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High-performance connectivity software delivers structured, high-volume equipment data required by tier-one fabs and advanced packaging facilities ahead of the expected mid-2026 SEMI standards update

POITIERS, March 25, 2026 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing, today unveils Agil'EDA, a new software solution implementing Equipment Data Acquisition (EDA), a set of SEMI standards also known as Interface A, to enable semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and advanced packaging facilities.

As semiconductor manufacturing moves towards higher levels of automation and data-driven optimization, fab owners increasingly require EDA alongside traditional SECS/GEM connectivity from semiconductor OEMs for their production tools. Agil'EDA addresses this by separating the control flow from the data flow, ensuring that structured, high-frequency data collection does not interfere with critical equipment operations.
Designed for long-term deployment, Agil'EDA fully supports the widely used EDA Freeze 2 (SOAP/XML) and is architected for the transition to Freeze 3 (gRPC/protocol buffers). This next-generation standard offers significantly higher data throughput and reduced latency. Agileo has already successfully tested and validated its EDA Freeze 3 implementation at SEMI’s North America Standards Fall Meetings in November 2024 in Milpitas, California. SEMI’s EDA Freeze 3 standards suite is expected to be released mid-2026.

Complementing the SECS/GEM standards used to control equipment behavior, Agil’EDA incorporates robust cybersecurity features such as authentication and encrypted communications. The product is available as a stand-alone solution for any existing equipment software using a platform-independent gRPC application programming interface (API) to communicate with it or as a pre-integrated component within Agileo’s A²ECF-SEMI framework. When used with Agil'GEM and Agil'GEM300, it provides a comprehensive connectivity solution that significantly reduces time to market for OEMs.

"With the growing demand for data to improve yield in tier-one fabs, as well as in Advanced Packaging and 3D integration, EDA is no longer optional. It is becoming a mandatory requirement for equipment entering the world's most advanced fabs," explains Marc Engel, chief executive officer of Agileo Automation. "The key value we deliver for OEMs is a fast and easy adoption path for a seamless EDA architecture that delivers compliant production machines to global fab customers. By providing a future-proof architecture ready for Freeze 3, which will significantly increase performance, we address OEMs’ current needs while preparing them for the evolving requirements of semiconductor manufacturing, including AI-driven process control."

- ends -

About Agileo Automation
Agileo Automation is a trusted partner for equipment manufacturers, helping them build smarter, automated, and more connected machines that integrate seamlessly into advanced semiconductor fabs. Founded in 2010 in Poitiers, France, Agileo helps OEMs with control, communication, data acquisition, and testing across their tools through proven software and expert support. Its flagship A²ECF-SEMI framework provides a solid foundation for developing equipment controllers fully aligned with SEMI SECS/GEM, GEM300, and EDA standards. As an active member of SEMI and the OPC Foundation, Agileo Automation contributes directly to shaping the standards that drive manufacturing. For more information, please visit our website or follow us on LinkedIn.

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Belgium France Germany Ireland Italy United States Seimconductor Device Assembly Training

Course Description 

This three-day workshop provides a complete overview of the semiconductor manufacturing process. The class focuses on key process steps needed to form a functioning device. Some important science and engineering ideas needed to understand device manufacturing will be discussed. The workshop is designed for non-technical personnel needing an understanding of the fab process steps.  Some technical background from attendees will improve the workshop learning. 

The first day will overview the fab process steps with a brief summary of how a transistor functions. We will discuss how multiple transistors are connected to form a logic or memory device. We will also cover how a transistor works with respect to the physical layout of Bipolar and MOSFET transistors. 

Day two will cover key fab process steps. Ion implantation, photolithography including DUV and EUV processes, plasma processes including deposition and etch, rapid thermal processing, and wet etch processing. Specific emphasis will be given to the different wet etch processes. 

The third day of the workshop will focus on the new transistor designs, including FinFET and CFET designs. We will also cover reasons for changing the transistor design and newer materials, including tantalum, hafnium, silicon germanium, and low-k dielectrics.  We will also review roadmaps of leading companies, including TSMC, Intel, and Samsung. 

After completing the workshop, the student will be able to describe all the fabrication and assembly process steps and have an understanding of how the process steps work together to form the completed integrated circuit, in addition to an understanding of future structures.

 

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Process Technicians
  • Material Engineers
  • Process Engineers
  • Equipment Manufactures
  • Technical Marketing Engineers

Topics Included

  • Silicon wafer manufacturing
  • Basic operating principles of transistors and semiconductor devices
  • Planar, FinFET, and GAA transistor formation and design differences

  • Fab processes needed to form a semiconductor, including the following:

    • Lithography, with a focus on DUV and EUV methods
    • Etching, including wet and plasma processes
    • Deposition, thermal, plasma, electroplating deposition
    • CMP and modern CMP processes

     

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Tom Dory
ITM Consulting, Inc
Instructor Bio

United States

- SEMI U

Strengthen your knowledge and skills by learning about IC packaging, assembly, and package/substrate and Heterogeneous Integration & Chiplets. 

Pricing         

              Early Bird Pricing: $100 off

  • Members:  $799   $699
  • Non-Members:  $849   $749

* * Group pricing for 20+ attendees: $12,900
Any questions, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles Register Now
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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Register now
Belgium Germany Singapore Taiwan United States FEMC 29 tile Business Executive Technical
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Digital Twin is a virtual representation of the structure, context, and behavior of physical systems or a process, with a live link to a physical system serving as a key enabler for predictive and data-driven optimization. In Printed and Flexible Hybrid Electronics (FHE), manufacturing involves multiple interdependent variables—different printing technologies, inks, substrates, and process conditions—each introducing its own complexity. In practice, additional challenges such as equipment drift, batch-to-batch variations, and environmental fluctuations further impact process consistency and yield. Changing a process or transferring it between tools is often difficult, as each setup is highly customized and sensitive to local conditions. To address these challenges, Digital Twin frameworks connect data from design, fabrication, and metrology into continuously learning digital models. They enable early detection of process drifts, virtual experimentation for process development, and data-driven optimization that reduces time, cost, and waste.

This course introduces Digital Twin frameworks for FHE, focusing on Deep Neural Network (DNN)-based predictive models. Participants will learn how to integrate design, fabrication, and metrology data into continuously learning virtual twins that detect process drifts, enable virtual experimentation, and optimize manufacturing. The program covers the full workflow—from image processing and virtual metrology to AI model training, validation, and hyperparameter tuning—using real datasets. A hands-on “Build Your Own Digital Twin” module in Google Colab will provide practical experience in training and refining models for printed electronics applications, equipping attendees with both theoretical insight and applied skills for process optimization and performance prediction.

ABOUT THE SPEAKER

Benyamin Davaji, PhD
Benyamin Davaji is an Assistant Professor in the Department of Electrical and Computer Engineering at Northeastern University, Boston, Massachusetts, where his research centers on integrated microsystems for sensing and computation using mechanical waves. His work spans acoustic and ultrasound transducers, biointerfaces, and microcalorimetry, with a strong emphasis on data-guided nanofabrication, advanced semiconductor device manufacturing, and interdisciplinary approaches to microsystem design and manufacturing. He earned his Ph.D. in Electrical and Computer Engineering from Marquette University in 2016 and completed a postdoctoral appointment at Cornell University.

United States

Davaji Profile picture
Ben Davaji, PhD
Assistant Professor
Northeastern University
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for a Master Class with Benyamin Davaji, PhD, as he introduces Digital Twin frameworks for Printed and Flexible Hybrid Electronics, demonstrating how AI- and DNN-based models integrate design, fabrication, and metrology data along with printing technologies to detect process drift, enable virtual experimentation, and optimize manufacturing performance. Participants gain hands-on experience building continuously learning digital twins to reduce variability, cost, and time to optimization. 

10:00 am - 12:00 pm Off Add to Calendar 2026-06-10 10:00:00 2026-06-10 12:00:00 FEMC#29 Digital Twins for Printed Electronics: How Can AI Learn FHE Printing? Join us for a Master Class with Benyamin Davaji, PhD, as he introduces Digital Twin frameworks for Printed and Flexible Hybrid Electronics, demonstrating how AI- and DNN-based models integrate design, fabrication, and metrology data along with printing technologies to detect process drift, enable virtual experimentation, and optimize manufacturing performance. Participants gain hands-on experience building continuously learning digital twins to reduce variability, cost, and time to optimization.  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
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Belgium France Germany Ireland Italy United States Fundamentals of ALD, ALE and Precursors Chemistries Training

Course Description 

This course provides a practical introduction to atomic layer deposition, an essential technique in semiconductor manufacturing. You'll learn about ALD foundational concepts, including growth, advantages, measurements, and more, chemical precursors for use in ALD, selected ALD processes, area-selective deposition, and atomic layer etching. Overall, the applications and chemistry used in semiconductor processing, as they relate to ALD and ALE, are heavily discussed.

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Engeineers
  • Managers
  • Process Engineers
  • R&D Engineers
  • Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

  • Understanding foundational concepts of ALD.
  • Describe chemical precursors for ALD applications.
  • Identify selected ALD processes and their associated films and materials. 
  • Explain area-selective deposition (ASD), and its uses.

  • Describe Atomic Layer Etching (ALE) concepts and understand it's relationship to ALD.

     

 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

Dr. Chuck Winter
Dr. Chuck Winter
Instructor
- SEMI U

Discover how atomic-scale precision is revolutionizing semiconductor manufacturing with Atomic Layer Deposition (ALD) and Etching (ALE). Course topics include ALD foundational concepts, Chemical Precursors and Processes, and Advanced ALD Techniques. 

Pricing

          Early Bird Pricing $100 off

  • Members: $845   $745
  • Non-Members: $945  $845

* Group pricing for 20+ attendees: $9900
Any questions, please contact [email protected]

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Location: Richardson, Texas

Modus Test, a leader in advanced test socket testing solutions and performance validation, and yieldWerx, a semiconductor data and yield analytics platform, today announced a strategic partnership to help close the gap between test hardware and yield intelligence. The collaboration combines Modus Test’s high-performance socket test technology with yieldWerx’s enterprise-scale yield management platform to provide manufacturers with direct visibility into the relationship between socket health and device performance.

The partnership addresses a long-standing disconnect between test execution and data analytics in high- volume manufacturing. Degraded, misaligned, or worn sockets can introduce false failures or escapes without clear root-cause identification. By integrating hardware performance data with yield analytics, manufacturers can better distinguish contact-related artifacts from true silicon failures.
Through this partnership, customers can now:
• Monitor and trend socket performance across testers, sites, and handlers
• Correlate device failures to specific sockets, test cells, or contact events
• Identify unnecessary device rejects caused by socket degradation
• Detect potential escapes where devices pass due to intermittent contact issues
• Optimize preventive maintenance cycles using data-driven insights

By integrating Modus Test equipment data with yieldWerx’s wafer-, lot-, and device-level analytics, manufacturers gain the ability to separate true device behavior from test interface variability, improving confidence in test outcomes and accelerating root-cause resolution.

About yieldWerx
yieldWerx provides a semiconductor yield management platform that enables manufacturers to collect, analyze, and act on production data across the manufacturing lifecycle. The platform consolidates data from wafer fabrication through final test, delivering visibility into product quality, process performance, and yield improvement opportunities.

About ModusTest
Modus Test, LLC was founded on the idea that there are creative ways to improve results by combining innovation with the best-known methods in test design and manufacturing. Providing innovative test solutions includes the MPT series of parametric tests, systems, and accessories. Modus Test has a global presence and the capability to support customers in all the IC development centers and high-volume manufacturing sites around the world. See for yourself how combining innovation with best-known methods can improve your results.

Statements from Leadership
“yieldWerx was built to unify disparate manufacturing data into actionable yield intelligence,” said Aftkhar Aslam, CEO of yieldWerx. “Valuable data exists across testers, handlers, sockets, MES systems, and inspection tools, but it often remains siloed. Our platform connects these domains into a unified analytical framework that enables faster, data-driven decisions that reduce costs.”

“This partnership represents an important step forward in bringing greater transparency and intelligence to semiconductor test,” said Jesse Ko, COO of Modus Test. “Modus Test’s high-performance socket validation solutions, combined with yieldWerx’s powerful analytics platform, create a closed-loop ecosystem where hardware performance and yield outcomes are fully correlated. Together, we are enabling a smarter, more adaptive test environment.”

For further information, please visit https://www.yieldWerx.com or https://www.ModusTest.org.

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Belgium France Germany Ireland Italy Overview of Semiconductor Manufacturing 5/27 Training

Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing: Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
  • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
  • Etching and Cleaning Processes: Plasma and wet etching processes
  • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
  • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
  • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
  • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
  • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Testimonials 

See what course participants had to say about this course!

  • "The expansive width of coverage with sufficient depth; well curated, relevant information with live references, and the open style of delivery which made the course more of a sharing than a lecture, was enjoyable."
  • "Denny's knowledge and ability to explain things in simplified ways was awesome!"
  • "I really enjoyed going over the topics and watching the in-depth videos. I also liked how we received the slide information prior to the class."
  • "The range of topics was perfect for an intro course."
  • "Denny did a great job explaining complex topics. The opportunity to ask questions directly was beneficial for the entire class. If a question couldn't be answered immediately, it was addressed by the next break at the latest."
  • "Thank you very much for the informative course. I appreciate the in-depth and in-detail insight in all aspects of Semiconductor Manufacturing!"

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

Germany

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Pricing

Early Bird Special - $100 off  

  • Members: $995 $895
  • Non-Members: $1095 $995

* Group pricing for up to 20+ attendees: $12,900
Any questions, please contact [email protected]

8:00 am - 4:30 pm Off Add to Calendar 2026-05-27 08:00:00 2026-05-28 16:30:00 Overview of Semiconductor Manufacturing (Europe) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingEarly Bird Special - $100 off  Members: $995 $895Non-Members: $1095 $995* Group pricing for up to 20+ attendees: $12,900Any questions, please contact [email protected] Germany SEMI.org [email protected] Europe/Berlin public Europe/Berlin Register Now
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Registration Details

Registration is required for this event as it is likely to reach maximum room capacity, at which point interested attendees will be waitlisted.

SEMI Members:  $150

Non-Members of SEMI:  $200

Refunds possible before May 1, 2026.  Substitutions allowed up to May 20.

Questions? Contact James Amano at [email protected].

Register Now
Belgium China France Germany India Ireland Italy Japan Singapore South Korea Taiwan United States 2026 EHS Summit Banner Business Executive Technical

The Summit includes strategic business and technical information for many levels and sectors of the ecosystem, including:

  • Government relations/advocacy staff
  • EHS regulatory professionals
  • Senior executives
  • Business development
  • Device manufacturers
  • Equipment suppliers
  • Materials suppliers
  • Component suppliers
  • Fab and facility systems construction companies

SEMI
673 South Milpitas Blvd.
Milpitas, CA 95035
United States

8:30 am

Badge Pickup and Networking

9:00 am
Joe Stockunas
Joe Stockunas
President, SEMI Americas
SEMI

Welcome and Introduction

9:05 am
James Amano
James Amano
Senior Director, EHS
SEMI

SEMI EHS Overview

9:20 am
Russ Lamotte
K. Russell LaMotte
Principal
Beveridge & Diamond, PC

US Regulatory Landscape: PFAS, PIP, TTR, and more

9:50 am
Iranda Chaki
Iranda Chaki
Senior Policy Coordinator
SEMI Europe

Europe: PFAS Restriction, POPs, F-Gas, GENESIS, REACH

10:15 am

Break

10:45 am
Michael Golden
Michael Golden
Director, Navy Programs & Microelectronics Initiatives
Office of the Deputy Assistant Secretary of War for Product Support

US Department of War Perspective on Semiconductor Supply Chain Risks

11:15 am
Patrick Gottsacker
Patrick Gottsacker
Supply Chain Regulatory Compliance Program Manager
Intel

US EPA: TSCA New Substances of Concern

11:45 am

Morning Session Q&A

12:15 pm

Lunch & Networking

1:15 pm
James Amano
James Amano
Senior Director, EHS
SEMI

Review of afternoon agenda

1:20 pm
Andrew Petraszak
Andrew Petraszak
Tokyo Electron
Patrick Gottsacker
Patrick Gottsacker
Intel

PFAS Transparency

1:50 pm
Masahide Yodogawa
Masahide Yodogawa
Director, Technology Co-Creation Promotion Group
AGC, Inc.

PFAS Recycling

2:15 pm
Ben Kallen
Ben Kallen
Sr. Manager, Public Policy & Advocacy
SEMI
Andrew Petraszak
Andrew Petraszak
Tokyo Electron

SEMI Washington DC Update: Federal and State-level Advocacy

2:40 pm

Afternoon Q&A

3:00 pm - 3:30 pm

Networking

EHS Sustainability Standards

Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California at the 2026 SEMI EHS Summit.

Industry experts will present on the regulatory matters that will impact the industry in 2026 and beyond, followed by discussions on taking collective action to strengthen semiconductor manufacturing. 

Topics:

  • US Regulatory Landscape under second Trump Administration
  • US State-level legislation
  • Europe: PFAS restriction, REACH restriction, Packaging and Packaging Waste Regulation, GENESIS Consortium, etc.
  • US Department of War Perspective on Semiconductor Supply Chain Risks
  • Stockholm Convention
  • Emerging regulations in Asia
  • Supply Chain Transparency
  • US EPA Technology Transition Rule (HFC Phasedown)
  • US EPA TSCA New Substances of Concern

Attend, network and strategically prepare your company.  This is an in-person event only.

8:30 am - 3:30 pm Off Add to Calendar 2026-05-28 08:30:00 2026-05-28 15:30:00 2026 EHS Summit Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California at the 2026 SEMI EHS Summit.Industry experts will present on the regulatory matters that will impact the industry in 2026 and beyond, followed by discussions on taking collective action to strengthen semiconductor manufacturing. Topics:US Regulatory Landscape under second Trump AdministrationUS State-level legislationEurope: PFAS restriction, REACH restriction, Packaging and Packaging Waste Regulation, GENESIS Consortium, etc.US Department of War Perspective on Semiconductor Supply Chain RisksStockholm ConventionEmerging regulations in AsiaSupply Chain TransparencyUS EPA Technology Transition Rule (HFC Phasedown)US EPA TSCA New Substances of ConcernAttend, network and strategically prepare your company.  This is an in-person event only. SEMI 673 South Milpitas Blvd. Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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The Challenge

Ayar Labs’ engineering teams faced challenges ingesting and analyzing non-standard test data across electro-optical and final test flows while scaling to meet aggressive go-to-market timelines. They sought a test analytics partner capable of loading, validating, and extracting insights from diverse datasets while supporting real-time alerting, yield recovery, and deep engineering analytics.

The Implementation

Week 1–2: Connecting the Pipes

Within the first two weeks, a secure cloud instance of yieldWerx was deployed, and raw data files were streaming in. The platform’s flexible pipelines ingested test data without custom code. The yieldWerx team went further, helping refine business rules, improve data quality, and enrich the information for greater downstream impact.

Week 3: First Insights

By week three, live dashboards were operational. Engineers could view wafer maps, outlier signatures, and correlations that previously required manual effort and scripting. Instead of working across multiple spreadsheets, they now had traceable, drill-down analytics at their fingertips.

Week 4: Real Results

In less than a month, the system was already supporting real yield decisions. Lots that previously required lengthy reviews were dispositioned in hours. Engineers trusted the analytics, and leadership recognized the tangible impact on quality and time-to-market. Ayar Labs is now preparing to onboard additional data formats, including qualification, reliability, and characterization.

The Outcome

The 30-Day Challenge demonstrated that yieldWerx is not just another analytics solution. In weeks, not months, yieldWerx moved from fragmented data to a unified platform that drives yield improvement, accelerates ramps, and reduces risk.

About yieldWerx

yieldWerx, an industry leader in semiconductor yield management, provides a platform that enables manufacturers to collect, validate, and act on production data across the entire semiconductor manufacturing lifecycle.

About Ayar Labs

Ayar Labs, a leader in optical engines for co-packaged optics, is transforming AI infrastructure by accelerating data movement in scale-up networks. Its industry-first optical I/O solution enables customers to maximize compute efficiency and performance while reducing costs, latency, and power consumption. Based on open standards and optimized for AI training and inference, Ayar Labs’ optical interconnect solutions are backed by a robust ecosystem to easily integrate into AI systems at scale. Ayar Labs was founded in 2015 and is funded by domestic and international venture capital firms, as well as strategic investors including AMD, Applied Ventures, GlobalFoundries, Hewlett Packard Pathfinder, Intel Capital, and NVIDIA.

Statements from Leadership

“Our collaboration with yieldWerx gave us measurable results in just 30 days. Their platform ingested
our complex photonics data, and the insights have accelerated how we make yield and quality decisions.”

— Garth Thompson, CIO, Ayar Labs

“Partnering with Ayar Labs has been both inspiring and validating. Photonics test data is some of the most complex in the industry, spanning electrical, optical, and multi-dimensional signatures that traditionally take months to integrate. Delivering measurable results in just 30 days shows the power of a unified, modern analytics platform. We’re proud that yieldWerx is helping Ayar Labs accelerate their roadmap, improve yields, and bring truly groundbreaking optical I/O technology to market faster and with higher confidence. “

— Aftkhar Aslam, CEO, yieldWerx
For further information, please visit https://www.yieldWerx.com or https://ayarlabs.com/.

Belgium China France Germany India Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Watch the recording ICP 2026 2 Business Executive Technical
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United States

Sustainability

SEMI Sustainability, in collaboration with STX Group, hosted a webinar on Internal Carbon Pricing (ICP) for the semiconductor value chain. The session was anchored in a new industry report developed with input from members of SEMI’s Carbon Pricing Workgroup and will feature speakers from ASML, Delta Electronics, and Lam Research.  The webinar  highlighted the 5 key steps in creating and implementing your own ICP plan, and understand the process, its benefits and the opportunities offered.

The presentations explored key insights from the report alongside SEMI member perspectives, with speakers sharing practical examples and lessons learned—from early exploration to applied approaches—across the semiconductor value chain. 

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Oxford Instruments, a leading provider of advanced plasma processing solutions, today announced a plasma equipment supply agreement with Applied Optoelectronics Inc. (AOI) (Nasdaq: AAOI), a leading provider of advanced optical and hybrid fibre-coaxial networking products that power the internet, for several etch and deposition cluster systems at their facility in Sugar Land, Texas.

The agreement will support AOI’s transformative expansion and technological advancements in indium phosphide (InP) for optoelectronic device manufacturing, as the company rapidly scales to increase production capacity within the U.S.

As AOI undergoes a significant growth phase, the company is upgrading its production capabilities to meet increasing demand for high-performance InP optoelectronic devices. Oxford Instruments’ advanced plasma etch and deposition processing systems will play a key role in this transformation by supporting AOI with fully automated 3-4-6-inch capable production systems for InP processes.

“AOI is expanding its U.S. manufacturing capacity in Texas to support demand for our optical transceivers in AI datacentres, and key suppliers like Oxford Instruments will help us continue to upgrade our fully automated production line,” said Fred Chang, Senior Vice President and North American General Manager at AOI. “With our combined technology, we can speed the processing of multiple wafer sizes, ranging from 3 to 6 inches, while improving overall quality and reducing costs.”

“AOI has been a valued long-term partner, and we are thrilled to have earned their trust as the chosen supplier for their production expansion and technology upgrades. Our unique high-temperature Electrostatic Chuck (ESC) design, which enables advanced processing capabilities, was a key factor in their decision. AOI also conducted an extensive vendor qualification process, including a visit to our brand-new purpose-built manufacturing facility in Bristol, UK, where we received high praise for our technology and production capabilities,” said Emiel Thijssen, Vice President of Sales and Business Development USA, Oxford Instruments Plasma Technology. “We are also investing significantly to ensure we continue to deliver world-class service capability in the Texas region, focusing on the availability of spares and expanding our field service and process engineering teams, to support the rapid expansion of leading manufacturers in the region such as AOI.”

###

 
For media enquiries, please contact:
Grant Baldwin, Head of Marketing
Oxford Instruments Plasma Technology
E: [email protected]
About Oxford Instruments plc
Oxford Instruments provides academic and commercial organisations worldwide with market-leading scientific technology and expertise across its key market segments: Materials Analysis, Healthcare & Life Science and Semiconductors. Innovation is the driving force behind Oxford Instruments' growth and success, supporting its core purpose to accelerate the breakthroughs that create a brighter future for our world. The vigorous search for new ways to make our world greener, healthier and more productive is driving unprecedented levels of R&D investment in new materials and techniques to support productivity and decarbonisation worldwide, creating a significant opportunity for Oxford Instruments to grow.

Oxford Instruments holds a unique position to anticipate global drivers and connect academic researchers with commercial applications engineers, acting as a catalyst that powers real world progress. Founded in 1959 as the first technology business to be spun out from Oxford University, Oxford Instruments is now a global company listed on the FTSE250 index of the London Stock Exchange (OXIG).

For more information, visit www.oxinst.com

About AOI 
Applied Optoelectronics, Inc. (AOI) is a leading developer and manufacturer of advanced optical and HFC networking products that are the building blocks for AI datacentres, CATV and broadband fibre access networks around the world. AOI supplies this critical infrastructure to tier-one customers across cloud computing, CATV broadband, telecom, and FTTH markets. The company has R&D facilities in Atlanta, GA, and engineering and manufacturing facilities at its corporate headquarters in Sugar Land, TX, as well as in Taipei, Taiwan and Ningbo, China. For additional information, visit www.ao-inc.com. 

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