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BERLIN, Germany ─ March 15, 2022 – To strengthen cybersecurity for semiconductor manufacturing in Europe, the industry must unify behind security standards, support decision-makers in adopting new technologies, and identify new skill sets needed to deploy and manage cybersecurity hardware, SEMI, the global industry association representing the electronics manufacturing and design supply chain, announced today. The findings mark the conclusion of a joint industry project on cybersecurity led by Coventry University’s Centre for Future Transport and Cities (CFTC) Systems Security Group (SSG) to examine drivers of computer hardware security adoption among businesses and consumers. The final report is now available.

SEMI logo“With hardware security critically important to the semiconductor industry, this project is a great step toward strengthening manufacturing cybersecurity to enable a safe and secure digital life,” said Laith Altimime, president of SEMI Europe. “SEMI welcomes the findings and will address these cybersecurity issues with our members. We thank the SSG research team for its invaluable support and are pleased to have partnered with it on this strategic initiative.”

The project, approved by the U.K. government’s Economic and Social Research Council (ESRC)-funded Discribe (Digital Security by Design Social Science) Hub, sought to identify the highest business costs of deploying cybersecurity solutions and reasons businesses do not implement stronger cybersecurity measures.

Following are key findings:  

  • The secure hardware ecosystem welcomes unified standards and common needs. Compliance and standards are main drivers of the adoption of secure hardware.
  • Support decision-makers in making adoption decisions.When gauging the costs and benefits of deploying cybersecurity hardware, companies must assess effectiveness at a systemic level.
  • Identify new skills sets needed to help drive adoption. Cybersecurity developers must identify overlaps between existing and new skills in order to effectively deploy security solutions. Developers also need sufficient support to leverage new hardware features.

Discribe funded the project in its mission to promote the commercial adoption of security technologies, expand the deployment of cybersecurity and ultimately help protect global economies against cyberattacks.

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

BRUSSELS, Belgium ─ February 08, 2022 – SEMI, the global industry association representing the electronics manufacturing and design supply chain, today applauded the publication of the European Chips Act. Launched to reinvigorate semiconductor manufacturing and innovation, the act calls to quadruple Europe’s production capacity by 2030 and lays out measures to avoid future supply chain disruptions.

SEMI logoUnder the act, the European Commission is called to step up investments in Europe’s capabilities to innovate in the design, production and packaging of advanced chips. Additionally, the act aims to strengthen the European Union’s R&D leadership and to address the skills shortages in the region.

“SEMI supports the European Chips Act and similar legislation and incentives designed to strengthen the resilience of the global semiconductor industry and create a more robust supply chain,” said Ajit Manocha, SEMI president and CEO. “The current chip shortage has extended lead times for semiconductor manufacturing equipment and materials, thus delaying efforts to expand semiconductor production capacity. To maximize the effectiveness of incentives aimed at expanding capacity and addressing extended supply chain issues, they should include investments in both new and existing semiconductor manufacturing equipment and materials facilities.”

“The European Chips Act is about bolstering Europe’s strengths,” said Luc Van den hove, chairman of the Semi Europe Advisory Board and president and CEO at imec. “By building on Europe’s unique assets, such as its leading equipment and material suppliers and its top-notch R&D, and by strengthening its manufacturing capabilities, both for mature as well as advanced technologies, Europe will reinforce its position in the global semiconductor ecosystem. This will secure Europe’s access to chip supplies that are indispensable for Europe's dominant industrial markets, as well as for its flourishing deep-tech start-up scene. Advanced chip technologies will pave the way to the next generation of innovative applications in autonomous cars, AR/VR, 6G-communication networks, smart robots, health diagnostics and personalized therapies. We are excited about this bold initiative to boost the European industry and are looking forward to contribute to it”.

“SEMI and the regional electronics ecosystem see the European Chip Act as a major step forward to advance the resilience and growth of the semiconductor industry in Europe,” said Laith Altimime, president of SEMI Europe. “With the shortage of critical components impacting the growth of numerous industries globally, we applaud the introduction of this timely initiative. We look forward to work with the European Commission and SEMI members to support this proposal and strengthen the European semiconductor ecosystem.” 

The European Chips Act is a key step forward to reinforce Europe’s capacities in semiconductors as a precondition for its future competitiveness, as well as a matter of technological security. The act is designed to build on the strengths of Europe’s semiconductor ecosystem and to address its weaknesses, supporting the European Union’s aims to develop a thriving, resilient supply chain and set measures to prepare for, anticipate and respond to future disruptions.

The European Chips Act is centred around five strategic objectives for the region:

  • Strengthen its research and technology leadership
  • Build and reinforce its own capacity to innovate in the design, manufacturing, and packaging of advanced chips, and turn them into manufactured products
  • Put in place an adequate framework to substantially increase its production capacity by 2030
  • Address the acute skills shortage, attract new talent, and support the emergence of a skilled workforce
  • Develop an in-depth understanding of global semiconductor supply chains

The unveiling of the European Chips Act is in line with similar initiatives to support semiconductor industry growth around the world. For example, in the United States, current legislation under consideration calls for US$52 billion in funding to increase domestic semiconductor production. Similarly, South Korea’s National Assembly approved rules and tax incentives to support and safeguard the local semiconductor industry, while China established 15 local semiconductor funds in a bid to supply 70% of its own chips needs by 2025.

Visit SEMI Global Advocacy and SEMI Europe Advocacy to learn more about SEMI public policy efforts.
 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
 

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

BRUSSELS, Belgium ─ January 25, 2022  SEMI announced today the return of the Industry Strategy Symposium Europe (ISS Europe) 2022 as an in-person event to Brussels, Belgium, May 30, with insights from leading analysts, economists, policymakers and technologists on major forces impacting the semiconductor industry. The annual symposium offers business leaders’ perspectives on industry growth trends and intelligence to help ensure their company business plans and forecasts are based on current market conditions. Registration is now open.

ISS Europe logoThemed Resilient Europe: Semiconductors Enabling a Sustainable Digital Life, ISS Europe 2022 will examine economic, technology, market, business, and geopolitical developments and trends influencing the global electronics manufacturing industry, along with their implications for strategic business decisions. 

“2022 is a critical year for semiconductor industry leaders to seize growth opportunities for Europe by ensuring more sustainable and resilient operations,” said Laith Altimime, president of SEMI Europe. “As digital transformation accelerates, the industry is rising in importance in Europe as a force of competitive advantage, with strong implications for our future and the climate.”

ISS Europe 2022 Highlights

SESSION 1: Making Environmental Sustainability Happen

Industry leaders will explore ways for companies to focus on sustainability, increasingly embed green practices into their business models, and target disruptive innovations to reach decarbonization and other goals now being established worldwide. 

SESSION 2: Longevity of the Semiconductor Industry through Social Responsibility

Experts will take a deep dive into organizational strategies and initiatives to address the semiconductor industry’s talent crisis and make workplaces more inclusive. The session will highlight key diversity and inclusion trends impacting societies and the importance of industry role models while offering takeaways for company leaders.

SESSION 3: Strengthening Europe by Resilience in the Supply Chain

Europe is well-positioned to expand its semiconductor manufacturing industry and foster greater supply chain resilience of its microelectronics industry to help fuel EU economic growth. This session will focus on the critical need for Europe to bolster the resilience of its semiconductor industry and improve its independence.

For more details, please visit the ISS Europe 2022 website and connect with SEMI Europe on Twitter or LinkedIn – @SEMIEurope, #ISSEurope

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

BRUSSELS, Belgium – 12 January, 2022 – SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, has issued recommendations to the European Commission for growing Europe semiconductor ecosystem resilience and competitiveness. The recommendations focus on the critical need for Europe to strengthen its microelectronics ecosystem with a long-term, forward-looking semiconductor manufacturing strategy and regulations that encourage more innovation. A diversified global network of suppliers and stronger strategic partnerships are key to that strategy.  

SEMI logo“Semiconductors must remain at the core of Europe’s industrial and technological ambitions,” said Laith Altimime, president of SEMI Europe. “With the launch of the Industrial Alliance on Processors and Semiconductor Technologies and the announcement of the European CHIPS Act, Europe has taken a pivotal step in securing supply chain resilience and future competitiveness of its microelectronics ecosystem.” 

The alliance and European CHIPS Act will be central to ensuring the funding, suppliers, and networks critical to Europe’s semiconductor ecosystem. The recommendations are aimed at building on Europe’s strategic position in embedded electronics to make it a global center of technological excellence and leadership in driving disruptive innovations.

SEMI Europe outlined the following recommendations to increase the resilience and competitiveness of the semiconductor ecosystem in Europe. The recommendations were approved by Luc Van den hove, SEMI Europe Advisory Board chair and president and CEO of imec, and board members. 

Manufacturing

  • Expand semiconductor manufacturing capacities with a focus on end-sector needs to maintain global leadership and market share.
  • Advance Europe’s leadership in international standardization of smart manufacturing technologies.
  • Support the introduction of circular economy strategies in semiconductor manufacturing.

Research and Innovation

  • Create pan-European research, innovation and development roadmaps for advanced semiconductor technologies.
  • Establish a European Semiconductor Technologies Innovation Observatory.
  • Enhance protections for Europe’s collective research and development (R&D) data by safeguarding the sharing and transfer of knowledge among industry, academia and Research and Technology Organizations (RTOs).
  • Create a European Semiconductor Fund to help scale European semiconductor innovation capacity.

Supply Chains

  • Encourage the sharing of best practices and approaches to mitigate future supply chain risks.
  • Develop common strategies for better securing the semiconductor supply chain, including semiconductor equipment, materials, and raw materials.

Skills

  • Leverage Pact for Skills for microelectronics as the foundation for reskilling and upskilling Europe’s talent pool.
  • Promote workforce development and mobility for better access to international technological expertise.

The annual Industry Strategy Symposium Europe (ISS Europe), March 17, 2022, in Brussels, will gather European microelectronics industry leaders and government officials in order to enhance their dialogue and collaboration.

For more information about the initiative, please contact Marek Kysela, Senior Coordinator Advocacy at SEMI Europe, at [email protected].

Visit SEMI Global Advocacy and SEMI Europe Advocacy to learn more about public policy efforts and developments.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

BRUSSELS, Belgium ─ December 28, 2021 ─ SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, urged closer cooperation among European Union member states on technology and prioritization of semiconductor technology ahead of the French Presidency of the Council of the European Union that begins January 1, 2022.

SEMI logoSEMI Europe President Laith Altimime and Soitec CEO Paul Boudre, vice chair of the SEMI Europe Advisory Board, sent a letter to Emmanuel Macron, president of the French Republic, to request that the upcoming French Presidency of the Council of the European Union make it a key priority to encourage deeper collaboration among member states in the interest of advancing the semiconductor industry.

“Only strong leadership among member states and a comprehensive semiconductor strategy can help Europe secure its technological vision,” Altimime said. “SEMI encourages strong member state partnerships to ensure Europe’s long-term resiliency, economic growth and prosperity.”

France is well-positioned to further Europe’s technological ambitions and the value of its electronics manufacturing industry. The region is a key pillar of Europe’s future industrial leadership and resilience, as stated in the recently published description of the European Chips Act and the Alliance on Processors and Semiconductor Technologies, key building blocks of Europe’s technological vision and strategy.

The SEMI position paper Recommendations to Grow Europe Semiconductor Ecosystem Resilience and Competitiveness reflects the views of Europe’s semiconductor ecosystem, focused on manufacturing, innovation, supply chains and skills.

For more information about the initiative, please contact Marek Kysela, senior coordinator of Advocacy at SEMI Europe at [email protected].

Visit SEMI Global Advocacy and SEMI Europe Advocacy to learn more about SEMI public policy efforts.

 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

MUNICH, Germany ─ October 19, 2021 ─ With leading-edge technologies such as artificial intelligence (AI), 5G and robotics at the heart of digital transformation, SEMICON Europa 2021 will convene industry visionaries and experts 16-19 November for insights into the latest innovations and smart applications powering the next wave of semiconductor industry growth. Europe’s premier event connecting the entire electronics design and manufacturing supply chain, SEMICON Europa, co-located with productronica, returns to Messe München, in Munich, Germany for a live exhibition and conferences. Registration is open.

SEMICON Europa logoSemiconductor manufacturing resiliency is growing in importance as the semiconductor supply chain works to overcome disruptions and shortages trigged by the pandemic. SEMICON Europa will explore ways the global supply chain can better withstand shocks in the future. 

“We are excited to welcome back key semiconductor industry players in person in Munich,” said Laith Altimime, president of SEMI Europe. “SEMICON Europa gathers experts across the value chain for the collaboration and innovation critical to Europe’s semiconductor industry growth. Visitors will take a deep dive into how semiconductors are making manufacturing, automotive and healthcare smarter to drive higher efficiency and productivity across a wide range of applications.”

SEMICON Europa 2021 will examine how the semiconductor industry can integrate environmental and social sustainability into its growth strategy to help transform Europe into a sustainable, connected digital hub that enables life-changing applications for current and future generations. The event will also highlight process, materials and technology innovations that make it possible for chipmakers to implement cutting-edge 3D packaging for a broad range of new application-specific technologies.

SEMICON Europa Highlights

  • Executive Forum (New!): European Ecosystems Connecting the Digital Future – 16 November. Presenting organizations: Bosch, Cariad, Edwards Vacuum, European Commission, Fraunhofer EMFT, imec, Intel, Infineon, KLA, CEA-Leti, Merck KGaA, Darmstadt, Germany, NXP Semiconductors, Philips, Samsung, TSMC
  • 25th Fab Management Forum: Expanding European Manufacturing Footprint –17 November
  • Advanced Packaging Conference: Material and Process Challenges in the Era of Digital Transformation – 18 November

Smart Technologies and EU-funded Projects

The new TechARENA in Hall B1 at SEMICON Europa 2021 will feature smart technologies and showcase how semiconductors are enabling technology innovation and solutions to global challenges. Focus topics will be manufacturing, mobility, medical, the future of computing, telecommunications, and workforce development.

The EU Digital Lounge in Hall B1 will provide updates on EU-funded semiconductor projects including the following:

  • MicroElectronics Training, Industry and Skills (METIS)
  • European Cooperation platform of Vocational Excellence in Microelectronics (ECoVEM)
  • Metrology Advances for Digitized Electronics Components and Systems Industry 4.0 (MADEin4)
  • Edge-to-Cloud Intelligence for Resilient Manufacturing (the IMOCO4.E Initiative)

Visit SEMICON Europa programs and conferences for additional details.

SEMICON Europa Premier Sponsors

  • Platinum: Samsung, Tokyo Electron Europe
  • Gold: JCET
  • Silver: Bosch, Evatec, KLA, SCREEN
  • Event sponsors: AP&S, ASE Group, Atotech, DAS Environmental Expert, DB Schenker, DISCO, EBARA, Edwards Vacuum, Flexciton, INFICON, InnoLas Photonics, Merck KGaA, Darmstadt, Germany, Pfeiffer Vacuum, Siconnex Customized Solutions, VAT, YES, ZEISS

For more details, please visit the SEMICON Europa 2021 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

BRUSSELS, BelgiumSeptember 30, 2021 – SEMI, the global industry association representing more than 2,400 semiconductor and electronics manufacturing companies worldwide, today applauded the proposed European Chips Act legislation aimed at strengthening semiconductor research, development, and manufacturing in Europe.

SEMI logoProposed by European Commission President Ursula von der Leyen in her State of the Union speech on September 15, the European Chips Act is part of the Commission’s policies to achieve the digital transformation of the region’s economy by 2030 under its Digital Decade plan.

“SEMI supports incentives for semiconductor manufacturing and supply chain investments such as those proposed to be included in the European Chips Act,” said Ajit Manocha, SEMI president and CEO. “Transparent implementation of such initiatives allows industry participants the opportunity to efficiently strengthen the resilience of the global semiconductor industry and create a more robust supply chain. The current chip shortage has exacerbated backlogs and lead times for semiconductor manufacturing equipment and materials. Given the vital importance of these elements to expanding semiconductor production capacity, incentives should extend to investments in both new and existing semiconductor manufacturing equipment and materials facilities.”

Citing the current shortages and Europe’s dependency on the global chip ecosystem in a recent blog post, Thierry Breton, the European Commissioner for Internal Market, emphasized the Chips Act must ensure the resilience of the semiconductor supply chain across design, production, packaging and equipment. Breton calls for the legislation to strengthen Europe’s ability to develop mega fabs capable of high-volume production of advanced and energy-efficient semiconductors. Additionally, he recommends the Chips Act include strategies for extending the research ambitions of Europe, tightening coordination of chip production among EU member states, and providing a framework for international cooperation and partnerships.

Visit SEMI Global Advocacy and SEMI Europe Advocacy to learn more about public policy efforts and developments.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contacts

Samer Bahou / SEMI Headquarters
Phone: +1.408.943.7870
Email: [email protected]

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

United States Belgium France Germany Ireland Italy Training

Course Description

By the end of this course, participants will understand the scope of SubFAB and its critical role within the semiconductor manufacturing ecosystem, tracing its evolution and recognizing new trends. They will be able to identify and describe the core SubFAB systems and interpret typical facility layouts and equipment installation specifics. Learners will assess the environmental, and sustainability impacts of modern SubFABs. They will map a standard SubFAB organizational chart, typical roles, and responsibilities, and simulate incident-response workflows to reinforce operational readiness. Participants will be exposed to preventive maintenance and safety best practices to ensure reliability and compliance with regulations.

Who Should Attend

This course is designed for engineers and technicians in semiconductor manufacturing, equipment suppliers/OEM on-site service personnel, IE and MEP designers. 

Course Outline

  • Introduction & Course Logistics
    • Welcome, introductions, and platform quick start
    • Learning objectives and course flow
  • Module 1: SubFAB Fundamentals
    • Definition & scope of SubFAB
    • Historical evolution (from early fabs to today)
    • Core equipment & support systems overview
    • Typical facility layouts and installation configurations
  • Module 2: Environmental & Sustainability Considerations
    • Key environmental impacts (emissions, water/chemical use)
    • Gas abatement and PFAS management fundamentals
    • Metrics & case studies in sustainable SubFAB operation
  • Module 3: Organizational & Operational Structures
    • SubFAB org charts and stakeholder roles
    • Operational workflows (from tool install to maintenance)
    • Incident-response and escalation paths (role-play)
  • Module 4: Safety, Maintenance, & Reliability
    • Preventine- maintenance best practices
    • Safety protocols and hazard identification
    • Reliability metrics and continuous improvement loops
  • Module 5: Emerging Trends & Innovations
    • Automation, digital twins, and Industry 4.0 in SubFAB
    • Advanced materials handling and process integration
    • Open discussion: Where SubFAB will go next
  • Wrap-Up & Next Steps
    • Final Q&A and feedback collection
    • Certification requirements and further resources
    • Suggested post-course readings and SEMI standard references 

 

Instructor

Ilya Zabelinksy

Instructor Bio

 

 

 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U Standards

SubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends. 

  • Jerusalem:   6:00 PM - 10:00 PM 
  • England:      4:00 PM -  8:00 PM 
Pricing
  • Members: $349
  • Non-Members: $399

* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar 2026-10-21 08:00:00 2026-10-21 12:00:00 SubFAB 101: Foundations of Semiconductor Support Facilities (Americas/EU) SubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends. Jerusalem:   6:00 PM - 10:00 PM England:      4:00 PM -  8:00 PM PricingMembers: $349Non-Members: $399* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format
Promote in calendar
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Brno, Czech Republic - July 10, 2026

Tescan, a pioneer in electron microscopy, announces the successful completion of its full acquisition by Shimadzu Corporation. As of July 7th, Tescan officially becomes a member of the Shimadzu Group, marking an important milestone in the company’s continued growth and evolution.

This step builds on the strong business alliance established in 2024 and reflects a shared commitment to advancing scientific discoveries and industrial innovations worldwide.
 

“For Tescan customers, this new chapter brings enhanced capabilities, broader expertise, and expanded access to integrated solutions, while preserving the agility, innovation, and customer focus that define the Tescan way,” said Sirine Assaf, CRO, Tescan. 

By combining Tescan’s leadership in surface analysis and electron microscopy technologies, including SEM, FIB-SEM, and TEM, with Shimadzu’s strengths in compositional and materials analysis, customers will benefit from:
 

  • More comprehensive solutions across research, development, and production workflows

  • Deeper application support through combined expertise in materials science, life sciences, and semiconductors

  • Accelerated innovation driven by joint R&D and shared technologies

  • Access to a larger global support network and enhanced service capabilities

  • Expanded product portfolio and future integrated offerings

Importantly, Tescan remains committed to maintaining its customer-centric approach, strong technical support and responsiveness, ensuring continuity in partnerships and daily operations.

Tescan’s growth will be further supported by Shimadzu’s global presence, particularly in Asia, alongside strengthened positions in Europe and the Americas. This will allow Tescan to:
 

  • Reach new markets and customers worldwide 

  • Scale manufacturing and service capabilities

  • Enhance operational efficiency while maintaining flexibility 

At the same time, Tescan will continue to operate from its headquarters in Brno, preserving its identity, expertise, and innovation culture. 

Since its founding in 1991, Tescan has delivered over 4,000 electron microscopes across more than 80 countries, supporting customers in both research and industrial environments. 

This acquisition reinforces Tescan’s long-term strategy to expand its technological leadership and deliver higher-value solutions, ensuring customers remain at the center of its development. 

The successful collaboration between Tescan and Shimadzu has already been demonstrated through the joint “Shimadzu by Tescan” SEM product line introduced in Japan. 

Building on this strong foundation, the integration marks a natural next step in deepening cooperation across technologies and markets. As part of this evolution, Tescan will adopt a new endorsed brand identity, “Tescan, A Shimadzu Company,” across its portfolio and communications. This reflects both the strength of the combined organizations and Tescan’s continued commitment to delivering innovative, customer-focused solutions under a globally recognized framework.

This acquisition is in fully synergy with Tescan and Shimadzu strategic plans and it makrs an acceleration of what Tescan already does best: delivering high-performance systems, application-driven innovation, and close collaboration with customers.

Tescan develops and manufactures advanced electron microscopy solutions for materials science, life sciences, semiconductor research, industrial R&D, and quality control. With a focus on imaging performance, automation, usability, and long-term collaboration, Tescan helps researchers see the invisible and accelerate discovery through reliable, future-ready microscopy workflows.

Belgium France Germany Ireland Italy United States Chip Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices. 

Who Should Attend

This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.   

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Module 1: Semiconductor Fundamentals

    Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.

  • Module 2: Semiconductor Terminologies and Manufacturing Context

    Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.

  • Module 3: Front-end and Back-end Semiconductor Manufacturing

    Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.

  • Module 4: Transistors and Their Operation

    Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits. 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Mayura Padmanabhan
Program Manager
SEMI

 

United States

SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

  • London: 4:00 pm - 8:00 pm 
  • Munich: 5:00 pm - 9:00 pm 

Pricing:                     

  • Members:  $199
  • Non-Members:  $249


Any questions, please contact [email protected]

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