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Breker Donates Advanced Test Suite Components to RISC-V International for Use in Future Compliance Activities

• Donation includes open-source system integrity tests for core and SoC certification
• Unique Breker tests complements existing test sets
• Breker’s RISC-V SystemVIP will be demonstrated at booth #P4 during RISC-V Summit North America 2025

SAN JOSE, CALIF. –– October 16, 2025––Breker Verification Systems today announced a donation to RISC-V International of a subset of its RISC-V advanced test suite developed through its work with more than 20 RISC-V core producers.

The donation is designed to be complementary to the existing Architectural Compliance Test (ACT) and ongoing ISA compliance activities, consisting of unique tests not available from other sources.

Breker provides test suites for the complete verification of RISC-V cores and SoCs from detailed microarchitectural analysis to advanced system integrity validation. The radonation will consist of a subset of these tests to target ISA compliance. The test donation will cover both core and SoC certification and will include, but is not limited to, coherency, hypervisor, vectors, advanced interrupt architecture, IOMMU and other scenarios. Each component is designed to complement existing tests.

“Breker is now working with over 20 commercial entities and other organizations to verify their RISC-V cores, providing us with unique experience of the myriad of unusual verification issues inherent in these processors,” says David Kelf, Breker’s CEO. “We are giving back to the RISC-V community by providing a subset of these tests, open source, that can target ISA compliance and for other purposes.”

The announcement of the donation coincides with the RISC-V Summit North America Tuesday, October 21, through Thursday, October 23, at the Santa Clara Convention Center in Santa Clara, Calif. As a Platinum Sponsor, Breker will exhibit in Booth #P4 and offer five presentations as part of the RISC-V Summit program.

“At RISC-V International, we greatly value the expertise of the Breker team and the contributions they have made to ongoing ISA compliance work,” remarks Andrea Gallo, RISC-V International’s CEO. “I am looking forward to Breker’s donation and the impact it can have in complementing and extending our existing ACT test suites.”

Breker’s donation provides alignment with RISC-V International programs. This will provide value to the company’s customers, as well as the RISC-V designer community, by aligning Breker’s full RISC-V verification test suite with RISC-V test developments.

In addition to existing test suites and generators, which are focused on random instruction generation for instruction set architecture testing, with SystemVIPs, Breker has been able to significantly extend testing to advanced system-level integrity. Using test suite synthesis technology, Breker is able to provide a high degree of coverage by driving cross functional stress verification and unpredictable corner case discovery. The donation will include tests generated using test suite synthesis.

David Kelf and Adnan Hamid, Breker’s Executive President and CTO, were elected Chairperson of the Requirements Working Group and Vice-Chairperson of the Test Plan Working Group, respectively, in the RISC-V International Certification Steering Committee.

Breker at RISC-V Summit North America 2025
Breker will demonstrate its RISC-V CoreAssurance and SoCReady SystemVIPs and Trek Test Suite Synthesis solutions at RISC-V Summit North America, Tuesday, October 21 through Thursday, October 23, at the Santa Clara Convention Center.

Presentations featuring Breker executives include:
Member Day: “Framework for RISCV Certification—Software, Hardware and Systems”
Nambi Ju, Lyle Technologies, LLP
Tuesday at 4 p.m. in Grand Ballroom H (Level 1)

Demo: “RISC-V AIA Expanding Interrupts: Applications, Implementation and Verification”
Adnan Hamid
Wednesday at 1 p.m.
Exhibit Hall A, Demo Theater

“RISC-V System Level Certification from Verification Foundations”
Adnan Hamid
Wednesday at 3:15 p.m.
Theater (Level 2)

Lightning Round: “Leveraging AI to understand the RISC-V ISA Specification”
Dave Kelf and Nambi Ju
Wednesday at 4:15 p.m.

“Unleashing ML Processing Power Through RISC-V Vectors: Applications, Implementation and Verification”
Brian Baker, Solutions Architect
Thursday at 2:35 p.m.
Grand Ballroom G (Level 1)

To arrange a demonstration or private meeting, send email to [email protected].

About Breker Verification Systems
Breker Verification Systems solves complex semiconductor challenges across the functional verification process from streamlining UVM-based testbench composition to execution for IP block verification, significantly enhancing SoC integration and firmware verification with automated solutions that provide test content portability and reuse. Breker’s solutions include a SystemVIP library of scenarios for RISC-V and Arm, core and SoC testing, coherency, security and other critical areas. Breker solutions easily layer into existing environments and operate across simulation, emulation, prototyping, and post-silicon execution platforms. Its Trek family is production-proven at leading semiconductor companies worldwide and enables design managers and verification engineers to realize measurable productivity gains, speed coverage closure and easy verification knowledge reuse. As a leader in the development of the Accellera Portable Stimulus Standard (PSS), privately held Breker has a reputation for dramatically reducing verification schedules in advanced development environments. Case studies that feature Analog Devices, Broadcom, IBM and other companies leveraging Breker’s solutions are available on the Breker website.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

TrekSoC, TrekSoC-Si, RISC-V CoreAssurance SystemVIP and RISC-V SoCReady SystemVIP are registered trademarks of Breker Verification Systems. Breker Verification Systems acknowledges trademarks or registered trademarks of other organizations for their respective products.

FOR IMMEDIATE RELEASE

Media contact: M. Guilbert, [email protected]

RECIF Technologies Adopts Agileo Automation’s Combined Speech Scenario and E84 PIO Box Solution to Test E84 and SECS/GEM SEMI Standard Compliance of Wafer Handling and Tracking Equipment

Global French manufacturer of automated handling equipment, wafer sorters, and equipment front-end modules (EFEMs) saves significant fab equipment integration time and enhances customer satisfaction

PHOENIX, October 7, 2025 – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, today announced at Booth #877 at SEMICON West 2025 that RECIF Technologies has adopted its combined Speech Scenario and E84 PIO Box solution to test its wafer handling and tracking equipment for E84 and SECS/GEM compliance. The global company headquartered in Toulouse Blagnac, France, which specializes in the design, manufacturing, and installation of automated equipment for semiconductor wafer handling, needed a fast and effective solution to validate the compliance of its products with SEMI’s E84 and SECS/GEM standards before they are shipped and implemented at customers’ semiconductor manufacturing sites all over the world.

Speech Scenario is a software that emulates the fab host to validate SECS/GEM tool scenarios before shipping brand-new production equipment to fabs. The E84 PIO Box is a compact and lightweight device that serves as an interface between Speech Scenario and E84 passive equipment. Used together, these products allow RECIF Technologies to generate complete test reports that can be communicated to its customers, ensure fast detection of non-compliance and errors to avoid downtime, as well as quick and reliable SEMI E84 and SECS/GEM compliance testing, especially in the management of complex cases. The company has now better control over host-sorter interactions, with customizable scenarios related to automatic carrier delivery defined in the E84 standards. With Speech Scenario, RECIF teams can more effectively replicate customer use cases when resolving anomalies.

“We were using less flexible software where automation messages were not easily modifiable and old emulation technology for validation of only the PIO part of the E84 standard, which meant that more complex cases and host-sorter interactions had to be tested and adapted in the field during machine integration at customer sites,” explains Thomas Brillouet, research and development director for RECIF Technologies SAS. “We selected Agileo’s all-in-one Speech Scenario and E84 PIO Box solution because we believe that it is the most efficient and competitive product currently on the market. The flexibility and time savings we have garnered since using Agileo’s solution has translated into enhanced overall customer satisfaction for our company.”

“Over the past 40 years, RECIF Technologies has built a solid reputation as an innovative industry leader in advanced semiconductor equipment manufacturing and as an early adopter of SEMI standards,” adds Marc Engel, CEO of Agileo Automation. “Agileo Automation, whose origins are closely tied to RECIF Technologies, benefits from a strong cultural and technical proximity with the company. We are proud to contribute to RECIF Technologies’ success, both as a technology partner and by supporting them in demonstrating quality and reliability to their customers.”

- ends -

About Agileo Automation
Since its inception in 2010 in Poitiers, France, Agileo Automation has empowered global semiconductor equipment manufacturers to optimize their production machines with control, communication, data acquisition, and testing solutions, enabling their deployment in large-scale fabs worldwide. At the heart of Industry 4.0, Agileo’s A²ECF-SEMI framework provides a robust foundation for developing equipment controller software, leveraging the SEMI SECS/GEM and GEM300 standard suites. As a member of SEMI and the OPC Foundation, Agileo Automation is a key contributor to the development and integration of industry standards such as SEMI and OPC UA. For more information, please visit our web site or follow us on LinkedIn.

About RECIF Technologies
RECIF Technologies, headquartered in Toulouse-Blagnac, France, has been providing advanced robotic solutions for semiconductor wafer handling since 1985. The company designs and manufactures reliable sorters, EFEMs, and compact handling tools that help leading semiconductor manufacturers worldwide improve productivity, ensure reliability, and reduce total cost of ownership. As a member of SEMI and the Aeneas association, RECIF Technologies actively contributes to the industry standards and collaborative projects shaping the future of the semiconductor industry. For more information, please visit our web site or follow us on LinkedIn.

Intel and Flexciton announce partnership to provide semiconductor manufacturers with a comprehensive Factory Automation and Optimisation Software Solution.

LONDON – September 25th, 2025 – Flexciton, a leader in autonomous planning and scheduling for semiconductor manufacturing, today announced a partnership with Intel. This collaboration will provide semiconductor manufacturers with a comprehensive, end-to-end set of software solutions to increase the level of automation and accelerate their transition to autonomous factory operations.

The partnership combines the power of  Intel® Automated Factory Solutions (Intel® AFS) software suite, including Intel® Operations Recon, and Intel® Factory Pathfinder, with Flexciton’s autonomous technology suite of Advanced Production Planning and Scheduling. The two companies will offer a synergic, holistic approach that provides complete visibility and control over complex semiconductor production workflows, enabling smart, autonomous decision-making and significant gains in key performance indicators.

"I am incredibly excited about this partnership. Intel® AFS solutions have been developed and tested within the most advanced fabs, and we see a great synergy with our cutting-edge planning and scheduling technologies," said Jamie, CEO & Cofounder, Flexciton. "With Intel® Factory Pathfinder and  Intel® Operation Recon combined with our Flex Planner and Scheduler suite, we will be able to provide an end-to-end optimisation solution that empowers our customers to unlock new levels of automation and significantly increase factory efficiency."

The partnership is designed to meet the growing demand for greater operational efficiency in the semiconductor industry. By leveraging high-speed simulations, AI, and advanced optimisation, the combined approach will enhance factory automation and deliver tangible benefits, including complete visibility of shopfloor operations, optimised planning and scheduling, and a significant uplift in factory key metrics such as throughput and cycle times.

Paul Schneider, Intel Principal Engineer, Director, said: "By combining our deep factory automation expertise with Flexciton's innovative scheduling solutions, we are providing manufacturers with the critical tools they need to enhance their operational efficiency and maintain a competitive edge.

—------------

About Flexciton: Flexciton partners with semiconductor manufacturers to power their transition towards autonomous factories. Our suite of intelligent planning and scheduling applications combines advanced optimisation techniques with the power of AI to orchestrate complex fab workflows and achieve critical revenue-to-shop-floor alignment. Flexciton’s Autonomous Technology transforms fab operations by eliminating manual and reactive decision-making processes. This dramatically improves factory throughput and cycle times, enhances labour efficiency, and optimises overall costs and resource utilisation. Trusted by industry leaders including Seagate Technology, Renesas, and Microchip, Flexciton drives the next phase of digitalisation and transformation to an autonomous factory. Headquartered in London, UK, Flexciton operates globally with dedicated teams located in Europe and the US.
www.flexciton.com 

About Intel Automated Factory Solutions: Intel® Automated Factory Solutions (Intel® AFS) is a comprehensive software suite that optimises industrial processes.  It utilises advanced technologies such as Digital Twins, predictive analytics, high-speed simulation, and AI to improve efficiency and reduce downtime in factory operations and other complex operational processes with many interdependencies.

Intel® Factory Pathfinder: A high-speed discrete event simulator and digital twin designed for factory prediction and optimisation. It can function independently or integrate with production systems to streamline product assignments and reduce order fulfilment times.

Intel® Operations Recon: Provides a graphical digital twin of factory production equipment and automated systems, boosting operational visibility and enabling real-time troubleshooting and material movement simulations.
www.intel.com/content/www/us/en/software/automated-factory-solutions.html

 

Singapore, September 17, 2025 – EUV Tech, the global leader in extreme ultraviolet (EUV) metrology equipment, today announced the opening of its first international office: EUV Tech Singapore Pte. Ltd., located at 163 Kallang Way, Mapletree Hi-Tech Park, Singapore.

This expansion marks a significant milestone in EUV Tech’s global growth strategy and reinforces its commitment to strengthening customer support across Asia’s rapidly expanding semiconductor market.

Strategic Rationale

Singapore was selected as EUV Tech’s first international office due to its robust infrastructure, business-friendly environment, and central location within Asia’s semiconductor ecosystem. While tool development will remain anchored in Martinez, California, the Singapore office will house EUV Tech’s international Customer Success Team, focused on field service engineering. It will also serve as a regional hub, enabling faster response times, enhanced service capabilities, and closer alignment with customers’ business hours.

“Customer service is at the heart of everything we do,” said Chami Perera, EUV Tech Chief Operating Officer. “By establishing a presence in Singapore, we are not just providing metrology tools. We are standing shoulder to shoulder with our customers to ensure their success in an evolving industry.”

The semiconductor industry in Asia is projected to continue its rapid growth over the next decade, with Singapore serving as a major regional hub. EUV Tech’s expansion positions the company to:

  • Strengthen existing relationships with leading semiconductor fabs
  • Support uptime with field service engineers on the ground
  • Leverage Singapore’s ecosystem of world-class universities, government initiatives, and industry networks

With tools already installed in every major semiconductor fab worldwide, EUV Tech’s Singapore office further cements its reputation as a trusted partner driving innovation and reliability in EUV metrology. 

EUV Tech’s Singapore office is a clear signal of the company’s ambition and growth in the global semiconductor sector. “We are growing and thriving,” said Perera. As the semiconductor industry continues to expand, we will be right there with our customers, innovating, adapting, and ensuring their success.”

About EUV Tech
EUV Tech enables technology advancement in the frontiers of semiconductor manufacturing and material science through the development of world-leading EUV and soft-x-ray instrumentation and techniques.

Media Contact:

Natalie Hill, Associate Director Marketing & Communications

[email protected]

PDF Solutions Secures Landmark Contract with Global IDM Customer
Large 2025 Contract Validates High-Volume Manufacturing Strategy

PDF Solutions, Inc. (Nasdaq: PDFS) today announced a landmark contract signing: a significant multi-year agreement to expand a prior contract and deploy eProbe® tools, Characterization Vehicle® infrastructure, and associated Exensio® analytics software across multiple high-volume manufacturing facilities of a major global semiconductor manufacturer.

Breakthrough Technology Scales to Mass Production

PDF Solutions' eProbe technology delivers contactless testing of 3D semiconductor structures using electron beam, optimized for each wafer's specific design characteristics. This agreement encompasses multiple eProbe systems with deployment in 2025, supported by PDF Solutions' comprehensive software suite for machine optimization and results analysis.

The contract marks a pivotal milestone that validates PDF Solutions' strategic vision and demonstrates the critical role of eProbe technology in both advanced node development and high-volume manufacturing.

Integration of Process characterization, Design and in-line Fabrication data

PDF Solutions combines the eProbe DirectScan™ application with Characterization Vehicle test chips and Exensio analytics software to enable faster yield learning in high-volume manufacturing environments.

This landmark contract validates the approach of integrating process characterization data with design layout data and in-line fabrication data to enhance detectability to ppb levels to accelerate root cause for yield diagnosis and variability control.

Secure Connected Solutions Drive Value

PDF Solutions will deploy eProbe tools and associated software at the Foundry’s manufacturing sites, using PDF Solutions’ secureWISE® network to provide secure remote equipment support and maintenance. This deployment exemplifies PDF Solutions' strategic vision: creating a cross-industry analytics and collaboration platform that connects key players in the semiconductor ecosystem.

Comprehensive connectivity is essential for achieving faster yield ramps and delivering on the promise of AI in semiconductors. To successfully implement AI solutions, the industry needs automated connections between data sources, tools, and enterprise software systems across the entire semiconductor supply chain.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics industry ecosystem to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor and electronics ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

Founded in 1991, PDF Solutions is headquartered in Santa Clara, California, with operations across North America, Europe, and Asia. The Company (directly or through one or more subsidiaries) is an active member of SEMI, INEMI, TPCA, IPC, the OPC Foundation, and DMDII. For the latest news and information about PDF Solutions or to find office locations, visit https://www.pdf.com.

Headquartered in Santa Clara, California, PDF Solutions also operates worldwide in Canada, China, France, Germany, Italy, Japan, Korea, Sweden, and Taiwan. For the Company’s latest news and information, visit https://www.pdf.com.

San Diego, CA[Date] ElevATE Semiconductor, a leading provider of advanced pin electronics (PE) and device power supply (DPS/PMU/VI) IC solutions for the semiconductor test market, proudly announces the appointment of Heather Kirkby as Chairwoman of its Board of Directors.  

Heather Kirkby, who has served on ElevATE’s board since 2024, brings more than 25 years of leadership experience across technology, life sciences, and semiconductor industries. Most recently, she was the Chief People Officer at Recursion Pharmaceuticals, where she helped scale the company through IPO and global growth. Prior to Recursion, Ms. Kirkby spent over 15 years at Intuit, where she held senior leadership roles in product management, marketing, and talent development, driving innovation and organizational transformation. She has also held leadership positions at Siebel (acquired by Oracle) and Schlumberger in her early career. 

Ms. Kirkby’s leadership has earned industry recognition, including Intuit’s CEO Leadership Award in 2017 and being named a finalist for the Women Tech Council Leadership Award in 2020. She also earned her MBA from Harvard Business School.   

“I am honored to step into the role of Chairwoman at ElevATE,” said Heather Kirkby. “Having served on the Board over the past year, I’ve seen firsthand the company’s commitment to innovation and excellence in the semiconductor test market. I look forward to working with the leadership team to continue building on this momentum and driving ElevATE’s long-term growth.” 

Ms. Kirkby succeeds Chris Puscasiu, Managing Partner of Presidio Investors, who helped guide ElevATE through a period of rapid growth and innovation.  

“It has been a privilege to serve as Chairman of ElevATE since 2018," said Chris Puscasiu. "After guiding the company’s growth for the past six years, I am ready to give the reins to Heather. She has already made a meaningful impact on the Board, and I am confident her leadership will further strengthen ElevATE’s position in the semiconductor test market.” 

Since its founding in 2012, ElevATE Semiconductor has established itself as a leader in innovation in the Test and ATE markets. The appointment of Heather Kirkby as the new Chairwoman marks a crucial step in the company’s evolution, reflecting its dedication to scaling its impact and shaping the future of semiconductor testing. 

SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Belgium Germany Singapore Taiwan United States FEMC #27- recorded Business Executive Technical
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A digital twin is a computer representation of the structure, context, and behavior of physical systems, which are critical components in the optimization of computational systems, accurately representing physical systems and processes. A Digital Twin can be used to reduce or eliminate iterative physical experiments needed for optimization, thereby enhancing yield, saving time, and resources. Semiconductor manufacturing involves numerous complex steps, where accurate control of each step is crucial to achieving the overall manufacturing yield and minimizing variations in device characteristics. The complexity of the manufacturing processes' flows limits flexibility for testing novel approaches. Unit processes can be based on first-principal models (physics-based), data-based models, or hybrid models combining both approaches when possible. Fabrication processes in the cleanroom and on printed electronics tools are often a function of time-varying parameters, including those of the equipment, environment, and materials. The parameters often have co-dependencies across different process steps and tool sets. 

This course will cover the necessary material to create DNN-based Digital twins for nanofabrication processes in cleanrooms. The course will include experimental details for data preparation, data processing, training models, and use case demonstrations. Nanofabrication process equipment can inherently have millions of internal variables and can learn from datasets, providing a robust and complementary approach to traditional feedback control and process stabilization methods. The included Digital Twin modes are developed using images (CD-SEMs, optical images), time history data (Optical Emission Spectroscopy), and textual process information (recipes and materials). The course will include: (1) Approaches to preprocess image data and create learning-based models, (2) using DNN-based domain translation for learning to predict the DUV nanolithography and ICP Plasma Etch, (3) virtual metrology methods for quantification of learning outcomes, and (4) developing a new class of process-aware DNN-based digital twins. 

ABOUT THE SPEAKERS

Benyamin Davaji, PhD
Benyamin Davaji is an Assistant Professor in the Electrical and Computer Engineering Department at Northeastern University. His research focuses on integrated microsystems with an emphasis on sensing and computation using mechanical waves, acoustic/ultrasound transducers, bio-interfaces, and microcalorimetry. He also applies data-guided methods to nanofabrication process development and semiconductor manufacturing. Dr. Davaji earned his PhD in Electrical and Computer Engineering from Marquette University in 2016 and later served as a post-doctoral associate at Cornell University’s School of Electrical and Computer Engineering.

Peter Doerschuk, PhD

Peter Doerschuk, Professor at Cornell University since 2006, previously served on the Purdue faculty in Electrical and Computer Engineering and Biomedical Engineering. He earned B.S., M.S., and Ph.D. degrees in Electrical Engineering from MIT, an M.D. from Harvard Medical School, and completed training at Brigham and Women’s Hospital and a postdoc at MIT. His research applies computational nonlinear stochastic systems to biology and medicine, spanning viral 3-D structure determination using electron microscopy and x-ray scattering, to nonlinear models of ethanol pharmacokinetics that enable sensor processing, pattern recognition, and individualized physiological analysis.

United States

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Ben Davaji, PhD
Assistant Professor
Northeastern University
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Peter Doerschuk, PhD
Professor
Cornell Engineering
Gity Samadi
Moderator
Gity Samadi, PhD
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology.

10:00 am - 12:00 pm Off Add to Calendar 2025-11-05 10:00:00 2025-11-05 12:00:00 FEMC#27 Digital Twin Models for Semiconductor Manufacturing Unit Process Join us for this engaging Master Class with Benyamin Davaji, PhD, Assistant Professor of Electrical and Computer Engineering at Northeastern University and Peter Doerschuk, Professor of Electrical and Computer Engineering and Biomedical Engineering at Cornell University, as they explore the role of digital twin models in advancing semiconductor manufacturing. The masterclass will highlight how data-guided methods and computational modeling are transforming unit process development, driving efficiency and innovation across the semiconductor industry. With expertise spanning microsystems, acoustic transducers, and nanofabrication, the speakers will provide insights into how digital twins can bridge research and production to accelerate breakthroughs in semiconductor technology. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Watch On-Demand
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【Sept. 11th, 2025 – Hsinchu】SEMICON Taiwan 2025 opened yesterday at the Taipei Nangang Exhibition Center, celebrating its 30th anniversary with its largest-ever scale under the theme “Leading with Collaboration. Innovating with the World.” Premier Cho Jung-tai, SEMI President and CEO Ajit Manocha, and other industry leaders marked the opening with keynote remarks, followed by a recognition ceremony led by Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI, honoring long-term exhibitors.

 

▲Premier Cho Jung-tai, SEMI President and CEO Ajit Manocha, and industry leaders gather at SEMICON Taiwan 2025 opening ceremony, celebrating the exhibition's 30th anniversary milestone

 

Industry and Government Leaders Mark SEMICON Taiwan’s 30-Year Milestone

Manocha highlighted SEMICON Taiwan’s evolution over the past 30 years into a globally recognized platform at the heart of the semiconductor ecosystem. He noted that AI and quantum computing are ushering in a new chapter for the industry, and stressed that despite geopolitical challenges, semiconductors serve as “the foundation of humanity” and must continue to advance without pause.

 

▲SEMI President and CEO Ajit Manocha delivers keynote remarks, highlighting Taiwan's position at the heart of the global semiconductor ecosystem as AI and quantum computing drive industry transformation

 

Premier Cho welcomed global industry leaders to Taiwan, announcing over NT$30 billion in new investment for the “AI Ten Major Infrastructure” initiative covering silicon photonics, quantum computing, drones, and robotics. He noted Taiwan’s semiconductor output has reached NT$5.3 trillion and is on track to exceed NT$6 trillion, underscoring its commitment to supply chain resilience, global collaboration, and advancing technology in the AI era.

SC Chien, Executive Board Director of the Taiwan Semiconductor Industry Association (TSIA) and President of UMC, highlighted the rising importance of semiconductors in today’s fast-changing landscape. He noted that Taiwan’s full value chain generated US$165.6 billion in 2024, underscoring its critical role in the global supply chain. Taiwan’s commitment to innovation and collaboration, he added, continues to propel the industry forward, with SEMICON Taiwan both celebrating technology and affirming a shared vision for the future.

 

Global Forums Spotlight Innovation and Sustainability

SEMICON Taiwan 2025 hosts over 25 international forums on technology, strategy, and sustainability. The CEO Summit drew strong attention, highlighted by the fireside chat “Navigating What’s Next: Global Opportunities and Taiwan’s Strategic Role” with Dr. Tien Wu, CEO of ASE and Chair of the SEMI International Board Executive Committee, and Cliff Hou, Chairman of  TSIA, Jochen Hanebeck, Infineon CEO, and Silicon Valley “chip legend” Jim Keller, delivering rare insights into AI innovation, global collaboration, and Taiwan’s place in the semiconductor landscape.

 

▲Terry Tsao, SEMI Global Chief Marketing Officer and President of Taiwan, presents recognition awards to long-term exhibitors, honoring their sustained support for SEMICON Taiwan

 

▲CEO Summit fireside chat featuring Dr. Tien Wu, CEO of ASE, and Cliff Hou, Chairman of TSIA, alongside Infineon and Tenstorrent CEOs exploring Taiwan's strategic role in the global semiconductor landscape

 

SEMI and TSIA co-hosted the Semiconductor Sustainability Summit, which explored net-zero pathways, AI-driven carbon reduction, and circular economy solutions, with keynotes from leaders including Dr. Arthur Chuang, Vice President of TSMC. The Summit introduced the SEMI Energy Collaborative and its efforts to advance decarbonization across Asia-Pacific, while the SEMI Forest exhibition highlighted global tree-planting and habitat restoration efforts, showcasing the industry’s tangible commitment to sustainability.

SEMICON Taiwan 2025 is underway through September 12, hosting industry professionals to experience the latest innovations and global exchange. For more information on SEMICON Taiwan 2025, visit the offical Website.
 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit  www.semi.org or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.

 

Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking 

Inter-Die Gapfill Tool Expands Industry-Leading Portfolio of Solutions for 3D Integration and Chiplet Technologies; Paves Way for New, AI-Accelerating Architectures 

FREMONT, Calif., Sept. 9, 2025 -- Lam Research Corp. (Nasdaq: LRCX) today unveiled VECTOR® TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence (AI) and high-performance computing (HPC) applications. TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. It provides ultra-thick, uniform, inter-die gapfill, leveraging a proprietary bowed wafer handling approach, innovations in dielectric deposition, and enhanced monitoring by Lam Equipment Intelligence® technology. TEOS 3D is installed at leading logic and memory fabs around the world. 

"VECTOR TEOS 3D deposits the industry's thickest, void-free, inter-die gapfill films, customized to meet the challenging requirements of advanced die stacking integration schemes, even on ultra-stressed, high-bow wafers," said Sesha Varadarajan, senior vice president of the Global Products Group at Lam Research. "It's another powerful addition to our best-in-class advanced packaging portfolio, which delivers the differentiated, atomic-level innovations chipmakers need to scale beyond Moore's Law and into the AI era."

Addresses Manufacturing Pain Points

The explosive growth of AI is driving the need for new devices that can support increasingly data-intensive workloads. Chipmakers are turning to 3D advanced packaging to integrate multiple dies into chiplet architectures to enable AI compute. By bringing memory and processing closer together to optimize electrical pathways, chiplet designs can improve processing speed, and pack more power into smaller form factors. However, as chiplets scale taller and become more complex, they present a range of new manufacturing hurdles, from stress during processing that can distort or bow a wafer's shape, to cracks and voids in films that cause defects and lower yield. 

TEOS 3D conquers a range of critical advanced packaging production challenges, excelling at handling bulky, high-bow wafers precisely and reliably. With nanoscale precision, it deposits specialized dielectric films of up to 60 microns thick between dies, with scalability to deposit films greater than 100 microns. The films provide essential structural, thermal and mechanical support to prevent common packaging failures such as delamination. TEOS 3D also features Lam's novel clamping technology and an optimal pedestal design that provides exceptional stability when processing thick wafers, enabling uniform film deposition even when dealing with extreme wafer bow. 

Other highlights include: 

  • The first solution for single-pass processing of crack-free films more than 30 microns thick, significantly enhancing yield and process time.
  • Unique quad station module (QSM) architecture to boost productivity: Lam's proven QSM architecture features four distinct stations to enable parallel processing and reduce bottlenecks. The modular design helps deliver nearly 70%1 faster throughput and up to 20% improvement in cost of ownership compared to Lam's previous generation of gapfill solutions.
  • Lam Equipment Intelligence® technology for process repeatability: Built into TEOS 3D, Equipment Intelligence solutions boost equipment performance and reliability, and drive yield improvement by using smart technology to monitor processes, fix issues faster, and automate routine tasks.
  • Enhanced energy efficiency: Integrated high-efficiency RF generators and ECO Mode peripheral control reduce energy consumption while improving process precision. 

Joins an Industry-Leading Suite of Advanced Packaging Solutions 

Leveraging the company's 15 years of leadership in advanced packaging and decades of expertise in dielectric films, TEOS 3D builds on Lam's existing VECTOR® Core and TEOS product families, representing continuous innovation in materials and processes for integrated packaging. It is part of a comprehensive product portfolio of industry-leading solutions that addresses critical challenges and drives innovation and productivity across the advanced packaging workflow. 

Media Resources 

About Lam Research 

Lam Research Corporation is a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Lam's equipment and services allow customers to build smaller and better performing devices. In fact, today, nearly every advanced chip is built with Lam technology. We combine superior systems engineering, technology leadership, and a strong values-based culture, with an unwavering commitment to our customers. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, Calif., with operations around the globe. Learn more at www.lamresearch.com

1 – Based on internal testing; 68%. 

Caution Regarding Forward-Looking Statements 

Statements made in this press release that are not of historical fact are forward-looking statements and are subject to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements relate to, but are not limited to: industry trends, demands, expectations and requirements; the requirements of our customers; and the capabilities and performance of our products. Some factors that may affect these forward-looking statements include: business, economic, political and/or regulatory conditions in the consumer electronics industry, the semiconductor industry and the overall economy may deteriorate or change; the actions of our customers and competitors may be inconsistent with our expectations; trade regulations, export controls, tariffs, trade disputes, and other geopolitical tensions may inhibit our ability to sell our products; supply chain cost increases, tariffs and other inflationary pressures have impacted and may continue to impact our profitability; supply chain disruptions or manufacturing capacity constraints may limit our ability to manufacture and sell our products; and natural and human-caused disasters, disease outbreaks, war, terrorism, political or governmental unrest or instability, or other events beyond our control may impact our operations and revenue in affected areas; as well as the other risks and uncertainties that are described in the documents filed or furnished by us with the Securities and Exchange Commission, including specifically the Risk Factors described in our annual report on Form 10-K for the fiscal year ended June 29, 2025. These uncertainties and changes could materially affect the forward-looking statements and cause actual results to vary from expectations in a material way. The Company undertakes no obligation to update the information or statements made in this press release. 

Company Contacts: 

Allison L. Parker 

Media Relations 

(510) 572-9324 

[email protected] 

Ram Ganesh 

Investor Relations 

(510) 572-1615 

[email protected] 

Source: Lam Research Corporation, (Nasdaq: LRCX)

【Sept. 11th, 2025 – Hsinchu】With surging demand for generative AI, high performance computing (HPC), memory, and heterogeneous integration, the semiconductor industry is confronting the limits of traditional scaling. At SEMICON Taiwan 2025, SEMI announced the launch of the 3DIC Advanced Manufacturing Alliance (3DICAMA), co-chaired by TSMC and ASE and joined by 37 leading companies, including All Ring, Chroma, Delta, Everlight Chemical, GMM, Grand Process, Scientech, and Unimicron, to advance cross-disciplinary collaboration, standardization, and the complete 3DIC ecosystem.

 

▲3DICAMA launches to drive standards, innovation, and yield breakthroughs across the semiconductor ecosystem

 

AI Era Drives 3DIC Growth

According to Yole Intelligence, the advanced packaging market is expected to more than double from US$38B in 2024 to US$79B in 2030 (12.7% CAGR), fueled by AI and high bandwidth memory (HBM) advancements. Rising demand for high-performance, low-power, high-density solutions positions 3DIC as a critical integration technology, though challenges in heterogeneous integration, thermal management, and interconnects remain. With its strong semiconductor ecosystem, advanced manufacturing, and contributions to global standards, Taiwan is playing an increasingly important role in 3DIC and advanced packaging.

 

3DICAMA Launches to Drive Cross-Domain Collaboration and Ecosystem Growth

Co-chaired by Dr. Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, and Dr. Mike Hung, Senior Vice President at ASE, 3DICAMA unites industry partners to strengthen supply chain collaboration, boost resilience, and establish technical standards across materials, processes, and design. The alliance will also advance 3DIC R&D to improve efficiency and yield, address thermal and interconnect challenges, and accelerate commercialization through enhanced testing, quality, software, and automation, building a complete and sustainable 3DIC ecosystem.

 

SEMI Unites Global Resources to Accelerate 3DIC Ecosystem

“3DICAMA highlights SEMI’s role in driving global collaboration,” said Terry Tsao, SEMI Global Chief Marketing Officer and President of Taiwan, SEMI. “By uniting global resources, fostering industry-policy dialogue, and accelerating commercialization, we aim to deliver faster, more efficient, and more competitive solutions for applications such as AI, HPC, and data centers.”

The launch ceremony underscored the industry’s commitment to innovation, with Dr. Chao-Chung Kuo, Director General of the Department of Industrial Technology, MOEA, highlighting the Alliance’s significance in advancing Taiwan’s packaging ecosystem and strengthening collaboration across industry, government, and academia.
 

▲TSMC, ASE, Chroma ATE, and Grand Process leaders discuss technology roadmaps and applications

 

Global 3DIC Summit Charts the Future of Advanced Packaging

The Global 3DIC Summit, themed ”Driving the Future of Advanced Packaging: Integration and Ecosystem Collaboration,” featured a keynote by Vince Hu, Corporate Vice President of MediaTek, and a panel moderated by Dr. Chao-Hsien (Jeff) Lin of ITRI with industry leaders including Dr. Jun He of TSMC, Dr. Mike Hung of ASE, Dr. I-Shih Tseng of Chroma ATE, and Ben-Li Shih of Grand Process Technology. The discussions focused on AI-driven 3DIC challenges, supply chain resilience, and automation, underscoring Taiwan’s strategic role in the global advanced packaging ecosystem.

For more information on SEMICON Taiwan 2025, visit the offical Website.
 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit  www.semi.org or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.