Lightium, MPI Corporation, and Axiomatic_AI Announce Strategic Partnership to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions
Zurich, Switzerland; Hsinchu, Taiwan; and Boston, USA – January 6, 2025 – Lightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.
This strategic collaboration aims to revolutionize the testing and qualification processes of photonic integrated circuit (PIC) devices by uniting state-of-the-art artificial intelligence, next-generation hardware, and deep domain expertise. The IAITS platform will deliver breakthrough performance in testing workflows—enabling unmatched efficiency, precision, and scalability to meet the ever-evolving demands of the photonics industry.
A Unified Vision for the Future of Photonics Testing
This partnership is driven by a shared commitment to deliver groundbreaking AI driven and self-optimizing solutions to the photonics industry. By combining Axiomatic_AI’s cutting-edge, reasoning-based, self-learning artificial intelligence with MPI Corporation’s industry-leading wafer probing systems and automation software, and leveraging Lightium AG’s advanced testing infrastructure and deep expertise in ultra-high-speed photonic device measurements, the collaboration aims to bring fully integrated, intelligent photonic integrated circuit (PIC) test solutions to market.
Together, the three companies are creating a unified AI platform that addresses the growing complexity and performance demands of characterizing photonic integrated circuits—unlocking new levels of automation, precision, and scalability for next-generation applications.
Disruptive Value Creation Across Hardware and Human Resources
The Intelligent, Autonomous, and Integrated Test Solution (IAITS) introduces a new paradigm in photonic integrated circuit (PIC) testing, delivering transformative value across both technology infrastructure and human capital.
Key Benefits of IAITS:
• Increased Throughput: By automating complex test routines, minimizing downtime, and optimizing measurement system utilization, IAITS significantly accelerates test cycles and reduces iteration times.
• Enhanced Human Efficiency: The system reduces reliance on manual operation, programming, and debugging—freeing skilled personnel to focus on high-value engineering and strategic innovation tasks.
IAITS will be commercially available as an advanced software add-on package for MPI Corporation’s wafer probing systems. Designed to support both R&D and high-volume production environments, the solution sets a new industry benchmark for efficiency, precision, and scalability—ultimately lowering the total cost of testing and accelerating time-to-market for next-generation PIC devices.
About Lightium AG
Lightium AG is a Swiss-based startup specializing in Photonic Integrated Circuit (PIC) foundry and design services, built on its proprietary, production-grade Thin-Film Lithium Niobate (TFLN) platform. Lightium accelerates customer innovation by delivering unmatched photonic performance, a streamlined and cost-efficient supply chain, and seamless scalability from prototyping to high-volume manufacturing.
As Europe’s first production-grade TFLN foundry, Lightium plays a pivotal role in enabling next-generation photonic solutions across a diverse range of industries, including telecommunications, data communications, quantum computing, artificial intelligence, and space technologies.
Further information can be found at: Lightium - Thin Film Lithium Niobate (TFLN) Photonic Foundry
About MPI Corporation
MPI Corporation, headquartered in Taiwan, is a global leader in advanced probe systems and testing solutions for the semiconductor, photonic, and photonic integrated circuit (PIC) industries. The company designs and manufactures high-performance wafer probing systems known for their exceptional precision, automation capabilities, and scalability—empowering cutting-edge testing across research, development, and high-volume production.
MPI’s innovations play a critical role in advancing next-generation technologies in wireless communication, electronics, and photonics. The company is publicly listed on the Taipei Exchange (TAIEX: 6223).
For more information, please visit: About MPI Corporation – Global Semiconductor Testing Leader
About Axiomatic_AI Inc.
Axiomatic_AI Inc., headquartered in Boston, is a pioneering startup developing physics-based reasoning artificial intelligence to accelerate innovation and reduce the cost and risk associated with deep-tech development. Its cutting-edge AI technologies are redefining how high-tech industries design, measure, and optimize complex systems—enabling faster, smarter decision-making across R&D and production environments.
Axiomatic_AI’s mission is to unlock new efficiencies and capabilities in fields where precision and complexity are paramount.
Learn more at: https://axiomatic-ai.com/mission/

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This cutting-edge panel-level wet processing demo tool handles large 510 × 515 mm substrates, delivering world class, high density Through Glass Vias (TGV) formation and ultra-small taper angles essential for advanced packaging in high performance computing.

Gütenbach, Germany – July 15, 2025 – RENA Technologies, a leading manufacturer of wet processing equipment for semiconductor and advanced packaging production, today announced the ramp-up of its dedicated glass core substrates facility in Germany. This new line, designed for substrates up to 510 × 515 mm, immediately opens for customer test lots, underscoring RENA's proven expertise in glass processing and creating new opportunities for process development and customer sample production. “As experts in precision wet processing, we can now offer large panel demo services for high aspect ratio through glass via (TGV) formation on various glass types,” said Dr. Holger H. Kuehnlein, SVP Technology at RENA. “Our alkaline based TGV process delivers extremely small taper angles, low sidewall roughness, and exceptional dimensional control at panel scale, enabling high density via applications. Customers can begin validating these capabilities today.”

Why Glass, and Why Wet Processing?
Glass substrates offer significant advantages for advanced electronics, including ultra-flat surfaces, low dielectric loss, and superior thermal stability. However, realizing these benefits at scale requires defect free surface preparation and the formation of uniform, high density TGVs with minimal taper angles. RENA's wet processing systems are specifically designed to address both challenges:
1. Surface Engineering – Our systems ensure precise cleaning and stress relief across 600 x 600mm panels with submicron total thickness variation (TTV).
2. Chemically Formed TGVs – Following initial laser modifications performed by our specialist partners, RENA’s proprietary chemistries form, enlarge and shape each via to exact specifications. This process consistently delivers very small taper angles and smooth sidewalls, ideal for subsequent metallization.

By collaborating with leading German and international laser partners, RENA offers customers the flexibility to choose their preferred laser vendor while ensuring all downstream wet processing steps are handled by our advanced equipment.

Key Highlights of the New Facility
Panel Size: Focus on 510 x 515mm and up to 600 × 600mm, smaller possible
Tool Set: Alkaline TGV etching, advanced rinse/dry, optical inspection & metrology
Field-Proven Recipes: Process conditions migrated from high volume tools
On-Demand Access: Customers may run demo substrates, qualify custom chemistries, or request full process flows
Sustainability: Low temperature chemistries and closed loop water reclamation reduce energy and ultrapure water (UPW) consumption

Market Impact
High-Performance Computing (HPC) as well as 5G/6G RF modules increasingly require new package designs, including panel-level fan-out and trend towards more complex chiplet architectures. Glass substrates, long considered the “holy grail” for core and interposer material, effectively eliminate the limitations imposed by warpage and dielectric loss in organic substrates. By combining laser modification from our vetted partners with RENA's chemistry driven via shaping, designers can now validate glass packaging concepts on the lab-platform proven at 600x600mm dimensions.
“With this lab-tool, we've created a great opportunity for semiconductor manufacturers to perform demos on panel level glass substrates,” added Peter Schneidewind, CEO of RENA. “From surface preparation to via formation, our wet process flow is ready for customers substrates to support TGV technology breakthroughs. This is world class made in Black Forest.”

Availability & Engagement Model
• Testing available now
• Flexible collaboration: Bring your own laser modified substrates, or leverage RENA’s ecosystem partners to benefit from joint process development support, and metrology services for process validation.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

CONTACT
Sales:
Felix Fink
Phone: +49 7723 9313-403
E-Mail: [email protected]

Press:
Dirk Hensel
Phone:+49 7723 9313-914
E-Mail: [email protected]
www.rena.com

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Espoo, Finland, July 14, 2025 – Beneq, a global leader in Atomic Layer Deposition (ALD) technology, is proud to announce significant progress in the microLED display market, underscored by repeat orders from industry-leading technology innovators. MicroLED technology is revolutionizing the future of displays across sectors including consumer electronics, augmented and virtual reality (AR/VR), and the automotive industry. With unparalleled brightness, contrast, energy efficiency, and durability, microLED represents a paradigm shift in how displays are designed and manufactured – enabling ultra-fine pixel resolution, seamless scalability, and longer device lifetimes. As demand for next-generation display solutions accelerates, microLED is poised to become the backbone of future visual interfaces.

According to Yole Group, global microLED display shipments are projected to grow at a compound annual growth rate (CAGR) of 180.6% from 2022, reaching 42.4 million units by 2029. Despite its promise, microLED development presents formidable challenges, particularly in scaling down pixel sizes to below 10 micrometers while maintaining uniformity, stability, and manufacturability. As pixels shrink, precise material control and surface passivation become critical to device performance. Atomic Layer Deposition offers a unique solution, enabling ultra-thin, conformal coatings with atomic-level precision. ALD addresses key barriers in microLED production, such as surface defect passivation, sidewall protection, transparent conductive oxides and final passivation, thereby improving both device efficiency and long-term reliability.

“Our top-tier customers rely on ALD technology to advance monolithic integration of microLEDs and driver electronics on a single chip. This integration paves the way for a new class of smaller, more powerful display products – delivering faster data transfer, lower power consumption, and a significantly more compact footprint,” says Mikko Söderlund, Head of Semiconductor ALD Sales.

“These repeat orders validate Beneq’s solution and demonstrate the company’s commitment to support customers through both the demanding development phase and the critical transition to volume manufacturing.”

Beneq’s Transform® ALD cluster platform stands at the forefront of this technological evolution. Designed for high-throughput production and advanced technology development, the Beneq Transform combines modularity, flexibility, and productivity, making it an ideal tool for microLED manufacturers. Its multi-chamber architecture supports a wide range of materials and processes, enabling customers to fine-tune optical and electrical properties while seamlessly scaling from lab to fab. By equipping microLED pioneers with the tools needed to overcome manufacturing barriers, the Beneq Transform is helping accelerate the commercialization of microLED displays – paving the way for brighter, smarter, and more sustainable electronic experiences.

About Beneq

Beneq pioneered industrial Atomic Layer Deposition (ALD) with the introduction of the first commercial ALD equipment in 1984. Today, Beneq advances ALD technology adoption and validation with a portfolio that includes Transform®, Transform® 300, and Prodigy™ for specialty semiconductor device fabrication; TFS 200 and TFS 500 for R&D; innovative spatial ALD platforms such as the C2R™, and Genesis for roll-to-roll processing. Beneq’s products support process innovation from lab to fab, enabling integration of ALD in high volume manufacturing. Headquartered in Espoo, Finland, Beneq operates globally to help customers scale ALD solutions for the future of semiconductors, optics, and functional coatings.

Press Contact

Charlotte Bärlund
Event and Communications Lead
[email protected]

Lie Luo
Head of Marketing
[email protected]

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Martinez, CA—EUV Tech (EUVT), a global leader in designing and manufacturing at-wavelength EUV metrology equipment, is excited to announce the release of the FALCON Photoresist Flood Exposure Tool. As our next-generation EUV resist characterization and diagnostics tool, FALCON allows photoresist manufacturers to rapidly and accurately test EUV resist sensitivity, as well as providing patterning materials developers critical insights into exposure mechanisms.

Built upon EUV Tech’s proven resist tool technology, FALCON is a fully automated tool that supports high-throughput contrast curves on EUV-patterning materials and radiation chemistry diagnostics by integrating a wide variety of optional add-on analysis and processing modules.

Enhancing FALCON’s platform is an array of in-situ analysis and process modules, including Fourier Transform Infrared (FTIR) Spectroscopy, Atomic Mass Spectrometry, Total Electron Yield (TEY), Photo-Electron Spectroscopy (PES), environmental and vacuum bake module with additional diagnostics, and a scanner-environment exposure module.

Key to FALCON’s effectiveness is its highly uniform exposure spot size of 6 mm, supporting high-sensitivity chemical analysis and over 1,000 exposures for a 300 mm wafer in a single recipe run. Built-in data visualization tools make it possible to analyze this rich data. Combining uniformity, high configurability, and deep data collection and analysis makes FALCON a highly efficient, cost-effective tool for advanced photoresist development.

For more information on the enhanced FALCON Flood Exposure Tool or any of EUV Tech’s at-wavelength metrology tools, please visit euvtech.com.

About EUV Tech
EUV Tech enables technology advancement in the frontiers of semiconductor manufacturing and material science through the development of world-leading EUV and soft-x-ray instrumentation and techniques.

For further information, contact:
EUV Tech, Inc.
[email protected]
+1 (925) 229-4388

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Integration of EDA empowers OEMs to deliver structured, high-bandwidth data to semiconductor fabs and drive efficiencies for competitive advantage

CEA LID World Summit, Grenoble, France, June 17, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, today announced the future expansion of its A²ECF-SEMI automation framework to include SEMI’s EDA (Equipment Data Acquisition) standards suite. This integration that already includes Agil’GEM and Agil’GEM300 will empower OEMs to deliver structured, high-bandwidth data to manufacturing facilities and drive process improvements with artificial intelligence (AI) by leveraging large amounts of reliable, actionable data. EDA standards, built on the legacy of SECS/GEM and GEM300, are transforming equipment communication and enabling high-speed, data-driven manufacturing. As semiconductor fabs become more connected and automated, the ability of OEM equipment to integrate seamlessly and deliver high-quality, structured data has become a competitive differentiator. 

Agileo Automation has carried out EDA Freeze 2 client and server tests with equipment manufacturers already supporting EDA and is working with these early adopters on the integration on their equipment using A²ECF-SEMI, Agil'GEM, and Agil'GEM300. The company will soon be providing a comprehensive offer for OEMs in need of EDA Freeze 2 or 3. EDA is increasingly required in RFQs that equipment manufacturers must address.

“EDA is going to enable fabs to realize superior yields, faster innovation cycles, and a sustainable competitive advantage in an ever-accelerating market,” explains Marc Engel, CEO of Agileo Automation. “Agileo is proud to be a major contributor to this global effort and pleased to support OEMs in all market segments with a complete and scalable product suite.”

About Agileo Automation

Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo Automation is a key contributor to the development and integration of industry standards such as SEMI standards and OPC Unified Architecture (OPC UA). For more information, please visit our web site or follow us on LinkedIn.

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Toulouse, 5 June 2025 – RECIF Technologies is pleased to announce the launch of R.PACK, the next-generation software suite designed for RECIF sorters. With an emphasis on usability, efficiency, and innovation, R.PACK introduces a suite of advanced features aimed at simplifying the management of wafer sorting equipment.

Built for Speed, Designed for Precision

R.PACK enhances operational efficiency for users of RECIF’s COMPACT and SMART sorters, featuring advanced capabilities and a modern interface designed to streamline wafer sorting processes

Key Features of R.PACK:

• Refined User Interface: The design of R.PACK makes it easier than ever to create recipes and monitor jobs, ensuring smoother operations and increased productivity.
• Seamless Transition: Current users will experience minimal disruption when transitioning to R.PACK, thanks to its intuitive interface that simplifies adoption.
• Ongoing Software Enhancements: R.PACK is built on a forward-compatible framework, with updates released annually to deliver new features and performance improvements. The first major update was rolled out in January 2025, with the next release scheduled for Q1 2026 — part of an ongoing roadmap to enhance user experience and expand system capabilities.

Commitment to Innovation and User Experience

The release of R.PACK reinforces RECIF Technologies’ ongoing commitment to providing high-performance solutions for the semiconductor industry. By focusing on a more intuitive and efficient wafer sorting process, R.PACK marks the first in a series of improvements designed to elevate both the user experience and operational efficiency.

"We believe R.PACK will significantly enhance our customers' workflows and performance," said Thomas Brillouet, the R&D Manager at RECIF Technologies. "By providing enhanced features and a modernized interface, we empower our customers with tools that maximize safety, enhance efficiency, and optimize equipment performance with minimal effort."

Availability and Future Updates

The first major update for R.PACK is available now, with additional updates scheduled annually every Q1. R.PACK is compatible with RECIF sorters (COMPACT & SMART) and will fully replace the WISE software by 2027.

For more information on R.PACK, including system requirements and update schedules, visit www.reciftech.com.

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