Kitchener, Ontario, July 15, 2025 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry has launched a new service offering to help OEMs comply with the SEMI® Cybersecurity Standard E187: Specification for Cybersecurity of Fab Equipment.

“PEER Group’s new PEER® E187 Compliance Assessment is a comprehensive third-party service for OEMs that provides the essential training, assessment, documentation, and guidance to help their equipment comply with SEMI E187,” says Doug Suerich, PEER Group’s Director of Marketing.

Released in 2022, SEMI E187 provides a baseline level of security for new equipment being shipped to factories. It applies specifically to computing devices installed on fab equipment that run Microsoft Windows or Linux. Already mandatory at some factories, SEMI E187 is being increasingly adopted as part of factory acceptance requirements.

“PEER Group is uniquely positioned to assist with E187 compliance thanks our leadership in SEMI’s Semiconductor Manufacturing Cybersecurity Consortium (SMCC), participation in SEMI Standards development, and our decades of experience working with both OEMs and factories to meet fab specification requirements and achieve SEMI Standards compliance,” shares Suerich, who also serves as an SMCC Governing Council member.

To help educate OEMs on how to comply with SEMI E187, PEER Group is hosting a free webinar on July 24, 2025. For more information, including how to register, visit: https://attendee.gotowebinar.com/register/7410295402908186710?source=se…

About PEER Group
PEER Group® is the leading global supplier of innovative factory and tool automation and connectivity software for the semiconductor industry. Since our founding in 1992, we have been committed to developing best-in-class solutions that help OEMs and factories reduce their time to market, risk, and costs by solving their most challenging automation, connectivity, and SEMI Standards compliance problems. Follow PEER Group on. Follow PEER Group on LinkedIn.

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This cutting-edge panel-level wet processing demo tool handles large 510 × 515 mm substrates, delivering world class, high density Through Glass Vias (TGV) formation and ultra-small taper angles essential for advanced packaging in high performance computing.

Gütenbach, Germany – July 15, 2025 – RENA Technologies, a leading manufacturer of wet processing equipment for semiconductor and advanced packaging production, today announced the ramp-up of its dedicated glass core substrates facility in Germany. This new line, designed for substrates up to 510 × 515 mm, immediately opens for customer test lots, underscoring RENA's proven expertise in glass processing and creating new opportunities for process development and customer sample production. “As experts in precision wet processing, we can now offer large panel demo services for high aspect ratio through glass via (TGV) formation on various glass types,” said Dr. Holger H. Kuehnlein, SVP Technology at RENA. “Our alkaline based TGV process delivers extremely small taper angles, low sidewall roughness, and exceptional dimensional control at panel scale, enabling high density via applications. Customers can begin validating these capabilities today.”

Why Glass, and Why Wet Processing?
Glass substrates offer significant advantages for advanced electronics, including ultra-flat surfaces, low dielectric loss, and superior thermal stability. However, realizing these benefits at scale requires defect free surface preparation and the formation of uniform, high density TGVs with minimal taper angles. RENA's wet processing systems are specifically designed to address both challenges:
1. Surface Engineering – Our systems ensure precise cleaning and stress relief across 600 x 600mm panels with submicron total thickness variation (TTV).
2. Chemically Formed TGVs – Following initial laser modifications performed by our specialist partners, RENA’s proprietary chemistries form, enlarge and shape each via to exact specifications. This process consistently delivers very small taper angles and smooth sidewalls, ideal for subsequent metallization.

By collaborating with leading German and international laser partners, RENA offers customers the flexibility to choose their preferred laser vendor while ensuring all downstream wet processing steps are handled by our advanced equipment.

Key Highlights of the New Facility
Panel Size: Focus on 510 x 515mm and up to 600 × 600mm, smaller possible
Tool Set: Alkaline TGV etching, advanced rinse/dry, optical inspection & metrology
Field-Proven Recipes: Process conditions migrated from high volume tools
On-Demand Access: Customers may run demo substrates, qualify custom chemistries, or request full process flows
Sustainability: Low temperature chemistries and closed loop water reclamation reduce energy and ultrapure water (UPW) consumption

Market Impact
High-Performance Computing (HPC) as well as 5G/6G RF modules increasingly require new package designs, including panel-level fan-out and trend towards more complex chiplet architectures. Glass substrates, long considered the “holy grail” for core and interposer material, effectively eliminate the limitations imposed by warpage and dielectric loss in organic substrates. By combining laser modification from our vetted partners with RENA's chemistry driven via shaping, designers can now validate glass packaging concepts on the lab-platform proven at 600x600mm dimensions.
“With this lab-tool, we've created a great opportunity for semiconductor manufacturers to perform demos on panel level glass substrates,” added Peter Schneidewind, CEO of RENA. “From surface preparation to via formation, our wet process flow is ready for customers substrates to support TGV technology breakthroughs. This is world class made in Black Forest.”

Availability & Engagement Model
• Testing available now
• Flexible collaboration: Bring your own laser modified substrates, or leverage RENA’s ecosystem partners to benefit from joint process development support, and metrology services for process validation.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, the glass industry and additive manufacturing. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates, 3D-printed metal components or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

CONTACT
Sales:
Felix Fink
Phone: +49 7723 9313-403
E-Mail: [email protected]

Press:
Dirk Hensel
Phone:+49 7723 9313-914
E-Mail: [email protected]
www.rena.com

• Read more about RENA Technologies Commissions High-Tech-Processing Facility for TGV Glass Substrates

Espoo, Finland, July 14, 2025 – Beneq, a global leader in Atomic Layer Deposition (ALD) technology, is proud to announce significant progress in the microLED display market, underscored by repeat orders from industry-leading technology innovators. MicroLED technology is revolutionizing the future of displays across sectors including consumer electronics, augmented and virtual reality (AR/VR), and the automotive industry. With unparalleled brightness, contrast, energy efficiency, and durability, microLED represents a paradigm shift in how displays are designed and manufactured – enabling ultra-fine pixel resolution, seamless scalability, and longer device lifetimes. As demand for next-generation display solutions accelerates, microLED is poised to become the backbone of future visual interfaces.

According to Yole Group, global microLED display shipments are projected to grow at a compound annual growth rate (CAGR) of 180.6% from 2022, reaching 42.4 million units by 2029. Despite its promise, microLED development presents formidable challenges, particularly in scaling down pixel sizes to below 10 micrometers while maintaining uniformity, stability, and manufacturability. As pixels shrink, precise material control and surface passivation become critical to device performance. Atomic Layer Deposition offers a unique solution, enabling ultra-thin, conformal coatings with atomic-level precision. ALD addresses key barriers in microLED production, such as surface defect passivation, sidewall protection, transparent conductive oxides and final passivation, thereby improving both device efficiency and long-term reliability.

“Our top-tier customers rely on ALD technology to advance monolithic integration of microLEDs and driver electronics on a single chip. This integration paves the way for a new class of smaller, more powerful display products – delivering faster data transfer, lower power consumption, and a significantly more compact footprint,” says Mikko Söderlund, Head of Semiconductor ALD Sales.

“These repeat orders validate Beneq’s solution and demonstrate the company’s commitment to support customers through both the demanding development phase and the critical transition to volume manufacturing.”

Beneq’s Transform® ALD cluster platform stands at the forefront of this technological evolution. Designed for high-throughput production and advanced technology development, the Beneq Transform combines modularity, flexibility, and productivity, making it an ideal tool for microLED manufacturers. Its multi-chamber architecture supports a wide range of materials and processes, enabling customers to fine-tune optical and electrical properties while seamlessly scaling from lab to fab. By equipping microLED pioneers with the tools needed to overcome manufacturing barriers, the Beneq Transform is helping accelerate the commercialization of microLED displays – paving the way for brighter, smarter, and more sustainable electronic experiences.

About Beneq

Beneq pioneered industrial Atomic Layer Deposition (ALD) with the introduction of the first commercial ALD equipment in 1984. Today, Beneq advances ALD technology adoption and validation with a portfolio that includes Transform®, Transform® 300, and Prodigy™ for specialty semiconductor device fabrication; TFS 200 and TFS 500 for R&D; innovative spatial ALD platforms such as the C2R™, and Genesis for roll-to-roll processing. Beneq’s products support process innovation from lab to fab, enabling integration of ALD in high volume manufacturing. Headquartered in Espoo, Finland, Beneq operates globally to help customers scale ALD solutions for the future of semiconductors, optics, and functional coatings.

Press Contact

Charlotte Bärlund
Event and Communications Lead
[email protected]

Lie Luo
Head of Marketing
[email protected]

• Read more about Beneq Advances MicroLED Leadership with Growing Demand from Industry Frontrunners

AI and HPC Fuel Advances in Packaging Technology 3DIC, FOPLP, and Chiplet Forums Gain Global Spotlight

【July 3, 2025 – Hsinchu】As demand for AI and HPC accelerates, the semiconductor industry is embracing a new era. With Moore’s Law slowing and scaling challenges rising, technologies like 3DIC, Fan-Out Panel Level Packaging (FOPLP), chiplets, and co-packaged optics (CPO) are becoming essential for next-level performance and system integration. SEMICON Taiwan 2025 will spotlight these advances through global forums starting September 8, ahead of the main exhibition from September 10–12 at Taipei Nangang Exhibition Center.

Explosive Growth in Advanced Packaging Market Redefines Industry Value Chain

“Fueled by soaring AI demand, advanced manufacturing capacity is expected to hit a record 1.4 million wafers per month by 2028,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “As AI demands surpass the limits of single-chip scaling, advanced packaging technologies like 3DIC and FOPLP are essential for system-level integration. With the industry moving from a linear supply chain to a more integrated and collaborative ecosystem, SEMICON Taiwan 2025 will serve as a vital global platform for industry leaders to explore how packaging and manufacturing innovation can unlock new commercial value across the semiconductor landscape.”

▲Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI

SEMI Promotes Global Collaborative Platform – 3DIC Advanced Manufacturing Alliance

As global supply chains are restructuring and geopolitical tensions rise, Asia is accelerating advanced packaging innovation, with Taiwan emerging as a strategic hub. To drive global collaboration and next-gen system integration, SEMI will officially launch the highly anticipated 3DIC Advanced Manufacturing Alliance (3DICAMA) at SEMICON Taiwan 2025. The alliance marks a key shift from single-chip to system-level solutions, aiming to boost cross-industry collaboration, enhance supply chain resilience, promote standards adoption, and speed up technology commercialization, laying the groundwork for a highly integrated and efficient packaging ecosystem.

World’s Top Advanced Packaging Platform at SEMICON Taiwan 2025

SEMICON Taiwan 2025 will host the Heterogeneous Integration Global Summit (HIGS), FOPLP Innovation Forum, and 3DIC Global Summit, covering critical topics from design and materials to process and supply chain. These high-level forums will map the future of advanced packaging and integration technologies. Industry leaders, including ASE, Broadcom, Lightmatter, MediaTek, Nvidia, Sony, and TSMC, will join HIGS Series to tackle challenges in 3DIC, CPO, and AI packaging. At the FOPLP Innovation Forum, AMD and PTI experts will share the latest innovations and market applications strategies.

▲SEMICON Taiwan 2025 to Present the World's Most Comprehensive Advanced Packaging Technology Platform

This year’s Heterogeneous Integration Area will expand to three pavilions: 3DIC Advanced Packaging, FOPLP, and Semiconductor Packaging, featuring cutting-edge technologies, tech demonstrations, industry standards, and supply chain collaboration. Leading companies such as Innolux, PTI, Comet, Coherent, E&R Engineering, GP, Lam Research, Manz, Mirle, PDF Solutions, PSK, Shibaura, and Utechzone will showcase state-of-the-art system-level solutions and integration applications, offering attendees key insights and partnership opportunities.

Registration for SEMICON Taiwan 2025 is now open. Apply for FREE visitor codes by August 31 and receive 30% off the International Semiconductor Forum with limited-time early bird rates. Visit the Official website.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit  www.semi.org  or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.

• Read more about Advanced Packaging on the Rise: SEMICON Taiwan 2025 Leads the Way

Martinez, CA—EUV Tech (EUVT), a global leader in designing and manufacturing at-wavelength EUV metrology equipment, is excited to announce the release of the FALCON Photoresist Flood Exposure Tool. As our next-generation EUV resist characterization and diagnostics tool, FALCON allows photoresist manufacturers to rapidly and accurately test EUV resist sensitivity, as well as providing patterning materials developers critical insights into exposure mechanisms.

Built upon EUV Tech’s proven resist tool technology, FALCON is a fully automated tool that supports high-throughput contrast curves on EUV-patterning materials and radiation chemistry diagnostics by integrating a wide variety of optional add-on analysis and processing modules.

Enhancing FALCON’s platform is an array of in-situ analysis and process modules, including Fourier Transform Infrared (FTIR) Spectroscopy, Atomic Mass Spectrometry, Total Electron Yield (TEY), Photo-Electron Spectroscopy (PES), environmental and vacuum bake module with additional diagnostics, and a scanner-environment exposure module.

Key to FALCON’s effectiveness is its highly uniform exposure spot size of 6 mm, supporting high-sensitivity chemical analysis and over 1,000 exposures for a 300 mm wafer in a single recipe run. Built-in data visualization tools make it possible to analyze this rich data. Combining uniformity, high configurability, and deep data collection and analysis makes FALCON a highly efficient, cost-effective tool for advanced photoresist development.

For more information on the enhanced FALCON Flood Exposure Tool or any of EUV Tech’s at-wavelength metrology tools, please visit euvtech.com.

About EUV Tech
EUV Tech enables technology advancement in the frontiers of semiconductor manufacturing and material science through the development of world-leading EUV and soft-x-ray instrumentation and techniques.

For further information, contact:
EUV Tech, Inc.
[email protected]
+1 (925) 229-4388

• Read more about EUV Tech Advances Semiconductor Manufacturing with the Launch of FALCON

Registration is Now Open
 

【June 18, 2025 – Hsinchu】SEMI today officially announced the launch of SEMICON Taiwan 2025, the annual premier event for the global semiconductor industry. Marking its 30th anniversary, the exhibition spotlights Taiwan’s rise as a collaborative innovation powerhouse. This year’s edition kicks off with a series of summit forums starting September 8, with the main exhibition officially opening from September 10 - 12 at Taipei Nangang Exhibition Center. Under the theme Leading with Collaboration. Innovating with the World, SEMICON Taiwan will strengthen global ecosystem partnerships and power the next wave of industry innovation.

Growth Amid Challenges: Open Collaboration Defines the New Industry Paradigm

“Global semiconductor equipment shipments hit US$32.05 billion in Q1 2025, up 21% YoY, driven by strong demand for AI, cloud, HPC, and edge applications*,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “Even with this robust growth, supply chain and geopolitical challenges remain. As a crucial global semiconductor hub, Taiwan is fully committed to pushing forward with new technologies and standards. Our theme, Leading with Collaboration. Innovating with the World. reflects our drive to foster innovation and strengthen global partnerships. SEMI will continue to work with partners to build a resilient and highly connected ecosystem.”

▲SEMICON Taiwan 2025 Marks Official Launch

▲Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI

Highlights of SEMICON Taiwan 2025

● Significant Scale-Up Aims to Bolster Global Semiconductor Ecosystem Ties: SEMICON Taiwan 2025 is set to break records, bringing together over 1,100 companies and industry partners from 56 countries, with more than 100,000 visitors expected to explore the latest semiconductor trends. For the first time, the event expands into a full International Semiconductor Week, featuring global forums on September 8 – 9 to deepen technical exchange and cross-border collaboration. A record 17 Country Pavilions further highlight Taiwan’s crucial role in the global semiconductor supply chain, providing an enhanced platform for industry dialogue and partnerships.

● Showcasing Cutting-edge Technologies and Delivering the World’s Most Comprehensive Semiconductor Insights: Fueled by soaring AI and HPC demand, the semiconductor industry is entering the ‘Hyper Moore’s Law’ era, advancing chip architectures beyond the nanometer scale into the angstrom era and driving greater system integration and miniaturization in packaging. As a leading innovation platform, SEMICON Taiwan 2025 will spotlight breakthroughs in advanced manufacturing and cutting-edge packaging technologies such as 3DIC, chiplets, and FOPLP. The event will also cover key innovations including silicon photonics, high-bandwidth memory (HBM), and backside power delivery networks (BSPDN), highlighting technologies that are reshaping the industry and defining the future of semiconductors.
As AI investment and cross-sector collaboration grow, the semiconductor ecosystem is moving toward integrated co-creation. SEMICON Taiwan gathers over 200 leading companies and experts in more than 20 forums, offering in-depth industry insights and driving technology into practice.

● Driving Future Competitiveness Through Geostrategy, Talent Development, Sustainability, and Cybersecurity: In response to global supply chain restructuring and geopolitical challenges, this year’s forum will debut Geostrategy as a new theme. International delegations at SEMICON Taiwan will engage in bilateral and multilateral dialogues with Taiwan’s government and industry leaders, while dedicated sessions on semiconductor geostrategy will focus on enhancing supply chain resilience and global collaboration.
As AI talent competition intensifies and net-zero goals advance, SEMICON Taiwan 2025 will bolster industry resilience for the long term. The Workforce Development Pavilion will launch the SEMI 20 UNDER 40 Awards and hands-on activities to inspire future talent, while the High-Tech Facility Pavilion and expanded Green Manufacturing Area will highlight sustainable technologies and ESG leadership.
As a global leader in advanced manufacturing, innovation, and cybersecurity, Taiwan sets industry benchmarks as SEMI advances security frameworks for a safer ecosystem. With a focus on talent, sustainability, and collaboration, SEMICON Taiwan powers the next 30 years of sustainable innovation.

Registration for SEMICON Taiwan 2025 opens on June 18. Industry professionals can apply for free visitor discount codes through August 31. Super early bird registration for the International Semiconductor Forum is also available now, offering an exclusive 30% discount for a limited time. For more details, visit the Official website.
*Source: SEMI Report, June 5, 2025
 

▲Main Theme of SEMICON Taiwan 2025_Leading with Collaboration. Innovating with the World

▲SEMICON Taiwan 2025 Is Set to Break Records With 100,000+ Visitors Expected

About SEMI

SEMI® is the global industry association for the semiconductor and electronics design and manufacturing supply chain, connecting over 3,000 member companies and 1.5 million professionals worldwide. Through diverse initiatives including policy advocacy, talent development, sustainability, and supply chain management, SEMI facilitates collaboration among members to address critical industry challenges. SEMI’s SEMICON® Taiwan exhibitions and events, technical communities, standardization, and market intelligence to empower members in driving business growth and innovation across design, devices, equipment, materials, services, and software, enabling smarter, faster, and more secure electronic technologies. For more information, visit  www.semi.org  or join SEMI Facebook, and SEMI LinkedIn.

• Read more about SEMICON Taiwan 2025 Marks Official Launch International Semiconductor Week to Steer the Global Industry Forward

Integration of EDA empowers OEMs to deliver structured, high-bandwidth data to semiconductor fabs and drive efficiencies for competitive advantage

CEA LID World Summit, Grenoble, France, June 17, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, today announced the future expansion of its A²ECF-SEMI automation framework to include SEMI’s EDA (Equipment Data Acquisition) standards suite. This integration that already includes Agil’GEM and Agil’GEM300 will empower OEMs to deliver structured, high-bandwidth data to manufacturing facilities and drive process improvements with artificial intelligence (AI) by leveraging large amounts of reliable, actionable data. EDA standards, built on the legacy of SECS/GEM and GEM300, are transforming equipment communication and enabling high-speed, data-driven manufacturing. As semiconductor fabs become more connected and automated, the ability of OEM equipment to integrate seamlessly and deliver high-quality, structured data has become a competitive differentiator. 

Agileo Automation has carried out EDA Freeze 2 client and server tests with equipment manufacturers already supporting EDA and is working with these early adopters on the integration on their equipment using A²ECF-SEMI, Agil'GEM, and Agil'GEM300. The company will soon be providing a comprehensive offer for OEMs in need of EDA Freeze 2 or 3. EDA is increasingly required in RFQs that equipment manufacturers must address.

“EDA is going to enable fabs to realize superior yields, faster innovation cycles, and a sustainable competitive advantage in an ever-accelerating market,” explains Marc Engel, CEO of Agileo Automation. “Agileo is proud to be a major contributor to this global effort and pleased to support OEMs in all market segments with a complete and scalable product suite.”

About Agileo Automation

Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo Automation is a key contributor to the development and integration of industry standards such as SEMI standards and OPC Unified Architecture (OPC UA). For more information, please visit our web site or follow us on LinkedIn.

• Read more about Agileo Automation Announces Future Expansion Of A²ECF-SEMI Automation Framework With SEMI EDA Standards

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. For details about this solution developed in late 2024 and 2025, download the case study here: Customer Success: Powertech Technology Inc. (PTI) Advances Panel Level Packaging with Nordson.

PTI, one of the world’s top OSAT (Outsourced Semiconductor Assembly and Test) companies, worked with the Nordson applications team to set up a comprehensive PLP demonstration that achieved high-quality, void-free underfill results at scale, using the industry-leading ASYMTEK Vantage® Series fluid dispensing system, equipped with the ASYMTEK IntelliJet® Jetting system. Nordson’s precision technology mitigated warpage and optimized fluid flow while decreasing cycle time by almost 30%.

PLP offers a path to managing the complexity of larger die sizes and higher-density designs while maintaining manufacturability and cost efficiency as the semiconductor industry transitions from 300-mm wafers to panels. PTI is enabling PLP applications that are designed to meet the semiconductor industry’s growing demands to serve AI, high-performance computing (HPC), and chiplet-based architectures.

Underfill has been pivotal in semiconductor packaging since the adoption of flip-chips in the 1990s. As applications have become more demanding, particularly in high-performance CPUs, GPUs, and advanced architectures like flip-chip and 2.5D/3D ICs, the importance of underfilling to enhance mechanical reliability and thermal performance has grown. Since the beginning, Nordson developed innovations for underfill processes as the industry evolved from PC board, substrate, wafer, and now panel applications.

Nordson’s distributor, Jetinn Global Equipment Ltd., supported the advancements discussed in this case study by investing in demonstration equipment and providing expert technical support.

• Read more about Nordson Electronics Solutions develops panel-level packaging solution for Powertech Technology, Inc. that achieves yields greater than 99% for underfilling during semiconductor manufacturing