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BRUSSELS, Belgium — April 11, 2023 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today announced that SEMI Europe, as the lead of a new 18-partner consortium, has won up to €4 million in funding to develop the European Chips Skills Academy, an initiative to help tackle the skills and talent shortages in Europe’s electronics industry and propel its long-term growth. The initiative is backed by more than 30 partner research organizations, vocational and education training providers, certification agencies and industry stakeholders.

ImageThe European Chips Skills Academy will expand on the Microelectronics Pact for Skills and the EU Chips Act to support the microelectronics ecosystem in Europe to attract new talent. The academy will deliver targeted European-wide training in key microelectronics fields such as automotive and additive manufacturing. The grant, provided by the European Commission’s Erasmus+ Programme, will fund the academy for four years.

The European Chips Skills Academy is the second phase of the Microelectronics Training, Industry and Skills (METIS) consortium. Both initiatives are designed to foster microelectronics industry collaboration with key education, training and certification providers to address the skills shortage and European competitiveness.

“The pan-European alliance guiding the European Chips Skills Academy will leverage the diverse and considerable strengths of its many partners from across the microelectronics’ ecosystem and industrial value chain,” said Ajit Manocha, president and CEO of SEMI. “The project aims to bring greater strategic foresight to the evolution of professions and skills in the industry by applying evidence-based, data-driven success metrics to workforce development.”

“Rapid semiconductor industry growth in Europe and around the globe in the years ahead necessitates that we quickly scale up the region’s training efforts and drive greater cohesion of skills strategies across Europe to meet demand for the qualified workers required to sustain innovation and growth,” said Laith Altimime, president of SEMI Europe. “The European Chips Skills Academy will be the first decentralized microelectronics skills provider in Europe to help overcome this critical workforce development challenge.”

“With the call on the Alliances for Sectoral Cooperation on Skills the Commission aims to boost the provision of new skills by designing and creating new curricula for higher education and vocational training, thus supporting the EU Chips Act to address the semiconductor skills shortage and attract new talents and workforce”, said Lucilla Sioli, Director of Artificial Intelligence and Digital Industry in Directorate-General CONNECT at the European Commission. “The European Chips Skills Academy, among other initiatives, will be an important step to support skills development in Europe and to underpin the implementation of the Chips Act across Members States.”

Expected to begin work in autumn 2023, the European Chips Skills Academy consortium consists of the following organizations:

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

Europe Advocacy  

Discover how SEMI Europe Advocacy & Public Policy supports the microelectronics industry across trade, taxes, talent, and R&D or become involved by contacting [email protected].

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

DRESDEN, Germany — April 4, 2023 — Leading experts in 3D integration and systems for semiconductor manufacturing will gather at the annual SEMI 3D & Systems Summit, June 26-28, 2023 in Dresden, for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent systems. The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies. Registration is open.

Logo“We look forward to hosting industry leaders at the 3D & Systems Summit as they deliver insights into cutting-edge advanced packaging solutions,” said Laith Altimime, President of SEMI Europe. “Packaging innovations are critical to semiconductor industry growth, increasing chip performance, reducing power consumption and enabling smaller end devices for emerging and growing segments including autonomous driving, 6G, Internet of Things (IoT), artificial intelligence (AI), and machine learning.”

Themed Smarter Systems through Heterogeneous Integration, this year’s 3D & Systems Summit will feature a broader scope of topics including: 

  • Advanced Packaging: Enabling Moore’s Law’s – The Next Frontier
  • Market Briefing and Technical Roadmap
  • Industrialization and Mass Adoption of 3D Technologies
  • Hybrid Bonding Developments
  • Chiplet Design Packaging: Architectures and Challenges
  • Novel Processes and Interconnect Solutions for 3D
  • Photonics Integration
  • Sustainability
  • Applications Enabled by 3D

3D & Systems Summit Distinguished Speakers

HS Seung Kang, VP of Strategy
Adeia, Inc.
Adeia Logo
HS Raja Swaminathan, Corporate VP
AMD
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HS Rozalia Beica, VP Strategic Marketing & Business Development, Microelectronics Business Unit
AT&S China
Logo
HS Yoan Dupret, Managing Director and CTO
Menta
Menta Logo
HS Pascal Metzger, CEO
SET Corporation S.A.
SET Corporation Logo
HS Luc Augustin, CTO
Smart Photonics
Smart Photonic Logo
HS E. Jan Vardaman, President
TechSearch International, Inc.
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HS Emilie Jolivet, Semiconductor, Memory and Computing Division Director
Yole Group
Yole Group Logo

 

Global Leaders to Present

3D & Systems Summit presenters also include experts from these global leaders:

  • Adeia
  • AMD
  • ASML
  • AT&S China
  • Besi
  • CEA-Leti
  • EPIC
  • EV Group
  • Fraunhofer IIS-EAS
  • Fraunhofer IZM-ASSID
  • imec
  • Intel Corporation
  • KLA Corporation
  • Menta
  • MKS-Atotech
  • Research Fab Microelectronics Germany (FMD) and Fraunhofer Group for Microelectronics
  • SET Corporation S.A.
  • Siemens EDA
  • Smart Photonics
  • SPTS Technologies Ltd., a KLA company
  • SÜSS MicroTec
  • TechSearch International
  • Yole Group

Exhibition and Premium Networking Opportunities

The 3D & Systems Summit will feature business-to-business matchmaking and networking for exploring new partnerships and other business opportunities. This year’s networking dinner will take place on the Elbe River cruise.

To reserve an exhibition space, contact [email protected].

For more details, please visit the 3D & Systems Summit website and connect with SEMI Europe onTwitter or LinkedIn – @SEMIEurope, #3DSummit.

Premium Sponsors


About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance electronics design and manufacturing technology and business. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable more innovative, faster, powerful, and affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

VIENNA, Austria ─ February 15, 2023 ─ SEMI Europe today announced recipients of the European SEMI Award and Special Service Award for 2022 at the SEMI Industry Strategy Symposium Europe (ISS Europe 2023). Melexis chairwoman Françoise Chombar was honored with the European SEMI Award and professor Thomas Skotnicki of Warsaw University of Technology and the Institute of High Pressure Physics (CENTERA Labs) with the Special Service Award.

LogoEstablished more than 30 years ago, the European SEMI Award and Special Service Award recognize key players in the global manufacturing supply chain, highlighting their leadership excellence and strategic contributions that lead to critical advances in the semiconductor industry.

“We are honored to recognize Françoise Chombar and professor Thomas Skotnicki for their outstanding leadership and tremendous contributions to Europe’s semiconductor community,” said Laith Altimime, president of SEMI Europe. “These extraordinary leaders have been instrumental in helping the semiconductor industry fulfill its ambitions and inspiring future generations to drive toward a more equitable, digital and greener future.”

HS“More diversity, equity and inclusion lead to more innovation, increased competitiveness, more decent leadership, higher levels of job satisfaction and a greater sense of community,” Chombar said. “Humbled to receive the 2022 European SEMI Award, I’d like to dedicate it to all the wonderful people I have the chance to collaborate with, and I hope it encourages many more diverse talents to strengthen the exciting semiconductor space, particularly in the EU, a great place to live and work.”

Chombar is Chairwoman and co-founder of Melexis, a fabless company based in Europe. She has served as Melexis CEO for 18 years. She is also president of the STEM-Platform, an advisory board to the Flemish government. Her long-term commitment to actively advocating for more STEM and diversity, equity and inclusion (DEI) is driven by her profound belief in their positive societal impact.

Recognitions for Chombar’s work include the 2016 Vlerick Business School Award for excellence in management, the 2018 BNP Paribas Global Prize for Women Entrepreneurs, the 2019 Flemish Community Honor, and the 2021 Medal of Honor by the Science and Technology Group of KU Leuven. She is UGent Honorary Ambassador for Applied Language Studies and VUB Honorary Science Fellow. In 2020, she was elected to Inspiring Fifty Belgium, a list of inspirational women in tech.

HS“Breakthrough innovation is not a piece of cake,” professor Skotnicki said. “It took me 26 years to convey the UTBB FD CMOS technology from equation to fabrication. This technology is now in production and has been labeled European KET. These great results were made possible by the support, openness, and confidence of my managers at STMicroelectronics, Jean-Marc Chery and Joel Hartmann. The European SEMI Special Award brings me a great satisfaction that I share with my collaborators and Ph.D. students.”

Professor Skotnicki has been active in the semiconductor industry for over 30 years. He joined Telecom France in 1985 and STMicroelectronics in 1999 to become the first Company Fellow and Technical Vice President. He co-leads the CENTERA project (International Research Agenda funded by Foundation for Polish Science) and is professor at Warsaw University of Technology, Poland.

He holds 80 patents has authored nearly 500 scientific papers on CMOS and Energy Harvesting. Professor Skotnicki invented the UTBB FDSOI structure (in production at STMicroelectronics, GlobalFoundries and Samsung). Models of his MASTAR software were used for calculations of CMOS roadmaps. He is an IEEE Fellow, and served on the executive committees for several industry conferences.

Nominations for the 2023 European SEMI Award are open. Please see the award guidelines. Prior European SEMI Award recipients hailed from companies including imec, Soitec, CEA-Leti, Technical University of Dresden, Catholic University of Leuven, STMicroelectronics, EV Group, Infineon, and the Fraunhofer Institute. See the list of past SEMI European Award recipients.

For more details, please visit the European SEMI Award website and connect with SEMI Europe on Twitter or LinkedIn – @SEMIEurope, #EuropeanSEMIAward.

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: 
[email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: 
[email protected]

VIENNA, Austria ─ February 14, 2023 – Key executives from leading semiconductor companies, market analysts, economists and policymakers will gather tomorrow for insights into the latest electronics industry trends, challenges and opportunities at the annual SEMI Industry Strategy Symposium Europe (ISS Europe) 2023 in Vienna, Austria. Registration is open for the Feb. 15-16 executive conference.

LogoThemed EU Chips Act: Realizing Europe’s Ambition by 2030, ISS Europe will highlight economic, technology, market, business, and geopolitical developments influencing the global electronics manufacturing industry as well as their implications for strategic business decisions.

“It is a priority for Europe to accelerate the semiconductor ecosystem by building on existing strengths,” said Christin Eisenschmid, Managing Director, Vice President and General Manager at Intel Germany. “Intel is committed to contributing to this important goal and to help rebalancing the European supply chain.”

“With its traditional strengths in 5G communications, Industry 4.0, and automotive, Europe has tremendous opportunities ahead in semiconductor design,” said Rebecca Dobson, Corporate Vice President EMEA at Cadence. “To convert these opportunities into growth for the region, we need to collaborate across the ecosystem, develop and invest in our workforce, and inspire and support entrepreneurship.”

“Semiconductor technology is at a turning point and complex 3D design architectures enforce the creation of new inspection strategies,” said Dionys van de Ven, President of Comet Yxlon. “Time-to-market is a critical element in semiconductor, and new inspection strategies will ensure sustainable product introductions.”

ISS Europe Distinguished Speakers

ISS Europe Sessions

Session 1: Industry Strategy and Market Forecast

Leading market analysts and policymakers will focus on semiconductor demand drivers both in the near and long terms to help companies position themselves to seize growth opportunities in the years ahead.

Session 2: Vision for Europe 2030

Deglobalization of the semiconductor supply chain will be the featured topic and the session will include a panel discussion featuring thought leaders from Analog Devices, ASE, imec, Intel and Soitec.

Session 3: Disruptive Technology Roadmap: Opportunities Fueled by Digitalization

Experts will discuss the critical role of innovation and disruptive technologies in the emergence of a vast array of electronic applications in industries including medical, automotive, agriculture and cloud computing.

Session 4: Closing the Talent Gap and Cultivating the Workforce of Tomorrow

The session will explore how inclusive leadership is essential to building a diverse and sustainable workforce and overcoming critical industry challenges such as the global talent shortage. The session will include a panel discussion featuring semiconductor industry representatives.

Session 5: Smart and Green Manufacturing Solutions

Thought leaders will provide insights into novel technologies and solutions for improving semiconductor manufacturing efficiencies and reducing the industry’s carbon footprint.

European SEMI Award

Each year since 1989, SEMI Europe has presented the European SEMI Award to a person or team who has made a significant contribution to the European semiconductor, micro-systems, photovoltaic, or display industries. SEMI Europe will announce the 2022 award winners tomorrow, Feb. 15.

Business Networking

ISS Europe 2023 will feature several networking activities including a welcome reception at the Hilton Vienna Park and an exclusive gala dinner at Hofburg Vienna, where attendees will meet with peers to explore new business partnerships and opportunities.

Premium sponsors: ASM, Besi, Cadence, Comet Yxlon, DB Schenker, Ebara, Edwards Vacuum, EV Group, HCLTech, imec, JSR Micro, Merck KGaA, Darmstadt, Germany, MKS’ Atotech, Ovivo, Soitec, Tokyo Electron Europe, and VAT.

For more details, please visit the Industry Strategy Symposium Europe (ISS Europe) 2023 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#ISSEurope).

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

VIENNA, Austria  January 24, 2023 The European Chips Act and Europe’s leading-edge R&D capabilities – both key drivers of Europe’s microelectronics growth – will come into sharp focus at SEMI Industry Strategy Symposium Europe (ISS Europe) 2023 as leading industry executives, analysts, economists, policymakers and technologists gather February 15-16 in Vienna, Austria. Registration is open.

LogoThemed EU Chips Act: Realizing Europe’s Ambition by 2030, ISS Europe 2023 will examine economic, technology, market, business, and social trends influencing the global electronics manufacturing industry.

“The European Chips Act is critical to strengthening Europe’s technological competitiveness and resilience as the region remains at the heart of innovation with its R&D prowess,” said Laith Altimime, president of SEMI Europe. “We look forward to hosting insightful discussions on how to strengthen the semiconductor ecosystem, make even greater contributions to a digital and green future, and power Europe’s sustainable economic growth.”

ISS Europe 2023 Highlights

Session 1: Industry Strategy and Market Forecast

Leading market analysts and policymakers will focus on semiconductor demand drivers both in the near and long terms to help companies position themselves to seize growth opportunities in the years ahead. Presenters include representatives from Cadence, European Commission, Future Horizons, Yole Group, Republic of Austria Federal Ministry, Soitec and STMicroelectronics.

Opening Session: Vision for Europe 2030

Led by Roland Berger, the session will address deglobalization of the semiconductor supply chain and include a panel discussion featuring thought leaders from Analog Devices, imec and Intel.

Session 2: Disruptive Technology Roadmap – Opportunities Fueled by Digitalization

Experts from Comet Yxlon, Infineon Technologies, IBM Research Europe, IMS Nanofabricationimec and VAT will discuss the critical role of innovation and disruptive technologies in the emergence of a vast array of electronic applications in industries including medical, automotive, agriculture and cloud computing.

Session 3: Closing the Talent Gap and Cultivating the Workforce of Tomorrow

Experts will explore how inclusive leadership is essential to building a diverse and sustainable workforce and overcoming critical industry challenges such as the global talent shortage. The session will also feature a panel discussion with representatives from Comet Yxlon, DECISION Etudes & Conseil, Ebara, Edwards and Graz University of Technology.

Session 4: Smart and Green Manufacturing Solutions

Thought leaders from Edwards, Besi, imec, MIDAS Ireland, Schneider Electric and VDE e.V. will provide insights into novel technologies and solutions for improving semiconductor manufacturing efficiencies and reducing the industry’s carbon footprint. 

Business Networking

ISS Europe 2023 will feature several networking activities including a February 15 welcome reception at the Hilton Vienna Park and an exclusive gala dinner at Hofburg Vienna, where  attendees will meet with peers to explore new business partnerships and opportunities.

ISS Europe 2023 premium sponsors: ASM, BesiCadence, Comet Yxlon, DB Schenker, Ebara, Edwards Vacuum, EV Group, imec, Merck KGaA, Darmstadt, Germany, MKS’ Atotech, Ovivo, Soitec, Tokyo Electron Europe, and VAT

For more details, please visit the Industry Strategy Symposium Europe (ISS Europe) 2023 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#ISSEurope).

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

BRUSSELS, Belgium — December 19, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today announced key actions proposed by SEMI Europe and European Commission (EC) representatives in consultation with semiconductor industry stakeholders to overcome the skills shortage in Europe’s microelectronics industry. The actions resulted from a December 2 workshop held in Brussels to support the European Chips Act and address challenges and future opportunities for developing skills critical to Europe’s semiconductor ecosystem.

LogoThe workshop marked the first meeting among SEMI Europe representatives, Lucilla Sioli, Director of Artificial Intelligence and Digital Industry in Directorate-General CONNECT at the European Commission, and more than 80 semiconductor industry stakeholders including representatives from SEMI Europe member companies to discuss key projects under the Pact for Skills for Microelectronics.

Workshop participants including SEMI members Bosch, imec, Intel and onsemi underscored the urgent need for training facilities, STEM graduates and a more diverse workforce, while market research firm Decision Etude and Conseil presented its recent METIS4Skills Strategy 2022 annual update. The report points to a worsening of the talent shortage in Europe since 2020.

The European Chips Act heightens the focus on the need for process engineers, maintenance technicians, process technicians and other semiconductor manufacturing workers.

“We thank the European Commission for its continuous support and collaboration with the semiconductor industry in strengthening Europe’s microelectronics skills ecosystem,” said Laith Altimime, president of SEMI Europe, who participated in the workshop with Christopher Frieling, director of Advocacy and Public Policy at SEMI Europe. “The European semiconductor industry must diversify its talent pool, an effort that requires funding so Europe can develop a sustainable workforce.”

Chip industry stakeholders participating in the workshop in person and virtually discussed common roadblocks to hiring, shared best workforce development practices and highlighted successes of EC, national and semiconductor industry skills initiatives. The participants generated a comprehensive list of actions geared toward improving the image of the semiconductor sector to attract students and young talent, re-skilling and upskilling workers, and sustaining the push for a diverse and inclusive workforce in Europe.

As part of the Erasmus+ project METIS, SEMI Europe will publish a summary of the workshop outcomes and recommendations for concrete follow-up actions in the first quarter of 2023. Examples of actions include:

  • Create an industry image campaign to raise public awareness on how technology is shaping the future, and how workers can establish careers in the semiconductor industry.
  • Remove barriers to entry in the industry for top university graduates in part by retooling immigration policies that affect the microelectronics sector.
  • Harmonize workforce development initiatives within Europe and create a European University Network for Microelectronics with a focus on internship and work opportunities for students.  
  • Inspire children and teenagers to pursue a STEM education, recruit more STEM teachers, attract female teenagers to STEM, and replicate existing talent development initiatives for the microelectronics industry such as competitions for European teenagers to design chips.

The workshop materials are available on the European Commission website. Once the EU Chips Act is enacted, the European Commission will host a second session to refine the actions that emerged from the initial workshop in order to help identify funding opportunities to support skills development in Europe, work that will support 2023 European Year of Skills initiatives.

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

For more details, contact the SEMI Europe Advocacy team:

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: 
[email protected]

VIENNA, Austria  December 13, 2022 Leading analysts, economists, policymakers and technologists will gather at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2023, February 15-16 in Vienna, Austria, to provide the latest insights into major forces impacting the global semiconductor industry. Returning to a live venue, the annual symposium offers business leaders semiconductor industry intelligence and perspectives on growth trends to help ensure their company business plans and forecasts are based on current market conditions. Registration is open, with early bird pricing offered until December 31.

LogoThemed EU Chips Act: Realizing Europe’s Ambition by 2030, ISS Europe 2023 will examine economic, technology, market, business, and social developments and trends influencing the global electronics manufacturing industry. 

“These are exciting times for industry leaders to plan how they can capitalize on growth opportunities in Europe with focus on building more sustainable, resilient operations in the years ahead,” said Laith Altimime, president of SEMI Europe. “The European Chips Act will be instrumental in fulfilling these ambitions and is a particularly compelling opportunity for the European semiconductor industry to accelerate activities critical to Europe’s economic growth while helping people reshape the way they work and live.”

ISS Europe 2023 Highlights

Session 1: Industry Strategy and Market Forecast
Leading market analysts will focus on semiconductor demand drivers both in the near and long terms to help companies position themselves to seize growth opportunities in the years ahead.

Session 2: Closing the Talent Gap and Cultivating the Workforce of Tomorrow
Experts will explore how inclusive leadership is essential to building a diverse and sustainable workforce, as well for overcoming critical industry challenges such as the global talent shortage.

Session 3: Sustainable and Smart Manufacturing Solutions
Thought leaders will provide insights into novel technologies and solutions for improving semiconductor manufacturing efficiencies and reducing the industry’s carbon footprint.  

Session 4: Disruptive Technology Roadmap: Opportunities Fueled by Digitalization
Semiconductors are critical drivers of innovation for a vast array of electronic applications in industries including medical, automotive, agriculture and cloud computing. Industry leaders will discuss the role of innovations and disruptive technologies.

Business Networking

ISS Europe 2023 will feature several networking activities including a February 15 welcome reception at the Hilton Vienna Park and an exclusive gala dinner at Hofburg Vienna, where  attendees will meet with peers to explore new business partnerships and opportunities.

Premium sponsors: ASM, Comet, Ebara, EV Group, imec, Ovivo.

For more details, please visit the Industry Strategy Symposium Europe (ISS Europe) 2023 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#ISSEurope).

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: 
[email protected]

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: 
[email protected]

BRUSSELS, Belgium — December 1, 2022 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded progress by the European Council on the European Chips Act, expressing strong support for the swift start of negotiations with the European Parliament in 2023.

With the European Council’s adoption today of its negotiating mandate, also known as its general approach, member states and the Czech Presidency of the Council have reached a critical milestone in supporting Europe’s efforts to advance semiconductor manufacturing and supplies of critical components while bolstering R&D for next-generation semiconductor innovations. 

Logo“Europe's future as a region of semiconductor manufacturing excellence is brimming with possibility,” said Laith Altimime, president of SEMI Europe. “The adoption of the European Council’s general approach marks a critical step in the passage of the European Chips Act, a landmark initiative for our industry.”

The European Parliament’s Committee on Industry, Research and Energy (ITRE) is expected to vote on the European Union Chips Act report in January 2023. The Committee will then submit the approved text to plenary for adoption, a vote scheduled for February 2023. The text would constitute the European Parliament’s negotiating position and mark the last step before the start of trialogue negotiations among the European Commission, Parliament, and Council. 

“SEMI looks forward to continued collaboration with the European institutions and our member companies to ensure the timely adoption and implementation of the European Chips Act, putting Europe’s semiconductor industry on a competitive footing with other regions,” said Christopher Frieling, director of Advocacy and Public Policy at SEMI Europe.

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

For more details, contact the SEMI Europe Advocacy team:

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

 

MUNICH, Germany ─ November 14, 2022 ─ Industry experts from across the electronics design and manufacturing supply chain will gather starting tomorrow at SEMICON Europa 2022 for the latest developments and trends across key semiconductor industry growth segments including advanced packaging, materials, medtech and mobility. Critical semiconductor industry issues such as sustainability, green manufacturing and workforce development will also highlight the event, 15-18 November at Messe München, in Munich, Germany. The SEMICON Europa exhibition and conferences are co-located with electronica.

Logo“We look forward to perspectives from global thought leaders on semiconductor trends that are crucial to industry growth,” said Laith Altimime, president of SEMI Europe. “Companies from across the semiconductor supply chain will meet to explore new business and technology opportunities and ways to accelerate innovation.”

SEMICON Europa 2022 Highlights

  • Opening Ceremony keynotes by industry leaders including Airbus, Athinia, Edwards Vacuum, imec, JCET Group, Porsche, Philips and Samsung.
  • ITF Beyond 5G - Powered by imec will explore the role of advanced and compound semiconductors in paving the way to next-generation mobile connectivity.
  • Advanced Packaging Conference – Companies including Amkor, ASE, Bosch, Henkel, Infineon and Intel will highlight advanced solutions for electronics packaging and testing, manufacturing equipment and materials, design for reliability and test, and Heterogeneous Integration (HI).
  • Fab Management Forum will cover key topics such as chip manufacturing, datafication of fabs, and Artificial Intelligence (AI) in microelectronics manufacturing as the industry intensifies its focus on long-term resilience strategies in light of COVID-19 and recent supply chain disruptions. Presenting companies include Bosch, Maxwell Biosystems, Roland Berger, STMicroelectronics, TechInsights, Volkswagen and X-FAB Group.
  • Executive Forum Program will delve into semiconductor industry topics such as materials innovation, Smart mobility, electrification and power semiconductors, Smart and green manufacturing and workforce development.
  • TechARENA Program will address themes including integrated photonics, Smart medtech, sustainability, and global government incentives for semiconductor manufacturing.

Programs on the show floor in Hall B1 and C1 are complimentary for all SEMICON Europa and electronica visitors. For more details, please visit the SEMICON Europa 2022 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

Press and media partners can register for free by contacting Serena Brischetto at [email protected] 
 

SEMICON Europa 2022 Sponsors

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

MUNICH, Germany ─ May 24, 2022 ─ SEMI Europe today announced the opening of the call for abstracts for SEMICON Europa 2022, Europe’s premier event connecting the entire electronics design and manufacturing supply chain, as the event returns to Messe München 15-18 November, in Munich, Germany for a live exhibition and conferences. Selected speakers at SEMICON Europa 2022, co-located with electronica, will share their expertise to the global microelectronics industry at the Advanced Packaging Conference (APC) and Fab Management Forum (FMF).

SEMICON Europa logoSEMICON Europa 2022 will convene experts and technologists for insights into the latest technology, materials and process innovations powering digital transformation and the next wave of semiconductor industry growth. The event will spotlight cutting-edge solutions that enable chipmakers to implement a broad range of new application-specific technologies.

Advanced Packaging Conference ─ Advanced Packaging Solutions in the Era of Digital Transformation

Advanced electronics packaging are integral to the system solutions required to enable mega trends in computing and communications and leading applications in markets such as medical devices and automotive. With collaboration critical to technology advances, experts from across the semiconductor supply chain who are driving innovations, technology concepts or roadmaps are invited to submit abstracts on advancements in the areas of Packaging/Assembly, Wafer/Package Test and Modelization. The submission deadline is June 10, 2022.

Fab Management Forum ─ Industry Meets Academia

New university graduates and young innovators looking to launch careers in the semiconductor industry will present their research and early-stage products to established fab managers. Key topics of interest are the Status of AI in Microelectronics Manufacturing and Advanced Analytics and Digital Twins for Faster, More Precise Decision Making. Students with doctorate and master’s degrees and their professors, as well as postgraduate researchers, research institutes and early start-ups and spinoffs, are invited to submit abstracts by June 17, 2022.  

Pre-recorded Presentations

In addition to the in-person programs, experts are invited to submit abstracts for the pre-recorded sessions on Friday, November 18. All pre-recorded presentations will be available to SEMICON Europa attendees onsite and virtually through the event website. The submission deadline is July 31, 2022.

Presentation abstracts, biographies and headshots must be submitted on the SEMICON Europa 2022 Call for Abstracts webpage. The conference language is English. All selected presenters will be notified in July 2022.

For more details, please visit the SEMICON Europa 2022 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

SEMICON Europa Premier Sponsors

  • Platinum: TEL
  • Gold: Edwards, JCET
  • Silver: Evatec, SÜSS MicroTec
  • Event sponsors: ASE Group, Atotech INFICON, Lam Research, SCREEN

 

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]