerships are to our business.”

To visit the new Brooks Instrument Korean-language website, go to www.BrooksInstrument.com/Ko-Kr.

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech industrial manufacturing and process industries.

With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers. Its broad family of products includes brands such as Celerity, UNIT Instruments and Tylan.
For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

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Online, KST
South Korea

Standards

Facilities Korea TC Chapter 

Date: Wednesday, September 28, 2022 

Time: 15:00-18:00 KST

via Virtual Meeting 

 

AGENDA 

TBD

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

3:00 pm - 6:00 pm Off Add to Calendar 2022-09-28 15:00:00 2022-09-28 18:00:00 Facilities Korea TC Chapter Meeting Facilities Korea TC Chapter  Date: Wednesday, September 28, 2022  Time: 15:00-18:00 KST via Virtual Meeting    AGENDA  TBD   NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here  Online, KST South Korea SEMI.org [email protected] America/Los_Angeles public

PENANG, MALAYSIA - August 2022 ViTrox Technologies, aims to be the world’s most trusted vision inspection solutions provider to the Semiconductor and SMT PCB Assembly industries, is pleased to present the latest edition of Tray-based Vision Series - TH1000SEi Tray-to-tray vision handler. TH1000SEi is a user-friendly model designed that allows you to enjoy high-speed tray to tray inspection capabilities while improving cost efficiency.

TH1000SEi will be your first choice to fulfil all the stringent inspection requirements of today’s advanced integrated circuit (IC) packaging market. This special edition of the Tray-to-tray vision handler features the world's most cutting-edge vision technologies for various IC package sizes ranging from 3mm x 3mm to 40mm x 40mm with no conversion needed on its vision module for the 6-sided inspection.

With an auto-pitching mechanism, TH1000SEi allows you to enjoy speedy and reliable nozzle pitch conversion time with its fourteen (14) pick-up nozzles. Having fourteen (14) pick up nozzles optimizes the machine throughput up to 33,000 units per hour (UPH). Additionally, the warpage clamper flattens unbalanced trays during the process. With this user-friendly and simple operating model, you can enjoy the highest performance in your precise production environment.

Besides, TH1000SEi is designed with various innovative vision technologies to provide high speed, high accuracy, and one-stop vision inspection solutions. Our TH1000SEi supports leaded packages inspection, ball packages inspection, and leadless packages inspection, suitable for BGA, QFP, QFN, CSP, TSSOP, MSOP, SOP, etc. Apart from all these attractive features, we offer additional inspection capabilities add-ons such as 2D barcode inspection, mark inspection, package vision inspection, passive component inspection, top colour inspection, etc.

Apart from these features, TH1000SEi is also upgradeable with the tape module for more high speed tray to tape and reel inspection capabilities. Ultimately, the TH1000SEi maximises inspection capabilities, allowing you to achieve maximum machine throughput cost-effectively.

For more exclusive details on the Tray-based Vision Handler series or TH1000SEi, contact our experts at [email protected] for further assistance.

About ViTrox Technologies
Since its inception in 2000, ViTrox aims to be the World’s Most Trusted Technology Company to provide the most innovative, advanced, and cost-effective machine vision solutions of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances. ViTrox offers a full spectrum of advanced 3D vision inspection solutions, including Intelligent Advanced Robotic Vision System, PCB Assembly SMT Vision Inspection Solutions and Industry 4.0 Smart Manufacturing Solution. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States, along with sales and support sites globally. For more information about ViTrox’s products and services, please visit www.vitrox.com.

In the two-day event, leading manufacturing partners will show how application visions in manufacturing are implemented through concrete software solutions and considerations. You will experience first-hand the presentation of application case details from various industrial manufacturers and their ongoing collaboration with partner camLine.

In association with Elisa IndustrIQ, you will get first insights into camLine’s AI-driven manufacturing strategy. Development highlights of camLine’s sophisticated LineWorks Suite, InFrame Synapse, XperiDesk, and Cornerstone software products will also be presented for discussion. Several solution demo stations will be available in the foyer.

In the User Group Meetings, participants are given the opportunity to vote on the priorities of future product
developments.

Register now: https://www.camline.com/forum-registration/

On-Demand Pricing

FULL CONFERENCE
SEMI Member: $149.00
Non-Member: $225.00

DAY 1—Tuesday, November 8, 2022
SEMI Member: $49.00
Non-Member: $75.00

DAY 2Wednesday, November 9, 2022
SEMI Member: $49.00
Non-Member: $75.00

DAY 3Thursday, November 10, 2022
SEMI Member: $49.00
Non-Member: $75.00

STUDENTS—FREE
Contact us at [email protected] with a picture of your student ID to receive your discount code.

CONTACT
Mark da Silva
[email protected]

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[email protected]
Sr. Sales Manager, SEMI
Tel: +1.408.943.7047 
Email: [email protected]

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2022 Organizing Committee

  • John Behnke | INFICON

  • Holland Smith | INFICON

  • Chan Pin Chong | KULICKE & SOFFA

  • Michael Arnold | PEER GROUP

  • Bobby Mitra | TEXAS INSTRUMENTS

  • James Lin | UMC

United States

TUESDAY, NOVEMBER 8, 2022 | TIMES IN PT

SESSION 1—Intelligent ACQUIRE: Data Sources, Variety and Acquisition

7:00 am
Mark da Silva
Mark da Silva
SEMI

Opening Remarks

7:02 am
Ajit Manocha
SEMI

Conference Opening Remarks

7:15 am
Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Keynote: Autonomous Smart Factory of the Future

7:35 am
Michael Arnold
Michael Arnold
PEER Group

Moderator Welcome

7:40 am
Praneetha Poloju
Praneetha Poloju
Chief Technologist
Microsoft

Azure Data Estate for Foundry Data Connectivity and Architecture Modernization​

Bella Chan
Bella Chan
Microsoft

Azure Data Estate for Foundry Data Connectivity and Architecture Modernization

8:05 am
Doug Suerich
Doug Suerich
PEER Group

End-to-End Smart Manufacturing: Using EDA to Advance the Backend ​

8:30 am
Fahad Golra
Dr. Fahad Golra
Research & Innovation Coordinator
Agileo Automation

Challenges in Edge to Cloud Level Data Sharing Across Value Chains in Semiconductor Industry

8:55 am
Padmanabha Kannampalli
Padmanabha Kannampalli
Engineer
Teradyne

Data Connectivity in Semiconductor Test—Challenges

9:20 am
Alan Weber
Alan Weber
Vice President, New Product Innovations
Cimetrix by PDF Solutions

Seeing is Understanding: Improving the Visibility into Smart Manufacturing Operations by Raising Our Standards​

9:40 am
Michael Arnold
Michael Arnold
PEER Group

Closing Remarks

SESSION 2—Intelligent INSIGHTS: Current Point Systems

5:00 pm
James Lin, UMC
MODERATOR
James Lin
UMC

Welcome Remarks

5:05 pm
CS Tan
CS Tan
Group VP & General Manager
STMicroelectronics

Product/Process Digitalization for Smart Manufacturing—Future is OPTIMIZED​

5:30 pm
John Foley
John Foley
Kulicke & Soffa

Big Data Analytics for Back-End Assembly Equipment​

5:55 pm
Bappaditya Dey
Bappaditya Dey
Senior R&D Engineer
imec

Deep Learning Denoiser Assisted Framework for Robust SEM Contour Extraction and Analysis for Advanced Semiconductor Node

6:20 pm
Ivan Aduna
Ivan Aduna
KY Technology

Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory​

6:45 pm
Anis Rahman
Anis Rahman
Chief Technology Officer
AR Photonics

A New Technique of Continuous Wave Cameraless T-Ray Imaging for Semiconductor Interfaces Analysis and Wafer Scale Die Sorting ​

7:35 pm
James Lin
UMC

Closing Remarks

WEDNESDAY, NOVEMBER 9, 2022 | TIMES IN PT

SESSION 3—Intelligent DIGITAL TWIN: Multi-Level Digital Twin

7:00 am
Holland Smith
MODERATOR
Holland Smith
Inficon

Welcome Remarks

7:05 am
Marc Engel
Marc Engel
Agileo Automation

How Existing Semiconductor Equipment Can Benefit From Digital Twins

7:30 am
Sarbajit Ghosal
Sarbajit Ghosal
SC Solutions

Development of Digital Twins for Manufacturing Applications

7:55 am
Basil Milton
Basil Milton
Kulicke & Soffa

Wire Bonding Digital Twin Enhancements for Smart Manufacturing

8:20 am
Shankar Ranganathan
Shankar Ranganathan
Associate General Manager R&D
HCL Technologies

Scalable Options to Support Semiconductor Capital Equipment's

8:45 am
Sriny Sundararajan
Sriny Sundararajan
CTO
Clip Automation

Ensuring Trust & Traceability: Secure Data Exchanges for Real-Time, Multi-Party Data Sharing in Industry 4.0 and Smart Manufacturing

Vikrant Kahlir
Vikrant Kahlir
Vendia
9:10 am
Anuj Mahendrum
Anuj Mahendru
Global Director, Semiconductor and Hi-Tech Industries
Rockwell Automation

Cleanroom Redefined—Addressing the Wafer Transport Challenge

9:35 am
Holland Smith
Holland Smith
Inficon

Closing Remarks

SESSION 4—Intelligent PREDICT: AI/ML Solution Integration

5:00 pm
Chan Pin Chong
MODERATOR
Chan Pin Chong
Kulicke & Soffa

Welcome Remarks

5:05 pm
KEYNOTE | John Herlocker, PhD | TIGNIS
Jon Herlocker, PhD
CEO
Tignis

KEYNOTE: Empowering Process Engineers With Self-Service AI/ML

5:30 pm
Jasper van Heugten
Jasper van Heugten
minds.ai

An Overview of How AI Is Reshaping Semiconductor Manufacturing: A Case Study in Fab Scheduling Using Deep Reinforcement Learning

5:55 pm
Jimmy Bramante
Jimmy Bramante
Inficon

Blurring Boundaries: Overcoming Context to Enable Deep Learning on Process Data​

6:20 pm
Nikunj Mehta
Nikunj Mehta
Founder & CEO
Falkonry

Automated, Field Deployed, Time Series Anomaly Detection With Time Series AI

6:45 pm
Erik Collart
Erik Collart
Global Product Manager SCADA
Edwards

Effective Use of Vacuum Assets Through Smart Manufacturing

7:10 pm
Yak Hua Khoo, ViTrox Technologies
Yak Hua Khoo
ViTrox Technologies

SMT Electronic Smart Close-Loop Prediction System​

7:30 pm
Chan Pin Chong
Chan Pin Chong
Kulicke & Soffa

Closing Remarks

THURSDAY, NOVEMBER 10, 2022 | TIMES IN PT

SESSION 5—Intelligent AUTONOMY: Smart, Autonomous Control

7:00 am
Bobby Mitra
MODERATOR: Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Welcome Remarks

7:05 am
Christoph Koegler, Infineon
Christoph Koegler
Director Innovation, Digitalization & AI
Infineon

A Flood of Problems Drained—Fixing Valves the Smart Way​

7:30 am
Gautham Unni
Gautham Unni
AWS

AWS for Semiconductor Smart Manufacturing ​

7:55 am
Peter Lendermann
Peter Lendermann
Chief Business Development Officer
D-SIMLAB Technologies

Enhanced Predictions, Smarter Actions: A Few Lessons Learnt on the Path towards 'Autonomy' in Frontend Production​

8:20 am
Ivy Qin
Ivy Qin
Senior Director of Engineering
Kulicke & Soffa

Road to Autonomous Wire Bonder

8:45 am
Matthew Putman
Matthew Putman
CEO
Nanotronics

Inspect, Correct, Protect

9:10 am
Christophe Curny
Christophe Curny
Soitec

Soitec 4.0 Journey​

9:35 am
Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Closing Remarks

SESSION 6 — Foundational Topics

5:00 pm
John Behnke
MODERATOR
John Behnke
General Manager FPS Product Line
Inficon

Welcome Remarks

5:05 pm
Koen de Backer
Koen de Backer
Vice President Smart Manufacturing and Artificial Intelligence
Micron

KEYNOTE: Leveraging Smart Manufacturing to Achieve Sustainability Goals

5:30 pm
Ming Chang Wu
Ming-Chang (Bright) Wu
Hon Hai Research Institute, Foxconn

Toward Digital Resilience – Transforming Management Practices Based on Cybersecurity 2.0 Standards​

5:55 pm
Jim Montgomery
Jim Montgomery
Principal Solution Architect
TXOne Networks

Is Wait-and-See a Good OT Security Strategy?

6:20 pm
Houng Sun
Dr. Houng Sun
Mirle

Advanced Automation for Smart Manufacturing​

6:45 pm
Andrew Seward, TEL
Andrew Seward
Field Solutions Product Marketing and Analytics Manager
TEL
David Gross, Siemens
Dave Gross
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Conference Closing Discussion—Where do we go from here?​

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Closing Remarks

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Deventer, July 27, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and Rohde & Schwarz GmbH & Co. KG, a market leader in the fields of measurement technology and communications, today announce the continuation of their longstanding partnership through several new projects in ASIC development.

The two companies have been working together for over 10 years and in this period RoodMicrotec has carried out the test development for various high frequency ASICs used by Rohde & Schwarz in their products. RoodMicrotec performs wafer and component level tests as well as qualifications prior to product launch. For the coming years, further projects of this kind are already scheduled.

"At Rohde & Schwarz, we rely on our own in-house expertise to develop our high-performance ASICs and therefore count on partners who share our high standards. We appreciate the quality RoodMicrotec offers - from quotation to test development, qualification and volume testing," says Bastian Nagel, Senior Director Mixed Signal ASIC Development at Rohde & Schwarz.

RoodMicrotec also appreciates the collaboration with Rohde & Schwarz, especially the respectful interaction and the high level of professional expertise.

Jan de Koning Gans, Managing Director of RoodMicrotec GmbH says: "Our projects with Rohde & Schwarz constantly pose new technical challenges, thus allowing us to broaden our know-how and the quality of our work from project to project."

About Rohde & Schwarz
The Rohde & Schwarz technology group develops, produces and sells a wide range of electronic capital goods. The company’s entire product portfolio represents a valuable contribution to a secure and networked world. In the markets of test & measurement, secure communications, networks & cybersecurity, as well as broadcast & media, customers around the world rely on Rohde & Schwarz and its technologically leading solutions. In addition to its well-established business areas, the Group invests in future technologies such as artificial intelligence, Industrial Internet of Things (IIoT), 6G, cloud, and quantum technology.

Further Information
Email: [email protected], Web: www.rohde-schwarz.com

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.