downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content
Default Banner Image

United States

Registration

2025_MedTech_photo1

Regular Pricing
$249 Members
$349 Non-Members

Cancellation Policy

Cancellations received on or before July 27, 2026, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after July 27, 2026, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to [email protected].

2025_MedTech_photo1
United States Smart Medtech Summit 2026 Technical
GlobalFoundries
Keynotes

Breaking Silos, Accelerating Innovation: Semiconductor & MedTech Converge Together

In a rare cross-industry gathering, MedTech pioneers and semiconductor innovators are coming together under one roof. The Semiconductor–MedTech Ecosystem Summit is designed to break down industry silos, connecting silicon innovators directly with medical device makers to accelerate the development of next-generation medical technology.

If you are building the future of medical devices, diagnostics, or connected care, this is where you secure your competitive advantage.

The Convergence: Three Focus Areas Driving the Next Frontier

By bringing these two massive industries together, we are accelerating the timeline for revolutionary healthcare. We will be diving deep into:

  • Wearables & Continuous Care: Changing the game for personalized healthcare by enabling clinical-grade, untethered monitoring that moves with the patient.
  • Advanced Medical Imaging: Pushing the boundaries of early detection through advanced imaging technologies that make the unseen visible.
  • Edge AI & Predictive Health: The invisible engine underpinning rapid advancements in both MedTech and silicon. We’ll explore how processing at the edge allows for the pinpointing of diagnoses and treatments long before traditional symptoms appear.

SEMI Headquarters
673 S. Milpitas Boulevard
Milpitas, CA 95035
United States

Marc Schaepkens
Marc Schaepkens
Chief Technology Officer, Advanced Imaging Solutions
GE Healthcare
Laura Matz, Merck KGaA
Laura Matz
Chief Science & Technology Officer
Merck KGaA
Ahmad Bahai, Texas Instruments
Ahmad Bahai
Senior Vice President & Chief Technology Officer
Texas Instruments

Breakfast & Registration

8:00 am - 9:00 am

Breakfast & Registration

Strategic Outlook

9:00 am - 9:15 am
Ajit_circle_photo-v2.png
Ajit Manocha
CEO
SEMI

Welcome Address

SEMI Perspective
Biography

9:15 am - 9:30 am
Mike Hogan Tile
Michael Hogan
Chief Strategy Officer
GlobalFoundries

Welcome from GlobalFoundries

9:30 am - 9:50 am
Marc Schaepkens
Marc Schaepkens
Chief Technology Officer, Advanced Imaging Solutions
GE Healthcare

Keynote: No Chips, No Cure: Why Semiconductors Are the Invisible Infrastructure of Modern Healthcare

9:50 am - 10:05 am
Derrick
Derrick Kiker
McKinsey & Company

The Life Sciences Growth Engine Runs on Silicon

Networking

10:05 am - 10:30 am

Break

Integration

10:30 am - 10:50 am
Laura Matz, Merck KGaA
Laura Matz
Chief Science & Technology Officer
Merck KGaA

Keynote: Exploring Enabling Approaches for Precision Medicine throughout the Drug Development Process

10:50 am - 11:05 am
Joshua De Souz Headshot
Joshua De Souza
Senior Principal Scientist
Medtronic

From Integration to Intervention: The Whole is Greater than the Sum of its Parts

11:05 am - 11:20 am
Paru Deshpande
Paru Deshpande
VP Health Technologies
IMEC

Bioconvergence: How Semiconductor Innovation is Shaping the Future of Healthcare

11:20 am - 12:00 pm

Panel Discussion: The Role of Semiconductor in 5-10 Years in MedTech

Session Chair - Anirban Bandyopadhyay
Fritz Werder | Silicon Labs
Mohsen Askarinya | Medtronic
Girish Naganathan | Former Dexcom
Paru Deshpande | imec
Lea Drye | FDA

Networking

12:00 pm - 1:00 pm

Lunch

Innovation

1:00 pm - 1:20 pm
Ahmad Bahai, Texas Instruments
Ahmad Bahai
Senior Vice President & Chief Technology Officer
Texas Instruments

Keynote: "Health Sciences, Semiconductor & AI" A Transformational Confluence

1:20 pm - 1:35 pm
Pieris Berreitter
Pieris Berreitter
Director of Engineering
HP

Inference on the Edge: The Next Generation of Wearable Silicon for Healthtech

1:35 pm - 1:50 pm
Mauro Ferrari headshot 2026
Mauro Ferrari
Chief Executive Officer
BrYet

Microfabbed Silicon as a (Transformational) Pharmaceutical Material

1:50 pm - 2:30 pm

Panel Discussion: Disruptive Innovation in MedTech for Therapeutic and Diagnosis

Session Chair - Melissa Grupen-Shemansky
Vibhu Sharma | Philips
Bharath Rajagopalan | STMicroelectronics
Laura Matz | Merck KGaA
Gregg Bartlett | GlobalFoundries

Networking

2:30 pm - 2:45 pm

Break

Innovation

2:45 pm - 3:00 pm
Bharath Rajagopalan, STMicroelectronics
Bharath Rajagopalan
Director of Strategic Marketing
STMicroelectronics

Semiconductor Innovations Enabling the Future of Healthcare

3:00 pm - 3:15 pm
Vibhu Sharma Philips
Vibhu Sharma
Biosubstrates Program Lead
Philips

When Biology Becomes the Sensor: Semiconductor-Enabled Platform for Cellular Intelligence

3:15 pm - 3:30 pm
Yusuf
Yusuf Haque
Cofounder & Chief Technology Officer
Exo Imaging

Democratization of Ultrasonic Medical Imaging & Challenges

3:30 pm - 3:45 pm
Girish_Naganathan
Girish Naganathan
Former CTO
EVP Dexcom

Beyond the Form Factor

3:45 pm - 4:00 pm

Wrap Up

SEMI

Networking

4:00 pm - 6:00 pm

Reception

Smart MedTech

Experience a one-of-a-kind convergence of silicon and clinical care. Connect directly with semiconductor foundries and MedTech OEMs on Aug 27 to accelerate next-gen medical devices.

8:00 am - 6:00 pm Off Add to Calendar 2026-08-27 08:00:00 2026-08-27 18:00:00 Semiconductor-MedTech Ecosystem Summit Experience a one-of-a-kind convergence of silicon and clinical care. Connect directly with semiconductor foundries and MedTech OEMs on Aug 27 to accelerate next-gen medical devices. SEMI Headquarters 673 S. Milpitas Boulevard Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Recommended Hotels

Embassy Suites by Hilton Milpitas Silicon Valley

901 East Calaveras Boulevard

Milpitas, CA 95035

(408) 942-0400

 

Courtyard by Marriott Milpitas Silicon Valley

1480 Falcon Dr.

Milpitas, CA 95035

(408) 719-1966

Register Here!
Event format
Tab Order
Overview
Agenda
Sponsors
New Tab 1
Promote in calendar
Off

High-performance connectivity software delivers structured, high-volume equipment data required by tier-one fabs and advanced packaging facilities ahead of the expected mid-2026 SEMI standards update

POITIERS, March 25, 2026 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing, today unveils Agil'EDA, a new software solution implementing Equipment Data Acquisition (EDA), a set of SEMI standards also known as Interface A, to enable semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and advanced packaging facilities.

As semiconductor manufacturing moves towards higher levels of automation and data-driven optimization, fab owners increasingly require EDA alongside traditional SECS/GEM connectivity from semiconductor OEMs for their production tools. Agil'EDA addresses this by separating the control flow from the data flow, ensuring that structured, high-frequency data collection does not interfere with critical equipment operations.
Designed for long-term deployment, Agil'EDA fully supports the widely used EDA Freeze 2 (SOAP/XML) and is architected for the transition to Freeze 3 (gRPC/protocol buffers). This next-generation standard offers significantly higher data throughput and reduced latency. Agileo has already successfully tested and validated its EDA Freeze 3 implementation at SEMI’s North America Standards Fall Meetings in November 2024 in Milpitas, California. SEMI’s EDA Freeze 3 standards suite is expected to be released mid-2026.

Complementing the SECS/GEM standards used to control equipment behavior, Agil’EDA incorporates robust cybersecurity features such as authentication and encrypted communications. The product is available as a stand-alone solution for any existing equipment software using a platform-independent gRPC application programming interface (API) to communicate with it or as a pre-integrated component within Agileo’s A²ECF-SEMI framework. When used with Agil'GEM and Agil'GEM300, it provides a comprehensive connectivity solution that significantly reduces time to market for OEMs.

"With the growing demand for data to improve yield in tier-one fabs, as well as in Advanced Packaging and 3D integration, EDA is no longer optional. It is becoming a mandatory requirement for equipment entering the world's most advanced fabs," explains Marc Engel, chief executive officer of Agileo Automation. "The key value we deliver for OEMs is a fast and easy adoption path for a seamless EDA architecture that delivers compliant production machines to global fab customers. By providing a future-proof architecture ready for Freeze 3, which will significantly increase performance, we address OEMs’ current needs while preparing them for the evolving requirements of semiconductor manufacturing, including AI-driven process control."

- ends -

About Agileo Automation
Agileo Automation is a trusted partner for equipment manufacturers, helping them build smarter, automated, and more connected machines that integrate seamlessly into advanced semiconductor fabs. Founded in 2010 in Poitiers, France, Agileo helps OEMs with control, communication, data acquisition, and testing across their tools through proven software and expert support. Its flagship A²ECF-SEMI framework provides a solid foundation for developing equipment controllers fully aligned with SEMI SECS/GEM, GEM300, and EDA standards. As an active member of SEMI and the OPC Foundation, Agileo Automation contributes directly to shaping the standards that drive manufacturing. For more information, please visit our website or follow us on LinkedIn.

Belgium France Germany Ireland Italy United States Seimconductor Device Assembly Training

Course Description 

This three-day virtual workshop (4 hours a day) provides a complete overview of the semiconductor manufacturing process. The class focuses on key process steps needed to form a functioning device. Some important science and engineering ideas needed to understand device manufacturing will be discussed. The workshop is designed for non-technical personnel needing an understanding of the fab process steps.  Some technical background from attendees will improve the workshop learning. 

The first day will overview the fab process steps with a brief summary of how a transistor functions. We will discuss how multiple transistors are connected to form a logic or memory device. We will also cover how a transistor works with respect to the physical layout of Bipolar and MOSFET transistors. 

The second day will cover key fab process steps. Ion implantation, photolithography including DUV and EUV processes, plasma processes including deposition and etch, rapid thermal processing, and wet etch processing. Specific emphasis will be given to the different wet etch processes. 

The third day of the workshop will focus on the new transistor designs, including FinFET and CFET designs. We will also cover reasons for changing the transistor design and newer materials, including tantalum, hafnium, silicon germanium, and low-k dielectrics.  We will also review roadmaps of leading companies, including TSMC, Intel, and Samsung. 

After completing the workshop, the student will be able to describe all the fabrication and assembly process steps and have an understanding of how the process steps work together to form the completed integrated circuit, in addition to an understanding of future structures.

 

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Process Technicians
  • Material Engineers
  • Process Engineers
  • Equipment Manufactures
  • Technical Marketing Engineers

Topics Included

  • Silicon wafer manufacturing
  • Basic operating principles of transistors and semiconductor devices
  • Planar, FinFET, and GAA transistor formation and design differences
  • Fab processes needed to form a semiconductor, including the following:
    • Lithography, with a focus on DUV and EUV methods
    • Etching, including wet and plasma processes
    • Deposition, thermal, plasma, electroplating deposition
    • CMP and modern CMP processes
       

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Dr. Tom Dory
ITM Consulting, Inc

United States

- SEMI U

Unlock the essentials of the semiconductor manufacturing process.  We will cover science and engineering concepts needed to understand device manufacturing. 

Pricing         

              Early Bird Pricing: $100 off

  • Members:  $699   $599
  • Non-Members:  $749   $649

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

8:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles Register Now
Event format
Promote in calendar
Off

SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Belgium Germany Singapore Taiwan United States FEMC 29 recording Business Executive Technical
Highlighted content

Digital Twin is a virtual representation of the structure, context, and behavior of physical systems or a process, with a live link to a physical system serving as a key enabler for predictive and data-driven optimization. In Printed and Flexible Hybrid Electronics (FHE), manufacturing involves multiple interdependent variables—different printing technologies, inks, substrates, and process conditions—each introducing its own complexity. In practice, additional challenges such as equipment drift, batch-to-batch variations, and environmental fluctuations further impact process consistency and yield. Changing a process or transferring it between tools is often difficult, as each setup is highly customized and sensitive to local conditions. To address these challenges, Digital Twin frameworks connect data from design, fabrication, and metrology into continuously learning digital models. They enable early detection of process drifts, virtual experimentation for process development, and data-driven optimization that reduces time, cost, and waste.

This course introduces Digital Twin frameworks for FHE, focusing on Deep Neural Network (DNN)-based predictive models. Participants will learn how to integrate design, fabrication, and metrology data into continuously learning virtual twins that detect process drifts, enable virtual experimentation, and optimize manufacturing. The program covers the full workflow—from image processing and virtual metrology to AI model training, validation, and hyperparameter tuning—using real datasets. A hands-on “Build Your Own Digital Twin” module in Google Colab will provide practical experience in training and refining models for printed electronics applications, equipping attendees with both theoretical insight and applied skills for process optimization and performance prediction.

ABOUT THE SPEAKER

Benyamin Davaji, PhD
Benyamin Davaji is an Assistant Professor in the Department of Electrical and Computer Engineering at Northeastern University, Boston, Massachusetts, where his research centers on integrated microsystems for sensing and computation using mechanical waves. His work spans acoustic and ultrasound transducers, biointerfaces, and microcalorimetry, with a strong emphasis on data-guided nanofabrication, advanced semiconductor device manufacturing, and interdisciplinary approaches to microsystem design and manufacturing. He earned his Ph.D. in Electrical and Computer Engineering from Marquette University in 2016 and completed a postdoctoral appointment at Cornell University.

United States

Davaji Profile picture
Ben Davaji, PhD
Assistant Professor
Northeastern University
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for a Master Class with Benyamin Davaji, PhD, as he introduces Digital Twin frameworks for Printed and Flexible Hybrid Electronics, demonstrating how AI- and DNN-based models integrate design, fabrication, and metrology data along with printing technologies to detect process drift, enable virtual experimentation, and optimize manufacturing performance. Participants gain hands-on experience building continuously learning digital twins to reduce variability, cost, and time to optimization. 

10:00 am - 12:00 pm Off Add to Calendar 2026-06-10 10:00:00 2026-06-10 12:00:00 FEMC#29 Digital Twins for Printed Electronics: How Can AI Learn FHE Printing? Join us for a Master Class with Benyamin Davaji, PhD, as he introduces Digital Twin frameworks for Printed and Flexible Hybrid Electronics, demonstrating how AI- and DNN-based models integrate design, fabrication, and metrology data along with printing technologies to detect process drift, enable virtual experimentation, and optimize manufacturing performance. Participants gain hands-on experience building continuously learning digital twins to reduce variability, cost, and time to optimization.  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch on-demand
Event format
Promote in calendar
Off
Belgium France Germany Ireland Italy United States Fundamentals of ALD, ALE and Precursors Chemistries Training

Course Description 

This course provides a practical introduction to atomic layer deposition, an essential technique in semiconductor manufacturing. You'll learn about ALD foundational concepts, including growth, advantages, measurements, and more, chemical precursors for use in ALD, selected ALD processes, area-selective deposition, and atomic layer etching. Overall, the applications and chemistry used in semiconductor processing, as they relate to ALD and ALE, are heavily discussed.

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Engeineers
  • Managers
  • Process Engineers
  • R&D Engineers
  • Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

  • Understanding foundational concepts of ALD.
  • Describe chemical precursors for ALD applications.
  • Identify selected ALD processes and their associated films and materials. 
  • Explain area-selective deposition (ASD), and its uses.
  • Describe Atomic Layer Etching (ALE) concepts and understand it's relationship to ALD.

     

 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

Dr. Chuck Winter
Dr. Chuck Winter
Instructor
- SEMI U

Discover how atomic-scale precision is revolutionizing semiconductor manufacturing with Atomic Layer Deposition (ALD) and Etching (ALE). Course topics include ALD foundational concepts, Chemical Precursors and Processes, and Advanced ALD Techniques. 

Pricing

          Early Bird Pricing $100 off

  • Members: $845   $745
  • Non-Members: $945  $845

* Group pricing for 20+ attendees: $9900
Any questions, please contact [email protected]

7:30 am - 11:30 am Off Add to Calendar Disabled America/Los_Angeles Register Now
Event format
Promote in calendar
Off

Brings Advocacy for the adoption of RISC-V processors and processor verification tool standards

Leverages broad experience in EDA business strategy, marketing and sales

SAN JOSE, Calif., March 05, 2026 (GLOBE NEWSWIRE) -- Breker Verification Systems today named Larry Lapides, former Synopsys Executive Director of RISC-V Tools Business Development, to its Advisory Board.

In making today’s announcement, David Kelf, Breker’s CEO, noted that Lapides has been a tireless advocate for the adoption of RISC-V processors and the urgent need for RISC-V processor verification tool standards. “Larry’s RISC-V knowledge and his ties to the RISC-V community are welcome additions to Breker and our advisory board.”

“Breker sits at the forefront in the development of commercial processor verification solutions and is a valued member of the RISC-V community,” remarks Lapides. “It will be a pleasure to work with Breker to move this important effort forward.”

Larry Lapides Biography
Lapides joined Synopsys through the acquisition of Imperas Software, where he was Vice President of Worldwide Sales and Marketing. He previously ran worldwide sales at EDA companies including Verisity Design and has more than 30 years in software tools and EDA, plus time spent in infrared systems engineering.

Lapides holds a Bachelor of Arts degree in Physics from UC Berkeley, a Master of Science degree in Applied Physics from Cornell University and an MBA from Clark University in Worcester, Mass.

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/

TrekSoC, TrekSoC-Si, TrekBox and SoC Scenario Modeling are registered trademark of Breker Verification Systems. Breker Verification Systems acknowledges trademarks or registered trademarks of other organizations for their respective products.

SurplusGLOBAL has rolled out a set of upgrades to SemiMarket (www.SemiMarket.com), its online marketplace for legacy semiconductor equipment and parts, aimed at making inventory discovery more actionable and sourcing workflows more practical for engineers and procurement teams operating in the secondary supply chain.

A central update is the expansion of how SemiMarket publishes and organizes Harvest-completed parts. The platform has opened Special Event sections that group harvested inventories by their "parent" tool, enabling buyers to navigate end-of-life components in the same equipment-centric structure fabs use for maintenance planning and spares management. By surfacing harvested parts in a tool-based format within the marketplace, SurplusGLOBAL says SemiMarket is becoming a more direct channel for sustaining older tool fleets as OEM availability thins or ends.

SemiMarket is also adding functionality for high-volume sourcing and internal review. A new bulk download feature lets users request an item list by selecting a top-level category and clicking "Download list" from the front-end interface. Once approved by the operations team, the file becomes available for download. SurplusGLOBAL positions the tool as a practical bridge between marketplace browsing and the internal processes procurement groups use to compare options, circulate listings, and document sourcing decisions at scale.

The changes address a growing pain point across mature-node fabs: when a single discontinued spare can sideline a tool, downtime can extend while teams source across brokers, refurbishers, and regional networks. The legacy spares supply chain remains fragmented, and even organizations with donor-tool pools often face challenges extracting, verifying, and redeploying parts efficiently at scale. SurplusGLOBAL says the trend is increasingly reaching 300mm tools manufactured before 2010, intensifying demand for more structured, searchable legacy parts supply.

To respond, the company says it is expanding its Harvest program—disassembling used equipment and remarketing parts—supported by in-house verification and data standardization. SurplusGLOBAL said it has harvested about 60 tools to date and plans to harvest roughly 200 to 300 tools this year, backed by teams spanning Harvest operations, parts verification, AI, SemiMarket, database engineering, and sales.

The company also said it is applying AI and OCR-driven workflows to accelerate classification, imaging, standardization, and listing creation, while building tool–part relationships, parts BOM coverage, and personalized recommendations.

The upgrades follow a recent rise in platform engagement tied to industry events. During SEMICON KOREA 2026, held Feb. 11–13 at COEX in Seoul, SurplusGLOBAL said about 3,000 industry visitors stopped by its booth and more than 800 signed up for SemiMarket on-site. The company said many of the new members included process and maintenance engineers, as well as employees from global equipment makers—roles closely connected to day-to-day tool operation and purchasing decisions.

Bruce Kim, SurplusGLOBAL's CEO, said the updates reflect "growing demand for faster, clearer decision-making and more actionable inventory discovery in the mature-node ecosystem, where uptime pressures and supply variability often push teams beyond OEM channels." He added that the company is expanding Harvest-led supply and improving how SemiMarket organizes that inventory so buyers can move from discovery to decision more quickly.

SurplusGLOBAL also pointed to a near-term offline expansion intended to complement online sourcing. The company said a 39,670m2(12,000-pyeong) SemiMarket Offline Parts Mall is scheduled to be completed in July, enabling customers to view large-scale inventory in person and access services such as parts verification and repair, strengthening global support for legacy tool sustainment.

Location: Richardson, Texas

Modus Test, a leader in advanced test socket testing solutions and performance validation, and yieldWerx, a semiconductor data and yield analytics platform, today announced a strategic partnership to help close the gap between test hardware and yield intelligence. The collaboration combines Modus Test’s high-performance socket test technology with yieldWerx’s enterprise-scale yield management platform to provide manufacturers with direct visibility into the relationship between socket health and device performance.

The partnership addresses a long-standing disconnect between test execution and data analytics in high- volume manufacturing. Degraded, misaligned, or worn sockets can introduce false failures or escapes without clear root-cause identification. By integrating hardware performance data with yield analytics, manufacturers can better distinguish contact-related artifacts from true silicon failures.
Through this partnership, customers can now:
• Monitor and trend socket performance across testers, sites, and handlers
• Correlate device failures to specific sockets, test cells, or contact events
• Identify unnecessary device rejects caused by socket degradation
• Detect potential escapes where devices pass due to intermittent contact issues
• Optimize preventive maintenance cycles using data-driven insights

By integrating Modus Test equipment data with yieldWerx’s wafer-, lot-, and device-level analytics, manufacturers gain the ability to separate true device behavior from test interface variability, improving confidence in test outcomes and accelerating root-cause resolution.

About yieldWerx
yieldWerx provides a semiconductor yield management platform that enables manufacturers to collect, analyze, and act on production data across the manufacturing lifecycle. The platform consolidates data from wafer fabrication through final test, delivering visibility into product quality, process performance, and yield improvement opportunities.

About ModusTest
Modus Test, LLC was founded on the idea that there are creative ways to improve results by combining innovation with the best-known methods in test design and manufacturing. Providing innovative test solutions includes the MPT series of parametric tests, systems, and accessories. Modus Test has a global presence and the capability to support customers in all the IC development centers and high-volume manufacturing sites around the world. See for yourself how combining innovation with best-known methods can improve your results.

Statements from Leadership
“yieldWerx was built to unify disparate manufacturing data into actionable yield intelligence,” said Aftkhar Aslam, CEO of yieldWerx. “Valuable data exists across testers, handlers, sockets, MES systems, and inspection tools, but it often remains siloed. Our platform connects these domains into a unified analytical framework that enables faster, data-driven decisions that reduce costs.”

“This partnership represents an important step forward in bringing greater transparency and intelligence to semiconductor test,” said Jesse Ko, COO of Modus Test. “Modus Test’s high-performance socket validation solutions, combined with yieldWerx’s powerful analytics platform, create a closed-loop ecosystem where hardware performance and yield outcomes are fully correlated. Together, we are enabling a smarter, more adaptive test environment.”

For further information, please visit https://www.yieldWerx.com or https://www.ModusTest.org.

Breker Verification Systems and Moores Lab AI Partner to Create First AI-Driven SoC Verification Solution
• Test Suite Synthesis, agentic AI integration will enable automated specification test generation across range of SoC designs on varied verification platforms
• AI-driven synthesis verification flow prototype to be demonstrated during DVCon U.S. in March
• Joint Breker, Moores Lab AI reception at DVCon U.S. Monday evening followed by AI in verification panel
SAN JOSE, CALIF.––February 26, 2026––Breker Verification Systems and Moores Lab AI today formalized a partnership to create the first AI-driven SoC verification flow integrating Breker’s Trek Test Suite Synthesis with Moores Lab agentic AI technology.

The solution leverages Breker’s vast experience in test generation for complex system design scenarios with the agentic AI VerifAgent™ product from Moores Lab AI. It seamlessly enables automated multicore, multitool, C or transaction level modeling (TLM) test generation for complex SoC scenarios from manually composed specifications.

The flow uses agentic AI to read a specification and generate appropriate scenario models for test synthesis that will produce combined C and SystemVerilog tests that can be run on simulation and emulation platforms targeting high-coverage SoC scenarios.

A prototype of the AI-driven verification flow will be demonstrated in Breker’s Booth (#203) and the Moores Lab AI Booth (#101) during DVCon U.S. March 2 through March 4 at the Hyatt Regency in Santa Clara.

“SoC verification requires highly complex scenario tests that find unpredictable corner cases across advanced, multi-core architectures,” says David Kelf, CEO of Breker Verification Systems. “The Moores Lab AI VerifAgent technology is an excellent complement to our proven Trek synthesis products that leverages our deep verification experience to drive the first AI SoC verification solution.”

“Breker has long been a pioneer in portable stimulus and system-level verification innovation,” notes Shelly Henry, CEO of Moores Lab AI. “Integrating VerifAgent with the Breker solutions creates a powerful synergy that enables engineering teams to verify increasingly complex silicon much faster and with greater confidence. We’re excited to partner with Breker to bring AI-driven transformation to SoC-level verification workflows.”

Combining Test Suite Synthesis with Agentic AI
Test Suite Synthesis generates high coverage tests efficiently for complex SoC-specific scenarios using various verification approaches, while agentic AI can accelerate the understanding of specifications to automatically derive verification plans and scenario models.

Combining the two can drive an automated verification solution that enables test generation for complex SoC scenarios from a manually composed specification that may be applied across a broad range of designs on varied verification platforms.

Availability
The AI-driven verification flow will be developed throughout 2026.

For more information, visit: http://www.breker.com or [email protected], or www.mooreslab.ai or [email protected].

Breker and Moores Lab AI at DVCon U.S.
In addition to the AI-driven verification flow prototype, Breker will exhibit and demonstrate its RISC-V CoreAssurance and SoCReady SystemVIP and Trek Test Suite Synthesis solutions at DVCon U.S. To arrange a demonstration or private meeting, send email to [email protected].

Moores Lab AI will showcase the VerifAgent product and discuss its product roadmap for agentic AI-driven silicon engineering at DVCon U.S. Email [email protected] to schedule an on-site meeting.

On Monday, March 2, Breker and Moores Lab AI will host an evening reception at DVCon in the Hyatt Regency Hotel Cypress room beginning at 6:30 p.m. and followed by a panel discussion on AI-driven SoC verification.

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: https://www.brekersystems.com/
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
X: @BrekerSystems

About Moores Lab AI
Moores Lab AI is building the next generation of AI tools for semiconductor design and verification. Its agentic AI platform transforms the chip development lifecycle by drastically reducing engineering time and cost, without changing existing flows, tools, or documentation. Moores Lab AI is headquartered in Austin, Texas, and proudly develops its products entirely in the United States.

For more information, visit www.mooreslab.ai or on social media:
LinkedIn: https://www.linkedin.com/company/mooreslabai/
X: @MooresLabAI

Registration Details

Registration is required for this event as it is likely to reach maximum room capacity, at which point interested attendees will be waitlisted.

SEMI Members:  $150

Non-Members of SEMI:  $200

Refunds possible before May 1, 2026.  Substitutions allowed up to May 20.

Questions? Contact James Amano at [email protected].

Belgium China France Germany India Ireland Italy Japan Singapore South Korea Taiwan United States 2026 EHS Summit Banner Business Executive Technical

The Summit includes strategic business and technical information for many levels and sectors of the ecosystem, including:

  • Government relations/advocacy staff
  • EHS regulatory professionals
  • Senior executives
  • Business development
  • Device manufacturers
  • Equipment suppliers
  • Materials suppliers
  • Component suppliers
  • Fab and facility systems construction companies

SEMI
673 South Milpitas Blvd.
Milpitas, CA 95035
United States

8:30 am

Badge Pickup and Networking

9:00 am
Joe Stockunas
Joe Stockunas
President, SEMI Americas
SEMI

Welcome and Introduction

9:05 am
James Amano
James Amano
Senior Director, EHS
SEMI

SEMI EHS Overview

9:20 am
Russ Lamotte
K. Russell LaMotte
Principal
Beveridge & Diamond, PC

US Regulatory Landscape: PFAS, PIP, TTR, and more

9:50 am
Iranda Chaki
Iranda Chaki
Senior Policy Coordinator
SEMI Europe

Europe: PFAS Restriction, POPs, F-Gas, GENESIS, REACH

10:15 am

Break

10:45 am
Michael Golden
Michael Golden
Director, Navy Programs & Microelectronics Initiatives
Office of the Deputy Assistant Secretary of War for Product Support

US Department of War Perspective on Semiconductor Supply Chain Risks

11:15 am
Patrick Gottsacker
Patrick Gottsacker
Supply Chain Regulatory Compliance Program Manager
Intel

US EPA: TSCA New Substances of Concern

11:45 am

Morning Session Q&A

12:15 pm

Lunch & Networking

1:15 pm
James Amano
James Amano
Senior Director, EHS
SEMI

Review of afternoon agenda

1:20 pm
Andrew Petraszak
Andrew Petraszak
Tokyo Electron
Patrick Gottsacker
Patrick Gottsacker
Intel

PFAS Transparency

1:50 pm
Masahide Yodogawa
Masahide Yodogawa
Director, Technology Co-Creation Promotion Group
AGC, Inc.

PFAS Recycling

2:15 pm
Ben Kallen
Ben Kallen
Sr. Manager, Public Policy & Advocacy
SEMI
Andrew Petraszak
Andrew Petraszak
Tokyo Electron

SEMI Washington DC Update: Federal and State-level Advocacy

2:40 pm

Afternoon Q&A

3:00 pm - 3:30 pm

Networking

EHS Sustainability Standards

Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California at the 2026 SEMI EHS Summit.

Industry experts will present on the regulatory matters that will impact the industry in 2026 and beyond, followed by discussions on taking collective action to strengthen semiconductor manufacturing. 

Topics:

  • US Regulatory Landscape under second Trump Administration
  • US State-level legislation
  • Europe: PFAS restriction, REACH restriction, Packaging and Packaging Waste Regulation, GENESIS Consortium, etc.
  • US Department of War Perspective on Semiconductor Supply Chain Risks
  • Stockholm Convention
  • Emerging regulations in Asia
  • Supply Chain Transparency
  • US EPA Technology Transition Rule (HFC Phasedown)
  • US EPA TSCA New Substances of Concern

Attend, network and strategically prepare your company.  This is an in-person event only.

8:30 am - 3:30 pm Off Add to Calendar 2026-05-28 08:30:00 2026-05-28 15:30:00 2026 EHS Summit Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California at the 2026 SEMI EHS Summit.Industry experts will present on the regulatory matters that will impact the industry in 2026 and beyond, followed by discussions on taking collective action to strengthen semiconductor manufacturing. Topics:US Regulatory Landscape under second Trump AdministrationUS State-level legislationEurope: PFAS restriction, REACH restriction, Packaging and Packaging Waste Regulation, GENESIS Consortium, etc.US Department of War Perspective on Semiconductor Supply Chain RisksStockholm ConventionEmerging regulations in AsiaSupply Chain TransparencyUS EPA Technology Transition Rule (HFC Phasedown)US EPA TSCA New Substances of ConcernAttend, network and strategically prepare your company.  This is an in-person event only. SEMI 673 South Milpitas Blvd. Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
Event format
Promote in calendar
On