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Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking 

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures 

FREMONT, Calif., Sept. 9, 2025 -- Lam Research Corp. (Nasdaq: LRCX) today unveiled VECTOR^® TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence (AI) and high-performance computing (HPC) applications. TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. It provides ultra-thick, uniform, inter-die gapfill, leveraging a proprietary bowed wafer handling approach, innovations in dielectric deposition, and enhanced monitoring by Lam Equipment Intelligence® technology. TEOS 3D is installed at leading logic and memory fabs around the world. 

"VECTOR TEOS 3D deposits the industry's thickest, void-free, inter-die gapfill films, customized to meet the challenging requirements of advanced die stacking integration schemes, even on ultra-stressed, high-bow wafers," said Sesha Varadarajan, senior vice president of the Global Products Group at Lam Research. "It's another powerful addition to our best-in-class advanced packaging portfolio, which delivers the differentiated, atomic-level innovations chipmakers need to scale beyond Moore's Law and into the AI era."

Addresses Manufacturing Pain Points

The explosive growth of AI is driving the need for new devices that can support increasingly data-intensive workloads. Chipmakers are turning to 3D advanced packaging to integrate multiple dies into chiplet architectures to enable AI compute. By bringing memory and processing closer together to optimize electrical pathways, chiplet designs can improve processing speed, and pack more power into smaller form factors. However, as chiplets scale taller and become more complex, they present a range of new manufacturing hurdles, from stress during processing that can distort or bow a wafer's shape, to cracks and voids in films that cause defects and lower yield. 

TEOS 3D conquers a range of critical advanced packaging production challenges, excelling at handling bulky, high-bow wafers precisely and reliably. With nanoscale precision, it deposits specialized dielectric films of up to 60 microns thick between dies, with scalability to deposit films greater than 100 microns. The films provide essential structural, thermal and mechanical support to prevent common packaging failures such as delamination. TEOS 3D also features Lam's novel clamping technology and an optimal pedestal design that provides exceptional stability when processing thick wafers, enabling uniform film deposition even when dealing with extreme wafer bow. 

Other highlights include: 

• The first solution for single-pass processing of crack-free films more than 30 microns thick, significantly enhancing yield and process time.
• Unique quad station module (QSM) architecture to boost productivity: Lam's proven QSM architecture features four distinct stations to enable parallel processing and reduce bottlenecks. The modular design helps deliver nearly 70%1 faster throughput and up to 20% improvement in cost of ownership compared to Lam's previous generation of gapfill solutions.
• Lam Equipment Intelligence® technology for process repeatability: Built into TEOS 3D, Equipment Intelligence solutions boost equipment performance and reliability, and drive yield improvement by using smart technology to monitor processes, fix issues faster, and automate routine tasks.
• Enhanced energy efficiency: Integrated high-efficiency RF generators and ECO Mode peripheral control reduce energy consumption while improving process precision. 

Joins an Industry-Leading Suite of Advanced Packaging Solutions 

Leveraging the company's 15 years of leadership in advanced packaging and decades of expertise in dielectric films, TEOS 3D builds on Lam's existing VECTOR® Core and TEOS product families, representing continuous innovation in materials and processes for integrated packaging. It is part of a comprehensive product portfolio of industry-leading solutions that addresses critical challenges and drives innovation and productivity across the advanced packaging workflow. 

Media Resources 

• Visit the Lam Newsroom for related images.
• Read the Lam blog.
• Learn more about VECTOR^® TEOS 3D. 

About Lam Research 

Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's equipment and services allow customers to build smaller and better performing devices. In fact, today, nearly every advanced chip is built with Lam technology. We combine superior systems engineering, technology leadership, and a strong values-based culture, with an unwavering commitment to our customers. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, Calif., with operations around the globe. Learn more at www.lamresearch.com. 

1 – Based on internal testing; 68%. 

Caution Regarding Forward-Looking Statements 

Statements made in this press release that are not of historical fact are forward-looking statements and are subject to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate to, but are not limited to: industry trends, demands, expectations and requirements; the requirements of our customers; and the capabilities and performance of our products. Some factors that may affect these forward-looking statements include: business, economic, political and/or regulatory conditions in the consumer electronics industry, the semiconductor industry and the overall economy may deteriorate or change; the actions of our customers and competitors may be inconsistent with our expectations; trade regulations, export controls, tariffs, trade disputes, and other geopolitical tensions may inhibit our ability to sell our products; supply chain cost increases, tariffs and other inflationary pressures have impacted and may continue to impact our profitability; supply chain disruptions or manufacturing capacity constraints may limit our ability to manufacture and sell our products; and natural and human-caused disasters, disease outbreaks, war, terrorism, political or governmental unrest or instability, or other events beyond our control may impact our operations and revenue in affected areas; as well as the other risks and uncertainties that are described in the documents filed or furnished by us with the Securities and Exchange Commission, including specifically the Risk Factors described in our annual report on Form 10-K for the fiscal year ended June 29, 2025. These uncertainties and changes could materially affect the forward-looking statements and cause actual results to vary from expectations in a material way. The Company undertakes no obligation to update the information or statements made in this press release. 

Company Contacts: 

Allison L. Parker 

Media Relations 

(510) 572-9324 

[email protected] 

Ram Ganesh 

Investor Relations 

(510) 572-1615 

[email protected] 

Source: Lam Research Corporation, (Nasdaq: LRCX)

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FOR IMMEDIATE RELEASE
Busch Group Expands US Footprint with nearly 60,000 sqft. Service Center in Tempe, Arizona

Tempe, AZ – August 14, 2025 – Busch Vacuum Solutions, part of the Busch Group, a global leader in vacuum and overpressure technology, is proud to announce the development of its newest U.S. facility: almost 60,000-square-foot Arizona Service Center located in Tempe. This strategic expansion underscores Busch’s continued investment in innovation, customer service, and regional growth across North America. The state-of-the-art facility is scheduled to open in October 2025.

The new Tempe facility will serve as a key regional hub specializing in the repair, service, and overhaul of vacuum pumps, vacuum systems, and overpressure equipment including turbo molecular pumps, leak detectors, valves and accessories etc. - supporting all major brands. This expanded capability brings greater flexibility, technical expertise, and responsiveness to customers across the semiconductor, industrial, medical, and environmental sectors. Designed to meet the growing demands of the region, the Tempe Service Center will provide faster turnaround times, expert support, and more efficient service delivery tailored to the unique operational needs of customers not just in the Southwest but across the US.

"This investment represents more than just added square footage. It’s about proximity, partnership, and performance," said Turgay Ozan, President & CEO, Busch Group USA. "With the launch of our Tempe location, we’re better positioned to deliver unmatched value to customers who rely on advanced vacuum technologies in high-performance environments."

“We’re excited to welcome Busch Vacuum Solutions, a global leader in advanced manufacturing, to Tempe. Their decision to invest here speaks to the strength of Arizona’s semiconductor ecosystem, diversity of thriving industries located here, and the spirit of innovation that defines our community. The new Tempe Service Center will create skilled employment opportunities, strengthen business partnerships, and keep Tempe at the forefront of high-tech growth and excellence. We are grateful to Busch Group for selecting Tempe as the location for its Southwest service hub and look forward to supporting their continued success.” said Corey Woods, Mayor of Tempe, AZ.

With more than 8,000 employees globally and over 1,200 in the United States, Busch continues to expand its network of facilities to support mission-critical operations across a diverse range of industries. In addition to semiconductor and industrial markets, Busch's vacuum technology supports automotive, food and beverage, packaging, metallurgy, pharmaceuticals, plastics, and large-scale distribution. These capabilities enable more localized production and increase operational resilience across essential supply chains.

The new Tempe facility reinforces the Busch Group’s ongoing mission to drive industry forward through cutting-edge vacuum solutions and service excellence.

Busch Group USA’s newest facility in Tempe, Arizona – a state-of-the-art service center designed to expand capabilities, enhance customer support, and strengthen the company’s national presence.

About the Busch Group
The Busch Group is one of the world’s largest manufacturers of vacuum pumps, vacuum systems, blowers, compressors and gas abatement systems. Under its umbrella, the group houses two well-known brands: Busch Vacuum Solutions and Pfeiffer Vacuum+Fab Solutions. The gas abatement systems previously offered by centrotherm clean solutions – a former Busch Group brand – are now part of the Pfeiffer portfolio.

The extensive product and service offer includes solutions for vacuum, overpressure and abatement applications in all industries, such as food, semiconductors, analytics, chemicals, plastics, and aerospace. This also includes the design and construction of tailor-made vacuum systems and a worldwide service network.

The Busch Group is a family business that is managed by the Busch family. More than 8,000 employees in 44 countries worldwide work for the group. Busch is headquartered in Maulburg, Baden-Württemberg, in the tri-country region of Germany, France and Switzerland.

The Busch Group manufactures in its 23 own production plants in China, the Czech Republic, France, Germany, India, Romania, South Korea, Switzerland, the United Kingdom, the USA and Vietnam. The Busch Group has an annual consolidated revenue of close to 2 billion Euro.

Media Contact:
Jake Young
Marketing Business Partner
Busch Group USA
[email protected]
+1-800-872-7867
www.buschgroup.com

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Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025. Visit TRI's Booth No. K3070 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions.

TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology, μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.

TRI will showcase the Wafer Inspection and metrology Platform, TR7950Q SII, capable of wafer macroscopic 3D inspection and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Through Silicon Via (TSV), thin film, and more.

TRI will also exhibit the back-end inspection solutions, the TR7007Q SII-S for C4 bumps (~100 μm Ø), Mini-LED, and 008004 paste inspection applications, and the TR7900Q SII-R TRI's Reject Station with A-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps and Cu pillars.

Visit TRI's Booth No. K3070 at SEMICON Taiwan 2025 to explore TRI's SEMI solutions.

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About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

• Read more about Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025