Dr. Dory has extensive experience in microelectronics covering semiconductor fab processing and assembly, hybrid circuits, and package assembly & test. He has worked in many different aspects of semiconductor manufacturing, including plasma deposition, RTP, and packaging technologies, while at Intel Corporation. Dr. Dory retired from Intel in the Assembly and Test Technology Development Research division after 20 years in R&D. As Pathfinding Integration Manager of the Intel Substrate Technology Research Labs, he was responsible for the development of advanced packaging technology in the areas of MEMS, wafer-level bonding, stacked die packages, and line pitch reduction designs. He specialized in packaging and assembly, focusing on high density substrate manufacturing and chip assembly, including wire bonding, flip chip, and 3D packaging.
Dr. Dory was a member of the Arizona State University chemical engineering faculty as a lecturer, teaching semiconductor processing and all transport phenomena.
He is the author or co-author of over 35 patents and publications in the areas of semiconductor chemicals and package design including underfill applications, embedded package capacitors. He is an Electrochemical Society member and Senior Member of IEEE.