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Milpitas, CA
United States

Morning, Day 1: March 18th, 2026

Smart Sensors and Edge Intelligence for Advanced Process Control​

Overview: Explore the latest sensor technologies—optical, thermal, vibration, and chemical—and how embedded AI at the edge enables real-time control loops for critical wafer fab processes. Includes case studies on inline metrology and adaptive control.​

Key Topics: Sensor fusion and calibration, Edge inference for process drift detection, Integration with APC and FDC system​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Anshu Bahadur
SEMI

Day 1 - Welcome All

Welcome & SEMI Manufacturing Coalitions Overview

8:55 am - 9:30 am
Russell Dover
General Manager, Service Product Line
LAM

Keynote: Vision – Edge Inference – Process Control, APC, FDC

9:30 am - 9:55 am
James Bramante
Senior Data Scientist
INFICON

Managing Edge AI for Smart Sensor Process Control

9:55 am - 10:20 am
Robert Hillinger
Industry Leader Semiconductor
Kistler

Advanced Process Control with Piezoelectric Sensor Fusion for Semiconductor Manufacturing

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Chris Dickens
Application Eng
Beckhoff Automation​

A Unified Industrial Platform​ for Production-Ready AI

11:00 am - 11:25 am
Gokul Sathya
Research Scientist
Siemens

Physical AI on the Manufacturing Floor: From Virtual Commissioning to Deployment

11:25 am - 11:50 am
Aumkar Renavikar
Chief Product Officer, Co-Founder & CTO
Parallax Worlds

Intelligent Robots & Digital Twins for Advanced Manufacturing

11:50 am - 12:05 pm
Chakravarthy Elumalai
CTO
Ray Vector

Sensor as the Eyes and Ears of AI

12:05 pm - 1:00 pm

Networking Lunch

Afternoon, Day 1: March 18th, 2026

.

Yield Enhancement through Edge-Driven Defect Detection and Classification​

Overview: Present how edge AI models process sensor and image data to identify yield-impacting defects early in the process. Discuss virtual metrology, anomaly detection, and feedback loops for yield optimization.​

Key Topics: Real-time defect classification, Sensor-based yield prediction, Integration with SPC and yield dashboards​

1:00 pm - 1:05 pm
Karim Somani
SEMI

SEMI Fab Owners Alliance (FOA)

1:05 pm - 1:35 pm
Surya Kalidindi
Co-Founder
Multiscale

Physics-Aware AI for Semiconductor Manufacturing Process Optimization: Deployed Systems and the Edge AI Frontier

1:35 pm - 2:00 pm
Maryia Kurdina
AI R&D Group Leader, Technology & AI Design Research Center
TEL

Real-Time, Tool-Independent Health Monitoring Using Gaussian Process Confidence Bands on Sensor Signals

2:00 pm - 2:25 pm
Avni Agarwal
Co-Founders & CTO
SixSense

Applications of AI-Based Defect Classification for Yield Improvement: From FEOL (Front end-of line) in Fabs to Assembly and Test

2:25 pm - 2:40 pm

Coffee Break

2:40 pm - 3:05 pm
Arjun Hegde
Senior Application Engineering Manager
KLA

Edge-Driven Yield Learning: Real-Time Deep Learning and HAR Defect Discovery in Advanced E-Beam Architectures

3:05 pm - 3:30 pm
Prasad Bachiraju
Senior Director, Business Development
Onto Innovation

Reducing Rework and Boosting Fab Capacity with Edge AI and Metrology-Driven Predictive Analytics

3:30 pm - 3:55 pm
Danny Krastev
Full Stack AI Developer
Microtronic

Overcoming the challenges of AI defect detection and classification of semiconductor macro defects

3:55 pm - 4:20 pm
Chengli He
Industry Manager
MathWorks

From Data to Decisions: Edge AI for Yield, Defect Detection, and Predictive Insights

4:20 pm - 4:35 pm
Stephen March
Semiconductor Leader
Schneider

Software Defined Industrial Automation: A Blueprint for AI-Ready, Real-Time Edge Operations in Semiconductor Manufacturing

4:35 pm - 6:35 pm

Reception

Morning, Day 2: March 19th, 2026

Autonomous WIP Movement: Robots, Sensors, and Edge AI Coordination​

Overview: Dive into next-gen clean rooms – how intelligent robotics & AI‑enabled inspection elevate yield, reliability & efficiency.

Key Topics: Sensor-guided AGVs and AMRs, AI-based path optimization, Interoperability with fab logistics systems​

8:00 am - 8:45 am

Registration & Breakfast

8:45 am - 8:55 am
Paul Carey and Melissa Grupen-Shemansky
SEMI

Day 2 - Welcome All

Day 1 Overview & MSIG Overview

8:55 am - 9:30 am
Carlos O’Farrill
Global Key Account Manager
KUKA

Keynote: Smarter Fabs in Motion: How Edge AI and Sensor Networks Drive Autonomous Material Handling

9:30 am - 9:55 am
Vidya Vijay
Director, Business Development, Growth & Strategy
Nordson

Precision, Automation, and Beyond: The Role of Advanced Sensors in the Evolution of Semiconductor Manufacturing for effective Tool set-up, Predictive and Preventative Maintenance

9:55 am - 10:20 am
Joseph Tsao
US Sales Director
Solomon 3-D

Perception-Enabled Assurance of Semiconductor Manufacturing Systems

10:20 am - 10:35 am

Coffee Break

10:35 am - 11:00 am
Murali Krishna
Vice President of Products
Minds.ai

Using Edge AI models and Deep RL to improve yield, tool availability, and fab performance

11:00 am - 11:25 am
Michael Bowcutt
Director of Sales Engineering
CamLine

Solving the Interoperability Gap: Orchestrating and Emulating Mixed-Fleet Robotics for High-Yield Fabs

11:25 am - 11:50 am
Greg Berger
Solution Consultant
Rockwell Automation

Smart Modular Conveyance, the first step towards Autonomous Operations in Analog & Legacy fabs

11:50 am - 12:15 pm
Brian Zmikly
Sr. Director, US Enterprise & Government Sales, 5G Acceleration
Verizon

The 5G Fabric: Leveraging Next Gen Connectivity to Enable Automation and Intelligence

12:15 pm - 12:30 pm
Anshu Bahadur
SEMI

Robots in the Cleanroom: Future of Automation in Semiconductor Manufacturing

12:30 pm - 1:30 pm

Networking Lunch

Afternoon, Day 2: March 19th, 2026

Predictive Maintenance at the Edge: From Vibration to Vision

Overview: Highlight how edge-deployed AI models use sensor data (vibration, acoustic, thermal, visual) to predict equipment failures before they occur. Showcase deployment strategies and ROI from reduced downtime.​

Key Topics: Edge analytics for tool health, Federated learning across equipment fleets, Maintenance scheduling optimization​

1:30 pm - 2:05 pm
James Bramante
Senior Data Scientist
INFICON

Keynote: Predictive Maintenance at the Edge - AI Enabling PdM

2:05 pm - 2:30 pm
Michael Passow
AI Semiconductor Factory Automation Program Manager
IBM

Edge AI–Enabled Predictive Maintenance: Closing the Loop Between Equipment Health and Fab Operations

2:30 pm - 2:55 pm
Mauro Riboni
Technical lead – Alliance & Partnership
Bosch

The Edge Revolution: Predictive Maintenance Reborn with Edge AI

2:55 pm - 3:20 pm
Paul Johnson
Senior Manager – Digital Transformation
Edwards

The Challenge Of AI At The Edge – Making Use Of Advanced Sensors

3:20 pm - 3:35 pm

Coffee Break

3:35 pm - 4:00 pm
Sainyam Galhotra
Co-founder & Faculty, Cornell University
Third AI Automation

Edge-based Defect Detection and Predictive Maintenance in Semiconductor Manufacturing

4:00 pm - 4:25 pm
Sundeep Ahluwalia
Chief Product Officer
TDK SensEI

Edge AI: The Future of Industrial Machine Health Monitoring

4:25 pm - 4:50 pm
Kelli Case
Business Development Director, Senseye Predictive Maintenance
Siemens

How AI‑based Maintenance Can Reshape Semiconductor Operations By Cutting Downtime By Up To 50%

4:50 pm - 5:00 pm

Wrap-Up

- Smart MFG FOA MSIG

Unlocking Smarter, More Autonomous Fabs with Edge AI

As semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.

This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:

  • Predictive maintenance to prevent downtime
  • Adaptive process automation for maximum efficiency
  • Real-time decision-making at the source of data generation

Join us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing.

Off Add to Calendar 2026-03-18 00:00:00 2026-03-19 00:00:00 Smarter Sensors, Smarter Fabs: AI at the Edge in Semiconductor Manufacturing Unlocking Smarter, More Autonomous Fabs with Edge AIAs semiconductor fabs strive for higher yield, uptime, and efficiency, AI at the edge is becoming central to semiconductor manufacturing. Modern edge devices combine advanced sensors with embedded AI to monitor equipment, optimize energy, and detect anomalies in real time - without relying on the cloud.This workshop will explore how AI-driven sensors and edge intelligence, integrated with IoT, 5G, and AI accelerators, enable scalable, resilient, and intelligent solutions tailored for semiconductor manufacturing. Learn how these technologies support:Predictive maintenance to prevent downtimeAdaptive process automation for maximum efficiencyReal-time decision-making at the source of data generationJoin us to see how the convergence of sensors, edge AI, and connectivity is unlocking the next era of smart manufacturing. Milpitas, CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On Demand
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Rogue Valley Microdevices (RVM) and the MiQro Innovation Collaborative Centre (C2MI) have signed a Memorandum of Understanding (MOU) to strengthen collaboration in MEMS and semiconductor manufacturing. By combining complementary expertise, the organizations will accelerate innovation and expand customer access to advanced technologies.

Rogue Valley Microdevices is a MEMS foundry specializing in the design, prototyping, and manufacture of MEMS devices for a diverse global customer base. C2MI is a world-class innovation centre in manufacturing MEMS, advanced semiconductor assembly, printed electronics and quantum superconductive chips. Together, they will create a stronger value chain for organizations in the MEMS and semiconductor fields—supporting the journey from ideas to proof of concept, in order to speed up commercialization of new technologies and products.

“This partnership between Rogue Valley Microdevices and C2MI allows us to collaborate and share resources,” said Jessica Gomez, CEO and founder of Rogue Valley Microdevices. “By leveraging each other’s facilities and complementary capabilities, we can fast track the creation and deployment of next-generation MEMS platforms, including advancements in 300mm technology.”

Marie-Josée Turgeon, CEO of C2MI added, “We are delighted to join forces with Rogue Valley Microdevices. By combining our strengths and sharing access to our world-class facilities, we will be opening new opportunities for customers on both sides of the border. This collaboration exemplifies our commitment to supporting our partners’ growth and to advancing innovation in the next generation of MEMS.”

Through this MOU, the two organizations will pool expertise and infrastructure to give customers greater access to essential resources. As demand for 300mm technology grows, Rogue Valley Microdevices and C2MI will collaborate to open new pathways for innovation in advanced microelectronics and MEMS.

Update on RVM’s 300mm-capable MEMS Fab

Rogue Valley Microdevices is continuing the build-out of its new 50,000-square-foot microfabrication facility in Palm Bay, Florida—expected to become the first 300mm-capable pure-play MEMS foundry in the U.S. Since 2003, RVM has partnered with customers to take designs from lab to fab, successfully commercializing MEMS and sensor technologies from its Medford, Oregon facility. With the addition of Palm Bay, the company will offer a strategically located second source, strengthening both manufacturing excellence and supply chain resilience. As the facility nears its anticipated opening, RVM expects to begin accepting orders for dielectric and conductive films in December, followed by MEMS devices and post-CMOS processing in early 2026.

Today, MEMS and related devices are central to industries ranging from biotechnology and industrial sensing to photonics. With the migration to larger substrates, RVM’s new facility will deliver modern capabilities and scalable manufacturing to meet the evolving needs of its customers.

Update on C2MI Fab

Anchored in Canada’s semiconductor manufacturing ecosystem, C2MI nears completion of new 11,000 square feet extension, mostly made of class ISO4 cleanroom. The extension will host advanced packaging and wafer post-processing capabilities on both 200mm and 300mm wafers, while also establishing the first pure play industrial-scale facility for superconducting quantum chips.

With this extension, C2MI will continue to offer a truly unique bridge between academia and industry—combining a collaborative research environment with an innovative approach to intellectual-property management and a fully integrated industrial development chain, accelerating the creation of cutting-edge technologies and significantly reducing commercialization risks for our customers.

Visit Rogue Valley Microdevices at SEMICON West

Rogue Valley Microdevices welcomes meeting with prospective customers and partners at SEMICON West, October 7-9 in Phoenix, AZ, at booth #777. Please email [email protected] to set up a meeting or just drop by the booth. To schedule a media briefing with Jessica Gomez during SEMICON West, please reach out to Maria Doyle at [email protected].

About C2MI

The MiQro Innovation Collaborative Centre (C2MI) serves as a reference in research and development to accelerate the commercialization of components essential to digital technologies, being a transversal vector for all the economic sectors and critical to wealth creation. Backed by a world-class infrastructure in the manufacturing fields of micro-electro-mechanical systems (MEMS), advanced semiconductor packaging, quantum and printed electronics, C2MI is at the core of all industry sectors integrating components essential for the use and deployment of digital technologies. The Centre is strongly committed to being a unique model of collaboration, where synergy between industrial and academic partners is necessary, even essential, for the development of next-generation products. Visit: www.c2mi.ca

About Rogue Valley Microdevices

Rogue Valley Microdevices is a full-service precision MEMS and photonics foundry that combines state-of-the-art process modules with the engineering expertise to go seamlessly from custom design to manufacturing. RVM also maintains the broadest and most comprehensive set of wafer services commercially available—with over 50 unique dielectric and conductive thin films and all services performed in its own Class 100 cleanroom. With headquarters in Medford, Oregon, and a new 300 mm fab under construction in Palm Bay, Florida, RVM offers a flexible, customer-focused approach to manufacturing. Visit: www.roguevalleymicro.com and follow us on LinkedIn.

RVM Media Contact:
Maria Doyle
Doyle Strategic Communications
781-964-3536
[email protected]

C2MI Media Contact:
Maryse Demers
C2MI
450-534-8000 ext. 1000
[email protected]

Semiconductor company with a 50-year Arizona history funds 50 school field trips to Arizona Science Center

PHOENIX, (September 24, 2025) - Semiconductors power everything from TikTok videos to Mars rovers, but does anyone actually know how these tiny tech wonders work? ASM, a semiconductor equipment company with a nearly 50-year history in Arizona, is launching an exhibition titled "From Sand to Stars: A Semiconductor Adventure" at Arizona Science Center to pull back the curtain on this magical world.

Running September 26 through December 24, 2025, this hands-on exhibition invites students to jump into the nano-world of microchips. ASM is sponsoring field trips for 50 low-income Phoenix-area schools, giving students the chance to experiment, play, and discover the atomic layers that power today's chips and tomorrow's dreams.

The exhibition showcases how ASMers work at the atomic scale—stacking layers of atoms so thin they’re nearly invisible—to create the chips that power everything from everyday devices like our phones and laptops, to life-saving medical technologies, and even the rockets that explore the farthest reaches of our universe. Students will dive into the nano-world of microchips, discovering how tiny grains of sand are transformed into the brains behind the technology that drives our world.

"The future of semiconductors – and everything they power, from AI data centers to your smartphone to spacecraft – it all depends on the brightest young minds joining our industry," said Vamsi Paruchuri Corporate VP, Technology, Innovation & Market Research. "By partnering with Arizona Science Center, we're showing students how they can shape tomorrow's technology at an atomic scale. Our new Scottsdale facility isn't just expanding ASM's footprint – it's creating a launchpad for Arizona's next generation of innovators who will master the art of atomic layering."

The exhibition showcases the periodic table’s semiconductor superstars—from silicon, the essential element found in beach sand, to hafnium oxide, which helps make our battery-powered devices faster and more efficient. Career videos introduce the pioneers of nanoscale technology, working at dimensions thousands of times smaller than a human hair, while imagination stations encourage guests to dream up the next world-changing innovation. Interactive displays feature a nearly 8-foot-tall, to-scale photo of equipment typically kept behind lock and key in ultra-clean semiconductor fabrication plants, including ASM’s massive XP8 Synergis machine.

Arizona's semiconductor boom needs brainpower to match its manufacturing might. The state leads the nation in semiconductor investments and supplier announcements, according to the Arizona Commerce Authority, creating a tech revolution that demands skilled talent. The Semiconductor Industry Alliance projects the industry will add nearly 115,000 jobs by 2030, with an estimated 58% at risk of going unfilled. It's not just about sending people to space or powering the latest smartphone – the semiconductor industry is racing to find the next generation of innovators who will shape the future at the atomic level.

ASM's multi-million-dollar investment in its new North American headquarters in Scottsdale is part of this growth story, bringing additional high-tech jobs to the local ecosystem and creating opportunities for today's students to become tomorrow's semiconductor pioneers.

“Kids can’t dream of careers they’ve never seen,” said Tammy Stewart, Interim Hazel A. Hare President & CEO. “We’re not just showing students how chips work—we’re uncovering the atomic magic behind everything they love, from gaming consoles to space exploration. When kids light up a circuit with their own hands or watch sand transform into technology, those ‘wow’ moments spark wonder that can grow into a lifelong passion. Together with ASM, we're turning complex semiconductor science into an adventure that might just inspire Arizona's next generation of innovators.”

Arizona Science Center exhibition’s timing coincides with SEMICON West 2025, which will be held in downtown Phoenix for the first time in the conference’s 50+ year history, October 7 through 9.

The "From Sand to Stars" exhibition will run from September 26 through December 24, 2025, at Arizona Science Center, located at 600 E. Washington St. in downtown Phoenix, just across the street from the Phoenix Convention Center, where SEMICON West will be held. The exhibition is displayed in the Arizona Science Center's lobby. To learn more visit, https://www.azscience.org/experience/all-exhibitions/level-1/from-sand-…

About ASM
ASM has been making the equipment that makes the chips inside the world's favorite devices for more than half a century. We enable the next generation of microchips by empowering leading semiconductor manufacturers with advanced wafer processing equipment. Through our mastery of thin-film deposition, we create the innovative tools and solutions that shape the materials at the heart of tomorrow’s technology – powering everything from AI and next-generation healthcare to cloud computing and smarter, more energy-efficient devices.

With over 4,500 employees in 15 key locations across three continents, we specialize in technologies that serve our customers' needs, including Atomic Layer Deposition (ALD), Plasma-Enhanced Atomic Layer Deposition (PEALD), epitaxy, silicon carbide epitaxy, Plasma-Enhanced Chemical Vapor Deposition (PECVD), and Vertical Furnaces.

At ASM, we care about the world we live in. Every day, we work to improve people's lives around the globe by enabling technology that bridges gaps, creates connections, and unlocks potential.

About Arizona Science Center
Located in downtown Phoenix, Arizona Science Center features more than 300 hands-on exhibits, a five-story giant-screen theater, live demonstrations, traveling exhibitions, and exciting science programs. The Center offers programs for all ages, including Science on Wheels, CAMP INNOVATION, Teen programs, Professional Development, and Adults' Night Out: Science with a Twist. Whether onsite or at your location–get ready to embark on a hands-on STEM learning journey you'll never forget. To learn more or to reserve tickets, visit azscience.org or call 602.716.2000. Follow us on Instagram, X, Facebook, LinkedIn, and YouTube.

Intel and Flexciton announce partnership to provide semiconductor manufacturers with a comprehensive Factory Automation and Optimisation Software Solution.

LONDON – September 25th, 2025 – Flexciton, a leader in autonomous planning and scheduling for semiconductor manufacturing, today announced a partnership with Intel. This collaboration will provide semiconductor manufacturers with a comprehensive, end-to-end set of software solutions to increase the level of automation and accelerate their transition to autonomous factory operations.

The partnership combines the power of  Intel® Automated Factory Solutions (Intel® AFS) software suite, including Intel® Operations Recon, and Intel® Factory Pathfinder, with Flexciton’s autonomous technology suite of Advanced Production Planning and Scheduling. The two companies will offer a synergic, holistic approach that provides complete visibility and control over complex semiconductor production workflows, enabling smart, autonomous decision-making and significant gains in key performance indicators.

"I am incredibly excited about this partnership. Intel® AFS solutions have been developed and tested within the most advanced fabs, and we see a great synergy with our cutting-edge planning and scheduling technologies," said Jamie, CEO & Cofounder, Flexciton. "With Intel® Factory Pathfinder and  Intel® Operation Recon combined with our Flex Planner and Scheduler suite, we will be able to provide an end-to-end optimisation solution that empowers our customers to unlock new levels of automation and significantly increase factory efficiency."

The partnership is designed to meet the growing demand for greater operational efficiency in the semiconductor industry. By leveraging high-speed simulations, AI, and advanced optimisation, the combined approach will enhance factory automation and deliver tangible benefits, including complete visibility of shopfloor operations, optimised planning and scheduling, and a significant uplift in factory key metrics such as throughput and cycle times.

Paul Schneider, Intel Principal Engineer, Director, said: "By combining our deep factory automation expertise with Flexciton's innovative scheduling solutions, we are providing manufacturers with the critical tools they need to enhance their operational efficiency and maintain a competitive edge.

—------------

About Flexciton: Flexciton partners with semiconductor manufacturers to power their transition towards autonomous factories. Our suite of intelligent planning and scheduling applications combines advanced optimisation techniques with the power of AI to orchestrate complex fab workflows and achieve critical revenue-to-shop-floor alignment. Flexciton’s Autonomous Technology transforms fab operations by eliminating manual and reactive decision-making processes. This dramatically improves factory throughput and cycle times, enhances labour efficiency, and optimises overall costs and resource utilisation. Trusted by industry leaders including Seagate Technology, Renesas, and Microchip, Flexciton drives the next phase of digitalisation and transformation to an autonomous factory. Headquartered in London, UK, Flexciton operates globally with dedicated teams located in Europe and the US.
www.flexciton.com 

About Intel Automated Factory Solutions: Intel® Automated Factory Solutions (Intel® AFS) is a comprehensive software suite that optimises industrial processes.  It utilises advanced technologies such as Digital Twins, predictive analytics, high-speed simulation, and AI to improve efficiency and reduce downtime in factory operations and other complex operational processes with many interdependencies.

Intel® Factory Pathfinder: A high-speed discrete event simulator and digital twin designed for factory prediction and optimisation. It can function independently or integrate with production systems to streamline product assignments and reduce order fulfilment times.

Intel® Operations Recon: Provides a graphical digital twin of factory production equipment and automated systems, boosting operational visibility and enabling real-time troubleshooting and material movement simulations.
www.intel.com/content/www/us/en/software/automated-factory-solutions.html

 

Sigma Design to Feature OmronTM Collaborative Robot at SEMICON West 2025 Service-driven innovation combined with advanced automation can address key industry challenges 

Phoenix, AZ – September 10, 2025 — Sigma Design, a leading provider of engineering and product development services to the semiconductor industry, will showcase its capabilities at SEMICON® West 2025 in partnership with OmronTM Automation, featuring live demonstrations of the Omron collaborative robot (Cobot) at Booth 1973 at the Phoenix Convention Center from October 7-9. 

The demonstration highlights how service-driven innovation combined with advanced automation can address key industry challenges in smart manufacturing, labor optimization, and operational flexibility. 

Key Highlights: 

  • Live demo of the OmronTM Cobot integrated into a service-centric automation solution, supporting assembly, inspection, and material handling tasks.
  • Discussion of how Sigma Design applies collaborative robotics in client environments to reduce manual burden, increase uptime, and improve safety.
  • Insight into workforce enablement strategies and scalable automation deployments tailored for semiconductor operations. 

Why It Matters: 

Themed “Stronger Together—Shaping a Sustainable Future in Talent, Technology, and Trade,” SEMICON West brings together global leaders from across the microelectronics industry to address critical industry priorities – from advanced manufacturing and supply chain resilience to sustainability and workforce development. Sigma Design and OmronTM’s collaboration demonstrates how cross-industry partnerships can deliver real-world value through intelligent automation and engineering support. 

About Sigma Design 

As product development experts, we are driven by new challenges. We design, engineer, build, and test solutions for our partners' success. Sigma Design is a full-service product development and engineering firm dedicated to solving complex challenges. With a focus on quality, efficiency, and innovation, Sigma Design provides end-to-end product development solutions that encompass design, engineering, manufacturing, testing, and staffing services. 

Committed to excellence, we exceed client expectations with our dedicated approach. Challenges Accepted. Solutions Delivered. 

For more information, visit www.sigmadzn.com 

About OmronTM Automation

OmronTM is a global leader in industrial automation solutions, including robotics, sensing, and control systems. Its collaborative robots are designed to safely work alongside humans, delivering flexibility and precision in advanced manufacturing environments. 

Contact:

Jordan Rousseau 
Marketing Specialist 
[email protected] 
360.396.2600 

Via Automation Debuts Agentic AI-Based Platforms for Smart Manufacturing at SEMICON West

• Set to revolutionize semiconductor manufacturing operations, paving the way for self-healing factories and resilient supply chains
• Demos of Via Connect and Via Co-Pilot available during SEMICON West October 7 to October 9 in Booth #7438
• Via Automation “Developing Explainable Digital Twins and Connecting to Via CoPilot Agents for Autonomous Tool Operations” at Smart Manufacturing Theater

FREMONT, CALIF.––September 23, 2025––Via Automation today unveiled Via Connect and Via Co-Pilot, Agentic AI-based platforms that combine edge data integration with AI-driven human collaboration to revolutionize enterprise manufacturing operations and pave the way for self-healing factories and resilient supply chains.

Demonstrations of Via Connect and Via Co-Pilot will be available during SEMICON West October 7 to October 9 at the Phoenix Convention Center in Phoenix, Ariz.

“Predictive maintenance isn’t just about preventing breakdowns, it’s about enhancing yield and enabling smarter, safer and more efficient industrial operations,” remarks Nitin Parekh, CEO at Via Automation. “With Via Connect and Via Co-Pilot, enterprises can move beyond pilot projects into scalable, trusted and ROI-positive predictive maintenance programs.”

Introducing AI-Powered Industrial Automation
Unplanned equipment downtime cost manufacturers more than $1.5 trillion globally per year, a problem that grows more expensive annually. The cost of a single hour of downtime has surged by 50% in just two years.

Via Automation’s Via Connect and Via Co-Pilot powers real-time, AI-driven decisions across the factory floor, enhancing efficiency, optimizing operations, reducing unplanned downtime, elevating performance across all areas.

Via Connect
Traditional solutions rely on dashboards and complex visualizations that don't solve the root problem. Via Connect seamlessly offers data integration at the edge by acting as the digital fabric between assets, IoT sensors and enterprise systems. Via Connect can be connected into digital twin models to provide holistic monitoring capabilities as a software development kit (SDK) for equipment vendors to integrate with their equipment.

With its edge-ready processing capabilities, Via Connect can detect low-latency anomalies directly at the factory floor and integrates with manufacturing execution systems (MES), enterprise resource planning (ERP) systems and cloud platforms including AWS, Azure and Databricks using out-of-the box connectors.

For predictive maintenance, it ensures unified data collection of real-time vibration, temperature and process signals streamed from machines and IoT endpoints. Using Via Connect, predictive models can access clean, contextualized data without integration bottlenecks, one of the biggest hurdles in scaling predictive maintenance initiatives.

Via Co-Pilot
Where Connect enables data orchestration, Via Co-Pilot elevates operational intelligence, acting as a decision assistant to unite humans with AI tools for smarter decision making.

Via Co-Pilot turns predictive maintenance from a “black-box algorithm” into a trusted co-worker—accelerating adoption and building operator confidence by providing AI-Driven insights for warnings of equipment degradation using machine learning models trained on sensor data. Its diagnostics are easily explainable, interpretable and highlight root causes, such as bearing wear or lubrication breakdown. It enables collaborative workflows for engineers, operators and managers to interact with AI that delivers recommendations, validate insights and trigger automated work orders

It also offers continuous learning opportunities with its feedback loops that improve model accuracy over time and adapt to new operating conditions.

Via Automation can AI enable any equipment or fab with Via Connect and Via Co-pilot. An intuitive interface gives manufacturing teams the ability to build and deploy custom workflows without deep AI expertise and focus on keeping their equipment running smoothly and efficiently.

Early results show that Via Connect and Via Co-Pilot together reduce unplanned downtime by between 30-40% and maintenance costs by between 15-20%. They extend asset life by about 25% and improve operator safety and compliance reporting.

Via Automation at SEMICON West October 7-9 in Phoenix, Ariz.
Via Automation will exhibit and demonstrate its Connect and Co-Pilot at SEMICON West in Booth #7438 Tuesday, October 7, through Thursday, October 9, at the Phoenix Convention Center in Phoenix, Ariz.

Kiran Karunakaran, Via’s CTO, will present “Developing Explainable Digital Twins and Connecting to Co-Pilot Agents for Autonomous Tool Operations” Wednesday in the Smart Manufacturing Pavilion Theater.

To arrange a demonstration or private meeting, send email to [email protected].

About Via Automation
Via Automation is a pioneering technology company that specializes in creating advanced automation solutions designed to optimize and transform fab operations for advanced semiconductors. Leveraging cutting-edge AI and machine learning technologies, it develops intuitive, scalable and robust tools aimed at enhancing productivity, efficiency and data-driven decision-making. Via Automation’s commitment to innovation and customer-centric solutions make it a leader in the fab and equipment automation space, driving progress and operational excellence for improving operations and maintenance with AI.
Engage with Via Automation at:
Website: Getvia.ai/
Email: [email protected]
LinkedIn: https://www.linkedin.com/company/getvia/

For more information, contact:
Nanette Collins
Public Relations for Via Automation
[email protected]

Singapore, September 17, 2025 – EUV Tech, the global leader in extreme ultraviolet (EUV) metrology equipment, today announced the opening of its first international office: EUV Tech Singapore Pte. Ltd., located at 163 Kallang Way, Mapletree Hi-Tech Park, Singapore.

This expansion marks a significant milestone in EUV Tech’s global growth strategy and reinforces its commitment to strengthening customer support across Asia’s rapidly expanding semiconductor market.

Strategic Rationale

Singapore was selected as EUV Tech’s first international office due to its robust infrastructure, business-friendly environment, and central location within Asia’s semiconductor ecosystem. While tool development will remain anchored in Martinez, California, the Singapore office will house EUV Tech’s international Customer Success Team, focused on field service engineering. It will also serve as a regional hub, enabling faster response times, enhanced service capabilities, and closer alignment with customers’ business hours.

“Customer service is at the heart of everything we do,” said Chami Perera, EUV Tech Chief Operating Officer. “By establishing a presence in Singapore, we are not just providing metrology tools. We are standing shoulder to shoulder with our customers to ensure their success in an evolving industry.”

The semiconductor industry in Asia is projected to continue its rapid growth over the next decade, with Singapore serving as a major regional hub. EUV Tech’s expansion positions the company to:

  • Strengthen existing relationships with leading semiconductor fabs
  • Support uptime with field service engineers on the ground
  • Leverage Singapore’s ecosystem of world-class universities, government initiatives, and industry networks

With tools already installed in every major semiconductor fab worldwide, EUV Tech’s Singapore office further cements its reputation as a trusted partner driving innovation and reliability in EUV metrology. 

EUV Tech’s Singapore office is a clear signal of the company’s ambition and growth in the global semiconductor sector. “We are growing and thriving,” said Perera. As the semiconductor industry continues to expand, we will be right there with our customers, innovating, adapting, and ensuring their success.”

About EUV Tech
EUV Tech enables technology advancement in the frontiers of semiconductor manufacturing and material science through the development of world-leading EUV and soft-x-ray instrumentation and techniques.

Media Contact:

Natalie Hill, Associate Director Marketing & Communications

[email protected]

PDF Solutions Secures Landmark Contract with Global IDM Customer
Large 2025 Contract Validates High-Volume Manufacturing Strategy

PDF Solutions, Inc. (Nasdaq: PDFS) today announced a landmark contract signing: a significant multi-year agreement to expand a prior contract and deploy eProbe® tools, Characterization Vehicle® infrastructure, and associated Exensio® analytics software across multiple high-volume manufacturing facilities of a major global semiconductor manufacturer.

Breakthrough Technology Scales to Mass Production

PDF Solutions' eProbe technology delivers contactless testing of 3D semiconductor structures using electron beam, optimized for each wafer's specific design characteristics. This agreement encompasses multiple eProbe systems with deployment in 2025, supported by PDF Solutions' comprehensive software suite for machine optimization and results analysis.

The contract marks a pivotal milestone that validates PDF Solutions' strategic vision and demonstrates the critical role of eProbe technology in both advanced node development and high-volume manufacturing.

Integration of Process characterization, Design and in-line Fabrication data

PDF Solutions combines the eProbe DirectScan™ application with Characterization Vehicle test chips and Exensio analytics software to enable faster yield learning in high-volume manufacturing environments.

This landmark contract validates the approach of integrating process characterization data with design layout data and in-line fabrication data to enhance detectability to ppb levels to accelerate root cause for yield diagnosis and variability control.

Secure Connected Solutions Drive Value

PDF Solutions will deploy eProbe tools and associated software at the Foundry’s manufacturing sites, using PDF Solutions’ secureWISE® network to provide secure remote equipment support and maintenance. This deployment exemplifies PDF Solutions' strategic vision: creating a cross-industry analytics and collaboration platform that connects key players in the semiconductor ecosystem.

Comprehensive connectivity is essential for achieving faster yield ramps and delivering on the promise of AI in semiconductors. To successfully implement AI solutions, the industry needs automated connections between data sources, tools, and enterprise software systems across the entire semiconductor supply chain.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics industry ecosystem to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor and electronics ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

Founded in 1991, PDF Solutions is headquartered in Santa Clara, California, with operations across North America, Europe, and Asia. The Company (directly or through one or more subsidiaries) is an active member of SEMI, INEMI, TPCA, IPC, the OPC Foundation, and DMDII. For the latest news and information about PDF Solutions or to find office locations, visit https://www.pdf.com.

Headquartered in Santa Clara, California, PDF Solutions also operates worldwide in Canada, China, France, Germany, Italy, Japan, Korea, Sweden, and Taiwan. For the Company’s latest news and information, visit https://www.pdf.com.

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North America Technical Committee Chapter Fall Meeting

Date: Tuesday, October 14, 2025

Time: 13:00-14:30 Pacific Time

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1:00 pm - 2:30 pm Off Add to Calendar 2025-10-14 13:00:00 2025-10-14 14:30:00 3D Packaging & Integration North America TC Chapter Fall Meeting 2025 Join us for the SEMI Standards3D Packaging & Integration (3DP&I)North America Technical Committee Chapter Fall MeetingDate: Tuesday, October 14, 2025Time: 13:00-14:30 Pacific TimeOnline via Web ConferenceTo receive the calendar invite, please reach out to the contact below. AGENDA(Subject to change)Last updated:  September 14, 2025  United States SEMI.org [email protected] America/Los_Angeles public

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Creating an Ecosystem for Advanced Packaging: How Backend Manufacturing is Leading the Way

As the semiconductor industry pushes the boundaries of performance, efficiency, and miniaturization, advanced packaging has emerged as a critical enabler of next-generation microelectronics. This virtual forum brings together leading voices from across the ecosystem to explore how backend manufacturing is driving innovation and collaboration in advanced packaging technologies.

Topics Include—

  • The evolving role of backend manufacturing in enabling heterogeneous integration and chiplet architectures
  • Key challenges and opportunities in scaling advanced packaging solutions

  • Collaborative models for building a robust ecosystem—from academia to industry

  • Workforce development and infrastructure needs to support future growth

  • Insights into government and industry initiatives shaping the future of microelectronics manufacturing

Whether you're a technologist, strategist, or policymaker, this forum offers a unique opportunity to gain actionable insights into the future of semiconductor packaging and the collaborative efforts driving it forward.

Participate in a U.S. Time Zone:

  • Pacific: 9am–11:00am
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Register now to be part of this important conversation and contribute to shaping a sustainable future for the semiconductor industry!
 

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WEDNESDAY, NOVEMBER 12

9:00 am - 9:05 am
Andrea Valencia, EMD Electronics
Chair, SEMI Texas Chapter
Andrea Valencia
Marketing & Communications
EMD Electronics

Welcome & Opening Remarks​

9:05 am - 9:30 am
Jan Vardeman
Jan Vardaman
Founder & President
TechSearch International

Advanced Packaging Options and the Role of Chiplets

9:30 am - 9:55 am
Larry Dunn, Texas Institute for Electronics
Larry Dunn, PhD
Co-Founder & Senior Director of Business Development
The Texas Institute for Electronics (TIE)

Texas Institute of Electronics and Next-Generation Microelectronics Manufacturing Overview

9:55 am - 10:15 am
Jason Conrad
Jason Conrad
Chief Operating Officer
Arizona State University Knowledge Enterprise

Arizona State University - A Leader in Advanced Packaging

10:15 am - 10:35 am
Lihong Cao, ASE Group
Lihong Cao, PhD
Senior Director, Engineering & Technical Promotion
ASE Group

Empowering AI through Advanced Packaging for Chiplet and Heterogeneous Integration

10:35 am - 10:55 am
Amit Shah, Hyperion
Amit Shah
Director of Sales & Marketing
Hyperion Technologies

Creating a US Fabrication Capabilities for Leading Edge IC-Substrate and 3D-Interconnect Fabrics

10:55 am - 11:00 am
Chase Farnsworth
Chase Farnsworth
Project Development Executive
Mortenson & Chair, SEMI Arizona Committee

Closing Remarks

Workforce Development

The SEMI Arizona & Texas Chapters Present
Creating an Ecosystem for Advanced Packaging: How Backend Manufacturing is Leading the Way

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