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Regular Pricing

SEMI Members: $75

Non-Members:  $149

SEMI Members: Use your corporate email address during log in to be recognized as a SEMI Member.

Students:  Free

Contact Andreia Smith-Moritz ([email protected]) with a picture of your student ID to receive your discount code.

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In this engaging two-hour Masterclass organized by SEMI, we explore the groundbreaking role of magnetic materials, particularly magnetic nanoparticles (MNPs), in biomedical fields. The session commences with an in-depth review of the physics and synthesis of MNPs, including comprehensive discussions on fundamental theories, synthesis methods, and advanced MNP surface functionalization strategies. Attendees will gain insights into the characterization techniques used to analyze the physicochemical properties of MNPs.

The Masterclass transitions to the applications of MNPs in therapeutic and diagnostic contexts. We will review cutting-edge MNP-based therapies, such as magnetic hyperthermia therapy, targeted drug and gene delivery, and magnetic neurostimulation. In addition, we will discuss various MNP-based diagnostic techniques, including magnetoresistive (MR) sensing, nuclear magnetic resonance (NMR), magnetic particle spectroscopy (MPS), magnetic resonance imaging (MRI), and magnetic particle imaging (MPI). A critical focus of this Masterclass will be on safety and biocompatibility issues associated with the use of MNPs in vivo, examining the toxicity of MNPs, immune responses, and their circulation time in the human body.

The latter part of the session will introduce participants to the innovative field of micromagnetic neural stimulation, an infant yet extremely promising field. We will delve into the design and efficacy of micromagnetic devices, such as the Magnetic Pen (MagPen) and Magnetic Patch (MagPatch) Array, which utilize micrometer-sized coils (μcoils) for targeted neural activation. This is particularly for patients with spinal cord injuries (SCI) and for reducing opioid dependency, with insights drawn from current research supported by the NIH Blueprint Medtech Program. By the end of the Masterclass, attendees will have a comprehensive understanding of the potential clinical applications of MNPs and MEMs-based micromagnetic neurostimulators.

 

ABOUT THE SPEAKER

Dr. Renata Saha, Senior Scientist, Dupont

Dr. Renata Saha is a Senior Scientist at DuPont located in Wilmington, DE. She holds a PhD in Electrical and Computer Engineering from the University of Minnesota, Twin Cities, which she earned in August 2023. Her undergraduate degree in Electronics & Communication Engineering was obtained from the National Institute of Technology in Durgapur, India. During the summer of 2017, she was an undergraduate research intern at Conseil européen pour la Recherche Nucléaire (CERN), located in Geneva, Switzerland working on the ALICE experiment upgrade.

Dr. Saha is the recipient of 3-year College of Science & Engineering Fellowship, Women in Technology Scholarship 2021-2022 from Cadence Design Systems, and the Graduate Neuromodulation Research Fellowship 2022-2023 from MnDRIVE. She was also elected an iREDEFINE Fellow in 2022 by ECEDHA and was named a Rising Star in EECS. She has published over 30 journal articles, 3 US patents, and 2 book chapters.

Her expertise and research interests involve designing and developing microelectromechanical systems (MEMs) devices for neuromodulation and cardiovascular monitoring, characterizing magnetic nanoparticles (MNPs) for potential biomarkers. Outside of her research and work, Dr. Saha is trained in Indian classical dance form, Odissi, and enjoys performing and choreographing the art form.

United States

Renata Saha
Renata Saha
Senior Scientist
Dupont
Gity Samadi
MODERATOR
Gity Samadi
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech ESD Alliance FlexTech

In this two-hour Masterclass, Dupont Senior Scientist Renata Saha delves into the biomedical applications of magnetic nanoparticles (MNPs), covering their manufacturing, functionalization as well as therapeutic and diagnostic uses including safety considerations such as biocompatability and toxicology. 

10:00 am - 12:00 pm Off Add to Calendar 2025-10-29 10:00:00 2025-10-29 12:00:00 FEMC #26 Innovations in Magnetic Materials: Applications in Biomedical Engineering In this two-hour Masterclass, Dupont Senior Scientist Renata Saha delves into the biomedical applications of magnetic nanoparticles (MNPs), covering their manufacturing, functionalization as well as therapeutic and diagnostic uses including safety considerations such as biocompatability and toxicology.  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch Now!
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Leverage SEMI U learning offerings to wrap up your 2025 professional development journey! Our pledge remains unwavering: providing comprehensive, technical education to equip you with the skills needed for a prosperous journey in the semiconductor sector.

Are you ready to take your semiconductor industry knowledge to the next level? We're thrilled to invite you to our upcoming webinar titled "SEMI University - 2025 and beyond." This webinar promises to be an informative session where you'll gain insights into the latest updates, exciting live trainings at SEMICON West and virtually the remainder of this year and beyond. 

During this webinar, you can expect to:  

  • Discover the latest updates and enhancements to SEMI U's course catalog.  
  • Learn about the exciting live, in-person training courses scheduled for SEMICON West.
  • Review upcoming virtual instructor-led trainings.
  • Gain access to a special 10% discount on ALL on-demand courses.  

 

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Headshot of Naresh Naik
Naresh Naik
Director, SEMI University
SEMI
SEMI U Workforce Development

Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value). 

Choose your session:

8:00 am - 8:30 am Off Add to Calendar 2025-09-25 08:00:00 2025-09-25 08:30:00 SEMI University - 2025 & Beyond Join us to discover our current course offerings, upcoming in-person and virtual trainings, and more. Engage in a Q&A session. Plus, by attending this free webinar, you'll receive a 10% discount code for all on-demand courses and will be entered into a raffle to win a FREE course bundle ($100 value). Choose your session:US/EU: 8:00 AM – 8:30 AM PT [Register Now]Asia/US: 5:00 PM – 5:30 PM PT [Register Now] United States SEMI.org [email protected] America/Los_Angeles public Register Now
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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Andreia Smith-Moritz ([email protected]) with a picture of your student ID to receive your discount code.

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Graphenea: Graphene Device Manufacturing

Graphene, a two-dimensional material with extraordinary electrical, mechanical, and biocompatible properties, is emerging as a key enabler for the next generation of medical devices. In this presentation, we will explore how Graphenea, through its advanced Graphene Foundry services, is driving the integration of graphene into scalable device manufacturing for biomedical applications. Attendees will gain insight into our end-to-end fabrication capabilities, from graphene synthesis, wafer-scale CVD graphene growth to cleanroom device prototyping and packaging. We will showcase examples of graphene-based biosensors, flexible electronics, and neural interfaces developed through our foundry platform, emphasizing their potential impact in diagnostics, monitoring, and therapeutic applications. The session will also address the challenges of material integration, process scalability, and regulatory pathways for graphene in medical technologies, providing a practical roadmap for researchers and companies looking to bring graphene-enabled devices from lab to market.

INBRAIN: Pioneering Precision Neuroelectronics: From Materials to Scalable Therapies

The convergence of materials science, artificial intelligence, and neuromodulation is transforming the future of neuroscience. This talk explores how high-density graphene-based brain-computer interfaces are enabling real-time decoding and precision modulation of neural circuits. Carolina Aguilar, CEO and Co-Founder of INBRAIN Neuroelectronics, will present the technological and clinical journey behind the world’s first graphene neural interface in humans, and how this platform is designed to deliver adaptive, patient-specific therapies for neurological disorders such as Parkinson’s disease. The session will highlight the translational path from research to regulated medical devices, and the role of Europe in leading responsible innovation in neurotechnology

ABOUT THE SPEAKERS:

Jesús de la Fuente

Jesús de la Fuente is the founder and CEO of Graphenea, a leading graphene production company established in 2010. Before founding Graphenea, he served as a Manager at Arthur Andersen, Director at PricewaterhouseCoopers in advisory professional services, and Managing Director at an industrial materials distribution company. He holds a Bachelor of Science in Engineering from Deusto University and an Executive MBA from IESE Business School. Under his leadership, Graphenea has become a world-leading graphene producer, contributing to the development of graphene applications across various sectors in over 60 countries.

Carolina Aguilar

Carolina Aguilar is the CEO and Co-Founder of INBRAIN Neuroelectronics, a neurotechnology company pioneering the use of graphene-based brain-computer interfaces for precision neuromodulation. With over 20 years of experience in healthcare, including 13 years at Medtronic where she led global businesses in brain modulation and diabetes, she has built a career at the intersection of innovation, neuroscience, and impact. Under her leadership, INBRAIN achieved the first-in-human implantation of a graphene neural interface and received FDA Breakthrough Device Designation. Carolina is also a 2025 World Economic Forum Technology Pioneer and a strong advocate for responsible, human-centric deep tech in Europe for the world.

United States

Jesús de la Fuente
Jesús de la Fuente
CEO
Graphenea
Carolina Aguilar
Carolina Aguilar
CEO and Co-Founder
INBRAIN
Gity Samadi
MODERATOR
Gity Samadi
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for this exciting Master Class with Jesús de la Fuente, Founder and CEO of Graphenea, and Carolina Aguilar, CEO and Co-Founder of INBRAIN, as they showcase their pioneering efforts of integrating graphene into scalable medical devices highlighting advancements in various medtech applications including biosensors and neural interfaces.

9:00 am - 11:00 am Off Add to Calendar 2025-09-10 09:00:00 2025-09-10 11:00:00 FEMC#25 Enabling Next-Generation Medical Devices: Graphene Device Manufacturing Join us for this exciting Master Class with Jesús de la Fuente, Founder and CEO of Graphenea, and Carolina Aguilar, CEO and Co-Founder of INBRAIN, as they showcase their pioneering efforts of integrating graphene into scalable medical devices highlighting advancements in various medtech applications including biosensors and neural interfaces. United States SEMI.org [email protected] America/Los_Angeles public Watch Now!
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Nijmegen, The Netherlands, 14 May 2025 — Trymax Semiconductor Equipment (Trymax), a leading provider of plasma- and UV-based solutions for semiconductor manufacturing, announces the installation of its 500th process chamber in Asia. This milestone reflects continued momentum across key regional markets—including China, Taiwan, South Korea, Malaysia, and the Philippines—and signals strong progress toward the company’s goal of 1,000 global installations by the end of 2025.

“Reaching 500 installations in Asia is a significant milestone for Trymax,” said Peter Dijkstra, Chief Commercial Officer at Trymax Semiconductor Equipment. “It reflects our team’s dedication to delivering practical, high-performance solutions with the speed and reliability that our customers need in order to stay competitive.”

Responsiveness as a Competitive Edge

In an industry where uptime, productivity, and reliability are critical, Trymax has earned a reputation for being highly responsive—from the inquiry stage to post-installation support. The company’s nimble structure allows it to take action quickly and decisively, enabling customers to manufacture with confidence. Many partners have cited the ease of communication with Trymax, and the timely support received, as reasons for early and continued engagement.

Supporting Asia’s Semiconductor Surge

Asia continues to lead global semiconductor growth, driven by accelerated adoption in high-demand sectors. Customers across the region are pushing forward with innovation and scale, particularly in:

• Automotive: The transition from internal combustion engine (ICE) vehicles to electric vehicles (EVs) is reshaping the industry. EVs require significantly more semiconductors—often up to 3,000 chips per vehicle—due to greater electrification, power management, and onboard computing systems. This shift is fueling demand for reliable, high-throughput semiconductor processing solutions.

• Artificial Intelligence (AI): The rise of AI and machine learning applications—from data centers to edge devices—is creating a surge in demand for advanced microprocessors and high-density memory. Backend processes play a critical role in ensuring the performance and yield of these complex chips, making equipment reliability and process control essential.

• 5G & Connectivity: Asia’s rapid deployment of 5G networks, combined with its mobile-first population and high-volume data consumption, is pushing the limits of semiconductor performance. This growth requires advanced packaging technologies, faster interconnects, and increased wafer-level precision—all of which depend on stable, repeatable backend processing steps.

Trymax’s plasma and UV curing technologies are designed to meet these demands, delivering proven results in ashing, descum, surface cleaning and activation, and isotropic etching. With a strong footprint across the region, the company continues to support customers at the forefront of innovation.

Forward Plans and Strategic Vision

To support its continued growth in Asia and globally, Trymax is advancing several strategic initiatives. The company is exploring plans to establish local manufacturing in China, a move aimed at strengthening supply chain resilience and improving responsiveness to regional customer needs.

As part of its 2025–2030 roadmap, Trymax is also deepening its collaborations with leading semiconductor manufacturers. By taking on selective, non-core process steps—particularly those related to backend wafer processing—Trymax helps larger players free up internal resources and maintain operational focus where it matters most.

In parallel, Trymax is expanding its role in advanced packaging. As integrated circuit (IC) designs evolve toward increasingly complex multi-layered stacks—sometimes comprising up to 16 layers—ensuring pristine, activated surfaces between each layer is critical. Trymax’s plasma solutions are engineered to meet these exacting standards, enabling customers to maintain high yield and reliability in next-generation device architectures.

Meet Trymax at SEMICON Southeast Asia 2025

Trymax will be showcasing its latest plasma-based innovations at SEMICON Southeast Asia 2025, from 20–22 May at the Sands Expo and Convention Centre, Marina Bay Sands, Singapore. Attendees are invited to meet the Trymax team at Booth #B1633 to learn more about the company’s technology roadmap and expansion plans.

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About Trymax Semiconductor Equipment

Trymax’s core business is to support semiconductor manufacturers through the world with innovative plasma-based solutions for photoresist removal, surface cleaning, isotropic etch, as well as UV curing and charge erase applications, that are used in the fabrication of integrated circuits and other semiconductor devices. Trymax is a privately held company headquartered in Nijmegen, The Netherlands. Trymax operates regional sales and service offices in Europe, UA, China, Southeast Asia, Taiwan, and Japan.

Learn more at www.trymax-semiconductor.com.

Test Research, Inc. (TWSE: 3030), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging.

Bosch has recognized TRI's valuable contribution to their success in MEMS packaging in 2025 with a Certificate of Appreciation. The certificate acknowledges the successful completion of the AI visual check for MEMS packaging, highlighting the strong cooperation and partnership between the two companies.

This collaboration demonstrates TRI's expertise in AI-driven inspection solutions and its commitment to providing valuable solutions for the electronics manufacturing industry. TRI's AI-powered solutions include the AI Defect Detection, AI Smart Programming, AI Verify Host, AI training tool, AI Station, and more.

Please visit the following link to learn more about TRI's AI Solutions:
https://www.tri.com.tw/en/about/about-107-2-2.html

Learn more about the Bosch Group by following the link below:
https://www.bosch-presse.de/pressportal/de/en/company-page.html

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About Test Research, Inc. (TRI)

TRI (TWSE: 3030), offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

Stanton Chase is pleased to announce that Sundar Rajan Ramalingam has joined the firm as a Partner in North America. His addition strengthens the firm's executive search and leadership consulting capabilities for the semiconductor sector at a time of rapid transformation.

Sundar brings nearly three decades of leadership experience across manufacturing and global technology sectors. He has scaled a multi-billion-dollar global engineering division and supported the growth of several Global Capability Centers (GCCs). Within the semiconductor ecosystem, he has played a pivotal role in building and advising leadership teams across chip design, chip-to-cloud platforms, semiconductor fabs, and foundry operations.

This deep operational and strategic background gives Sundar a unique perspective on the evolving talent needs of semiconductor organizations.

"The semiconductor industry is entering a pivotal era—what I call a 'perfect leadership storm'—driven by generative AI, strategic autonomy imperatives, and breakthroughs like 3nm and advanced packaging," said Sundar. "While these trends are accelerating innovation, the industry also faces a growing talent gap. Companies need capable leaders who can navigate complexity, scale innovation, and build resilient teams. I plan to use my experience in technology and manufacturing to help semiconductor companies find executives who deliver results and foster sustainable growth."

Sundar's career spans both strategic HR leadership and general management with P&L responsibility, offering clients a rare blend of technical insight and leadership development expertise.

"Sundar fits well with our North American team and fills a specific need in our practice," said Mickey Matthews, Managing Director at Stanton Chase in North America and Chair of the Governance Committee. "His time working across borders gives him a genuine understanding of how global teams function. Blending this multicultural understanding with Sundar's deep technology products and services vertical expertise matters a lot to the clients we serve and specifically in the semiconductor space."

Jan-Bart Smits, Managing Partner at Stanton Chase Amsterdam and Global Sector Leader for Semiconductors, added: "Sundar joins us when the semiconductor industry sits at a turning point. Firms in this sector are looking for something different in their executives—people who understand both market forces and engineering details. Sundar knows this world and will further enhance our ability to serve chip makers and their suppliers."

As the semiconductor industry moves into a new chapter—marked by AI-driven demand, geopolitical shifts, and the race toward next-gen nodes—Sundar's appointment signals Stanton Chase's commitment to helping clients lead with confidence and clarity.

Sundar holds an MBA from XLRI Jamshedpur (India) and completed executive education programs, including the Chief Human Resource Officer Program at Wharton, University of Pennsylvania.

He will serve clients from Stanton Chase offices in Baltimore and Raleigh, USA, as well as Bangalore, Hyderabad, and Chennai, India—locations near semiconductor business centers.

Click here to learn more about Sundar.

Click here to learn more about Stanton Chase's semiconductor expertise.

About Stanton Chase

Stanton Chase ranks among the top global retained executive search firms with more than 76 offices in 45 countries and a worldwide team of senior consultants. Stanton Chase serves clients across multiple industry specialties and places C-suite executives, senior managers, and board members for companies ranging from global corporations to emerging businesses. Stanton Chase belongs to the Association of Executive Search and Leadership Consultants (AESC), adhering to the highest industry standards of professionalism and ethics.

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The webinar will address the following:

  1. Overall Contents of the Guidance
  2. Topics explored in creating the Guidance
  3. Intention of why the Guidance was developed
  4. Who was involved in the development
  5. Who should use the Guidance
  6. How it differs from existing standards and protocols

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Sustainability

Join the Leaders of the Semiconductor Climate Consortium Scope 3 Working Group, plus other industry experts, to review the recently released Scope 3 Category 11 GHG Assessment and Guidance for the Semiconductor Value Chain.  Compiled with the expert assistance of ERM, with input from all levels of the ecosystem, this document has been designed to align on reporting Scope 3, Category 11, an important step in measuring the impact of reduction efforts across the industry.

Download the Guidance Document

8:00 am - 9:00 am Off Add to Calendar 2025-06-12 08:00:00 2025-06-12 09:00:00 Webinar - Category 3.11 Review Join the Leaders of the Semiconductor Climate Consortium Scope 3 Working Group, plus other industry experts, to review the recently released Scope 3 Category 11 GHG Assessment and Guidance for the Semiconductor Value Chain.  Compiled with the expert assistance of ERM, with input from all levels of the ecosystem, this document has been designed to align on reporting Scope 3, Category 11, an important step in measuring the impact of reduction efforts across the industry.Download the Guidance Document United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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Singapore, May 12, 2025 - DuPont (NYSE: DD) is excited to announce its participation in SEMICON Southeast Asia (SEMICON SEA), taking place May 20-22, 2025, in Singapore. At booth L3105, DuPont will showcase the latest offerings of Kalrez® perfluoroelastomer parts specifically designed for semiconductor and electronics applications, aimed at enhancing manufacturing efficiency and operational sustainability.

“Our new Kalrez® product offerings are engineered for enhanced sealing performance, significantly reducing leaks and pumping times,” said Dr. Meredith Dunbar, Kalrez® Global Technology Leader, DuPont. “In our continuous pursuit of sustainability, we have achieved improvements in sealing performance under harsh process conditions, which enable substantial waste reduction. These advancements make Kalrez® seals an ideal choice for the toughest challenges in semiconductor fabs, and also showcase our dedication to delivering high-quality, efficient, and environmentally responsible solutions.”

Highlighting this longstanding commitment to innovation, the Kalrez® brand is proud to celebrate its 50th anniversary this year. This milestone reflects five decades of excellence and dedication to developing high-performance sealing solutions tailored for critical applications in demanding environments. At this year’s SEMICON SEA exhibition, attendees will discover several key advancements, including:

Kalrez® Bonded Door Seal (BDS): Specifically designed for semiconductor manufacturing equipment, including applications like plasma etching, CVD, and PVD, Kalrez® BDS offers improved sealing performance over conventional O-rings by reducing particle generation, extending seal life, and minimizing maintenance downtime.

Bonding Methodology: An innovative bonding method developed by DuPont's technology team, allowing Kalrez® components to be fused with other functional materials, creating unique, composite-structured Kalrez® parts.

Custom Shaped Parts: Kalrez® custom perfluoroelastomer parts can be tailored to unique geometries for specific sealing applications and are available in various shapes and compounds to meet different thermal, chemical, and plasma resistance requirements. Custom parts can be produced as both volume production and prototypes.

DuPont is proud to be driving technological advancements in the Kalrez® product family and providing game-changing solutions to its customers worldwide. All SEMICON SEA attendees are invited to join in celebrating the 50th anniversary of Kalrez® and explore how Kalrez® products can support their innovation programs.

For more information about Kalrez® parts and applications, please visit www.kalrez.com.

About DuPont

DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets, including electronics, transportation, construction, water, healthcare, and worker safety. More information about the company, its businesses, and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.

#   #   #

05/12/25

DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, ℠ or ® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted. 

For further information, contact:

Rebekah Lazar
Semiconductor Technologies Communications Leader
DuPont
[email protected]

Cell: +1-302-509-1859

Zhubei, May 8th, 2025 – ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access to ERS’s PhotoThermal debonding machine for wafers and panels, LUM600S1, a strategic move to meet the growing demand for panel-level packaging (PLP) technologies in the region.

Panel-level packaging is rapidly gaining traction in the semiconductor industry due to its cost advantages and process scalability. Dr. Yik Yee Tan, Technology & Market Principal Analyst at Yole Group, predicts that the market will grow from $160 million in 2024 to over $600 million by 2030, driven by cost-efficient solutions in advanced packaging. By 2030, high-density fan-out technology, propelled by Generative AI, is expected to dominate the market, capturing more than 50% of the market share. (1). In Chiplet and Heterogeneous Integration demand for larger form factor is driving the growth of PLP in the coming years to meet higher density requirement. For large package size of ~5.5x reticle size limit, PLP can boost carrier area efficiency by more than 80%, compared to just 45% with Wafer Level Packaging (WLP).

In addition to wafer solutions, ERS was among the first to bring PLP equipment to the market, introducing a panel-level debonder in 2018. Today, ERS offers a wide portfolio of semi- and fully-automatic systems, including PhotoThermal debonding machines enabling temporary bonding and debonding (TBDB) processes essential for handling ultra-thin substrates, which is critical for HPC and AI applications, like CoWoS and HBM.

“With LUM600S1, we are providing a high-yield solution tailored for high-volume manufacturing of complex AI chips. Our Taiwanese customers can now experience firsthand how PhotoThermal Debonding enhances efficiency, scalability, and cost-effectiveness,” says Sébastien Perino, Managing Director of ERS Taiwan.
For more information about the Zhubei demonstration center and LUM600S1’s availability for testing and demonstration, please visit ERS’s website to get in contact with regional sales representatives.

About ERS:
ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for wafer probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide.

(1) Sources: Panel Level Packaging 2025 report – Advanced Packaging Market Monitor, Yole Group

Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Paul Cohen ([email protected]) with a picture of your student ID to receive your discount code.

Germany Taiwan United States Intro to Design and EDA Recorded Event.jpg Technical Training
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The chips powering today’s cell phones, cars, computers, and more can contain billions of transistors. Designing these chips requires a team of engineers with expertise in various aspects of the design flow, along with Electronic Design Automation (EDA) tools that are needed to implement and verify these complex designs.

This Master Class is intended for non-technical staff that wish to understand the basics of semiconductor chip design. It provides an appreciation of the complex design flows and an understanding of some of the terminology used by chip design teams.

For students, the course will introduce some of the rewarding challenges and career opportunities available in the design and EDA industries.

In this class we will cover basic information about digital chips, then introduce some of the key steps and tools used during the design flow. We will also discuss some of the tradeoffs of different implementation methodologies and some of the challenges presented by various critical applications such as devices used in medical and automotive systems.
 

10:00 am - 10:05 am
Gity Samadi
Gity Samadi
Sr. Director of R&D Programs
SEMI

Welcome and Introduction

10:05 am - 11:30 am
Paul Cohen
Paul Cohen
Sr. Manager, ESDA
SEMI

Introduction to Chip Design and EDA

Biography

Course Overview
• Introduction to electronic devices
• Overview of digital logic and chip design history
• Semiconductor manufacturing basics
• Chip design and verification flow
• Implementation choices
• Heterogenous integration
• Interface to manufacturing
• Emerging challenges

Smart MFG ESD Alliance FOA SOI

Complex semiconductor chips power today’s cell phones, cars, computers, and more. This on-line Master Class will provide non-technical people who work in and around the chip design industry a high-level overview and understanding of how these complex chips are designed. 

10:00 am - 11:30 am Off Add to Calendar 2025-06-25 10:00:00 2025-06-25 11:30:00 ESD Alliance Master Class: Introduction to Design and EDA Complex semiconductor chips power today’s cell phones, cars, computers, and more. This on-line Master Class will provide non-technical people who work in and around the chip design industry a high-level overview and understanding of how these complex chips are designed.  SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now to Watch the Recorded Event
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