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United States Understanding Semiconductor Technology and Business (Asia)
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Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device. 
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, check your junk/spam folders before contacting SEMI U for support.

Singapore

SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing
  • Members: $545
  • Non-Members: $645
  • Students/Vets: $445

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

9:30 am - 5:00 pm Off Add to Calendar 2024-10-28 09:30:00 2024-10-28 17:00:00 Understanding Semiconductor Technology and Business (Webinar, Asia) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $545Non-Members: $645Students/Vets: $445* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now
Event format
United States Packaging Material and Characterizations for Microelectronics
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Course Description 

The principles of Microelectronics packaging range from Electronics, Mechanical, and Material to Chemical Engineering. Due to this multi-discipline nature, many industry professionals don’t know what they don’t know as they do not undergo multi-discipline training to understand these principles. This course provides the necessary technical knowledge for industry professionals. 

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Directors
  • Managers
  • Process Engineers
  • R&D Engineers
  • Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

  • Understand the principles in the evolution of IC packaging and how the semiconductor industry has evolved with time.
  • Understand the principles of Interconnections ranging from TAB, and Wirebond to various Flip Chip bonding, such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development.
  • Review the interposer of leadframe, ceramic, flex to BT substrates for Microelectronics packaging.
  • Explain the assembly flow and new assembly techniques from backgrinding to singulation.
  • Describe the material characterization from bulk to interfaces to reduce stress and enhance interfacial adhesion for reliability enhancement.

Course Topics

  • Advanced packaging and material characterization.
  • Packaging principles and how packaging evolves into heterogeneous packaging.
  • Packaging concepts such as Fan-in, Fan-out WLP, Embedded packaging technology, 3D packaging, TSV.
  • Wirebond and Flip chip interconnect technologies inclusive of interposer technologies, such as leadframe, ceramic, flex and substrate.
  • Assembly processes from backgrinding to singulation for QFP and FBGA packages.
  • Material characterization to select materials to reduce stress and strengthen the interface for reliability enhancement.

Instructor

Dr. Lee Teck Kheng

Institue of Technical Education

Instructor Bio

Please note that only the person who registered will receive a certificate of completion. 

 

 

United States

- SEMI U

Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 of this course focuses on the design in electrical and thermal which are used to enhance the electrical, thermal, and reliability performance of the package. 

Pricing
  • Members: $645
  • Non-Members: $745
  • Students/Vets: $545

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

2:00 pm - 6:00 pm Off Add to Calendar 2024-10-09 14:00:00 2024-10-10 18:00:00 Advanced Packaging and Material Characterization for Microelectronics (Webinar, US) Strengthen your knowledge and skills by learning about new packaging technologies in Fan-in, Fan-out WLP, Embedded packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV, etc. Packaging knowledge is a must for professionals in the semiconductor industry. The first part of this course dives deep into advanced packaging. Part 2 of this course focuses on the design in electrical and thermal which are used to enhance the electrical, thermal, and reliability performance of the package. PricingMembers: $645Non-Members: $745Students/Vets: $545* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
Event format

Registration

Early Bird Pricing (Before October 15, 2024)
Member: $75 | Non-member: $100

Regular Pricing
Member: $100 | Non-member: $125

Registration is final. No refunds provided. No substitutions.

Lin Tso
Email: [email protected]
Phone: +1.408.943.7920

+
United States Midwest Chapter Forum Thumbnail Business Executive

Travel

Union Club Hotel

Hotel Accommodations

The Union Club Hotel is located on-campus with a dedicated parking garage located directly across from The Purdue Memorial Union.
 

There are also two hotels located near campus (5min drive).

 

Parking

Parking on-campus can be often a challenge. Whether you stay at the Union Club Hotel, or another hotel, parking in the Grant Street Parking Garage will be the best option for the day.

View Purdue University's Campus Map

 

Shuttle Options

There are shuttle options from ORD (O’Hare Airport) or IND (Indianapolis Airport) to Purdue University.

Union Club Hotel
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BMWC Logo 170x65
Huntington Logo 170x65
Indiana Economic Development Corp Logo 170x65
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Become a Sponsor

Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Midwest Breakfast Forum.

Contact Lin Tso, [email protected] to learn about available sponsorship opportunities.

Join us for the Midwest Chapter Breakfast Forum—

The Growing Semiconductor Ecosystem and U.S. Innovation in the Midwest

Join us to hear from industry leaders on their pivotal role in America’s semiconductor innovation. Listen in on discussions about how Indiana and our Midwest partners are bolstering the semiconductor industry, and how they are leveraging the exceptional talent pipeline to drive forward key innovations that will impact global markets. 

SEMI Midwest Breakfast Forum is an excellent opportunity to LEARN, NETWORK, and SHARE your business solutions and ideas—Register Today!

This new regional chapter was formed to serve SEMI Members in the Midwest region. Its goal is to support member companies to grow and prosper collectively. Future chapter forums will identify, discuss, and find solutions to current topics impacting our industry. 

 

View Purdue University's Campus Map

In-Person—Eastern Time
Purdue Memorial Union, North Ballroom
101 North Grant Street
West Lafayette, IN 47906-3574
United States

Eastern Time | Tuesday, October 29, 2024 | In-Person

8:00 am - 8:30 am

Check-In and Breakfast

8:30 am - 8:40 am
Dave Brewster, Managing Director, Jobs Ohio
Dave Brewster
SEMI Midwest Chapter Co-Chair and Managing Director, Information Technology Sector
JobsOhio
Vidya Vijay
Vidya Vijay
SEMI Midwest Chapter Co-Chair and Senior Program Manager
Nordson Corporation
8:40 am - 8:45 am
April Fisher, Indiana Economic Development Corporation
April Fisher
Vice President, Global Markets
Indiana Economic Development Corporation (IEDC)

IEDC Welcome

8:45 am - 9:05 am
Dimitrios Peroulis, Purdue University
Dimitrios Peroulis
Senior Vice President for Partnerships and Online, Reilly Professor of Electrical and Computer Engineering
Purdue University

Keynote

9:05 am - 9:30 am
Jonathan Spaner, McKinsey
Jonathan Spaner
Partner
McKinsey & Company

Market Perspectives on CHIPs Act Implementation

9:30 am - 9:50 am
Jimmy Costa, ARI
Jimmy Costa
Senior Vice President of Innovation and Semiconductor
Applied Research Institute (ARI)

Applied Research Institute

9:50 am - 10:20 am

Break

10:20 am - 10:40 am
Patrick Wilson, Mediatek
Patrick Wilson
Vice President, Government Relations
MediaTek

Here vs There, What is Takes to Drive Semi Innovation to the Midwest

10:40 am - 11:00 am
Woongsun Lee, SK hynix
Woong Sun Lee, PhD
Head of WLP Technology Wafer Level Manufacturing Technology
SK hynix

Unleashing The Possibilities of AI Memory Technology

11:00 am - 11:20 am
Julie Orlando, Nanotronics
Julie Orlando
Chief Product Officer
Nanotronics

Nanotronics

11:20 am - 11:40 am
Dave Brewster, Managing Director, Jobs Ohio
Dave Brewster
SEMI Midwest Chapter Co-Chair and Managing Director, Information Technology Sector
JobsOhio

Growing the Semiconductor Ecosystem in the Midwest

11:40 am - 12:00 pm

Q&A and Closing Remarks

Workforce Development

SEMI Breakfast Forum Organized by SEMI Midwest Chapter

In-Person

Eastern Time

Hosted and Breakfast Forum Sponsored by Purdue University

8:00 am - 12:00 pm Off Add to Calendar 2024-10-29 08:00:00 2024-10-29 12:00:00 Midwest Chapter Breakfast Forum—The Growing Semiconductor Ecosystem and U.S. Innovation in the Midwest SEMI Breakfast Forum Organized by SEMI Midwest ChapterIn-PersonEastern TimeHosted and Breakfast Forum Sponsored by Purdue University In-Person—Eastern Time Purdue Memorial Union, North Ballroom 101 North Grant Street West Lafayette, IN 47906-3574 United States SEMI.org [email protected] America/New_York public America/New_York 2
REGISTER NOW

Brewer Science Named 2024 National Top Workplace in Manufacturing Industry

Work-life balance and supportive managers among top culture drivers identified

Rolla, MO – July 15, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, has been named a 2024 National Top Workplace in the Manufacturing Industry, marking the fourth consecutive year the company has received this recognition.

Brewer Science has been named 2024 Top Workplaces 2024 based upon employee feedback

This list is based solely on employee feedback gathered through a third-party survey administered by employee engagement technology partner Energage LLC, a research company with more than 18 years of experience surveying over 27 million employees at 70,000 organizations. Results are calculated by comparing the survey’s research-based statements, including 15 Culture Drivers proven to predict high performance against industry benchmarks.

In addition to being named a National Top Workplace in the Manufacturing Industry, Brewer Science received regional recognition as a 2024 Top Workplace in Greater St. Louis, marking the eighth consecutive year the company has received this recognition.

“Being recognized as a Top Workplace both on a national industry level, as well as locally within our community, speaks volumes to Brewer Science’s dedication in providing our employee-owners with the most fulfilling work experience,” states Dan Brewer, Executive Vice President, Corporate Resources Officer at Brewer Science.

Culture Badges demonstrate employee satisfaction

Brewer Science ranked in the top 25% in two culture drivers, thus earning separate Culture Badges for Work-Life Balance and Supportive Managers, described by Energage as the following:

Work-Life Balance: Employees have the flexibility they need to balance their work and personal life.

Earning the Work-Life Balance badge is best exemplified by some of Brewer Science’s policies and benefits, including:

- Community Service Leave
- Flexible Schedules
- Wellness Breaks
- Disconnect Days

Supportive Managers: Employees feel the managers at Brewer Science care about their concerns and help them learn, grow and succeed.

Earning the Supportive Managers badge is best exemplified by some of Brewer Science’s leader development programs, including:

- Emotional Intelligence Training
- On-Demand Coaching and Mentoring
- Leader Development Programs
- Educational Assistance

“Brewer Science is honored to receive the Top Workplace Award for the eighth consecutive year and to be recognized for supportive managers and work-life balance – drivers enabling our employee-owners to be fulfilled and engaged,” states Vicki Hallsworth, Director of International Human Resources at Brewer Science. “Valuing our employees’ well-being and workplace experience is key to our success, as their investment and satisfaction drives company and industry growth, exceptional service and innovative solutions our customers and communities trust and expect.”

Providing customized solutions to customers’ unique complex situations requires high regard for a sense of purpose and commitment by everyone within the company. This dedication has been instilled through the company values and creates a workplace flourishing with culture. The employees at Brewer Science are attentive to their roles in the company and the value they articulate to the customers, suppliers, and industry. This has been exemplified by the company becoming Certified Employee-Owned in 2020. Additionally, the company was recognized for meeting the highest corporate social and environmental standards, transparency, and accountability to all stakeholders by becoming a Certified B Corporation™ in 2021.

Learn more about Brewer Science’s company culture and explore career opportunities by visiting our website: https://www.brewerscience.com/about-us/company/careers/

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.

United States Understanding Semiconductor Technology and Business (EU)
Highlighted content

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device. 
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Please note that only the person who registered will receive a certificate of completion. 

Germany

SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing

Early Bird Special! $200 off

  • Members: $845 $645
  • Non-Members: $955 $745
  • Students/Vets: $845 $545

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

9:30 am - 5:30 pm Off Add to Calendar 2024-10-15 09:30:00 2024-10-15 17:30:00 Understanding Semiconductor Technology and Business (Webinar, EU) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingEarly Bird Special! $200 offMembers: $845 $645Non-Members: $955 $745Students/Vets: $845 $545* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. Germany SEMI.org [email protected] Europe/Brussels public Europe/Brussels Register Now
Event format
United States Overview of Semiconductor Manufacturing (EU)
Highlighted content

Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing:
    • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
    • Etching and Cleaning Processes: Plasma and wet etching processes
    • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
    • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
    • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
    • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
    • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Please note that only the person who registered will receive a certificate of completion. 

Germany

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Pricing

Early Bird Special! $200 off

  • Members: $995 $795
  • Non-Members: $1,095 $895
  • Students/Vets: $895 $695

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

9:30 am - 5:00 pm Off Add to Calendar 2024-10-16 09:30:00 2024-10-17 17:00:00 Overview of Semiconductor Manufacturing (Webinar, EU) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingEarly Bird Special! $200 offMembers: $995 $795Non-Members: $1,095 $895Students/Vets: $895 $695* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. Germany SEMI.org [email protected] Europe/Brussels public Europe/Brussels Register Now
Event format
United States SEMI Silicon Valley Forum Business Executive
ABB Logo 170x65

Become a Sponsor

Sponsoring the SEMI Silicon Valley Breakfast Forum offers unique opportunities to elevate your brand, connect with industry leaders, and influence the future of semiconductor innovation.

Contact Tim Janes, [email protected] to learn about available sponsorship opportunities. 

Data Centers, Eat Your Vegetables: Building Sustainable Foundations for the AI Era

The industry has been feasting on AI growth, performance, and scale, but now must focus on the less glamorous necessities—efficiency, sustainability, materials, power, water, circularity, and supply chain resilience. 

The AI boom has created unprecedented demand for compute, power, cooling, advanced materials, and infrastructure. While industry attention has focused on performance and scale, the next phase of growth will require discipline around resource efficiency, environmental impact, and long-term resilience. What are the "vegetables" the industry needs to consume today to ensure healthy growth tomorrow?
 

SEMI HQ
673 S. Milpitas Blvd.
Milpitas, CA 95035
United States

Thursday, November 5, 2026 | Pacific Time

7:00 am - 8:00 am

Registration and Breakfast

8:00 am - 8:10 am
Joe Stockunas, SEMI Americas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

8:10 am - 8:20 am
Charlie Polidoro, IEEE
Charlie Polidoro
Silicon Valley Co-Chair
Inventec

Introduction

8:20 am - 9:20 am

Keynote Presentation

9:20 am - 9:50 am

The AI Diet—Why Broccoli Matters More than Ever

9:50 am - 10:20 am

The Energy Plate—Powering Growth Without Breaking the Grid

10:20 am - 10:50 am

Hidden Ingredients—Which Resources will Become the Industry’s Biggest Bottleneck Over the Next Decade?

10:50 am - 11:20 am

Networking Break

11:20 am - 11:50 am

Healthy Growth—Sustainability to Business Imperatives

11:50 am - 12:20 pm

Panel Discussion—From Chips to Chillers: The Sustainable Materials Stack Behind AI

12:20 pm - 12:30 pm
Janell Centers, Macquarie
Janell Centers
Marketing Manager
Macquarie

Closing Remarks

Presented by the SEMI Silicon Valley Chapter

 

7:30 am - 12:30 pm Off Add to Calendar 2026-11-05 07:30:00 2026-11-05 12:30:00 SEMI Silicon Valley Breakfast Forum Presented by the SEMI Silicon Valley Chapter  SEMI HQ 673 S. Milpitas Blvd. Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles 2
REGISTER NOW
Event format
Promote in calendar
Off
United States Overview of Semiconductor Manufacturing
Highlighted content

Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing:
    • Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
    • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
    • Etching and Cleaning Processes: Plasma and wet etching processes
    • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
    • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
    • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
    • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
    • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Biography

Embassy Suites by Hilton Scottsdale Resort
5001 N. Scottsdale Road
Scottsdale, AZ 85250
United States

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Pricing
  • Members: $1,295 
  • Non-Members: $1,395 
  • Students/Vets: $1,195 

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:30 am - 5:00 pm Off Add to Calendar 2024-10-22 08:30:00 2024-10-23 17:00:00 Overview of Semiconductor Manufacturing Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingMembers: $1,295 Non-Members: $1,395 Students/Vets: $1,195 * For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. Embassy Suites by Hilton Scottsdale Resort 5001 N. Scottsdale Road Scottsdale, AZ 85250 United States SEMI.org [email protected] America/Phoenix public America/Phoenix Register Now
Event format
United States Understanding Semiconductor Technology and Business
Highlighted content

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device. 
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

 

Denny Frye 

PT International, LLC

Biography


Embassy Suites by Hilton Scottsdale Resort
5001 N. Scottsdale Road
Scottsdale, AZ 85250
United States

SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing
  • Members: $1,095 
  • Non-Members: $1,199
  • Students/Vets: $895

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:30 am - 5:00 pm Off Add to Calendar 2024-10-21 08:30:00 2024-10-21 17:00:00 Understanding Semiconductor Technology and Business Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingMembers: $1,095 Non-Members: $1,199Students/Vets: $895* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. Embassy Suites by Hilton Scottsdale Resort 5001 N. Scottsdale Road Scottsdale, AZ 85250 United States SEMI.org [email protected] America/Phoenix public America/Phoenix Register Now
Event format
United States From Concept to Reality: Advancing Digital Twins in Semiconductor Manufacturing Business Executive Technical

Suggested Hotels:

Embassy Suites by Hilton Milpitas Silicon Valley

901 East Calaveras Boulevard

Milpitas, CA 95035

(408) 942-0400

 

Courtyard by Marriott Milpitas Silicon Valley

1480 Falcon Dr.

Milpitas, CA 95035

(408) 719-1966

 

Event Sponsors

AirV Labs
Dassault Systems
INFICON
PhysicsX
SEEQ
Sentient Cloud

Sponsorship Opportunities

Enhance your brand with our exclusive sponsorship packages. For details, contact:

Eric Rude
Tel: +1.408.943.7047
Email: [email protected]

Highlighted content

From Concept to Reality: Advancing Digital Twins in Semiconductor Manufacturing

Following up on the SEMI Digital Workshop 2023, this workshop will delve into the practical aspects of implementing digital twin technology in semiconductor manufacturing. The aim is to bridge the gap between theoretical concepts and real-world applications, providing participants with actionable insights and strategies to successfully develop and integrate digital twins into their operations. Further the workshop aims to address some of the future upcoming challenges in the areas of integration of multi-modal real time data sources, security, process complexity, scalability, and standards.

 

SEMI HQ
673 S Milpitas Blvd.
Milpitas, CA 95035
United States

Morning, Day 1: December 4, 2024

8:00 am - 9:00 am

Registration & Breakfast​

9:00 am - 12:30 pm

Session #1 - Data Needs for Digital Twins - Data Sources, Integration & Interoperability

This session will explore the critical data requirements for creating and maintaining digital twins. Integrating multi-modal data sources (sensors, enterprise systems, equipment, etc.) that feed into digital twins, ensuring that they accurately reflect their physical counterparts is a minimum necessity. This session will also cover data integration techniques (from various factory systems), and interoperability to support dynamic digital twins.

9:00 am - 9:10 am
Mark da Silva
Mark da Silva​
Senior Director, Smart Manufacturing
SEMI

Welcome Remarks

9:10 am - 9:35 am
Mike Neel
Michael Neel
Director of Marketing
Inficon

Keynote​ - Enabling Autonomous Operations Through Integrated Digital Twins

9:35 am - 10:00 am
Robert Baseman
Robert Baseman
Senior Technical Staff Member
IBM

Semantic Models for Microelectronic Manufacturing & Development

10:00 am - 10:25 am
David McKee
Technology Leader & Managing Partner
Counterpoint Tech/DTC

Journey to Twins: A toolkit for Capabilities & Data to Digital Twins

10:25 am - 10:40 am

Coffee Break - Sponsored by INFICON

Inficon Logo 170x65
10:40 am - 11:05 am
Rad Desiraju
Rad Desiraju
Director, WW Industry Advisory
Microsoft

Overcoming Data Interoperability Challenges for Effective Digital Twins

11:05 am - 11:30 am
Wei Zhao
Wei Zhao
Head of Process Integration
Athinia
Chris Han-Adebekun
Chris Han-Adebekun
VP, Business Development
Athinia

Building Process & Supply Chain Digital Twins through Integrated Data Assets and Secure Data Sharing

11:30 am - 12:30 pm
Dave Henshall
Dave Henshall
Vice President of Business Development and Government Relations
Semiconductor Research Corporation
Chris Ritter
CTO
Idaho National Lab

Special Session - SmartUSA – Semiconductor Digital Twin Manufacturing USA Institute

12:30 pm - 2:00 pm

Lunch

Afternoon, Day 1: December 4, 2024

2:00 pm - 5:00 pm

Session #2 - Data Standards for Digital Twins: Managing Unclean Factory Data

This session will focus on the importance of data standards for digital twins in semiconductor manufacturing, particularly in the context of dealing with unclean factory data. It will explore the challenges associated with unclean data and discuss strategies for cleaning and standardizing to ensure seamless ingestion into digital twins at various levels. Best practices for data validation, transformation, and integration as well as how to implement robust data standards to enhance reliability and accuracy of digital twins.

Sponsored by - Seeq

SEEQ
2:00 pm - 2:25 pm
Dr. Joseph Ervin
Dr. Joseph Ervin
Product Line Head of Semiverse Solutions Group
Lam Research

Keynote - Addressing Future Challenges in the Stochastics Era of Patterning with EUV Dry Resist

New patterning technologies will be needed to advance the device roadmap to 2 nm and beyond. Minimum pitch scaling will be exceptionally difficult to achieve at these advanced nodes, even with EUV patterning. Stochastic effects using wet resists during EUV patterning become problematic at the nanoscale, and can lead to line collapse, bridging, unacceptable line edge roughness (LER) and line width roughness (LWR). These stochastic effects present challenges when optimizing the tradeoffs between EUV resist resolution, dose, sensitivity, line edge / line width roughness, defectivity and cost.
In this talk, we will review the basics of dry resist technology, including dry resist equipment requirements, process flows and process integration modeling. In addition, we will present data that documents the advantages of dry resist technology over wet resist technology, demonstrating superior image quality, scaling and yield. We will conclude the talk by demonstrating a digital twin of the process integration and usage of optimization to achieve improved LER/LWR characteristics.

2:25 pm - 2:50 pm
Alan Weber
Alan Weber
Vice President, New Product Innovations
Cimetrix by PDF Solutions

Charting the Digital Twin Standardization Path: An Iterative Implementation and Abstraction Process

2:50 pm - 3:15 pm
Brett Brimhall
Deloitte

3:15 pm - 3:30 pm

Coffee Break - Sponsored by INFICON

Inficon Logo 170x65
3:30 pm - 3:55 pm
Andres Torres
Andres Torres
Engineer and Key Expert
Siemens

Feature Engineering as the bridge to Semantic Factory Data

3:55 pm - 4:20 pm
Michael Bowcutt
Michael Bowcutt
Director of Sales Engineering for Romaric products at camLine
camLine USA

Control Software Integration with Digital Twins: How Virtual Data Aligns with Physical Reality

4:20 pm - 5:20 pm
Kenneth Smith
Moderator
Kenneth Smith
VP Growth Markets
Seeq
Sean Tropsa
Sean Tropsa
Principal Analytics Engineer
Seeq

Panel: Harmonizing Standards for Semiconductor Digital Twins​ ​

5:30 pm - 7:00 pm

Networking Reception - Sponsored by Sentient Cloud

Sentient Cloud

Morning, Day 2: December 5, 2024

8:00 am - 9:00 am

Registration & Breakfast​

9:00 am - 12:30 pm

Session #3 - Modeling High Complexity Semiconductor Processes

This session will explore the integration of digital twin technology in modeling high complexity semiconductor processes. As the semiconductor industry advances, the need for precise and efficient modeling techniques becomes crucial. Digital Twins offer a transformative approach to simulate and optimizes these processes, though challenges exist. Cases studies and future innovations will also be covered in this session.

9:00 am - 9:05 am
Mark da Silva
Mark da Silva​
Senior Director, Smart Manufacturing
SEMI

Welcome Remarks

9:05 am - 9:30 am
Umesh Kelkar
Umesh Kelkar
Master/Vice President, Semiconductor Products Group
Applied Materials

Keynote: Key Enablers for Semiconductor Equipment and Process Digital Twins: Accelerated Computing (AC), Artificial Intelligence (AI) and Physics Modeling

9:30 am - 9:55 am
Prith Bannerjee
Prith Bannerjee
Chief Technology Officer
Ansys

AI Driven Digital Twins for Semiconductor Manufacturing

9:55 am - 10:20 am
Xi-Wei Lin
Xi-Wei Lin
Executive Director, Applications Engineering
Synopsys

AI and Physics-based Models for Technological Development with High Complexity Semiconductor Processes

10:20 am - 10:45 am

Coffee Break - Sponsored by PhysicsX

PhysicsX
10:45 am - 11:10 am
Amit Lal
Amit Lal
Professor, Cornell University
Cornell
Peter Doerschuk
Peter Doerschuk
Professor
Cornell University
Ben Davaji
Ben Davaji
Assistant Professor
Northeastern University

Digital Twin Flow Using AI/ML Applied to Ferroelectric Memory

11:10 am - 11:35 am
John Maculley
John Maculley
Semiconductor Industry Strategy Consultant
Dassault Systemes

Leveraging Virtual Twins and AI for Enhanced Fabrication Technology Co-Optimization in Semiconductor Manufacturing

11:35 am - 12:30 pm
Pushkar Apte
Strategic Technology Advisor and Global Data-AI Lead
SEMI

Panel Discussion

12:30 pm - 2:00 pm

Lunch - Sponsored by Dassault Systemes

Dassault Systems

Afternoon, Day 2: December 5, 2024

2:00 pm - 5:00 pm

Session #4 - GenAI & AI/ML Role in the Development of Digital Twins - Implementation Strategies for DT

Integrating AI/GenAI & Digital Twins - Explore the cutting-edge integration of Generative AI (GenAI) and Artificial Intelligence/Machine Learning (AI/ML) in the creation and evolution of digital twins. This session will delve into how GenAI & AI/ML technologies are revolutionizing the simulation, prediction, and real-time replication of physical assets in semiconductors through case studies and practical applications. 

 

2:00 pm - 2:25 pm
Kamaljeet Ghotra
Kamaljeet Ghotra
Senior Director, Go-To Market and Digital Strategy
PDF Solutions

Keynote - Accelerating Digital Twins with Gen AI

The rise of sophisticated AI tools, including generative AI, is revolutionizing the semiconductor industry by enabling the analysis of vast datasets to generate valuable insights. Executives in the sector see generative AI as a transformative force rather than just another tool. They believe it can deliver significant value, particularly in manufacturing, operations, and maintenance, its potential for process and equipment analysis, Predictive maintenance and smart diagnostics.

As fabs adopt smart manufacturing and virtual modeling it is pertinent for digital twins to leverage technologies like generative AI for data generation, Data Synthesis/Augmentation, Real Time Analysis, Model Optimization (AI enhanced physics models) , Rapid Prototyping and Accelerated Design and Development with data-driven model-based learning.

2:25 pm - 2:50 pm
Peter Lendermann
Peter Lendermann
CTO
D-SIMLAB

About Cross-Fertilization between Digital Twins and AI Techniques for Capacity Planning and WIP Flow Optimisation in Semiconductor Fabs​

2:50 pm - 3:15 pm
Kiran Karunakaran
Kiran Karunakaran
Chief Technology Officer
Via Automation

Developing Explainable Digital Twins for the Semiconductor Industry Using GenAI, Knowledge Graphs, and ML Techniques​

3:15 pm - 3:30 pm

Coffee Break - Sponsored by PhysicsX

PhysicsX
3:30 pm - 3:55 pm
Mark Huntington
Mark Huntington
Managing Director of North America
PhysicsX

Real-Time Digital Twins for Semiconductor Manufacturing: Accelerating Multi-Physics Optimization with Physics-Based AI

3:55 pm - 4:20 pm
Becky Kelderman
Becky Kelderman
Solutions Sales Manager
Rockwell Automation

Advancing Industrial Data Architectures & Models for AI in Process Digital Twins

4:20 pm - 5:20 pm
Mithun Kamat
Moderator
Mithun Kamat
Partner
McKinsey

Panel - Rewiring organizations for AI / Digital twin: a business-backed view of successful implementation and challenges in adoption of Digital twins in the semiconductor industry

-

Following up on the SEMI Digital Workshop 2023, this workshop will delve into the practical aspects of implementing digital twin technology in semiconductor manufacturing. The aim is to bridge the gap between theoretical concepts and real-world applications, providing participants with actionable insights and strategies to successfully develop and integrate digital twins into their operations. Further the workshop aims to address some of the future upcoming challenges in the areas of integration of multi-modal real time data sources, security, process complexity, scalability, and standards.

 

Given the exclusivity and richness of discussions, please note that seats are capped at 80 attendees. Don’t wait to secure your spot.

 

8:00 am - 5:00 pm Off Add to Calendar 2024-12-04 08:00:00 2024-12-05 17:00:00 From Concept to Reality: Advancing Digital Twin in Semiconductor Manufacturing Following up on the SEMI Digital Workshop 2023, this workshop will delve into the practical aspects of implementing digital twin technology in semiconductor manufacturing. The aim is to bridge the gap between theoretical concepts and real-world applications, providing participants with actionable insights and strategies to successfully develop and integrate digital twins into their operations. Further the workshop aims to address some of the future upcoming challenges in the areas of integration of multi-modal real time data sources, security, process complexity, scalability, and standards. Given the exclusivity and richness of discussions, please note that seats are capped at 80 attendees. Don’t wait to secure your spot.  SEMI HQ 673 S Milpitas Blvd. Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Purchase On-Demand