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Primarius Technologies will demonstrate its entire portfolio of EDA toolchain and one-stop design enablement solutions that integrate advanced parallelization technologies with industry-proven modeling and simulation engines at the 61st Design Automation Conference (DAC) June 24-26 at Moscone West in San Francisco.

Also announced today: Primarius acquired Magwel N.V., provider of 3D solver- and simulation-based layout analysis and design solutions for digital, analog/mixed-signal, power management, automotive and RF ICs, and launched ESDiTM, a chip-level human body model (HBM) analysis platform and power device design, and PTMTM, a layout verification tool family.

Demonstrations will highlight Primarius’ fast, accurate device modeling and cell library characterization and circuit simulation solutions based on its continuous innovation and R&D expertise, including:

• SDEPTM, the spec-driven extraction platform that builds auto model extraction flows for fast SPICE model extraction, a key engine enabling efficient Design-Technology Co-Optimization (DTCO), and an extended capability on top of the de facto golden-standard SPICE modeling platform, BSIMProPlusTM.
• NanoSpice XTM, the latest high-performance SPICE simulator addressing simulation capacity and accuracy challenges of big post-layout designs at advanced process nodes.
• NanoSpice Pro XTM, the latest FastSPICE simulator with simulation performance and accuracy needs tailored for SRAM, DRAM, Flash and big analog-on-top designs in high-performance computing, mobile, AI and other advanced applications.
• NanoCellTM, the latest standard cell library characterization solution employs advanced distributed parallel architecture technology and cell circuit analysis extraction algorithms embedded with a high-precision SPICE simulator, making it a fast, accurate and easy-to-use alternative to other commercial solutions.
• ESDi, state-of-the art HBM analysis, simulation and verification tool for on-chip ESD protection.

The Primarius Product Portfolio
IC company challenges designing and manufacturing high-end chips have increased sharply. Foundries and IDMs need to provide their design customers with more comprehensive and accurate SPICE models, more reliable and complete PDKs, and more coverage of standard cell library within shorter development cycles. Chip designers also require stronger COT capabilities to work with device engineers to customize process and devices, develop customized SPICE models, and perform re-characterization of cell libraries based on actual applications.

Primarius provides complete EDA toolchain and a one-stop design enablement technical development solutions. Innovations like these can shorten the SPICE model development cycle from several months to a few weeks or even hours for quick iteration addressing the efficiency bottleneck of DTCO. The advanced simulation technologies speed-up challenging circuit simulation by several times, and the latest cell library characterization solution provides the best throughput with near-linear scaling on thousands of x86 or ARM CPU cores on a computer farm or public cloud.

It aims to enable faster turnaround from technology development to advanced chip designs. Solutions include advanced analysis capabilities for high-sigma yield, aging, EM/IR, ESD, signal integrity and more targeting optimum yield and power, performance and area (PPA).

Primarius also provides the 9812 series, an industry-golden low frequency noise testing system used by most industry-leading semiconductor companies worldwide. Its latest release, 9812AC, is the only commercial low-frequency noise system under AC excitation and designed for the most advanced process development and chip designs.

Magwel N.V. Acquisition
Primarius acquired Belgian-based Magwel N.V. driven by broad market demand and technological evolution, integrating its chip-level HBM ESD analysis platform, the power device design and layout verification tool suite and other technologies into the Primarius portfolio.

“Primarius and Magwel share a common goal of enhancing the market competitiveness of overall analog and power semiconductor solutions,” states Dr. Lianfeng Yang, President of Primarius. “Magwel's integration will further advance our strategy to optimize DTCO, enhance our technology portfolio, expand our product coverage and further strengthen and consolidate our market competitiveness.”

Availability and Pricing
Primarius Technologies. Pricing is available upon request.

For more information, visit the Primarius website or send email to [email protected].

Primarius Technologies at 61st DAC
Primarius Technologies will be in DAC booth #1415 Monday, June 24, through Wednesday, June 26, from 10 a.m. until 6 p.m. at Moscone West in San Francisco.

To arrange a private meeting or demonstration of the Primarius Technologies product portfolio, send email to: [email protected].

DAC registration is open.

About Primarius
Primarius Technologies (688206.SH) is a global electronic design automation (EDA) company providing innovative DTCO-enabled EDA solutions for advanced technology development, and complex full custom designs including analog, mixed-signal and memory circuits. Primarius provides the industry’s de facto golden SPICE modeling solution adopted by most of the leading semiconductor companies for more than a decade, and leading SPICE/FastSPICE technologies proven by leading memory and SoC design companies worldwide. Its design enablement EDA solutions enable a full coverage of fab technology development and fabless COT flow development including device testing systems, SPICE modeling and PDK development solutions, and standard cell library characterization solutions. Built around an innovative SPICE/FastSPICE dual engine, Primarius provides a complete circuit simulation and analysis solution with comprehensive high-sigma yield and signal integrity analysis, aging and EM/IR, ESD simulation and advanced circuit checking capabilities. Primarius also provides a complete full custom design environment with advanced circuit design and optimization, layout automation and physical verification functions, and hierarchy design planning and timing analysis solutions for advanced SoC designs. Visit Primarius Technologies for more information.

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If you are not yet a SEMI Standards Program Member, please fill out the Application FormMembership is free.

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Join us for the SEMI Standards

3D Packaging & Integration (3DP&I)

North America Technical Committee Chapter Meeting!

Date: Monday, July 15, 2024

Time: 13:00-14:30 Pacific Time

Online via Web Conference

To receive the calendar invite, please reach out to the contact below.

 

AGENDA

(Subject to change)

Last updated:  June 14, 2024

 

1:00 pm - 2:30 pm Off Add to Calendar 2024-07-15 13:00:00 2024-07-15 14:30:00 3D Packaging & Integration North America TC Chapter Meeting Join us for the SEMI Standards3D Packaging & Integration (3DP&I)North America Technical Committee Chapter Meeting!Date: Monday, July 15, 2024Time: 13:00-14:30 Pacific TimeOnline via Web ConferenceTo receive the calendar invite, please reach out to the contact below. AGENDA(Subject to change)Last updated:  June 14, 2024  Virtual United States SEMI.org [email protected] America/Los_Angeles public

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SEMI uses RingCentral to host virtual meetings. Make sure to download the latest version of RingCentral and test your audio connections prior to the meeting.

To download and install the RingCentral Meetings application to your computer:

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To receive the calendar invite, please reach out to the contact below.

Contact

Laura Nguyen
Sr. Coordinator, International Standards

Kitchener, Ontario, June 13, 2024 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, will launch the latest versions of its best-in-class automation and connectivity products at SEMICON West 2024.

The new versions of PEER® Tool Orchestrator (PTO®) and EIB® OEM feature multiplatform support for Windows and Linux, the latest technologies including Microsoft .NET and gRPC, and the ability to be deployed as a container.

“We’re excited to launch the latest versions of our flagship products, PTO and EIB OEM at booth 339 during SEMICON West,” says Mike Barrett, PEER Group’s Vice President, Global Sales. “By continuously reinvesting in our products, we make sure our customers get access to the latest technologies and advancements in tool automation and connectivity. Now, with PTO and EIB OEM, our customers benefit from more deployment flexibility, higher performance, reduced costs, and faster time to market.”

Cybersecurity forum
Building on the momentum of last year’s SEMICON West Global Cybersecurity Forum and subsequent establishment of the SEMI Semiconductor Manufacturing Cybersecurity Consortium (SMCC), SEMI is presenting an all-new forum for 2024, Assuring Cybersecurity Resilience Through Industry Partnership.

Hosted by Doug Suerich, PEER Group’s Director of Marketing and Governing Council member of the (SMCC), the forum will feature presentations from cybersecurity thought leaders who will share best practices examples from other industries and how they can be adopted by semiconductor manufacturing. Attendees will also learn about the progress made by the SMCC and the different ways industry members can get involved in helping guide the best path forward to securing and protecting our supply chain.

Smart Manufacturing Pavilion
Suerich will also perform moderating duties at the Smart Manufacturing Pavilion Stage, which will feature presentations on the latest advancements in smart manufacturing, including digital twins, AI, automation, and more.

To learn more about PEER Group’s presence at SEMICON West 2024, or to book a meeting during the show, visit: .

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. An award-winning company, PEER Group’s commitment to quality has been recognized by Intel’s EPIC Supplier Program, naming PEER Group a Distinguished Supplier in 2024. Follow PEER Group on LinkedIn.

Axiomise, a company noted for enabling formal verification adoption, today announced the formation of its Technical Advisory Board and its first two members, Dr. Vidya Chandran Darbari and Colin McKellar.

Dr. Darbari is an Axiomise co-founder and company director as well as Senior Lecturer in Structural Biology at Queen Mary University of London (QMUL). McKellar, formerly Vice President of Imagination Technologies, is currently Senior Director of Hardware at X-Silicon Inc.

“Vidya and Colin have long served as my unofficial advisers and confidants as I built Axiomise from the ground up,” remarks Dr. Ashish Darbari, founder and CEO of Axiomise. “Formalizing our relationships with Vidya and Colin will further strengthen the company and the expertise of our formal verification experts.”

“I have had the pleasure of watching Axiomise grow from early startup to a formidable verification provider and I couldn’t be prouder,” states Dr. Darbari. “I look forward to adding my voice as a member of the Technical Advisory Board.

My relationship with Ashish goes back to the early days of Imagination,” notes McKellar. “I watched with amazement and respect as he implemented a rigorous formal verification flow that caught bugs that would have forced costly respins and threats to the company’s good name and reputation.”

About Dr. Vidya Chandran Darbari
Dr Vidya Chandran Darbari, an Axiomise co-founder and company director, has a multi-disciplinary record combining medicine, life sciences, mathematics and technology. A leader and key contributor who leads from the front, Dr. Darbari helped steer Axiomise from its early stages to establishing it as a global leader in formal verification consulting and services, training and RISC-V solutions. She is a senior lecturer at the Queen Mary University of London with several impactful publications in high-end journals including Nature and Science. Dr Darbari received her Bachelor of Medicine, Bachelor of Surgery (MBBS) degree from Seth G.S. Medical College (KEM Hospital) in Mumbai, India, before completing her Master of Technology (MTech) degree from Indian Institute of Technology (IIT) Bombay. Dr. Darbari obtained her Doctorate degree from the University of Cambridge. She has been recognized for her innovative research through Biochemical Society Early Career Award, British Crystallographic Society Early Career prize and recently a Research Excellence Award by the Science and Engineering Faculty at QMUL.

About Colin McKellar
Colin McKellar brings the customer experience to the Axiomise team having been a key player in driving customer engagements in his previous roles with Apple, Intel, TI, SiFive and SEGA among others. He started his career in electronics 30 years ago in Sony Broadcast and Professional working on HD video encode and decode. Most of his career was spent working at Imagination Technologies as a key contributor to the graphics IP roadmap and was instrumental in bringing in and maturing a world-class verification infrastructure including simulation, formal verification and large FPGA, emulation and silicon farms. McKellar joined X-Silicon in 2023 with the responsibility to drive product and execution for bringing graphics and AI acceleration to the RISC-V ecosystem. He has a wealth of design and verification experience across GPU, CPU, AI and SoC chips successfully managing large multinational teams of more than 200 engineers.

About Axiomise
Axiomise is accelerating formal verification adoption through its unique combination of training, consulting, services and specialized verification solutions for RISC-V. Axiomise was founded by Dr. Ashish Darbari, FBCS, FIETE, DPhil (Oxford), who has been a formal verification practitioner for more than two decades with 60 patents in formal verification and over 70 publications.

Engage with Axiomise at:
Website: www.axiomise.com
Twitter: @axiomise
LinkedIn: https://www.linkedin.com/company/axiomise/
Facebook: https://www.facebook.com/axiomise

If you are an employer wanting to get involved, please contact: 

Melinda Gomez 

mgomez@semiorg

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This webinar will introduce members of the military community to the semiconductor industry and connect them directly with veterans and recruiters. Employers recognize and need this skilled and talented community to join as the industry prepares for huge growth in the next few years.  We will dive into the roles expected and qualifications needed to jump into an exciting new career. Opportunities nationwide!

About SEMI VetWorks


The SEMI VetWorks Initiative aims to address the microelectronics industry's need for attracting, developing, and retaining talent by tapping into the skills and experiences of military veterans and reservists. SEMI prioritizes connecting its members with this talented pool through initiatives that align industry hiring practices, internship, and apprenticeship programs. By leveraging existing training and credentialing opportunities, veterans gain access to well-paid technician and operator roles. The SEMI VetWorks Guidebook offers tools and recommendations for recruiting, hiring, and retaining veterans, while the SHRM Veterans at Work Certificate program provides additional resources for connecting with the military community.

Watch the recording of the March webinar

United States

10:00 am - 10:20 am
Melinda Headshot Round
Melinda Gomez
Program Manager, Veteran Initiatives
SEMI Foundation

Industry Overview

10:20 am - 11:00 am

Panel of Opportunities

George Ramsey, Micron
Jason Spears, TEL
Jordan Smith, ASM
Dana Gharda, ASML
Mardo Caceres, Applied Materials

11:00 am - 12:00 pm

Breakout rooms to network with employers

Workforce Development

Members of the Military Community, join us for an interactive and informative session about career opportunities in the semiconductor industry. Hear from employers and veterans in the industry directly!

10:00 am - 12:00 pm Off Add to Calendar 2024-06-26 10:00:00 2024-06-26 12:00:00 SEMI VetWorks: Careers in Chips Members of the Military Community, join us for an interactive and informative session about career opportunities in the semiconductor industry. Hear from employers and veterans in the industry directly! United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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Leadership Board Provides Ongoing Insights on Design of Career-Ready Programs

WILMINGTON, Del., June 5, 2024 — DuPont (NYSE: DD) today announced that Randal King, PhD, Vice President of R&D/Technology, DuPont Electronics & Industrial, has been named to Purdue University’s Semiconductor Degrees Leadership Board.

As a member of the Board, Dr. King will bring his unique perspectives from DuPont into the Semiconductor Degrees Program. Introduced in 2022, the Semiconductor Degrees Program is one of the first in the U.S. to offer semiconductor-specific credentials to graduate and undergraduate students as well as a master’s degree in semiconductor engineering to prepare students for a variety of careers in the industry. Students can take classes on a wide range of topics including semiconductor materials, devices, and manufacturing, system on chip design, thermal management, heterogeneous integration and advanced packaging, and green manufacturing. Students have experiential learning opportunities through STARS (Summer Training and Awareness for Semiconductors) and through industry-advised student project teams during the academic year.

The Semiconductor Degrees Leadership Board is a group of senior industry professionals representing the breadth of the semiconductor supply chain. The Board plays an active role in ensuring the Program’s content reflects current and future workforce needs, including skilled roles in fab operations, innovation, product development, engineering, technical service, quality, data science, and other related areas.

“I’m honored to join the Purdue University Semiconductor Degrees Leadership Board to provide guidance on programs that support the next generation of the semiconductor workforce,” said Dr. King. “Through mentorship, education, and collaboration, this program will help develop qualified talent to meet growing demand across the electronics ecosystem and prepare individuals for the unique challenges of the semiconductor industry.”

According to a recent report from the Semiconductor Industry Association (SIA), the U.S. is expected to triple semiconductor manufacturing capacity from 2022 to 2032, with policies such as the CHIPS and Science Act supporting investments throughout the supply chain (SIA, 2024). However, research from Deloitte and other firms indicates there will be a talent shortage of 70,000 or more fab jobs alone (Deloitte, 2022), and additional talent needed throughout the supply chain. One key path to addressing future talent needs is by attracting and training more students for careers in semiconductor fields.

DuPont is a key semiconductor materials supplier in the U.S., with domestic research and development and manufacturing operations for materials including pads and slurries for chemical mechanical planarization (CMP), photoresists and other microlithography materials, advanced cleaning chemistries, electronic polymers, and advanced packaging materials.

Dr. King brings more than 30 years of industry experience, and currently leads innovation strategy and worldwide research and development investment, and the execution and management of all technical resources for DuPont’s Electronics & Industrial business, a technology leader serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, defense, industrial and transportation industries.

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. http://electronics.dupont.com

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

Sunnyvale, USA - Meylan, FRANCE – May 29, 2024 Numem - a leader in high-performance Memory IP Cores and Memory Chip/Chiplet based on its patented NuRAM (MRAM) and SmartMem technologies, and IC’ALPS - a leader in ASIC/SoC design and supply chain management, have pooled their expertise to meet the challenge of developing an ambitious integrated circuit with RISC-V processors, 2MBytes of NuRAM and a DSP/AI Custom Datapath Accelerator. The Custom SoC was developed in an advanced technology node.

This SoC has been designed and implemented to highlight the Numem high-performance, low power Memory subsystem with a RISC V Processor and AI Accelerator for ultra-low power applications. It has been developed through a close collaboration between Numem and IC’ALPS.

The physical implementation of this integrated circuit was made in a secure space (isolated location, network, and servers, encrypted exchanges, etc.) to meet with the stringent protection of sensitive data required by this program.

“We were very pleased with the collaboration and quality of service provided by IC’ALPS which made this on-time tape out possible and first time functional silicon,” said Jack Guedj, CEO of Numem. NuRAM with SmartMem is a high-performance memory subsystem which is 2-3x smaller and boast significant power reduction over SRAM,” he added.

Lucille Engels, COO of IC’ALPS indicated: “The challenges were numerous including: architecture, power domains, protection of the sensitive data, run times pushing improvement of EDA flow and the pressure of the tape out deadline.”

Numem and IC’Alps intend to extend their partnership to serve new customers SoC projects – feel free to contact us.

NUMEM/IC'ALPS with ultra-low-power SoC for Sensor and AI

About NUMEM
Numem, headquartered in Sunnyvale, California, is the leading provider of Memory Subsystem Chip/Chiplet and IP based on proven foundry MRAM process. Numem’s patented NuRAM technology enables best in class power/performance and reliability with 2.5x smaller area and 85x lower leakage power than traditional SRAM. Numem’s SmartMem subsystem technology significantly improves performance and endurance as well as ease-of-use and reliability for high-volume deployment and enables to reach ultra-high bandwidth.
Visit our website at https://www.numem.com or contact us at [email protected].

About IC’Alps
IC’Alps is your one-stop-shop ASIC partner. Based in France (HQ in Grenoble, two design centers in Grenoble and Toulouse), the company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the management of the entire production supply chain. Its areas of expertise include analogic, digital and mixed-signal circuits (sensor/MEMS interfaces, ultra-low power consumption, power management, high-resolution converters, high voltage, signal processing, ARM and RISC-V based multiprocessors architectures, hardware accelerators) on technologies from 0.18 µm down to 5 nm, and from multiple foundries (TSMC, Global Foundries, Tower Semiconductor, X-FAB, STMicroelectronics, etc.). The company is active worldwide in medical, industrial, automotive, IoT, IA, mil-aero and digital identity & security sectors. IC’Alps is ISO 9001:2015, ISO 13485:2016, EN 9100:2018 certified, Common Criteria on-demand, IATF16949-ready, member of TSMC Design Center Alliance (DCA), ARM Approved Design Partner and X-FAB’s partner network. More information on www.icalps.com and follow us on https://www.linkedin.com/company/ic-alps

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Your company has built a strong patent portfolio — now what? This webinar will discuss strategies for managing existing patents, including how to use IP to strengthen your business and maximize return on investment.  Topics will include best practices for patent marking, controlling rising maintenance fees, and licensing, as well as insights into emerging trends in patent enforcement and litigation in the semiconductor sector.

 

 ABOUT THE SPEAKER

Michael Jones, Partner, Rothwell Figg
Michael H. Jones’s practice includes patent litigation, patent prosecution, and IP counseling.  Michael advises clients who have developed a broad range of technologies, including semiconductor devices and manufacturing, integrated circuits and systems, green energy, terahertz electronics, hardware and protocols for wireless communications, and various online technologies. Although much of his work is with large multinational clients with complex patent portfolios, Michael also has a significant, and growing, practice with smaller high-technology clients, ranging from startups to growth companies dealing with patent issues for the first time in their evolution. Michael has a B.S. in Electrical and Computer Engineering from University of Virginia, a M.S. in Electrical and Computer Engineering from University of California, Santa Barbara, and a J.D. from The George Washington University Law School.

United States

Michael Jones
Michael Jones
Member
Rothwell Figg
Gity Samadi
Gity Samadi
Director, R&D Programs
SEMI
NBMC ESD Alliance FlexTech 10:00 am - 12:00 pm Off Add to Calendar 2024-11-06 10:00:00 2024-11-06 12:00:00 FEMC #23 Best Practices for Semiconductor Patent Portfolio Management United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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Dan Trojan, CEO, Axus Technology
 
Dan Trojan is the Chief Executive Officer of Axus Technology, a leading provider of chemical mechanical planarization (CMP) and wafer thinning equipment and process solutions for the semiconductor industry. With a distinguished career spanning 34 years, Dan brings a wealth of experience in engineering, management, and strategic leadership to his role at Axus Technology. Before joining Axus Technology, he held key roles at SpeedFam, Speedfam- IPEC, and Strasbaugh, where he was instrumental in driving innovation and operational excellence.
Since becoming CEO of Axus Technology, Dan has focused on expanding the company's global footprint, enhancing its product offerings, and fostering a culture of continuous improvement and customer-centric innovation. Under his leadership, Axus Technology has achieved significant milestones in product development and market penetration, solidifying its reputation as a trusted partner in the semiconductor manufacturing industry.
Dan is known for his collaborative approach, commitment to quality, and strategic vision, which have been pivotal in steering Axus Technology towards sustained growth and success. His dedication to advancing semiconductor technology continues to inspire the Axus team and drive the company forward in a rapidly evolving industry.
 
Catherine Bullock, Director Process Technology, Axus Technology
 
Catherine Bullock is a seasoned leader in the semiconductor industry, currently serving as the Director of Process Technology at Axus Technology. With a robust career spanning over two decades at companies like Novati, Applied Materials, and Motorola, Catherine has been at the forefront of process innovation and technological advancements in semiconductor manufacturing.
Catherine joined Axus Technology, a leading provider of CMP and wafer thinning solutions, bringing with her a wealth of experience and a proven track record of success in process engineering and technology development. Her expertise encompasses a wide array of semiconductor processes, including chemical mechanical polishing (CMP), wafer bonding, and custom process development techniques
At Axus Technology, Catherine is responsible for spearheading the development and optimization of cutting-edge process technologies. Her role involves leading a talented team of engineers and collaborating closely with customers to deliver customized solutions that meet the evolving demands of the semiconductor market. Catherine’s strategic vision and technical acumen have been instrumental in driving the company’s innovation initiatives and maintaining its competitive edge.
Catherine holds a Bachelor of Science in Chemical Engineering from a prestigious university, where she graduated with honors. Her educational background laid a solid foundation for her career, providing her with the critical thinking skills and technical knowledge necessary to excel in the semiconductor industry.


 

United States

Dan Trojan
CEO
Axus Technology
Catherine Bullock
Director Process Technology
Axus Technology
MSIG

Silicon Carbide (SiC) is revolutionizing the semiconductor industry, enabling the development of advanced technologies across AI, MEMS, sensors, automotive, and semiconductor sectors. As a next-generation material, SiC offers advantages that silicon cannot match. However, processing SiC is challenging and expensive. Leading CMP semiconductor manufacturers still rely on outdated technology and inefficient processes, resulting in high costs which hinder innovation. To address these challenges, Axus Technology is hosting a webinar on SiC to introduce its modern, flexible CMP technology and solutions for efficient SiC processing. 

8:00 am - 9:00 am Off Add to Calendar 2024-06-27 08:00:00 2024-06-27 09:00:00 Advanced SiC Processing to Enable Future Technology in the AI, MEMS, Sensors, Automotive, and Semiconductor Industries Silicon Carbide (SiC) is revolutionizing the semiconductor industry, enabling the development of advanced technologies across AI, MEMS, sensors, automotive, and semiconductor sectors. As a next-generation material, SiC offers advantages that silicon cannot match. However, processing SiC is challenging and expensive. Leading CMP semiconductor manufacturers still rely on outdated technology and inefficient processes, resulting in high costs which hinder innovation. To address these challenges, Axus Technology is hosting a webinar on SiC to introduce its modern, flexible CMP technology and solutions for efficient SiC processing.  United States SEMI.org [email protected] America/Los_Angeles public Register here
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