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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

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This comprehensive course will cover the underlying fundamentals, the interrelationship between materials and processes, and the hardware used in printed electronics.  The masterclass will also explore how printed electronics can be applied currently in example applications including practical aspects of the technology, its highlights and challenges and scalability.  We will also explore emerging new technologies at the cutting edge of FHE, semiconductor packaging, photonics and quantum materials.  Throughout the course there will be opportunities for Q/A and discussions and case studies based on participant's interest.

ABOUT THE SPEAKER

J. Devin MacKenzie, PhD
Dr. Devin MacKenzie is the Washington Research Foundation Professor and an Assoc. Prof. of Materials Science and Engineering and Mechanical Engineering at UW. He is also the Technical Director of the Washington Clean Energy Testbeds, a lab that provides open-access to world-class advanced manufacturing and characterization tools for printed optoelectronics, sensors and energy device research and scale-up. Devin also has 25 years of entrepreneurial experience in sustainable materials and manufacturing of semiconductors, optoelectronics and energy devices. Prior to UW he was CEO and co-founder of printed battery company, Imprint Energy (acquired CCL/Avery), Previously, as the CTO of Add-Vision, Inc. (acquired Sumitomo Chemical), Dr. MacKenzie led R&D for roll-to-roll printed flexible OLEDs at Add-Vision with licensing in Europe and Asia. Prior to Add-Vision, he led printed silicon RF device and product engineering at Kovio, Inc. a Si Valley MIT spin-out (acquired Thin Film Electronics). Dr. MacKenzie also co-founded, Plastic Logic, from Cambridge University as a postdoc and subsequently a visiting scientist in Physics at the Cavendish Laboratory. Prior to that he worked at Bell Labs and NASA. Dr. MacKenzie has authored over 240 publications and patents that have been licensed globally and has been cited over 12,900 times in fields ranging from rare earth-doped nitrides to quantum materials. He holds Ph.D, MS, and undergraduate degrees in Materials Science and Engineering from the University of Florida and the Massachusetts Institute of Technology.

United States

J. Devin MacKenzie
J. Devin MacKenzie, PhD
Washington Research Foundation Professor of Clean Energy, Associate Professor
University of Washington
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for a comprehensive Master Class with Dr. Devin MacKenzie, as he dives into the fundamentals and real-world applications of printed and flexible hybrid electronics (FHE). This session will explore the critical interrelationship between materials, processes, and hardware used in printed electronics, providing a strong foundation for understanding how these systems are designed and manufactured.

Participants will gain insight into current applications of printed electronics, along with practical considerations such as performance, scalability, and manufacturing challenges. The course will also highlight emerging technologies at the forefront of innovation, including advances in FHE, semiconductor packaging, photonics, and quantum materials

10:00 am - 12:00 pm Off Add to Calendar 2026-09-30 10:00:00 2026-09-30 12:00:00 FEMC#31 Advancing Printed Electronics Technology: From Macroelectronics to Quantum Devices Join us for a comprehensive Master Class with Dr. Devin MacKenzie, as he dives into the fundamentals and real-world applications of printed and flexible hybrid electronics (FHE). This session will explore the critical interrelationship between materials, processes, and hardware used in printed electronics, providing a strong foundation for understanding how these systems are designed and manufactured.Participants will gain insight into current applications of printed electronics, along with practical considerations such as performance, scalability, and manufacturing challenges. The course will also highlight emerging technologies at the forefront of innovation, including advances in FHE, semiconductor packaging, photonics, and quantum materials United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
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India Japan Malaysia Singapore South Korea Taiwan United States Vietnam Inside the Fab Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.  

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Basic Electronics and Microelectronics
  • Process Nodes
  • Device Physics and Transistor Operation
  • Crystal Growth and Wafer Preparation
  • Advanced Transistor Technologies
  • Circuit Design and Layout
  • Wafer Processing

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Kalya Shubhakar
Kalya Shubhakar
Senior Lecturer
 

 

Singapore

- SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

Pricing                     
  • Members:  $399
  • Non-Members:  $449

* * Group pricing for 10+ attendees: $3,800 and 20+ attendees: $7,600
Any questions, please contact [email protected]

10:00 am - 2:00 pm Off Add to Calendar 2026-08-10 10:00:00 2026-08-13 14:00:00 Inside the Fab: An Introduction to Semiconductor Manufacturing (Asia) Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. Pricing                     Members:  $399Non-Members:  $449* * Group pricing for 10+ attendees: $3,800 and 20+ attendees: $7,600Any questions, please contact [email protected] Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now
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Thank you to our sponsors:  

 

 

         Sundt Construction Company & General Contractor | Sundt                                   SCREEN logo

 

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United States

9:00 am - 9:10 am

Welcome and Overview of the Water Management Working Group

9:10 am - 9:25 am
Pascal Osten
Leader, Water Solution Providers Cohort
Pascal Osten
DAS Environmental Expert GmbH

Procedures Guide

9:25 am - 9:35 am
Catherine Marsan-Loyer
Co-Lead, Fab, OSATs Cohort
Catherine Marsan-Loyer
C2MI

Water Savings Guide and Baseline-setting

9:35 am - 9:45 am
Jared Burdik
Co-Lead, Fab, OSAT Cohort
Jared Burdick
Sundt Corp.

Solutions Maturity Scale

9:45 am - 9:55 am

Q&A & WrapUp

EHS SMG Sustainability EMG FOA Standards

Join the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports.  The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge. 

The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.

Reports can be downloaded HERE.

9:00 am - 10:00 am Off Add to Calendar 2026-05-21 09:00:00 2026-05-21 10:00:00 Water Management Strategies Webinar Join the SEMI Water Management team and document authors for a webinar discussing their research and findings for the Water Management Strategy Reports.  The reports are guides for water managers for understanding their water balance, baseline, potential savings and a general maturity scale for several solutions to be considered to move up the maturity scale to Zero Liquid Discharge (ZLD). The webinar will provide an overview on how the documents should be used to work with water solutions providers and provide strategies for both new and legacy facilities with end-of-pipe solutions as well as treatments for individual process stage water discharge. The webinar will include a discussion of next steps for the continued development of the reports, including how they interact with SEMI Standards and the industry roadmaps.Reports can be downloaded HERE. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Here
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High-performance connectivity software delivers structured, high-volume equipment data required by tier-one fabs and advanced packaging facilities ahead of the expected mid-2026 SEMI standards update

POITIERS, March 25, 2026 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing, today unveils Agil'EDA, a new software solution implementing Equipment Data Acquisition (EDA), a set of SEMI standards also known as Interface A, to enable semiconductor equipment manufacturers to meet the evolving high-performance connectivity requirements of tier-one fabs and advanced packaging facilities.

As semiconductor manufacturing moves towards higher levels of automation and data-driven optimization, fab owners increasingly require EDA alongside traditional SECS/GEM connectivity from semiconductor OEMs for their production tools. Agil'EDA addresses this by separating the control flow from the data flow, ensuring that structured, high-frequency data collection does not interfere with critical equipment operations.
Designed for long-term deployment, Agil'EDA fully supports the widely used EDA Freeze 2 (SOAP/XML) and is architected for the transition to Freeze 3 (gRPC/protocol buffers). This next-generation standard offers significantly higher data throughput and reduced latency. Agileo has already successfully tested and validated its EDA Freeze 3 implementation at SEMI’s North America Standards Fall Meetings in November 2024 in Milpitas, California. SEMI’s EDA Freeze 3 standards suite is expected to be released mid-2026.

Complementing the SECS/GEM standards used to control equipment behavior, Agil’EDA incorporates robust cybersecurity features such as authentication and encrypted communications. The product is available as a stand-alone solution for any existing equipment software using a platform-independent gRPC application programming interface (API) to communicate with it or as a pre-integrated component within Agileo’s A²ECF-SEMI framework. When used with Agil'GEM and Agil'GEM300, it provides a comprehensive connectivity solution that significantly reduces time to market for OEMs.

"With the growing demand for data to improve yield in tier-one fabs, as well as in Advanced Packaging and 3D integration, EDA is no longer optional. It is becoming a mandatory requirement for equipment entering the world's most advanced fabs," explains Marc Engel, chief executive officer of Agileo Automation. "The key value we deliver for OEMs is a fast and easy adoption path for a seamless EDA architecture that delivers compliant production machines to global fab customers. By providing a future-proof architecture ready for Freeze 3, which will significantly increase performance, we address OEMs’ current needs while preparing them for the evolving requirements of semiconductor manufacturing, including AI-driven process control."

- ends -

About Agileo Automation
Agileo Automation is a trusted partner for equipment manufacturers, helping them build smarter, automated, and more connected machines that integrate seamlessly into advanced semiconductor fabs. Founded in 2010 in Poitiers, France, Agileo helps OEMs with control, communication, data acquisition, and testing across their tools through proven software and expert support. Its flagship A²ECF-SEMI framework provides a solid foundation for developing equipment controllers fully aligned with SEMI SECS/GEM, GEM300, and EDA standards. As an active member of SEMI and the OPC Foundation, Agileo Automation contributes directly to shaping the standards that drive manufacturing. For more information, please visit our website or follow us on LinkedIn.

Dresden, Germany, March 24, 2026 – As semiconductor manufacturing continues to expand in China, reliable and efficient environmental technologies are becoming increasingly important for stable and sustainable fab operation. DAS Environmental Experts presents its SALIX wet scrubber product family, a series of high-efficiency point-of-use systems designed for the treatment of waste gases from wet chemical processes in semiconductor manufacturing.

SALIX systems are engineered to ensure high removal efficiency and stable operation in demanding semiconductor production environments. SALIX reliably removes substances such as IPA, ammonia and hydrofluoric acid (HF) from waste gas streams of modern single wafer clean systems – a key contribution to safe and sustainable semiconductor manufacturing. In addition, the technology removes particles, salts and droplets from the processed gas stream. The robust system design supports high uptime and long maintenance intervals, contributing to reliable fab operation.

A key advantage of the SALIX product family is its flexible portfolio. SALIX products are among the smallest and most compact systems on the market and are suitable for both new fabs and retrofit applications in existing fabs. DAS Environmental Experts offers the technology in four different products, providing semiconductor manufacturers with a wide range of configuration options:

• NEW: SALIX – the latest release with improved performance and optimized system operation
• SALIX MINI – a compact two-stage system for space-constrained installations
• NEW: SALIX MICRO [SR1.1]– a highly compact configuration with pre-scrubber section for flexible integration

This structured product portfolio enables customers to select the most suitable system according to process requirements, fab layout and integration needs. The availability of multiple system variants within one technology platform provides semiconductor manufacturers with excellent flexibility in system selection and plant design.

SALIX systems are designed for compatibility with all common process tools and can be adapted to a wide range of wet chemical applications. Their compact design and flexible configuration support efficient integration into modern fabs, helping manufacturers optimize both environmental performance and operational efficiency.

The SALIX product family will be presented during SEMICON China 2026 (March 25–27, Shanghai New International Expo Centre). Interested visitors can learn more about the technology and its applications at the DAS Environmental Experts booth (Booth N2 | 2619).

With more than three decades of experience in environmental technology for the semiconductor industry, DAS Environmental Experts continues to support chip manufacturers worldwide with solutions that combine high process reliability, efficient emission treatment and long-term operational stability.

About the Company
DAS Environmental Experts Group (DAS Group), headquartered in Dresden, Germany, was founded in 1991 and is now a global organization with subsidiaries on three continents and more than 950 employees worldwide. Over the past three decades, DAS Group has become one of the leading technology and equipment providers for waste gas abatement solutions with a focus on semiconductor industry.
In addition, DAS Group develops advanced process and system solutions for industrial water treatment, with extensive expertise in the recycling and reuse of wastewater from the semiconductor industry.
DAS solutions are engineered to meet the stringent purity requirements of semiconductor manufacturing, helping clients comply with global environmental standards.

SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

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Digital Twin is a virtual representation of the structure, context, and behavior of physical systems or a process, with a live link to a physical system serving as a key enabler for predictive and data-driven optimization. In Printed and Flexible Hybrid Electronics (FHE), manufacturing involves multiple interdependent variables—different printing technologies, inks, substrates, and process conditions—each introducing its own complexity. In practice, additional challenges such as equipment drift, batch-to-batch variations, and environmental fluctuations further impact process consistency and yield. Changing a process or transferring it between tools is often difficult, as each setup is highly customized and sensitive to local conditions. To address these challenges, Digital Twin frameworks connect data from design, fabrication, and metrology into continuously learning digital models. They enable early detection of process drifts, virtual experimentation for process development, and data-driven optimization that reduces time, cost, and waste.

This course introduces Digital Twin frameworks for FHE, focusing on Deep Neural Network (DNN)-based predictive models. Participants will learn how to integrate design, fabrication, and metrology data into continuously learning virtual twins that detect process drifts, enable virtual experimentation, and optimize manufacturing. The program covers the full workflow—from image processing and virtual metrology to AI model training, validation, and hyperparameter tuning—using real datasets. A hands-on “Build Your Own Digital Twin” module in Google Colab will provide practical experience in training and refining models for printed electronics applications, equipping attendees with both theoretical insight and applied skills for process optimization and performance prediction.

ABOUT THE SPEAKER

Benyamin Davaji, PhD
Benyamin Davaji is an Assistant Professor in the Department of Electrical and Computer Engineering at Northeastern University, Boston, Massachusetts, where his research centers on integrated microsystems for sensing and computation using mechanical waves. His work spans acoustic and ultrasound transducers, biointerfaces, and microcalorimetry, with a strong emphasis on data-guided nanofabrication, advanced semiconductor device manufacturing, and interdisciplinary approaches to microsystem design and manufacturing. He earned his Ph.D. in Electrical and Computer Engineering from Marquette University in 2016 and completed a postdoctoral appointment at Cornell University.

United States

Davaji Profile picture
Ben Davaji, PhD
Assistant Professor
Northeastern University
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for a Master Class with Benyamin Davaji, PhD, as he introduces Digital Twin frameworks for Printed and Flexible Hybrid Electronics, demonstrating how AI- and DNN-based models integrate design, fabrication, and metrology data along with printing technologies to detect process drift, enable virtual experimentation, and optimize manufacturing performance. Participants gain hands-on experience building continuously learning digital twins to reduce variability, cost, and time to optimization. 

10:00 am - 12:00 pm Off Add to Calendar 2026-06-10 10:00:00 2026-06-10 12:00:00 FEMC#29 Digital Twins for Printed Electronics: How Can AI Learn FHE Printing? Join us for a Master Class with Benyamin Davaji, PhD, as he introduces Digital Twin frameworks for Printed and Flexible Hybrid Electronics, demonstrating how AI- and DNN-based models integrate design, fabrication, and metrology data along with printing technologies to detect process drift, enable virtual experimentation, and optimize manufacturing performance. Participants gain hands-on experience building continuously learning digital twins to reduce variability, cost, and time to optimization.  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch on-demand
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Brings Advocacy for the adoption of RISC-V processors and processor verification tool standards

Leverages broad experience in EDA business strategy, marketing and sales

SAN JOSE, Calif., March 05, 2026 (GLOBE NEWSWIRE) -- Breker Verification Systems today named Larry Lapides, former Synopsys Executive Director of RISC-V Tools Business Development, to its Advisory Board.

In making today’s announcement, David Kelf, Breker’s CEO, noted that Lapides has been a tireless advocate for the adoption of RISC-V processors and the urgent need for RISC-V processor verification tool standards. “Larry’s RISC-V knowledge and his ties to the RISC-V community are welcome additions to Breker and our advisory board.”

“Breker sits at the forefront in the development of commercial processor verification solutions and is a valued member of the RISC-V community,” remarks Lapides. “It will be a pleasure to work with Breker to move this important effort forward.”

Larry Lapides Biography
Lapides joined Synopsys through the acquisition of Imperas Software, where he was Vice President of Worldwide Sales and Marketing. He previously ran worldwide sales at EDA companies including Verisity Design and has more than 30 years in software tools and EDA, plus time spent in infrared systems engineering.

Lapides holds a Bachelor of Arts degree in Physics from UC Berkeley, a Master of Science degree in Applied Physics from Cornell University and an MBA from Clark University in Worcester, Mass.

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/

TrekSoC, TrekSoC-Si, TrekBox and SoC Scenario Modeling are registered trademark of Breker Verification Systems. Breker Verification Systems acknowledges trademarks or registered trademarks of other organizations for their respective products.

Location: Richardson, Texas

Modus Test, a leader in advanced test socket testing solutions and performance validation, and yieldWerx, a semiconductor data and yield analytics platform, today announced a strategic partnership to help close the gap between test hardware and yield intelligence. The collaboration combines Modus Test’s high-performance socket test technology with yieldWerx’s enterprise-scale yield management platform to provide manufacturers with direct visibility into the relationship between socket health and device performance.

The partnership addresses a long-standing disconnect between test execution and data analytics in high- volume manufacturing. Degraded, misaligned, or worn sockets can introduce false failures or escapes without clear root-cause identification. By integrating hardware performance data with yield analytics, manufacturers can better distinguish contact-related artifacts from true silicon failures.
Through this partnership, customers can now:
• Monitor and trend socket performance across testers, sites, and handlers
• Correlate device failures to specific sockets, test cells, or contact events
• Identify unnecessary device rejects caused by socket degradation
• Detect potential escapes where devices pass due to intermittent contact issues
• Optimize preventive maintenance cycles using data-driven insights

By integrating Modus Test equipment data with yieldWerx’s wafer-, lot-, and device-level analytics, manufacturers gain the ability to separate true device behavior from test interface variability, improving confidence in test outcomes and accelerating root-cause resolution.

About yieldWerx
yieldWerx provides a semiconductor yield management platform that enables manufacturers to collect, analyze, and act on production data across the manufacturing lifecycle. The platform consolidates data from wafer fabrication through final test, delivering visibility into product quality, process performance, and yield improvement opportunities.

About ModusTest
Modus Test, LLC was founded on the idea that there are creative ways to improve results by combining innovation with the best-known methods in test design and manufacturing. Providing innovative test solutions includes the MPT series of parametric tests, systems, and accessories. Modus Test has a global presence and the capability to support customers in all the IC development centers and high-volume manufacturing sites around the world. See for yourself how combining innovation with best-known methods can improve your results.

Statements from Leadership
“yieldWerx was built to unify disparate manufacturing data into actionable yield intelligence,” said Aftkhar Aslam, CEO of yieldWerx. “Valuable data exists across testers, handlers, sockets, MES systems, and inspection tools, but it often remains siloed. Our platform connects these domains into a unified analytical framework that enables faster, data-driven decisions that reduce costs.”

“This partnership represents an important step forward in bringing greater transparency and intelligence to semiconductor test,” said Jesse Ko, COO of Modus Test. “Modus Test’s high-performance socket validation solutions, combined with yieldWerx’s powerful analytics platform, create a closed-loop ecosystem where hardware performance and yield outcomes are fully correlated. Together, we are enabling a smarter, more adaptive test environment.”

For further information, please visit https://www.yieldWerx.com or https://www.ModusTest.org.

Breker Verification Systems and Moores Lab AI Partner to Create First AI-Driven SoC Verification Solution
• Test Suite Synthesis, agentic AI integration will enable automated specification test generation across range of SoC designs on varied verification platforms
• AI-driven synthesis verification flow prototype to be demonstrated during DVCon U.S. in March
• Joint Breker, Moores Lab AI reception at DVCon U.S. Monday evening followed by AI in verification panel
SAN JOSE, CALIF.––February 26, 2026––Breker Verification Systems and Moores Lab AI today formalized a partnership to create the first AI-driven SoC verification flow integrating Breker’s Trek Test Suite Synthesis with Moores Lab agentic AI technology.

The solution leverages Breker’s vast experience in test generation for complex system design scenarios with the agentic AI VerifAgent™ product from Moores Lab AI. It seamlessly enables automated multicore, multitool, C or transaction level modeling (TLM) test generation for complex SoC scenarios from manually composed specifications.

The flow uses agentic AI to read a specification and generate appropriate scenario models for test synthesis that will produce combined C and SystemVerilog tests that can be run on simulation and emulation platforms targeting high-coverage SoC scenarios.

A prototype of the AI-driven verification flow will be demonstrated in Breker’s Booth (#203) and the Moores Lab AI Booth (#101) during DVCon U.S. March 2 through March 4 at the Hyatt Regency in Santa Clara.

“SoC verification requires highly complex scenario tests that find unpredictable corner cases across advanced, multi-core architectures,” says David Kelf, CEO of Breker Verification Systems. “The Moores Lab AI VerifAgent technology is an excellent complement to our proven Trek synthesis products that leverages our deep verification experience to drive the first AI SoC verification solution.”

“Breker has long been a pioneer in portable stimulus and system-level verification innovation,” notes Shelly Henry, CEO of Moores Lab AI. “Integrating VerifAgent with the Breker solutions creates a powerful synergy that enables engineering teams to verify increasingly complex silicon much faster and with greater confidence. We’re excited to partner with Breker to bring AI-driven transformation to SoC-level verification workflows.”

Combining Test Suite Synthesis with Agentic AI
Test Suite Synthesis generates high coverage tests efficiently for complex SoC-specific scenarios using various verification approaches, while agentic AI can accelerate the understanding of specifications to automatically derive verification plans and scenario models.

Combining the two can drive an automated verification solution that enables test generation for complex SoC scenarios from a manually composed specification that may be applied across a broad range of designs on varied verification platforms.

Availability
The AI-driven verification flow will be developed throughout 2026.

For more information, visit: http://www.breker.com or [email protected], or www.mooreslab.ai or [email protected].

Breker and Moores Lab AI at DVCon U.S.
In addition to the AI-driven verification flow prototype, Breker will exhibit and demonstrate its RISC-V CoreAssurance and SoCReady SystemVIP and Trek Test Suite Synthesis solutions at DVCon U.S. To arrange a demonstration or private meeting, send email to [email protected].

Moores Lab AI will showcase the VerifAgent product and discuss its product roadmap for agentic AI-driven silicon engineering at DVCon U.S. Email [email protected] to schedule an on-site meeting.

On Monday, March 2, Breker and Moores Lab AI will host an evening reception at DVCon in the Hyatt Regency Hotel Cypress room beginning at 6:30 p.m. and followed by a panel discussion on AI-driven SoC verification.

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: https://www.brekersystems.com/
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
X: @BrekerSystems

About Moores Lab AI
Moores Lab AI is building the next generation of AI tools for semiconductor design and verification. Its agentic AI platform transforms the chip development lifecycle by drastically reducing engineering time and cost, without changing existing flows, tools, or documentation. Moores Lab AI is headquartered in Austin, Texas, and proudly develops its products entirely in the United States.

For more information, visit www.mooreslab.ai or on social media:
LinkedIn: https://www.linkedin.com/company/mooreslabai/
X: @MooresLabAI

China India Japan Malaysia Singapore Taiwan Vietnam Chiplet & Heterogeneous 6/30 Training

Course Description 

This workshop reviews the needs of the packaging solution to meet the demand for digitalization through the artificial intelligent and Internet-of-things from urbanization, sustainability to industry. The course provides an overview of the fabrication process of IC carriers of leadframe, ceramics, substrate and flex and how they have to evolve to meet the heterogeneous integration. With these foundations, various stacking and integration technologies through wirebonding, flip chip and 3D interconnect from interconnect to system level will be shared. Packaging innovation of TSV, fan-in, fan-out wafer level packaging and its challenges will also be shared for chiplet and heterogeneous integration. It ends off by sharing the embedded technologies and embedded multi-die interconnect bridge for chiplet and heterogeneous integration.

The course looks into the R&D development as well as the dynamics changes of heterogeneous integration technologies in the Semiconductor packaging arena. This workshop curates the technologies development to date and provides the necessary information for professionals in the manufacturing and R&D environment to perform their tasks.

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Directors
  • Managers
  • Process Engineers
  • R&D Engineers
  • Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

  • Understand why chiplet and heterogeneous integration for advanced packaging
  • Review of IC carriers
  • Summarize 3D and TSV for Chiplet and Heterogeneous Integration
  • Explain Fan-in and Fan-out wafer-level packaging for chiplet and heterogeneous integration
  • Describe chiplet, embedded, and embedded multi-die interconnect beam for chiplet and glass substrate for heterogenous integration 

Instructor

Dr. Lee Teck Kheng

Institue of Technical Education

Instructor Bio

Testimonials 

See what previous course participants had to say about this training!

  • "All the necessary information are neatly fitted into a few slides prepared by Dr. Lee"
  • "I found the review of the material between sessions and the slides to follow along with to be the most beneficial aspects of the training."
  • "Much thanks to Dr. Lee & SEMI University for giving me a chance to study all my unclear items in the past."

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

Singapore

SEMI U

Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging, Through Silicon Via (TSV), and Fan-out wafer level packaging (Fo-WLP) technologies into a system in the package for applications. Chiplet, EMIB, and glass substrate will also be shared in this course. 

Pricing
  • Members: $599
  • Non-Members: $649

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

8:30 am - 5:00 pm Off Add to Calendar 2026-06-30 08:30:00 2026-06-30 17:00:00 Chiplet and Heterogeneous Integration for Microelectronics Packaging (Asia) Chiplet and heterogeneous integration of packaging has been embraced as the next revolutionary innovation to meet the quest of size, cost, and performance for packaging. The technologies are seen as another disruptive technology to bring devices into a package by integrating the various Multi-chip module (MCM), 3D packaging, Through Silicon Via (TSV), and Fan-out wafer level packaging (Fo-WLP) technologies into a system in the package for applications. Chiplet, EMIB, and glass substrate will also be shared in this course. PricingMembers: $599Non-Members: $649* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now
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