Join SEMI and the Environment Risk & Mitigation Reporting Working Group to learn how the semiconductor industry and supply chain is assessing Water Risk, and what steps can be taken to mitigate exposure.
In a collaboration with WaterPlan®, the working group surveyed more than 140 production site and 89 unique water basins to arrive at a water risk assessment for flooding, reputational risk, water quality risk, infrastructure risk and water scarcity risk.The survey found that over 80% of wafer fabrication and 88% of chemical and materials sites face medium-high to high flood risk.
During the webinar experts will provide key insights on key drivers and what is required by risk management teams – both internal and external – for reports and disclosures for:
The Global Reporting Initiative (GRI)
Disclosure Insight Action (CDP)
Task force on Climate-Related Financial Disclosures (TCFD)
The International Sustainability Standards Boards (ISSB)
Sustainability Accounting Standard Board (SASB)
European Sustainability Reporting Standards (ESRS)
Register now to learn more.
Ripple Effects: Water Risk and Resilience Across the Semiconductor Value Chain
8:00 am - 9:00 am
Off
Add to Calendar2025-12-11 08:00:002025-12-11 09:00:00Ripple Effects: Water Risk and ResilienceJoin SEMI and the Environment Risk & Mitigation Reporting Working Group to learn how the semiconductor industry and supply chain is assessing Water Risk, and what steps can be taken to mitigate exposure. In a collaboration with WaterPlan®, the working group surveyed more than 140 production site and 89 unique water basins to arrive at a water risk assessment for flooding, reputational risk, water quality risk, infrastructure risk and water scarcity risk. The survey found that over 80% of wafer fabrication and 88% of chemical and materials sites face medium-high to high flood risk.During the webinar experts will provide key insights on key drivers and what is required by risk management teams – both internal and external – for reports and disclosures for:The Global Reporting Initiative (GRI)Disclosure Insight Action (CDP)Task force on Climate-Related Financial Disclosures (TCFD)The International Sustainability Standards Boards (ISSB)Sustainability Accounting Standard Board (SASB)European Sustainability Reporting Standards (ESRS)Register now to learn more.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Remember to save the dates for the upcoming Spring meetings (Albany, NY) in conjunction with SEMI ASMC (May 11-14, 2026) and SEMICON West moving back to San Francisco, CA October 13-15, 2026.
SEMI Standards will host 9 committees + over 30 task forces engaged in various standardization activities, including:
Environmental, Health, and Safety (EH&S)
Facilities
Gases
Information & Control
Liquid Chemicals
Metrics
MEMS/NEMS
Physical Interfaces & Carriers
3D Packaging & Integration
Note |Some Technical Committees + Task Forces may meet virtually outside of this Meeting set.
Leverage SEMI U learning offerings to accelerate your professional development journey for 2026! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.
Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "Kick Start 2026 with SEMI U." This webinar promises to be an informative session where you'll gain insights into the latest updates and course offerings.
During this webinar, you can expect to:
Discover the latest updates and enhancements to SEMI U's on-demand course catalog.
Upcoming virtual and in-person instructor-led trainings scheduled for the first half of the year.
Gain access to a special 10% discount on ALL on-demand courses.
Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value).
Kick Start 2026 with SEMI U
FREE Webinar (PM session)
January 21, 2026
5:00 pm - 5:30 pm
Off
Add to Calendar2026-01-21 17:00:002026-01-21 17:30:00Kick Start 2026 with SEMI U - Free Webinar (PM Session) Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value).United StatesSEMI.org[email protected]America/Los_AngelespublicRegister Now
Leverage SEMI U learning offerings to accelerate your professional development journey for 2026! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.
Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "Kick Start 2026 with SEMI U." This webinar promises to be an informative session where you'll gain insights into the latest updates and course offerings.
During this webinar, you can expect to:
Discover the latest updates and enhancements to SEMI U's on-demand course catalog.
Upcoming virtual and in-person instructor-led trainings scheduled for the first half of the year.
Gain access to a special 10% discount on ALL on-demand courses.
Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value).
Kick Start 2026 with SEMI U
FREE Webinar (AM session)
January 21, 2026
8:00 am - 8:30 am
Off
Add to Calendar2026-01-21 08:00:002026-01-21 08:30:00Kick Start 2026 with SEMI U - Free Webinar (AM Session)Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value).United StatesSEMI.org[email protected]America/Los_AngelespublicRegister Now
3D Packaging & Integration North America TC Chapter Meeting
1:00 pm - 2:30 pm
Off
Add to Calendar2025-10-14 13:00:002025-10-14 14:30:003D Packaging & Integration North America TC Chapter Fall Meeting 2025Join us for the SEMI Standards3D Packaging & Integration (3DP&I)North America Technical Committee Chapter Fall MeetingDate: Tuesday, October 14, 2025Time: 13:00-14:30 Pacific TimeOnline via Web ConferenceTo receive the calendar invite, please reach out to the contact below. AGENDA(Subject to change)Last updated: September 14, 2025 United StatesSEMI.org[email protected]America/Los_Angelespublic
Virtual + Voting Instructions
SEMI uses RingCentral to host virtual meetings.
To receive the calendar invite, please reach out to the contact below.
Enter your Standards Membership username and password (same login you use for voting on ballots)
Find the meeting room you wish to attend under “Room Name”
Click “Go” to enter the meeting room.
NOTE: You must be a registered SEMI Standards Program Member to gain access. Reach out to your staff contact if you are unable to log on, or if your "voting interest" is incorrect or shows "NONE".
Contact
Laura Nguyen Sr. Coordinator, International Standards
Contact Michelle Fabiano, [email protected] for a student registration code.
This is an online recorded event; therefore, you will receive the content recording following the event. We are not processing refunds or cancellations.
Creating an Ecosystem for Advanced Packaging: How Backend Manufacturing is Leading the Way
As the semiconductor industry pushes the boundaries of performance, efficiency, and miniaturization, advanced packaging has emerged as a critical enabler of next-generation microelectronics. This virtual forum brings together leading voices from across the ecosystem to explore how backend manufacturing is driving innovation and collaboration in advanced packaging technologies.
Topics Include—
The evolving role of backend manufacturing in enabling heterogeneous integration and chiplet architectures
Key challenges and opportunities in scaling advanced packaging solutions
Collaborative models for building a robust ecosystem—from academia to industry
Workforce development and infrastructure needs to support future growth
Insights into government and industry initiatives shaping the future of microelectronics manufacturing
Whether you're a technologist, strategist, or policymaker, this forum offers a unique opportunity to gain actionable insights into the future of semiconductor packaging and the collaborative efforts driving it forward.
Participate in a U.S. Time Zone:
Pacific: 9am–11:00am
Mountain: 10am–12:00pm
Central: 11am–1:00pm
Eastern: 12pm–2:00pm
Register now to be part of this important conversation and contribute to shaping a sustainable future for the semiconductor industry!
A digital twin is a computer representation of the structure, context, and behavior of physical systems, which are critical components in the optimization of computational systems, accurately representing physical systems and processes. A Digital Twin can be used to reduce or eliminate iterative physical experiments needed for optimization, thereby enhancing yield, saving time, and resources. Semiconductor manufacturing involves numerous complex steps, where accurate control of each step is crucial to achieving the overall manufacturing yield and minimizing variations in device characteristics. The complexity of the manufacturing processes' flows limits flexibility for testing novel approaches. Unit processes can be based on first-principal models (physics-based), data-based models, or hybrid models combining both approaches when possible. Fabrication processes in the cleanroom and on printed electronics tools are often a function of time-varying parameters, including those of the equipment, environment, and materials. The parameters often have co-dependencies across different process steps and tool sets.
This course will cover the necessary material to create DNN-based Digital twins for nanofabrication processes in cleanrooms. The course will include experimental details for data preparation, data processing, training models, and use case demonstrations. Nanofabrication process equipment can inherently have millions of internal variables and can learn from datasets, providing a robust and complementary approach to traditional feedback control and process stabilization methods. The included Digital Twin modes are developed using images (CD-SEMs, optical images), time history data (Optical Emission Spectroscopy), and textual process information (recipes and materials). The course will include: (1) Approaches to preprocess image data and create learning-based models, (2) using DNN-based domain translation for learning to predict the DUV nanolithography and ICP Plasma Etch, (3) virtual metrology methods for quantification of learning outcomes, and (4) developing a new class of process-aware DNN-based digital twins.
ABOUT THE SPEAKERS
Benyamin Davaji, PhD Benyamin Davaji is an Assistant Professor in the Electrical and Computer Engineering Department at Northeastern University. His research focuses on integrated microsystems with an emphasis on sensing and computation using mechanical waves, acoustic/ultrasound transducers, bio-interfaces, and microcalorimetry. He also applies data-guided methods to nanofabrication process development and semiconductor manufacturing. Dr. Davaji earned his PhD in Electrical and Computer Engineering from Marquette University in 2016 and later served as a post-doctoral associate at Cornell University’s School of Electrical and Computer Engineering.
Peter Doerschuk, PhD
Peter Doerschuk, Professor at Cornell University since 2006, previously served on the Purdue faculty in Electrical and Computer Engineering and Biomedical Engineering. He earned B.S., M.S., and Ph.D. degrees in Electrical Engineering from MIT, an M.D. from Harvard Medical School, and completed training at Brigham and Women’s Hospital and a postdoc at MIT. His research applies computational nonlinear stochastic systems to biology and medicine, spanning viral 3-D structure determination using electron microscopy and x-ray scattering, to nonlinear models of ethanol pharmacokinetics that enable sensor processing, pattern recognition, and individualized physiological analysis.
Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology.
Digital Twin Models for Semiconductor Manufacturing Unit Process
Flexible Electronics Master Class #27
10:00 am - 12:00 pm
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Add to Calendar2025-11-05 10:00:002025-11-05 12:00:00FEMC#27 Digital Twin Models for Semiconductor Manufacturing Unit ProcessJoin us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Watch On-Demand
Join us for an insightful webinar as we present the findings from the 2025 Semiconductor Supply Chain Survey, a collaborative effort between the SEMI Supply Chain Management initiative and McKinsey & Company.
The annual survey aims to establish benchmarks for operational agility metrics, covering the entire value chain from material suppliers to OEMs, offering a comprehensive view of the landscape. New this year are additional insights on trends in LTAs and organizational supply chain management capabilities
During this webinar, we will share results from the survey uncovering key trends, challenges, and opportunities within the semiconductor supply chain. By attending, you'll gain valuable insights to benchmark your organization against peers, identify areas for improvement, and course-correct more effectively. Please contact us if you like to learn about how your company can participate in the SCM initiative.
Join us for a webinar highlighting the 2025 Semiconductor Supply Chain Survey results, conducted by SEMI SCM initiative and McKinsey & Company. Gain fresh insights into operational agility, LTAs, and SCM capabilities across the value chain. Discover key trends, challenges, and opportunities to benchmark your organization and strengthen supply chain resilience.
2025 Semiconductor Supply Chain survey: Insights for strategy and capabilities
9:00 am - 10:00 am
Off
Add to Calendar2025-09-23 09:00:002025-09-23 10:00:002025 Semiconductor Supply Chain survey: Insights for strategy and capabilitiesJoin us for a webinar highlighting the 2025 Semiconductor Supply Chain Survey results, conducted by SEMI SCM initiative and McKinsey & Company. Gain fresh insights into operational agility, LTAs, and SCM capabilities across the value chain. Discover key trends, challenges, and opportunities to benchmark your organization and strengthen supply chain resilience.Choose your session:US/EU: 9:00 AM – 10:00 AM PT [ Register Now ]Asia/US: 5:00 PM – 6:00 PM PT [ Register Now ]United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Speakers
Henry Marcil
Partner
McKinsey & Company
Bio: Leader in McKinsey’s Advanced Industries Practice, focused on semiconductors n and key end markets (e.g., high tech)
Leads McKinsey’s Resiliency and Geopolitics service line in Semiconductor
Kushal Jolapara
Engagement Manager
McKinsey & Company
Bio: Manager in McKinsey's Operations practice, with a focus on product development and procurement service lines
Leads Supply Chain studies for Advanced Industries clients including Aerospace, Auto and Semiconductors
Dan Peacock
Engagement Manager
McKinsey & Company
Bio: Manager in McKinsey’s Operations Practice, focused on procurement and capital projects
Leads Operations projects at Foundries, IDMs, and equipment clients
• Lead times throughout the semiconductor value chain • Landscape and trends in purchasing agreements and LTAs • Demand forecasts, backlogs, and end markets • Market outlook, opportunities, and threats • New for 2025: Organizational capabilities in supply chain management
As the European Union enacts the Cyber Resilience Act (CRA), the semiconductor industry must rapidly adapt to evolving cybersecurity requirements that will impact product design, software compliance, and the global supply chain. Join the Semiconductor Manufacturing Cybersecurity Consortium (SMCC) for a live webinar unpacking what the CRA means for semiconductor companies and how to prepare for compliance.
This session will provide expert insight, practical guidance, and live Q&A with cybersecurity leaders from top technology firms.
Key Topics
Overview of the EU Cyber Resilience Act and its latest updates
How CRA regulations apply to semiconductor manufacturing, equipment, and design
Risk management strategies and third-party software compliance
Real-world approaches to implementation from leading global firms
Open Q&A with cybersecurity and compliance experts
Who Should Attend
Cybersecurity and compliance professionals
Semiconductor design and manufacturing leaders
Legal and regulatory affairs professionals
Product development and software teams
Government and policy stakeholders
United States
EU CRA Updates
3:00 pm - 5:00 pm
Off
Add to Calendar2025-09-17 15:00:002025-09-17 17:00:00EU CRA UpdatesUnited StatesSEMI.org[email protected]America/Los_Angelespublic
Speakers
Uwe Rueddenklau Head of Infineon Global Standardization & Associations, Infineon
Gerard Mas Corporate Standards and Alliances Director, STMicroelectronics
Ben Kokx Director of Product & Systems Security, Philips
SZ Lin President, ISA Taiwan Section| Chief Cybersecurity Advisor, Sun Square
Wilko Baks Manager, Product Security and 3rd Party Software Compliance, ASML
Konstantinos Papapanagiotou Principal Consultant, Styx Cybersecurity Services
Join us for a webinar that will explore the role of SEMI’s Public Policy and Advocacy (PP&A) team in driving policy developments that are relevant to the ESDA community. PP&A staff will present on SEMI’s advocacy efforts, how you can interface with our team in DC, and how we work with member companies to advance key legislative and advocacy priorities in specific policy areas including:
The ESD Alliance, a SEMI Technology Community, is hosting a free webinar, "SEMI's Public Policy & Advocacy Office—A Valuable Resource for The Electronic Design Automation Industry," to share how this team can help you navigate global trade complexities and stay ahead of evolving policy challenges.
ESD Alliance Webinar: SEMI's Public Policy & Advocacy Office—A Valuable Resource for The Electronic Design Automation Industry
10:00 am - 11:00 am
Off
Add to Calendar Disabled
America/Los_Angeles
REGISTER NOW
