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Registration Details

$39 for SEMI Members (sign into your account with your work email to be recognized)

$59 for non-SEMI Members

Belgium China France Germany Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Vietnam Register for the 9:00-10:00 AM PT Session Register for the 4:00-5:00 PM PT Session SSI Webinar Series tile 360x317 - Cloned Business Executive
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Abstract

Companies across the semiconductor value chain must respond to a dynamic horizon as the ISSB Standards are adopted by securities regulators, standard-setters and stock exchanges around the world. At the same time, investors are asking companies to voluntarily transition from the TCFD recommendations to the ISSB Standards to meet their information needs.

To clarify what the ISSB Standards mean for the semiconductor value chain, SEMI is pleased to collaborate with the IFRS Foundation, which is the organizational seat of the ISSB. Our webinar, ISSB Standards Adoption and Reporting for the Semiconductor Value Chain, outlines the stakes for companies, demonstrates the business value of the Standards (IFRS S1 and IFRS S2), answers audience questions, and provides a venue for information exchange. There will be a deep dive into implications for climate reporting under IFRS S2 after a high-level look at the background and workplan of the ISSB.

Our distinguished speakers from IFRS Foundation are Neil Stewart, Director of Corporate Outreach, and Jing Zhang, Head of Climate Research.

This event is part of the SEMI webinar series, “Global State of Play: Sustainability Regulations, Reporting, & Incentives.” This series offers semiconductor industry professionals the chance to interact with top-tier experts on the most pressing challenges in compliance, disclosure, and strategy for sustainable business.

Speakers

Neil Stewart

Neil Stewart, Director of Corporate Outreach, IFRS Foundation

Neil Stewart is the International Sustainability Standards Board’s New York-based Director of Corporate Outreach, working with preparers, industry associations, the accounting profession and consultants to build awareness and understanding of the ISSB Standards and SASB Standards. Neil joined SASB in 2020 from Citigroup.

 

 

 

 

Jing Zhang

Jing Zhang, Head of Climate Research, IFRS Foundation

Jing Zhang is Head of Climate Research on the International Sustainability Standards Board’s technical staff. Previously he was the Global Head of Quantitative Research at Moody’s Analytics. Jing has numerous published books and research papers on financial risk, including the Risk Publications book “Climate Change: Managing the Financial Risk and Funding the Transition.” Jing has a PhD from the Wharton School of the University of Pennsylvania.

United States

Sustainability

Worldwide, companies in the semiconductor value chain are undergoing paradigm shifts in how they report sustainability-related risks and opportunities to stakeholders in government and capital markets.

Semiconductor manufacturing and design firms, together with their business partners, face heightened pressure to report on their performance related to climate transition, human capital management, supply chain management, and a host of other environmental, social, and governance issues.

On one hand, companies face a patchwork of reporting rules conditioned on where they do business. On the other hand,  a global baseline of sustainability-related disclosures ushered in by the IFRS Foundation’s International Sustainability Standards Board (ISSB) is gathering momentum.

Times

Multiple sessions available!
EMEA: Thursday, January 23, 2025 6:00-7:00 pm Central European Time (AM Session - 9:00-10:00 am Pacific)
America:  Thursday, January 23, 2025, 9:00-10:00 am or 4:00-5:00 pm Pacific Time
Asia Pacific: Friday, January 24, 2025 9-10 am Japan Standard Time (PM Session) 4-5 pm Pacific) 
Off Add to Calendar Disabled America/Los_Angeles
Event format

Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Paul Cohen ([email protected]) with a picture of your student ID to receive your discount code.

Germany Japan South Korea Taiwan United States Savage on Security 1 Recording Tile.jpg Technical
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New horizons for semiconductors have been revealed by innovations in heterogeneous integration, especially due to the availability of an abundance of inter-chiplet wires. All this has implications on security leading to new challenges as well as opportunities. This talk presents an overview on how prior work on 2D SoCs may or may not be helpful in addressing this challenge.

Meet the Speakers

Guest Speaker

Ankur Srivastava

Ankur Srivastava
Director of the Institute for Systems Research
University of Maryland
Biography

Moderator

Warren Savage

Warren Savage
Researcher at University of Maryland
Applied Research Laboratory for Intelligence and Security
Biography

United States

APHI ESD Alliance SiPAT

The ESD Alliance, a SEMI Technology Community, is hosting a webinar series, "Savage on Security," moderated by Warren Savage, Researcher at University of Maryland, Applied Research Laboratory for Intelligence and Security.

Off Add to Calendar Disabled Register Now to Watch the Recorded Event
Event format

SEOUL, Oct. 30, 2024 — DuPont (NYSE: DD) today announced it has been selected for the 2024 Best Partner Award from Samsung Electronics in the Innovation category. The award recognizes DuPont’s development of polishing pads for advanced semiconductor fabrication and was presented at Samsung’s third annual Material-day (M-day) event.

Organized by Samsung Electronics' Materials Technology Group, M-day gathers semiconductor material suppliers and other supply chain partners to discuss materials and technology trends and celebrate outstanding achievements.

DuPont is an innovation leader in polishing pads, slurries and advanced cleans for chemical mechanical planarization (CMP) and continues to invest in the development of new products and features, including offerings for emerging technical performance needs, process efficiency and sustainability. Products such as CMP pads in the Ikonic™ pad family are enabling effective and consistent polishing of semiconductor wafers at the most advanced technology nodes, supporting semiconductor industry advancement for technologies including artificial intelligence (AI), 5G, and data centers.

“Innovation is a collaborative effort, where insight into process requirements and feedback from customers drives product development and optimization,” said Sanjay Kotha, Global Business Director, CMP Technologies, DuPont Electronics & Industrial. “We are honored to be selected for the Best Partner Award for innovation in CMP pads and truly value our relationship with Samsung Electronics. This recognition represents success for our team both for the technical achievements and for the strong collaboration, reflecting our commitment to be a Partner of Choice to our customers.”

At the 2023 M-day event, DuPont was honored by Samsung Electronics with the Best Partner Award in the Environmental, Social and Governance (ESG) category for contributions in establishing a sustainable supply chain by collaborating to develop more sustainable semiconductor materials.

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial, and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. http://electronics.dupont.com

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

PDF Solutions, Inc. (Nasdaq: PDFS), a leading provider of comprehensive data solutions for the semiconductor and electronics ecosystems, today announced it will host an Executive Conference on the power of AI to transform semiconductor design and manufacturing. This event will take place on December 12, 2024, in downtown San Francisco, CA, following the 70th Annual IEEE International Electron Devices Meeting.

This one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on the state of art and best practices to design, deploy, scale, and manage trusted AI/ML solutions across the global semiconductor industry.

Additional information including agenda, logistics, and registration, will be available in the coming weeks.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics ecosystems to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

Registration

For questions or inquiries, please contact: 

Elle Liang

[email protected]

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Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam 360x317_Event_Calendar_Ad_DAI_Analyzing AI_Driven_v1@2x Business Executive
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The wide adoption of Artificial Intelligence is profoundly impacting many industries, perhaps none more so than the semiconductor industry. Beyond serving as a growth driver for chips across a diverse range of applications, AI and semiconductors are beginning a virtuous cycle where AI is helping to design more powerful chips that in turn enable more advanced AI. The semiconductor industry’s path to $1 trillion in annual revenue by the end of the decade is promising, thanks in large part to AI, but what will that journey actually look like?

This webinar will examine the industry’s AI-driven growth opportunities in depth, while looking at the technological innovation needed to fuel the market expansion. Dr. Handel Jones, CEO of IBS, and author of When AI Rules the World, will share his analysis of how AI will shape the outlook for semiconductor end-markets and segments – along with the race to achieve 1.0nm technology nodes and accelerate the virtuous AI-semiconductor development cycle. He will also cover the future of semiconductor market growth in the AI era as well as areas of opportunities.

About IBS

United States

10:00 am - 10:05 am
Ajit Manocha, SEMI
Ajit Manocha
CEO
SEMI

Welcome Remarks

10:05 am - 10:10 am
Pushkar Apte
Pushkar Apte
Strategic Technology Advisor, Smart Data-AI
SEMI

SEMI Smart Data-AI Initiative and Future of Computing Update

10:10 am - 11:00 am
Handel Jones
Dr. Handel Jones
CEO
IBS

Why AI Will Propel the Semiconductor Market to $1 Trillion and Achieve 1.0nm by 2030

11:00 am - 11:15 am

Q&A

Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments.

10:00 am - 11:15 am Off Add to Calendar 2024-11-20 10:00:00 2024-11-20 11:15:00 Analyzing AI-Driven Growth: $1T and Beyond Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On-demand
Event format
Belgium France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Register Now (8-9am PT) Register Now (5-6pm PT) [email protected] Business Executive Featured Speakers
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In today’s fast-paced and interconnected world, the electronics industry faces unprecedented challenges from global disruptions, geopolitical uncertainties, and supply chain vulnerabilities. To remain competitive and resilient, organizations must adopt robust risk management frameworks that proactively identify and mitigate risks.


This webinar is brought to you by the Resiliency Working Group, part of the SEMI Supply Chain Management Initiative. We will explore the creation and implementation of an industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Attendees will learn how to assess potential risks, develop mitigation strategies, and leverage cutting-edge tools to improve visibility and responsiveness across their supply networks.

Key topics include:


•     The critical risks impacting electronics supply chains and how to address them.
•     Best practices for building a resilient and adaptable risk management framework.
•     Strategies for real-time risk monitoring, supplier risk assessments, and scenario planning.
•     How to align your supply chain with industry standards for business continuity and operational stability.

Who should attend:


•    Supply chain managers
•    Risk officers
•    Operations executives
•    Anyone involved in supply chain planning and resilience in the electronics sector

Join us to discover actionable insights and practical approaches to future-proof your electronics supply chain, ensuring it remains resilient, efficient, and prepared for any disruption.
 

Speaker bio:

Austin Evans is the Director of Supply Chain Risk Management at Intel.  He is responsible for overseeing risk management for Intel’s supply chain as well as Intel’s Contingent Workforce Program Office.  His organization is responsible for business continuity, governance, resilience, supply chain security and compliance. 

United States

Austin Evans.jpg
Austin Evans
Director of Supply Chain Risk Management
Intel
Standards

Join us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring.

Off Add to Calendar 2024-10-24 00:00:00 2024-10-24 00:00:00 Building Resilient Supply Chains Join us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

Brooks Instrument, a world leader in advanced flow measurement and control, recently celebrated a grand opening for its new manufacturing facility in Penang, Malaysia, where it produces mass flow controllers (MFCs) used in semiconductor and other critical gas flow control applications.

The 57,000-square-foot plant, which began shipping MFCs in January 2024, is Brooks Instrument’s fourth global production area. The other locations are in the U.S., Hungary, and Korea.

Brooks Instrument is owned by Illinois Tool Works (ITW), one of the world’s leading diversified manufacturers of specialized industrial equipment. ITW has a 42-year history of investment in Penang, with ITW Meritex providing packaging solutions for chips that support semiconductor back-end customers.

The Brooks Instrument grand opening took place at the end of August and included Dato’ Seri SH Wong, President of the Malaysia Semiconductor Industry Association (MSIA) and Dato’ Loo Lee Lian, CEO of InvestPenang, along with several other government officials, industry dignitaries, and customers.

Patty Hartzell, Executive Vice President, Test & Measurement and Electronics at ITW, gave the keynote address and paid tribute to the efforts of the team who made the new facility operational in record time.

“I am proud to say it took less than a year from the time we approved the capital expenditure to the day when the first mass flow controllers were produced in the factory,” said Hartzell.

She also recognized the support Brooks Instrument received from several government and industry groups, including InvestPenang, Majlis Bandaraya Seberang Perai (MBSP), the Malaysian Investment Development Authority (MIDA), Penang Development Corporation (PDC) and MSIA.

The new Penang site includes Brooks Instrument’s largest Class 100 clean room manufacturing area and will allow the company to double its worldwide MFC production capacity. The high-volume facility is mainly producing GF100 series mass flow controllers, which are often viewed as the semiconductor industry standard for reliable and repeatable delivery of process gasses.

The factory also serves as an additional location for manufacturing and parts inventory, complementing the company’s other production facilities while reducing the risk of a supply chain disruption.

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech manufacturing, laboratories and other processes and industries. With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

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Heterogeneous Integration (HI) has come a long way in 50 years. The world of multi-chip modules (MCMs) has given way to a vast ecosystem of chiplets, 3D stacked die, and co-packaging of antenna, high-bandwidth memory (HBM), and optics. HI is at the center of “More than Moore” development activities, as innovative engineers look for creative ways to overcome the slower scaling of silicon technology. The promise of HI is new devices with superior power, performance, area, and cost (PPAC). All these promises come with new challenges. Managing different process nodes, physical characteristics, mechanical stresses, and other system-level challenges not found in monolithic system-on-chip (SoC) devices, creates a great opportunity for design and manufacturing companies to reshape our industry. 

 

In this webinar, we’ll explore this enabling technology from both the device maker and material supplier perspectives. We will learn about demands placed on devices by new applications and what new tools are needed to meet these demands. We will also hear about the challenges placed on materials and equipment suppliers to develop processes capable of manufacturing the individual components and integrating them into final products. Join us as our panel of experts address the issues and opportunities involved with heterogeneous integration. 
 

United States

Arsalam Alam
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging

2nd Generation 3D V-Cache™ Enablement

Andrea Chacko
Andrea Chacko, PhD
Director of Packaging Solutions
Brewer Science
Dong Shun Bai
Dongshun Bai, PhD
Business Development Director and Senior Technologist of Packaging Solutions
Brewer Science

Enabling Heterogeneous Integration through Material Design

The realization of Heterogeneous Integration (HI) has been key in driving advancements in semiconductor technology. The complexities of integrating dissimilar materials continue to be a challenge for HI. All advanced packaging technologies rely on advanced materials to address the many challenges in achieving continued shrinking and improved performance of devices. Novel materials capable of managing mechanical stresses and increased thermal budgets with strict cleanliness requirements are required for processes such as wafer thinning, fan-out wafer-level packaging, and hybrid bonding. This presentation will highlight how advanced materials can address the growing challenges in the industry.

Andrea Maret
Andrea Maret
Senior Knowledge Manager
Entegris

Webinar Moderator

APHI CAST EHS NBMC Smart MFG SMG Sustainability EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI

Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.

10:00 am - 11:00 am Off Add to Calendar 2024-10-16 10:00:00 2024-10-16 11:00:00 Heterogeneous Integration finds its place Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
Event format

Chip Integration Technology Center (CITC) today announced the appointment of Toni Versluijs as the new chairman of its Supervisory Board. Versluijs will serve as the incoming chairman from September through December. Effective January 1, 2025, he will take over the responsibilities from chairman Roel Fonville who is retiring.

Versluijs has an extensive background of more than 25 years in the semiconductor industry, of which more than 15 years in general and executive management roles. Prior to this appointment, he worked for NXP, where he led the In-Vehicle Networking product line and was NXP Nijmegen site director and statutory director of NXP Netherlands. Most recently, he led the Business Group MOS at Nexperia, served as statutory director for Nexperia in the UK and was part of the company’s global executive leadership team.

He explains his choice for CITC: “I look forward to using my many years of experience in the semiconductor industry to contribute to the success of CITC in Nijmegen. Nijmegen is a location with a long heritage in semiconductor packages that have changed the world. CITC is a unique venture and has a unique position between private parties, the academic world and knowledge institutes.”

CITC is a smaller and different kind of organization than his previous employers, but Versluijs sees the potential: “CITC has attracted quite some talent in recent years, built partnerships and initiated new developments. In short: it has laid the foundation for growth, and it will flourish in the coming years. I am convinced that it has the potential to change the world of semiconductor packaging again.”

The current chairman of the CITC Supervisory Board, Roel Fonville, adds: “The Supervisory Board is very pleased to welcome Toni Versluijs to our midst. His personality and broad experience in the industry and in the Nijmegen region will help the Board to fulfill its role in securing the continued development of the organization.”

About CITC
Chip Integration Technology Center (CITC) is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC's contribution to the ecosystem is to provide access to innovation, infrastructure, and education. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by local and regional governments.
www.citc.org

Certified B CorporationTM recertification and 2024 Impact Report accredit commitment to positive impact.

Rolla, MO – July 30, 2024 – Brewer Science, Inc., a global leader in semiconductor innovation, is thrilled to announce its recertification as a Certified B Corporation™. This achievement underscores Brewer Science's steadfast commitment to sustainable business practices and ethical operations.

Certified B Corporations meet high standards of verified social and environmental performance, transparency, and accountability. Brewer Science's recertification reaffirms its dedication to People Using Business as a Force for Good®, aligning with a global movement of companies seeking to balance profit with purpose. Brewer Science received its initial B Corp Certification in 2021. Certified B Corporations are required to renew their certification every three years, by completing a meticulous assessment process conducted by B Lab™, the certifying body of B Corps, which examines over 170 factors while reviewing Brewer Science’s customers and vendors, record of inclusion, community involvement, corporate governance and environmental impact. Key elements such as average employee tenure, charitable giving, energy savings plan, recycling policies, employee volunteer service, and employee upward mobility are also analyzed.

Alongside this milestone, Brewer Science is proud to unveil its 2024 Impact Report, offering a detailed overview of the company's impact across the five key areas identified by B Corp: Governance, Workers, Community, Environment, and Customers.

The 2024 Impact Report showcases Brewer Science's significant achievements and progress in fostering positive impacts within its sphere of influence. Highlights include:

• Environment Impact
o Reducing carbon footprint for Scope 1 and Scope 2 GHG by 80% from baselines (2018) by 2030
o Achieving net zero carbon footprint by 2050

• Customer Impact
o Building a collaborative supply chain
o Participating in industry consortiums, such as SEMI

• Employee Impact
o Improving employee benefits, such as community service leave
o Assessing employee satisfaction through third-party anonymous survey

• Community Impact
o Collaborating with companies, like Askinosie Chocolate, to improve public health
o Supporting STEM education in schools and community organizations

• Governance Impact
o Ensuring equity by being Certified Employee-Owned
o Providing transparency through third-party audits, such as GreenCircle Certified

"Renewing our Certified B Corporation status underscores Brewer Science's ongoing dedication to integrating social and environmental responsibility into our core business strategy," states Terry Brewer, Founder and Executive Chairman of Brewer Science. "Since our initial certification, we've leveraged over three years of experience to amplify our impact across global operations, benefiting our employees, communities, and customers worldwide. We believe in the mission to Use Business as a Force for Good, and we will continue to deliver on our promise to drive positive change and create lasting value for all stakeholders."

Brewer Science's recertification reflects its continuous journey towards driving positive change within the semiconductor industry and beyond. By maintaining B Corp status, the company remains part of a global community of like-minded organizations dedicated to redefining success in business.

To access the 2024 Impact Report and learn more about Brewer Science's sustainability initiatives, please visit www.brewerscience.com/going-green.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.

About B Lab
B Lab is transforming the global economy to benefit all people, communities, and the planet. A leader in economic systems change, the global network creates standards, policies, tools, and programs for business, and we certify companies — known as B Corps — who are leading the way. To date, 8,000 B Corps across 95 countries and 161 industries employ over 750,000 workers, and more than 280,000 companies manage their impact with the B Impact Assessment and the SDG Action Manager. B Lab has created and led efforts to pass over 50 corporate statutes globally that enable stakeholder governance: www.bcorporation.net