DRESDEN, Germany — June 5, 2024 —The SEMI 3D & Systems Summit, taking place from 12-14 June, 2024 in Dresden, will feature the forefront of technological integration. Themed Heterogeneous Systems for the Intelligently Connected Era, the summit will unravel the intricate web of collaboration among components driving the next wave of innovation. From artificial intelligence algorithms to sensor data processing, attendees will deep dive into the dynamic framework enabling decision-making and real-time applications in an increasingly connected world. Registration is open.

"SEMI Europe looks forward to welcoming leading experts in Dresden. With exceptional speakers and a brand-new exhibition, the Summit offers insights into cutting-edge heterogeneous integration innovations essential for semiconductor applications, driving the advancement of intelligent systems," said Laith Altimime, President of SEMI Europe.

This year’s SEMI 3D & Systems Summit will present a broad scope of topics including:

• AI as a Driver to Grow 3D Technology Implementation
• Accelerating the AI Economy through Heterogeneous Integration
• Heterogeneous Integration for Photonics Applications
• Technology and Market Updates for 2.5D & 3D Packaging for Heterogeneous Integration
• Design and Technologies of Chiplet System Architectures
• Hybrid Bonding Technologies for Advanced 3D Integration
• Manufacturing Innovation for 3D Integration

Featured Speakers 

• Bill Chen, ASE Fellow & Senior Technical Advisor, ASE, Inc.
• Carlos Lee, Director General, EPIC
• Dirk Hilbert, Mayor, City of Dresden
• Jan Vardaman, President, TechSearch International, Inc.
• Frank Bösenberg, Managing Director, Silicon Saxony
• Kurt Herremans, Program Director Automotive Chiplets, imec
• Isabel Obieta, Programme Manager for Sustainable Semiconductors, EISMEA
• Liron Gantz, Manager of the Electro-Optics Group, NVIDIA
• Ming Zhang, VP of R&D, PDF Solutions
• Serge Nicoleau, Group VP of Technology, STMicroelectronics
• Seung Kang, Senior VP of Semiconductor Strategy, Adeia

Global Leaders to Present 

3D & Systems Summit presenters include experts from global leaders:

• Adeia
• ANSYS, Inc.
• ASE, Inc. 
• CEA-Leti
• Comet Yxlon
• EPIC
• European Commission
• EV Group
• Fraunhofer IZM
• HEIDENHAIN
• imec
• KLA Corporation
• Lam Research
• MKS-Atotech
• NVIDIA
• PDF Solutions
• Siemens EDA
• Silicon Saxony
• SPTS Technologies
• STMicroelectronics
• SUSS MicroTec
• TechSearch International, Inc.
• Tokyo Electron Limited
• Yole Group

Networking 

This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise on the second day of the summit.

Networking Dinner Cruise registration is reserved exclusively for 3D & Systems Summit 2024 participants. Guests may register their spouse for dinner by completing the spouse registration form.

Exhibition

The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies at the new exhibition area. Exhibitors include: Adeia, ASE, Inc., ASMPT AMICRA, Besi, CEA-Leti, Comet Yxlon, Confovis, European Chips Diversity Alliance, European Chips Skills Academy, EV Group, Fraunhofer IZM-ASSID, HEIDENHAIN, HiCONNECTS, Lam Research, ProSys, Renishaw, SET Corporation, Tokyo Electron Limited and Wooptix.

To reserve an exhibition space, contact [email protected].

3D & Systems Summit Premium Sponsors

• Platinum: Adeia, ASE, Inc., Comet Yxlon, Heidenhain, KLA Corporation, and Lam Research
• Event: EV Group, Evatec, imec, MKS-Atotech, SÜSS MicroTec and Tokyo Electron Limited

For more details, please visit the 3D & Systems Summit 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#3DSummit).

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI 3D & Systems Summit to Highlight Heterogeneous Systems for Intelligent Decision-Making and Real-Time Applications

Initial Course Programs Designed to Meet Rising Industry Demand for Technicians

MILPITAS, Calif. — May 14, 2023 — Aiming to help the global semiconductor industry address its talent gap by training and upskilling workers, SEMI today announced that its SEMI University™ learning platform now offers online course certification programs designed to fast-track semiconductor career development. Tailored to help meet burgeoning industry demand for technicians, the first two SEMI University Semiconductor Certification Programs are designed for new talent seeking rewarding careers in the industry and experienced workers looking to keep their skills current.

“With semiconductor manufacturers investing heavily in new fabs backed in part by government incentives, SEMI projects the global industry will need 1 million new workers worldwide by 2030 to support the chipmaking expansion,” said Shari Liss, Executive Director of the SEMI Foundation, which drives the SEMI Workforce Development program. “Technicians are in the highest demand, accounting for roughly 40% of the semiconductor workforce worldwide. The SEMI University Certification Program will help meet the industry’s pressing need for a diverse range of training and certification programs to close the talent gap.”

“SEMI University’s new Semiconductor Certification Programs give the industry a fast way to train new talent while enabling current workers to keep pace with its expanding skills requirements,” said SEMI University Director Naresh Naik. “The first two certification programs address critical technician roles. We look forward to adding new certifications to support the industry’s growing workforce needs and career development for our learners.”

The SEMI University Semiconductor Certification Programs include:

• The Semiconductor Technician Certification equips new semiconductor industry workers with the skills necessary to excel in chip manufacturing. The certification program provides comprehensive training in the semiconductor process and on-the-job tasks. Courses cover the function of semiconductors and their manufacture, how electrical circuits work and the physical laws that apply to electrical current, as well as the various applications of electrical testing equipment.
• The Pneumatics/Hydraulics Technician Certification covers the use of vacuum technology in pneumatic systems and hydraulics theory. Courses address the properties of gases and vacuums, how various vacuum types are generated, and hydraulic systems and their components including actuators. The curriculum also compares hydraulic and pneumatic systems.

About SEMI University
The SEMI University learning platform offers more than 575 online courses tailored for the semiconductor industry, providing easy-to-use online training in multiple languages for employees ranging from recently hired facility operators to experienced technicians, engineers and non-technical staff. SEMI U also offers in-person trainings. See the SEMI University Course Calendar.

About the SEMI Workforce Development Program
SEMI has offered in-person training and technology trend for updates more than 50 years, and it hosts webinars covering SEMI standards, market dynamics and semiconductor manufacturing and design best practices. SEMI University builds on this experience and adds to the association’s holistic Workforce Development program offered by the SEMI Foundation.

The non-profit arm of SEMI, the SEMI Foundation works to increase awareness of semiconductor industry careers, connect member companies with university students for mentoring and internships, attract and train military veterans, and develop a more diverse and inclusive workforce. Learn more about semiconductor industry career paths at the SEMI Foundation Career Portal.

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about New SEMI University Online Certification Programs to Fast-Track Semiconductor Skills Development

The European Chip Skills Academy (ECS Academy) Connects Students with Microelectronics Studies to Help Build Talent Pipeline

BRUSSELS, Belgium – May 16, 2024 – University students will connect with professors to explore semiconductor learning paths and employment opportunities at the European Chip Skills Academy Summer School, August 18-23, 2024 in Bologna, Italy. Supported by SEMI and held in collaboration with AENEAS, EPoSS, and Inside, the event is integral to the European Chips Skills Academy, an EU-funded project coordinated by SEMI Europe. The event will be held at the University Residential Centre, University of Bologna, Bertinoro, Italy. Registration is open.

The ECS Academy, funded through the Erasmus+ program, aims to foster dialogue, strategic planning, and actionable steps to help grow the microelectronics industry workforce.

The Summer School will serve as a key initiative of the ECS Academy for 2024, offering insights into current microelectronics technologies and anticipated future applications across the semiconductor value chain.

Summer School Key Topics

• Semiconductor Technology
• Integrated Circuits Design
• Digital Systems and Embedded Intelligence
• Integration, including Packaging and MEMS Technology

Other Event Highlights

• Networking Reception – Meet with peers and industry experts to explore semiconductor industry career paths.
• Meet like-minded students – Interact with peers with similar interests and motivations.
• Explore Bologna: Admire the city’s unique architecture, and in particular the red tiled rooftops.

Enrollment Criteria

The initiative is designed for STEM undergraduates’ students in the following categories:

• Preparing to declare a graduate degree major
• Considering to pursue a master’s degree
• Attending or currently enrolled in a university based in EU Member States and specified countries associated to the program

The Summer School will be complimentary. Some participants may qualify for a travel reimbursement of up to 600 EUR.

Student selection will be based on the applicant’s CV, a motivation letter, recommendation letters, and academic transcripts. The selection process will take into account gender and geographical balance to ensure diverse student backgrounds.

Applications should be submitted by May 19, 17:00 CEST. Selected students will be notified on June 15, 2024.

For more details, please visit the Summer School webpage and connect with SEMI Europe on X or LinkedIn @SEMIEurope and with ECSA on X and LinkedIn (#summerschool #ECSA #talent #microelectronics).

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about European Chips Skills Academy Launches Summer School in Italy to Promote Microelectronics Industry Careers

MUNICH, Germany ─ May 21, 2024 ─ SEMI Europe today announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), Fab Management Forum (FMF), MEMS & Imaging Sensors Summit and during presentations on the show floor.

Europe’s premier event connecting the entire electronics design and manufacturing supply chain, SEMICON Europa 2024 will gather industry-leading experts and innovators to explore cutting-edge technologies, materials, and process advancements driving the digital transformation and growth in the semiconductor industry. The exhibition and conference will be co-located with electronica.

Call for Abstracts – Events

Advanced Packaging Conference ─ Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency

The emergence of new types of neural networks like ChatGPT and other AI applications is driving unprecedented demand for high-performance computing (HPC) and innovations in advanced packaging – including for chiplets – heat dissipation, miniaturization, material integration, and power optimization. Abstracts on topics including growth through innovation, developments in design, manufacturing efficiency, and testing systems are invited.

Fab Management Forum ─ Industry Meets Innovative Ideas

Geared for fab managers, the Fab Management Forum will focus on optimizing next-generation core technologies such as SiC, photonics, and quantum computing to support industry growth. The forum will explore advancements in smart manufacturing solutions that leverage AI-driven tools for efficiency gains to address Europe's environmental sustainability goals and mitigate semiconductor industry-related environmental risks.

MEMS & Imaging Sensors Summit  ─ MEMS and Imaging Young Talent

Entrepreneurs, start-up companies, and graduates will showcase their research and early-stage products to MEMS and imaging sensors technologists. Topics of interest include MEMS technologies, new applications and use cases, advancements in MEMS and sensors technology and materials, MEMS-photonics co-integration, and imaging technologies focused on new sensor applications, materials, and architectures.

Pre-recorded Innovation Presentations ─ Innovation and Collaboration: Powering Sustainable Exponential Growth

SEMI Europe will also highlight microelectronics and semiconductors innovations in short pre-recorded messages, pitches and product announcements by technologists. The videos will be aired on SEMICON Europa 2024 main stages during networking sessions and on the final day of the event.

Presentation abstracts, biographies and headshots must be submitted in English on the SEMICON Europa 2024 Call for Abstracts webpage by June 17, 2024. Selected presenters will be notified in August 2024.

For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#SEMICONEuropa).

SEMICON Europa Premier Sponsors

• Platinum: Comet Yxlon, Edwards, Inficon and Siemens
• Gold: KLA+, Schneider Electric and Synopsys
• Silver: Adeia, Honeywell and Semilab
• Event sponsors: ASE, Inc., IBM, MKS-Atotech, Screen and Watlow

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Maria Daniela Perez/SEMI Europe
Phone: +49 160 2562977
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Europa 2024 Call for Abstracts Opens

 MILPITAS, Calif. – May 14, 2024 – The global semiconductor manufacturing industry in the first quarter of 2024 showed signs of improvement with an uptick in electronic sales, stabilizing inventories and an increase in installed wafer fab capacity, SEMI announced today in its Q1 2024 publication of the Semiconductor Manufacturing Monitor (SMM) Report, prepared in partnership with TechInsights. Stronger industry growth is expected in the second half of the year.

In Q1 2024, electronic sales rose 1% year-over-year (YoY), with Q2 2024 forecast to register a 5% YoY increase. IC sales posted robust 22% YoY growth in Q1 2024 and are expected to surge 21% in Q2 2024 as shipments of high-performance computing (HPC) chips increase and memory pricing continues to improve. IC inventory levels stabilized in Q1 2024 and are expected to improve this quarter.

Installed wafer fab capacity continues to increase and is projected to exceed 40 million wafers per quarter (in 300mm wafer equivalent), rising 1.2% in Q1 2024 with an expected 1.4% uptick in Q2 2024. China continues to log the highest capacity growth among all regions. However, fab utilization rates, particularly for mature nodes, remain a concern with little signs of recovery expected in the first half of 2024. Memory utilization rates were lower than expected in Q1 2024 due to disciplined supply control.

In line with fab utilization trends, semiconductor capital expenditures remain conservative. After falling 17% YoY in Q4 2023, capital expenditures continued to pull back 11% in Q1 2024 before eking out an expected 0.7% gain in Q2 2024. Sequentially in Q2 2024, the trend is turning positive with an expected 8% increase in memory-related capital expenditures as they see slightly stronger growth than non-memory segments.

“Demand in some semiconductor segments is recovering, but the pace of recovery is uneven,” said Clark Tseng, Senior Director of Market Intelligence at SEMI. “AI chips and high-bandwidth memory are currently among devices in the highest demand, leading to increased investment and capacity expansion in these areas. However, the impact of AI chips on IC shipment growth remains limited due to their reliance on a small number of key suppliers.”

“Semiconductor demand in the first half of 2024 is mixed, with memory and logic rebounding due to surging generative AI demand,” said Boris Metodiev, Director of Market Analysis at TechInsights. “However, analog, discrete, and optoelectronics have experienced a slight correction due to the slow recovery of the consumer market coupled with a pullback in demand from the automotive and industrial markets.”

“A full-on recovery is likely to take hold in the second half of the year with the projected boost in consumer demand by AI’s expansion to the edge,” Metodiev said. “Additionally, the automotive and industrial markets are expected to return to growth in the latter part of the year as interest rates fall – providing consumers more purchasing power – and inventory declines.”

Sources: SEMI (www.semi.org) and TechInsights (www.techinsights.com), May 2024

The Semiconductor Manufacturing Monitor (SMM) report provides end-to-end data on the worldwide semiconductor manufacturing industry. The report highlights key trends based on industry indicators including capital equipment, fab capacity, and semiconductor and electronics sales, and includes a capital equipment market forecast. The SMM report also contains two years of quarterly data and a one-quarter outlook for the semiconductor manufacturing supply chain including leading IDM, fabless, foundry, and OSAT companies. An SMM subscription includes quarterly reports.

Download a sample Semiconductor Manufacturing Monitor report. 

For more information on the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. Details on SEMI market data are available at SEMI Market Data.

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Key Measures of Global Semiconductor Manufacturing Industry Strength Improve in Q1 2024, SEMI Reports

SEMI Talent Forum Connects Students, Young Professionals with Semiconductor Companies to Help Build Talent Pipeline

SWANSEA, United Kingdom – April 10, 2024 – Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, May 1, 2024 at the University of Swansea. Sponsored by SEMI, the event will also highlight how technology is reshaping the global workforce. Participation is free of charge for students. Registration is open.

Sponsored by organizations including Catapult, Comet Group, CS Connected, Edwards, KLA, Oxford Instruments, Swansea University, and the Welsh Government, the event will be held at the Great Hall on Swansea University Bay Campus, Fabian Way, Crymlyn Burrows, Swansea SA1 8EN, UK.

The SEMI Talent Forum 2024 is an ideal venue for semiconductor companies to promote their workforce development, diversity and inclusion initiatives to the next generation of industry talent. The forum targets young talent as the semiconductor industry presses ahead to build the workforce critical to innovations in cutting-edge technologies that are transforming how we work and live, including a focus on environmental sustainability. Representatives from Swansea University and the Welsh government will kick off the event.

SEMI Talent Forum Key Topics

• Technologies Addressing Global Challenges
• Microelectronics Enabling Transformative Technologies
• Microelectronics Empowering a Sustainable Future
• Panel Discussion: Exciting Career Opportunities in Microelectronics
• Technology, Diversity and Inclusion

Other Event Highlights

• Tech Demos – Interactive demonstrations of technologies such as virtual reality and augmented reality.
• Career Café – Students and post-graduates will meet with industry leaders to learn about their companies’ work and culture.
• SEMI University – Young talent will learn about SEMI University courses and receive free giveaways at the SEMI stand.
• Student Pitches – Local students will pitch their research on stage.
• Student Poster Exhibition – Local students will showcase their research.
• Networking Reception – Students and industry experts will meet to explore semiconductor industry career paths.

For more details, please visit the SEMI Talent Forum 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#talentforum #digitalfuture)

About SEMI

SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Talent Forum 2024 to Help Build Next-Generation Chip Industry Workforce

VIENNA, Austria — February 13, 2024 — The SEMI Industry Strategy Symposium Europe (ISS Europe) 2024, March 6-8 in Vienna, Austria, will host distinguished speakers to spotlight innovations addressing the semiconductor industry’s sustainability goals, strategies for building supply chain resilience in Europe and approaches to cultivating the future workforce. The speakers will join other key executives from leading semiconductor companies, market analysts, economists and policymakers as they gather at the conference for insights into the latest electronics industry trends, challenges and opportunities. Registration is open.

Themed Key Strategies for Europe’s Success: An Evolving Global Landscape, ISS Europe 2024 will provide industry intelligence that enables attendees to align their company business plans and forecasts with current market conditions. 

“Resilience is not just about bouncing back from setbacks; it's also about anticipating and adapting to challenges in a complex global supply chain before they arise,” said Silke Sorger, Vice President of Procurement at Infineon Technologies, and ISS Europe 2024 distinguished speaker. “Diversifying supply and building strong partnerships are key success factors for Europe’s semiconductor industry to enhance its position as a global leader and to drive sustainable growth for years to come.”

“In the quest for greener IC manufacturing, imec aims to bring together the semiconductor industry," said Jo De Boeck, Executive VP and Chief Strategy Officer at imec. "Collaboratively, we can achieve sustainable practices through a comprehensive understanding of the environmental impacts associated with semiconductor fabrication.”

ISS Europe 2024 Distinguished Speakers  

• Jens Irmscher, VP Purchasing, QMP Sensors, Control Units Automated Driving, Semiconductors, BMW
• Katharina Westrich, Global Head of Vertical Management Semiconductor, Digital Industries, Siemens
• Jochen Thewes, Chairman of the Board of Management, Schenker AG
• Jo De Boeck, Executive VP and Chief Strategy Officer, imec
• Silke Sorger, VP of Procurement, Infineon Technologies
• David Bloss, Corporate VP in Manufacturing Supply Chain and Operations and the GM, Global Sourcing for Equipment and Materials, Intel
• Andreas Lippert, Head of Department (VP) Acquisition, Inward Investment, Saxony Economic Development Corporation
• Mikolaj Trunin, Deputy Director, Invest in Pomerania  
• Sandrine Bronner, VP Supply Chain Semiconductor Division, Edwards
• Juergen Schmidt, VP Semiconductor Manufacturing Frontend, Robert Bosch
• Manfred Horstmann, Managing Director and Senior VP, GlobalFoundries Dresden
• Thomas Richter, Senior VP and Managing Director, Infineon Dresden
• Ivo Raaijmakers, Corporate Vice President and Executive Advisor, ASM
• Miriam Tolksdorf, Global Head Sustainability, Merck KGaA, Darmstadt, Germany
• Handel Jones, Founder and CEO, International Business Strategies (IBS)
• Stephan Haferl, CEO, Comet Group
• Isabel Obieta, Programme Manager for Sustainable Semiconductors, European Innovation Council and SMEs Executive Agency (EISMEA), European Commission
• Jean-Christophe Eloy, President and CEO, Yole Group

ISS Europe 2024 Highlights

Session 1: Market Trends and Key Strategies 
Leading market analysts will address global semiconductor market trends and strategies, highlighting Europe’s challenges and opportunities in an evolving world.

Session 2: End-to-End Supply Chain Resilience

Experts will explore deglobalization trends, ways to secure the semiconductor supply chain and opportunities in both the front and back ends of semiconductor production such as process innovation and equipment advancements.

Session 3: Cultivating the Workforce and Leaders of Tomorrow 

Thought leaders will provide insights into the actionable strategies companies can implement to cultivate the workforce of tomorrow. The discussions will highlight pathways for collaboration, innovation, and strategic partnerships that can strengthen the chip industry.

Session 4: Inspire Innovation, Empower Sustainability 

Experts will examine how integrating advanced technologies – including automation and data analytics – can help address the industry’s sustainability goals, climate change, and growing digitalization.

Session 5: Sustainable Technology Solutions for Future Applications 

Speakers will shed light on coming innovations across diverse applications – such as medical devices, data centers, artificial intelligence, and automotive – and their profound implications for the design and manufacture of semiconductors.

Business Networking

ISS Europe 2024 will feature several networking activities including a welcome reception at the Hilton Vienna Park and an exclusive gala dinner at Hofburg Vienna, where attendees will meet with peers to explore new business partnerships and opportunities.

Sponsors

• Platinum: Comet, Edwards, Macquarie, Schneider Electric, Tokyo Electron Europe
• Gold: ASM, EBARA and Synopsys
• Event: DB Schenker, EV Group (EVG), imec, JSR Micro, Ovivo

For more details, please visit the Industry Strategy Symposium Europe (ISS Europe) 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#ISSEurope).

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI ISS Europe 2024 Distinguished Speakers to Address Sustainability, Supply Chain Resilience and Workforce

MUNICH, Germany ─  October 24, 2023 ─ Themed Shaping a Sustainable $1 Trillion Era, SEMICON Europa 2023 will gather industry experts November 14-17 at Messe München in Munich, Germany for insights into the latest trends and innovations in sustainability, mobility, healthcare, materials, packaging, fab management and workforce development. The event, Europe’s premier exhibition and conference for the microelectronics supply chain, will feature keynotes from the electronics design and manufacturing ecosystem, academia and government. Registration is open.

Co-located with productronica, SEMICON Europa 2023 will feature an exhibition, strategic programs, technical sessions and panel discussions.

"We look forward to hosting leaders from across the value chain to explore new innovations that will help drive continued semiconductor industry growth in Europe and globally," said Laith Altimime, President of SEMI Europe. “Just as importantly, visionaries will gather to offer insights into achieving net zero and overcoming the talent gap. Increased European chip industry investments from the EU Chips Act are vital in enabling semiconductor powerhouses to accelerate the development of sustainable technology solutions that fuel the $1 trillion exponential growth.”

SEMICON Europa Highlights

• CEO Summit: Executives from Cadence, CEA-Leti, Comet Group, Edwards, Infineon Technologies, Intel, imec and TSMC will share perspectives on key topics such as sustainability and innovation paving the way to the future of the European semiconductor industry.
• Advanced Packaging Conference: Industry leaders will showcase packaging innovations driving sustainability in areas like front-end integration megatrends, supply chain solutions, testing, reliability, System in Package (SiP) and power electronics packaging.
• Fab Management Forum: Experts will discuss topics including fab expansions, industrial collaboration models, workforce development, net zero solutions, and smarter manufacturing for a connected ecosystem.
• ITF towards NETZERO - Powered by imec: Industry leaders will discuss environmental challenges and innovative sustainability approaches in the semiconductor industry.
• ALD TechDay – Powered by Beneq: Experts from Yole Intelligence, Beneq and imec will deep dive into innovative Atomic Layer Deposition (ALD) applications.
• SEMI Networking Night: Industry stakeholders will gather to connect with peers and explore new business partnerships.

“ALD has enabled the scaling of logic and memory semiconductor devices,” said Lie Luo, Head of Marketing at Beneq. “Today, ALD is rapidly gaining adoption in specialty device fabrication, including in wide-bandgap GaN and SiC power semiconductors. The ALD TechDay will present ALD adoption trends, equipment and process solutions, as well as innovations in novel architectures, materials, and performance improvements.”

Executive Forum Program

• Global GAAC Summit - Smart Mobility Forum: This forum provides an industry-wide perspective on automotive and electronics value chains while addressing current challenges and exploring solutions in the automotive semiconductor sector.
• Electrification and Power Semiconductors: This session highlights advancements in manufacturing efficiency and next-gen application technologies.
• Smart MedTech Forum: Experts will delve into how real-time data and personalized insights are transforming the healthcare landscape.
• Smart Manufacturing: Leaders will address supply chain optimization, data acquisition, digital twins, manufacturing scheduling, and sustainable manufacturing.
• Empowering People and Industries to Innovate and Invest for a Better Future: Specialists will present approaches to collaboration, funding, growth acceleration, government incentives, net zero goals and sustainability promotion.
• Connecting Automotive to SiC Manufacturing: Advancing SiC manufacturing for semiconductor power not only enhances e-mobility, but also addresses production costs and the growing demand for SiC components, particularly within the automotive sector.
• Fireside Chat with Wolfspeed CFO, Neill Reynolds: Wolfspeed's CFO will discuss the key challenges faced during their global manufacturing expansion and offer advice for chipmakers looking to expand manufacturing capacity worldwide.
• Materials Innovation: This session will explore materials innovation developments and challenges related to modern nanoelectronics technology manufacturing.

TechARENA Program

• Integrated Photonics: This session provides insights into the significance of Photonic Integrated Circuits (PICs) in future of communications, biosensing, and manufacturing.
• Future Disruptions: Future disruptions entail sustainable, energy-efficient semiconductor tech with minimal power use and optimal performance. This session addresses disruptions for capacity enhancement and industry-wide collaboration.
• Future of Computing: Experts will showcase the latest technological advancements in quantum computing, neuromorphic computing, and trusted electronics.
• The Future of Work: Industry leaders will discuss the crucial role of inclusive leadership in developing a diverse and sustainable workforce, addressing the global talent shortage, future leaders' mentorship programs, and the onboarding of new talent.
• SCREEN ─ Innovation For a Sustainable World: Experts will present solutions for research and development topics in Europe and will show new equipment platforms.
• EU Digital Future Forum: EU-funded collaborations enhance productivity, address challenges, and boost profitability. The session explores how these efforts enable next-gen innovation and global competitiveness.
• European PFAS Restriction Proposal: Experts will discuss the use of Per- and polyfluoroalkyl substances (PFAS) in the semiconductor sector in light of the legislative process.
• SOI for Automotive: Industry experts will deep dive into how Silicon on Insulator (SOI) technology is being adopted to solve the challenges of speed, reliability, and sustainability for the automotive sector and other critical industries.
• Film Premiere ─ Chip In: The European premiere of Chip In, a documentary featuring three young adults in their twenties on a tour to explore careers in microelectronics.
• Innovation Showcase: SEMI will highlight microelectronics and semiconductor innovations in pre-recorded messages and product announcements.

For more details, please visit the SEMICON Europa 2023 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

Press and media partners can register for free by contacting Serena Brischetto at [email protected].

SEMICON Europa Sponsors

• Platinum: Cadence, Global Now Pte. Ltd, Koh Young Europe, Macquarie, and Tokyo Electron Europe (TEL)
• Gold: Comet Yxlon, Edwards, Exyte, KLA, Resonac Europe, and Schneider Electric
• Silver: Evatec, Invest in Pomerania, Microchip USA, Semilab, Soitec, SÜSS MicroTec, and ZEISS
• Event sponsors:ASE Global, Atotech an MKS Brand, ATREG, Beneq, DB Schenker, EBARA, Entegris, EVGroup (EVG), Flexciton, Huawei, imec, INFICON, Lam Research, Merck KGaA, Darmstadt, Germany, Panasonic Connect, Photon Delta, Sachsen-Anhalt, Samsung, SCREEN, Synopsys, VAT and Watlow 

About SEMI
SEMI^® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Europa 2023 to Highlight Chip Industry Investments, Sustainability and Talent Strategies to Shape $1 Trillion Era

GRENOBLE, France – September 18, 2023 – Innovation will take center stage at the SEMI MEMS & Imaging Sensors Summit as the event opens tomorrow at the World Trade Center in Grenoble to provide the latest insights into new opportunities for MEMS, imaging and sensors applications and their potential to enable a smarter and more sustainable world. Registration is open for the September 19-21 conference.

“AI and machine learning are driving a new wave of innovative applications in the development and manufacturing of MEMS and image sensors,” said Laith Altimime, President of SEMI Europe. “We look forward to hosting industry thought leaders as they share their visions for how new advances promise to drive the development of more eco-friendly products and applications.”

The event is hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community.

Themed Ubiquitous Sensing for a Sustainable World, the MEMS & Imaging Sensors Summit will highlight recent manufacturing advances in MEMS and imaging sensors, as well as how the latest innovations are enabling intelligent applications in various sectors such as entertainment, medical, communications, and mobility.

Featured Speakers

• Hod Finkelstein, Head of Cameras and Depth, Reality Labs, Meta
• Bernard Kress, Director, Optical Engineering, Augmented Reality Hardware, Google
• Lia Li, Co-founder and CEO, Zero Point Motion
• Kilian Bilger, Vice President Engineering Sensor Components, Bosch
• Theodor Nielsen, CEO, NIL Technology (NILT)
• Isabella Drolz, Vice President of Product Marketing, Comet Yxlon
• Moti Margalit, CEO, SonicEdge
• Martin Croome, Vice President of Marketing, GreenWaves Technologies
• Julia Brueckner, Global Applications & Product Engineering Manager for Packaging & Wafer Business Unit, Corning Incorporated
• Thomas Russell, CEO, Mesoline
• Philippe Andreucci, CEO, Inject Power
• André Henning, Head of R&D, Siemens Healthineers

Gala Dinner and Networking Opportunities

The SEMI MEMS & Imaging Sensors Summit networking opportunities include a complimentary welcome reception on September 19 in the exhibition area at the WTC and a gala dinner on September 20 at the Chateau de Sassenage.

Industry Leaders Exhibiting at MEMS & Imaging Sensors Summit

• Adeia
• AEMtec
• ASE
• Besi
• CEA-Leti
• Comet Yxlon
• Eurofins | MASER
• EV Group (EVG)
• FormFactor
• Okmetic
• OPTIM Wafer Services
• Panasonic Connect Europe
• Philips MEMS & Micro Devices
• Polyteknik AS
• ProSys
• Pyxalis
• SET Corporation
• Siconnex
• Siemens EDA (represented by EDA Solutions Limited)
• SoftMEMS LLC
• Sumitomo Precision Products
• SUSS Microtec
• VTT
• L. Gore & Associates
• Yole Group

Premier Sponsors

• Platinum Sponsors: Adeia, ASE, Infineon, KLA and Siconnex
• Gold Sponsors: Comet Yxlon and SUSS MicroTec
• Event sponsors: Beneq, Caeleste, Evatec, EV Group (EVG), Okmetic and Teledyne MEMS

For more information, please visit the SEMI MEMS & Imaging Sensors Summit website.

Stay in touch on Twitter @SEMIEurope: #MEMSSummit #MEMS #Imaging #SEMIEurope

About SEMI 
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more. 

Association Contacts 

Serena Brischetto/SEMI Europe 
Phone: +49 30 3030 8077-11 
Email: [email protected] 

Michael Hall/SEMI US 
Phone: 1.408.943.7988 
Email: [email protected]

• Read more about SEMI MEMS & Imaging Sensors Summit Opens Tomorrow with Sustainability and Innovation in Focus

MUNICH, Germany ─ September 5, 2023 ─ Experts will gather for insights into the latest advanced packaging and fab management trends and innovations as critical enablers of the path to net zero at SEMICON Europa 2023, November 14-17 at Messe München in Munich. Registration is open for the Advanced Packaging Conference (APC) and Fab Management Forum (FMF).

Co-located with productronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain and featuring a live exhibition and programs.

Advanced Packaging Conference ─ Packaging Innovations Enabling Sustainable Applications

Sustainability is vital to the semiconductor industry growth on its path to $1 trillion, with electrification, renewable energy, connectivity, and AI playing crucial roles. Collaboration and innovation across the semiconductor supply chain will be essential to fueling sustainability.

This year’s Advanced Packaging Conference (APC) will focus on: 

• Megatrends and Opportunities for Advanced Packaging and Front-End Integration
• Smarter Supply Chain Solutions for A Sustainable Ecosystem
• Testing and Reliability
• System in Package (SiP) Requirements for Future Applications
• Power Electronics Packaging

Speakers include experts from AT&S, Atotech an MKS Brand, Cohu, Comet Yxlon, Elmos Semiconductor, Evatec, Fraunhofer Institutes, GlobalFoundries, Henkel, imec, Infineon Technologies, JCET Group, Koh Young Europe, Merck KGaA, Darmstadt, Germany, ProSys, STMicroelectronics, and TSMC.

The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, Merck KGaA, Darmstadt, Germany, Panasonic Connect and Resonac Europe.

Fab Management Forum ─ Strategies for Succeeding Sustainable Growth

Long-term strategies are essential to improving resilience across the European semiconductor supply chain.

This year’s Fab Management Forum (FMF) will focus on:

• Fab Expansion Landscape: Opportunities and Challenges
• Industrial Collaboration Models
• Poster Session: Industry Meets Innovative Ideas
• Cultivating the Workforce of Tomorrow
• Solutions Enabling the Path to Net Zero
• Smarter Manufacturing for a Connected Ecosystem

Speakers include thought leaders from Applied Materials, D-SIMLAB Technologies, INFICON, Infineon Technologies, Intel, Qualcomm, Robert Bosch, Schneider Electric, STMicroelectronics, Texas Instruments, Tokyo Electron Europe, Watlow, Wolfspeed, and X-FAB.

The forum is sponsored by Comet Yxlon, Edwards, Flexciton, INFICON, Sachsen-Anhalt, Schneider Electric, Tokyo Electron Europe (TEL), and Watlow.

Other SEMICON Europa 2023 Highlights

• Opening Ceremony will include keynotes by industry leaders from Cadence, CEA-Leti, Comet Group, Edwards, and imec.
• ITF Towards NETZERO - Powered by imec will explore the environmental impact and resource consumption challenges faced by the semiconductor industry.
• ALD TechDay – Powered by Beneq will feature keynotes from Yole Intelligence, Beneq and imec on innovative Atomic Layer Deposition (ALD)
• Executive Forum Program will delve into semiconductor industry topics such as Smart Mobility, Smart MedTech, Smart and Green Manufacturing, materials innovation, electrification and power semiconductors. The program will also feature a fireside discussion with thought leaders from Wolfspeed and ATREG.
• TechARENA Program will address themes including geopolitics, public policy European-funded projects, workforce development, the future of computing and integrated photonics. The program will also include the European premiere of the Chip in, a documentary featuring three twentysomethings on a tour to explore careers in microelectronics, and a discussion on sustainability innovations with leaders from SCREEN.

Programs in halls B1 and B2 are complimentary for all SEMICON Europa and productronica visitors. For more details, please visit the SEMICON Europa 2023 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

Press and media partners can register for free by contacting Serena Brischetto at [email protected].

SEMICON Europa 2023 Sponsors

• Platinum: Cadence, Koh Young Europe, Macquarie, and Tokyo Electron Europe (TEL)
• Gold: Comet Yxlon, Edwards, KLA and Resonac Europe
• Silver: Evatec, Invest in Pomerania, Soitec, SÜSS MicroTec, and ZEISS
• Event sponsors: ASE Global, Atotech an MKS Brand, ATREG, Beneq, EBARA, Entegris, EVGroup (EVG), Flexciton, imec, INFICON, Merck KGaA, Darmstadt, Germany, Panasonic Connect, Sachsen-Anhalt, Samsung, SCREEN, Synopsys, and Watlow

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Europa 2023 Conferences to Highlight Advanced Packaging and Fab Management as Key Enablers of Sustainability