MILPITAS, Calif. – September 4, 2024 – Global semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same period, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

“Global semiconductor equipment billings totaled $53.2 billion for the first half of 2024, reflecting a healthy year so far for the industry overall,” said Ajit Manocha, SEMI President and CEO. “The semiconductor equipment market has returned to growth driven by strategic investments to support continued strong demand for advanced technologies and regions seeking to bolster their chipmaking ecosystems.” 

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

Download a sample of the EMDS report.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More details are also available on the SEMI Market Data webpage.  

About SEMI

SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870

Email: [email protected] 

• Read more about Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports

MILPITAS, Calif. – September 4, 2024 – The MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, today announced an updated Request for Proposals (RFP) for the development and manufacture of positioning, navigation and timing (PNT) components and systems. The full RFP contains information on the submission process. 

The MSIG PNT program, a public-private partnership with the U.S Army Research Laboratory, advances PNT solutions that pinpoint the position of stationary and mobile assets and enable their navigation under mission-critical situations. SEMI MSIG expects to announce multiple awards to teams or U.S. organizations with a diverse range of research and development capabilities. White paper proposals are due September 23, 2024, at 5:00 p.m. PDT.

Specific focus areas identified by the MSIG Technical Council include:

• Thrust Area 1: Novel Materials, Fabrication, Packaging, and Testing Techniques for Low-SWaP Inertial and PNT Sensors

• Thrust Area 2: Advanced Active and Passive Integrated Photonics for Low-SWaP Atomic Clocks, Quantum Systems, and PNT Sensors

• Thrust Area 3: Advancements Towards Low-SWaP-C, GPS-Free PNT Technologies

Subject matter experts from the SEMI MSIG Technical Advisory and Governing Councils and the U.S Department of Defense will evaluate, prioritize, review, and manage the proposals and their resulting projects. Funding granted by SEMI MSIG must be matched with funds in the form of cash and in-kind contributions from the grant recipient to cover total project costs. On average, the industry has covered nearly 60% of the funding for the previous PNT development projects. 

“We invite proposals that will innovate and push the leading-edge in MEMS devices and their manufacture,” said Tim Brosnihan, executive director of SEMI MSIG. “This round of funding marks the third of the 5-year project.”

The intent of the R&D funding is to build on phase two of the SEMI MSIG PNT program, as well as identify new areas and approaches to PNT solutions for GPS-denied environments. Emphasis will be placed on system solutions, including but not limited to software, sensor fusion, cost-effective process innovation, advanced packaging solutions, component innovations, and disruptive materials development. 

R&D may cover software, hardware, and advanced packaging requirements of optical and MEMS-based positioning and timing systems that improve bias stability and reduce sensor noise. Technical solutions will need to address the total GPS-denied problem, meeting the system-level performance necessary to advance the state of the art.

SEMI MSIG will provide information about the RFP during a webinar to be held from 8:00-9:00 a.m. PDT on September 6, 2024. 

About SEMI

SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870

Email: [email protected] 

• Read more about SEMI MEMS & Sensors Industry Group Opens New Round of Proposals for Funding Positioning, Navigation and Timing Development

GREATER NOIDA, India – September 4, 2024 – SEMICON India 2024 will bring together global leaders, semiconductor industry experts, academia, and government officials from September 11-13, 2024, at the India Exposition Mart Ltd. (IEML) in Greater Noida, Delhi NCR. The event will offer valuable insights into innovations and trends in key areas such as smart manufacturing, supply chain management, sustainability, and workforce development. The event’s extensive exhibition will feature over 250 exhibitors from across the global semiconductor supply chain and will be co-located with electronica India and productronica India, providing Southeast Asia’s single largest platform for showcasing the latest advancements in the semiconductor and electronics industries. Registration is open.

The SEMICON India 2024 program is designed to maximize technological advancements in the semiconductor and electronics domain and highlight India’s policies aimed at strengthening its semiconductor ecosystem. Themed Shaping the Semiconductor Future, the event will showcase the country’s growing semiconductor ecosystem with support from the Ministry of Electronics and Information Technology (MeitY) and the India Semiconductor Mission (ISM), Government of India (GoI). Additionally, officials from state governments – including host state Uttar Pradesh and Gujarat, Assam, Karnataka, Odisha, and Tamil Nadu – will share their vision for ecosystem expansion with progressive and industry-friendly policies for attracting investments in the semiconductor and display ecosystems.

“India is primed to blossom as a global semiconductor hub, as the chip industry seeks to bolster supply chain resiliency, serve the rapidly growing electronics market, and employ the region’s wealth of engineering talent,” said Ajit Manocha, SEMI President and CEO. “SEMI is bringing the collective power and expertise of our member companies in the global electronics design and manufacturing supply chain to SEMICON India, along with hallmark SEMICON opportunities for networking, new business, and tech and market updates from top experts. This is not just a new exposition – SEMICON India represents a path to accelerate the growth of the India semiconductor ecosystem as SEMI and SEMICONs have done in other key industry regions over the past half century.”

“India Semiconductor Mission, Ministry of Electronics & IT, and Government of India are committed to a diversified and resilient semiconductor supply chain,” said ISM CEO Shri Akash Tripathi. “In the last 32 months, ISM has placed India in the semiconductor manufacturing map of the world with four semiconductor manufacturing facilities coming up with a total investment of over USD 17billion. With a very strong talent pipeline and strong resolve of GoI to support the development of the semiconductor industry in India, I am sure we will be a successful in becoming a trusted partner in the global value chain of semiconductors in the coming years.” 

Opening Ceremony and Keynote Program

Hon’ble Prime Minister of India, Shri Narendra Modi, will inaugurate SEMICON India and the accompanying exhibition on September 11, 2024. The opening ceremony will feature keynotes by prominent industry leadership from SEMI, NXP, Foxconn, PSMC, Renesas, Tata Electronics, and CG Power. The ceremony will be followed by keynote sessions themed around smart manufacturing, supply chain management, sustainability, and workforce development:

• The keynote session on Wednesday, September 11 will feature the theme Creating a Vibrant Semiconductor Manufacturing Ecosystem in India and a roundtable discussion themed Academia Perspectives on "Opportunity India."
• The session on Thursday, September 12 themed Global Market, Local Execution – The Benefits of Cross-Regional Partnerships will conclude with a roundtable looking at Perspectives on Lessons Learned from Greenfield Projects in Other Regions.
• In addition to government officials, company representatives from Applied Materials, Cadence, CG Power, KLA, Lam Research, Micron, NXP, Renesas, TATA Electronics, Tokyo Electron, and many other industry leaders will participate.

Additional Program Sessions and Participating Companies

• Advanced Packaging – Experts will discuss how 2.5D and 3D integration enable chiplets to be optimized for different functions while highlighting the role of heterogeneous integration in developing next-generation devices for artificial intelligence, high-performance computing, and other demanding applications. Participating companies include AMD, Applied Materials, BESI, KLA and Western Digital.
• Design / EDA – This session will explore the march of technology in chip design and how tool vendors are evolving to equip designers with the capabilities needed to create and verify the next generation of chips. Participating companies include Breker Verification Systems, Cadence, Micron, Real Intent, Siemens and Synopsys.
• Flexible Hybrid Electronics (FHE) – Speakers will delve into the latest advancements in FHE, focusing on advanced packaging techniques and healthcare applications while exploring market opportunities and the importance of environmental sustainability. Participating companies and organizations include Elephantech, ITC Packaging, MeitY, National Centre for Flexible Electronics, and Reddy Laboratories ltd.
• Smart Manufacturing – This program will feature presentations showcasing real-world applications of technology areas like automation, data utilization with AI and machine learning, and digital twins, providing attendees with a clear path towards integrating them into their own operations. Participating companies include Ansys, Applied Materials, Lam Research, Micron and Tata Electronics.
• Smart MedTech – Experts will explore how advanced medical electronics and semiconductors are transforming patient care and healthcare supply chains, featuring insights into cutting-edge technologies and solutions for preventative care.
• Supply Chain Management – This session aims to provide a holistic overview of the current landscape, challenges, and opportunities in the semiconductor supply chain in India, featuring insights from industry leaders in device manufacturing, semiconductor equipment manufacturing, and materials providers. Participating companies include Applied Materials, Lam Research, Tata Electronics, and TechInsights.
• Sustainability – Experts will analyze sustainability vulnerabilities in the semiconductor industry, highlight existing resources that can be readily implemented, and explore innovative solutions to unsolved challenges. Participating companies and organizations include Applied Materials, Electramet, MeitY, and  Merck KGaA, Darmstadt, Germany.
• Workforce Development –This session will offer a comprehensive overview of semiconductor workforce development in India with insights from industry leaders, educators, and government officials. Participants will review and adapt successful global initiatives to the Indian context and explore potential partnerships with local educational institutions, government agencies, and NGOs. Participating companies and organizations include AICTE, Applied Materials, ESSCI, and Micron.
• In addition to the above, parallel sessions are planned themed around design ecosystem by Qualcomm, R&D for advanced packaging, and taxation regime of India. 

For more details, please visit www.semiconindia.org and connect with SEMI India on LinkedIn and X (#SEMICONIndia).

Press and media partners can register for free by contacting Samer Bahou at [email protected]. 

SEMICON India Sponsors

• Platinum: Applied Materials, KLA, Lam Research, SiLT, Tata Electronics, and Tokyo Electron (TEL) 

• Gold: KAS Technologies and Western Digital

• Silver: DISCO

SEMICON India Organization and Partners

SEMICON India 2024 is organized by SEMI, the global industry association representing the semiconductor and electronics design and manufacturing supply chain, in partnership with India Semiconductor Mission (ISM), Ministry of Electronics and IT (MeitY), and Messe München India, the Indian subsidiary of Messe München GmbH and a leading organizer of trade fairs in India. The SEMICON India 2024 program has been developed in partnership with the Electronic Industries Association of India (ELCINA) and with support from the India Electronics & Semiconductor Association (IESA) and India Cellular & Electronics Association (ICEA). 

About SEMI

SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

About ISM

ISM was established on December 15, 2021, under the Digital India Corporation following the approval of the Union Cabinet chaired by Hon’ble Prime Minister of India.  It is the nodal agency for the Semicon India Programme for Development of Semiconductors and Display Manufacturing Ecosystem in India with an outlay of ~USD 10 Bn.  The India Semiconductor Mission (ISM) has been advancing India's strategies to develop a robust semiconductor and display ecosystem. 

Association Contact

Samer Bahou
Phone: 1.408.943.7870
Email: [email protected] 

• Read more about SEMICON® India 2024 to Highlight Local Semiconductor Ecosystem Growth and Industry Trends from September 11-13

TAIPEI – September 4, 2024 – SEMICON Taiwan 2024 SEMI opens today at the Taipei Nangang Exibition Center (TaiNEX Hall 2) with industry leaders and visionaries set to take part in this year’s CEO Summit keynote program. The program culminates in a first-of-its-kind AI Chip Fireside Chat that will bring together key leaders from ASE Group, Google, Samsung, and TSMC to look at AI’s role in propelling the global semiconductor industry to $1 trillion in annual revenue near the end of this decade. Registration is open. 

The fireside chat will focus on how AI is driving global economic growth, strategies to address technical challenges and opportunities surrounding chips, and how different industries can accelerate cross-sector collaboration with the semiconductor ecosystem. Panelists include:

• Hamidou Dia, Vice President of Applied AI Engineering, Google 

• Dr. Jung-Bae Lee, Corporate President and Head of Memory Business, Samsung Electronics

• Dr. Y.J., Mii, Executive Vice President and Co-COO, TSMC

• Dr. Tien Wu, CEO, ASE Group, will moderate

CEO Summit keynotes will spotlight the AI revolution as it relates to manufacturing, packaging and testing, memory, and chip design. Presenters include:

• Gary Dickerson, President and CEO Applied Materials

• Dr. Luc Van den hove, President and CEO, imec

• Noam Mizrahi, Executive Vice President and Corporate CTO, Marvell

• Rani Borkar, Corporate Vice President, Azure Hardware Systems and Infrastructure, Microsoft

• The aforementioned Dr. Lee of Samsung Electronics

• Justin Kim, President, SK hynix

Record-setting Exhibition

Themed Breaking Limits: Powering the AI ​​Era, SEMICON Taiwan 2024 will feature an exhibition from September 4-6 with more than 3,700 booths – a record event high – and over 1,100 exhibitors showcasing groundbreaking semiconductor technology innovations and smart applications. As the largest and most influential annual semiconductor event on the Silicon Island, SEMICON Taiwan 2024 is expected to attract 85,000 visitors from 56 countries.

About SEMI

SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org to learn more.

Association Contacts

Elma Fang/SEMI Taiwan

Phone: 886. 3-560-1777 #211

Email: [email protected]

Samer Bahou / SEMI Headquarters

Phone: 1.408.943.7870

Email: [email protected]

• Read more about SEMICON Taiwan 2024 to Open with Tech Giants Discussing AI and Semiconductors at CEO Summit

MILPITAS, Calif. – September 3, 2024 – Seeking to bolster global semiconductor value chain efforts to lower greenhouse gas (GHG) emissions, the industry association SEMI released today an analysis by its Energy Collaborative (EC) of current and forecasted low-carbon energy (LCE) markets for Japan, the second in a series of market-specific reports. Developed by the SEMI EC and its sponsors, incorporating insights from the Japanese government and partner organizations, the report outlines policy changes and investments required to increase LCE supply.

Japan is cited as one of the two most challenging markets for clean energy procurement in the latest annual disclosure report from RE100, a consortium of more than 400 companies committed to using 100% renewable energy. In 2022, LCE made up only 27% of Japan’s electricity generation mix with the remaining 73% covered by fossil fuels. The EC projects the total LCE demand in Japan in 2030 to be 390 to 450 TWh, with the best-case-scenario being that supply falls 20-80 TWh short of demand, providing for only 20%-50% of total voluntary corporate demand. 

“The Japan government has goals to revitalize the semiconductor industry and triple global production from JPY 5 trillion now to JPY 15 trillion in 2030,” said Mousumi Bhat, PhD, Vice President, Global Sustainability Programs. “To do so, the industry will need access to LCE to meet its customers’ decarbonization expectations.”

The EC report recommends accelerating the installation of LCE in Japan by:

• Updating land usage policies that enable greater access for LCE development
• Alleviating current policy impediments to facilitate expanding and accelerating offshore wind development 
• Overcoming transmission grid bottlenecks with greater clarity on long term grid development plan and implementation / project delivery
• Fostering community collaboration that accelerates designation of LCE promotion zones across the country
• Facilitating collaboration among industries to propagate knowledge of corporate LCE procurement mechanisms.

“The analysis and findings of this substantial body of research provides a strong basis for collaboration with the semiconductor industry, facilitated by the Energy Collaborative’s meetings with government, infrastructure, and other industry leaders,” said Bhat. We provide detailed scenarios of our industry’s needs, energy technology analysis, and the voice of a critical energy customer as the local government plans policies that impact future supply of LCE.”

Each recommendation is supported by detailed analysis of current and historical market conditions in Japan and draws from concrete examples of how other regions have successfully implemented similar measures to drive LCE adoption.  

The Energy Collaborative report Key Challenges and Potential Solutions for Expansion and Procurement of Low-Carbon Electricity on Japan is the second of five, joining the report on South Korea. The EC will also analyze Taiwan, Malaysia and Singapore. Organizations sponsoring the EC will get access to more detailed analysis of each region. More information on the benefits of membership and sponsoring the Energy Collaborative initiative is available by contacting Jamie Belliveau at [email protected].

About the Energy Collaborative

The SEMI Energy Collaborative is dedicated to engaging a leadership network of corporations and domain experts to accelerate the pace of adoption of renewable energy solutions together with regional governments and regulators in key markets. Through collaboration with the semiconductor value chain, the EC aspires to improve the currently untenable trajectory of semiconductor manufacturing emissions. Companies sharing this vision from across the semiconductor and energy ecosystems sponsor the EC, along with partners from civil society and non-profit organizations.

About SEMI

SEMI ^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org , contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact
Samer Bahou
Phone: 1.408.943.7870
Email: [email protected] 

• Read more about SEMI Energy Collaborative Releases Recommendations for Growing the Supply of Low Carbon Energy in Japan

Chip Integration Technology Center (CITC) today announced the appointment of Toni Versluijs as the new chairman of its Supervisory Board. Versluijs will serve as the incoming chairman from September through December. Effective January 1, 2025, he will take over the responsibilities from chairman Roel Fonville who is retiring.

Versluijs has an extensive background of more than 25 years in the semiconductor industry, of which more than 15 years in general and executive management roles. Prior to this appointment, he worked for NXP, where he led the In-Vehicle Networking product line and was NXP Nijmegen site director and statutory director of NXP Netherlands. Most recently, he led the Business Group MOS at Nexperia, served as statutory director for Nexperia in the UK and was part of the company’s global executive leadership team.

He explains his choice for CITC: “I look forward to using my many years of experience in the semiconductor industry to contribute to the success of CITC in Nijmegen. Nijmegen is a location with a long heritage in semiconductor packages that have changed the world. CITC is a unique venture and has a unique position between private parties, the academic world and knowledge institutes.”

CITC is a smaller and different kind of organization than his previous employers, but Versluijs sees the potential: “CITC has attracted quite some talent in recent years, built partnerships and initiated new developments. In short: it has laid the foundation for growth, and it will flourish in the coming years. I am convinced that it has the potential to change the world of semiconductor packaging again.”

The current chairman of the CITC Supervisory Board, Roel Fonville, adds: “The Supervisory Board is very pleased to welcome Toni Versluijs to our midst. His personality and broad experience in the industry and in the Nijmegen region will help the Board to fulfill its role in securing the continued development of the organization.”

About CITC
Chip Integration Technology Center (CITC) is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC's contribution to the ecosystem is to provide access to innovation, infrastructure, and education. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by local and regional governments.
www.citc.org

• Read more about Toni Versluijs to chair CITC Supervisory Board from January 2025

The partnership aims to accelerate implementation of a sustainability roadmap across the entire value chain

Brussels, April 23, 2024 - Syensqo is now a member of the Semiconductor Climate Consortium (SCC), an initiative introduced by trade association SEMI to drive progress on addressing climate challenges within the semiconductor industry. As a materials supplier, the Group is determined to work with customers and partners across the industry to help implement a sustainability roadmap for the entire value chain.

“Semiconductors play a vital role in the green transition, they are at the center of new technologies but manufacturing them is resource intensive” said Peter Browning, President of Syensqo Specialty Polymers. “Through this partnership, Syensqo will contribute to the sustainability roadmap of the whole value chain, advancing the industry and benefiting humanity."

“The Semiconductors Climate Consortium is focused on addressing the challenges of climate change, which no single company can meet alone,” added Mousumi Bhat, PhD, Vice President of Global Sustainability at SEMI. “We welcome Syensqo to the SCC as a long-standing member of SEMI, and look forward to their collaboration in our value chain efforts.”

Syensqo provides high-performance material solutions for virtually every process step in advanced semiconductor manufacturing, including Solef® PVDF for ultra-pure water piping, Halar® ECTFE for gas abatement and wet process tool structural parts, Tecnoflon® PFR FFKM for O-rings, and Galden® PFPE for heat transfer fluids, as well as Fomblin® VAC for vacuum pump oil.

Syensqo’s ECHO portfolio is designed to offer specialty polymer grades with a lower carbon footprint than their original counterparts. These products integrate bio-sourced, recycled and mass balance feedstocks, while offering the same level of performance. Syensqo aims to become carbon neutral across all operations by 2040, with 40% reductions in Scope 1 and 2 emissions and 23% reductions in Scope 3 emissions by 2030[1].

Solef®, Halar®, Tecnoflon®, Galden® and Fomblin® are registered trademarks of Syensqo.

[1] Within the framework of the Greenhouse Gas Protocol (GHGP), Scope 1 refers to direct emissions from in-house production processes, Scope 2 to indirect emissions from purchased energy, and Scope 3 to all other indirect emissions from upstream and downstream sources, such as material supplies, packaging and transportation.

• Read more about Syensqo joins the SEMI Climate Consortium