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Taiwan

Registration for the Global Executive Summit is closed.  Please contact Heidi Hoffman at [email protected] with any questions.  

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SEMI Japan has included the Okura Hotel and 3 other hotels convenient to the Okura in the Hotel Block for SEMICON Japan - taking place December 17-19 at Tokyo Big Sight.  View the hotels and rates HERE.

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Building on the foundational work of the SEMI Sustainability Climate Consortium and the 2025 Global Climate Summit Workshops (GCSW), this closed-door summit is designed to shift our industry from alignment to action. We are convening a select group of key Executive decision makers & senior leaders from fabs, fabless companies, hyperscalers, and key suppliers and energy partners to: 

  • Showcase and accelerate progress on priority climate initiatives: Abatement, Gas Substitution, Green Materials, and Energy
  • Define clear deliverables and next-phase commitments that unlock scale and momentum
  • Strengthen executive collaboration to remove barriers, share ownership, and drive measurable results

This Summit is not about what we could do — it’s about what we will do, and who will lead.

Click here for the Executive Briefing outlining the event objectives, and the action pathways and methods of engagement for all attendees.  Plan ahead on how presence can shape outcomes that accelerate our industry's decarbonization.

Okura Hotel
Tokyo
Japan

Monday, December 15, 2025

9:00 am - 9:20 am

Coffee & Registration

9:25 am - 9:30 am
 Masahiko (Jim) Hamajima - President, SEMI Japan
Jim Hamajima
President
SEMI Japan

9:30 am - 9:45 am
Ajit Manocha, SEMI
Ajit Manocha
CEO & President
SEMI
Carolin Seward, Google
Carolin Seward
VP of Custom Silicon Sourcing and Operations
Google

GES Opening

9:45 am - 10:25 am
Carolin Seward, Google
Moderator
Carolin Seward
Google
Jinman Han
Jinman Han
President
Samsung Foundry
Jens Liebermann
Jens Liebermann
Senior VP of Global Business
BASF
Sundeep Bajikar
Sundeep Bajikar
Corp. VP Head of Corp Strategy
Applied Materials
Sam Naffziger
Sam Naffziger
SVP & Fellow of Product Technology Architecture
AMD

Fireside Chat: Bending the Curve of Emissions Through Industry Collaboration

Join senior executives from Apple, Samsung Foundry, BASF and Applied Materials, for a discussion on the partnerships required to meaningfully bend the curve towards decarbonization. In an industry already operating under tremendous constraints, what are the lower hanging fruits that are ripe for intentional, precompetitive collaboration? And what can be solved independently?

10:25 am - 10:40 am
Sam Naffziger
Sam Naffziger
SVP & Fellow of Product Technology Architecture
AMD

Spotlight: AMD on the role of Silicon Design for Energy Efficiency

Discover how fabless leaders are driving decarbonization through innovations in energy-efficient product architecture and the critical role of silicon design in minimizing "Use Phase" emissions, the largest contributor to a chip's carbon footprint.

10:40 am - 11:10 am
Anne Meegan
Moderator
Anna Meegan
Director of Sustainability
Google Platforms & Devices
Angela Baker
Angela Baker
VP Sustainability
Qualcomm
Dharmesh Jani
Dharmesh Jani
Director, AI Infra Ecosystem & Partnerships
Meta
Cooper Elsworth
Cooper Elsworth
Sr. TPM, Advanced Energy Labs
Google

End-User Panel: The Decarbonization Imperative

Hear from technology leaders at AMD, Qualcomm, Meta, and Google on why accelerated decarbonization is a business imperative. This panel explores how end-users are (1) acting with a sense of urgency, (2) engaging and enabling their supply chains, (3) driving energy efficient design to drive innovation to accelerate collective progress.

11:10 am - 11:25 am

Break

11:25 am - 11:30 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Overview of Priority Initiatives

Priority Initiative: Fab Upstream Materials

11:30 am - 11:40 am
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Opening Remarks

From Fragmentation to Focus: Outlining a strategy to activate the fab supply chain with a unified customer voice and collaborative support.

11:40 am - 12:10 pm
Bessima
Bessma Aljarbou
Head of Strategy of Environment & Supply Chain Innovation
Apple, Inc.

Keynote: Apple's Supply Chain Engagement

Hear from Apple senior leadership on supply chain engagement and decarbonization, using commercial levers and the power of support and collaboration.

12:10 pm - 12:40 pm
Handy Ko TSMC
Handy Ko
Director, Materials Management
TSMC

From Ambition to Action: A Fab's Role in Upstream Decarbonization

Hear about TSMC's upstream scope 3 (supply chain) decarbonization leadership and recognition of the business imperative, which have been embedded into their core supplier engagement program.

12:40 pm - 12:55 pm
Andrea Jorissen
Andrea Jorissen
Supplier Carbon Solutions
Apple, Inc.

Solutions Enablement & Calls-to-Action

Highlighting clean energy advanced procurement academies and demand aggregation case studies. Announce renewed ambitions and goals for fab upstream scope 3 decarbonization.

12:55 pm - 1:55 pm

Networking & Lunch

Priority Initiative: Clean Electricity

1:55 pm - 2:05 pm
Rebecca Green
Rebecca Green
Partner
ERM
Ken Haig
Ken Haig
Senior Director Government Affairs
Microsoft

Opening Remarks

Setting the stage for collective action on clean electricity in Asia.

2:05 pm - 2:30 pm
Patrick Tan
Patrick Tan
Head of Wider Asia, APAC
Aurora Energy Research

From Visibility to Viability: Developer Insights on Building a Net Zero Future

Hear a market outlook on Clean Electricity in Korea, Japan, and Taiwan, examining current barriers to renewable expansion and the major opportunities driving investment and clean energy growth through 2030.

2:30 pm - 2:55 pm
William Hudson
Will Hudson
Director, Energy & Sustainability Policy
Microsoft

Keynote: Clean Electricity Policy Action & Urgency

Accelerating Clean Electricity expansion requires clear, coordinated policy action. By uniting around shared advocacy priorities, industry and government can remove barriers, unlock renewable supply, and strengthen cost competitiveness across Korea, Japan, and Taiwan.

2:55 pm - 3:25 pm
YS Kim SK HYNIX
Yong Sung Kim
Head of Clean Energy
SK Hynix

Deep Dive: A Clean Semiconductor Partnership in Korea

Explore the proposed Clean Semiconductor Partnership (CSP), SEMI’s flagship initiative to accelerate Clean Electricity development in Korea by aligning industry, government, and utilities on policy reform and procurement innovation, creating a model for collaborative clean energy expansion across Asia.

3:25 pm - 3:40 pm
William Hudson
Will Hudson
Director, Energy & Sustainability Policy, Asia Pacific
Microsoft

Calls to Action

From discussion to action, secure collective advocacy priorities, resource commitments, and endorsement of the Clean Semiconductor Partnership as the pilot for accelerating Clean Electricity expansion across the region.

3:40 pm - 4:10 pm

Break

4:10 pm - 4:50 pm
Rebecca Green
Moderator
Rebecca Green
ERM
Josh Seidenfeld
Josh Seidenfeld
Supply Chain Clean Energy Lead
Google
Chikako Matsumoto
Chikako Matsumoto
Director, Managing Executive Officer
Sumitomo Mitsui Trust Group
Rei Ushikubo
Rei Ushikubo
Director and Head of the Carbon-Free Solutions Division
Shizen Energy
Daisuke Tsujimoto
Daisuke Tsujimoto
Executive Officer, CSO
Renova Inc.

Day 1 Closing Panel: Accelerating Affordability: Scaling Clean Energy Through Collaboration.

How banks, fabs, and retailers can work together to lower renewable energy prices and spread risk, while examining how AI and digital innovation can accelerate price reductions across the supply chain, grid integration, and project development.

4:50 pm - 5:00 pm
Saifi Usmani, EMD Electronics
Saifi Usmani
Vice President, Sustainability
SEMI

Day 1 Closing Remarks and Look Ahead

Reflect on the day's takeaways and action items.

5:00 pm - 6:00 pm

Member-to-Member Meetings / Break

6:00 pm - 6:30 pm

Networking Reception

Join us for Networking in the Orchard Foyer

6:30 pm - 8:30 pm
Alison Drury
Alison Drury
Global Technology Industry Lead
ERM

Dinner with Fireside Chat: “2030 in Focus: Choices That Will Define a Decade”

A forward-looking conversation on how the semiconductor industry can navigate the convergence of climate action, geopolitics, and AI to define its leadership in 2030.

Tuesday, December 16, 2025

8:30 am - 9:15 am

Coffee & Networking

9:15 am - 10:00 am
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Day 2 Opening

Opening remarks will summarize Day 1 and preview Day 2.

9:30 am - 10:00 am
Lora Ho
Lora Ho
SVP Strategy & ESG
TSMC

TSMC Keynote

Hear from industry leader TSMC on their strategy for decarbonizing advanced semiconductor manufacturing and how it connects to the four GES Priority Initiatives including a new, collaborative path to scale low-GWP gas substitutions from R&D to high-volume manufacturing.

10:00 am - 10:15 am

Break

Priority Initiative: Gas Substitution

10:15 am - 10:25 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Opening Remarks

Current efforts to pursue low Global Warming Potential (GWP) gas substitutions in etch and chamber clean applications remain fragmented, resulting in high material costs for HVM application. While promising gas substitutions exist, the traditional paths of small scale or single customer adoption are typically too expensive due to cost scaling limitations. So how do we enable low GWP gas substitutions that also meet cost (as well as performance) expectations? By coordinating a fab-led, industry wide approach to
1) Prioritize a single, low GWP target gas for replacement
2) Co-create and execute a phased experimental plan

10:25 am - 10:45 am
Vahid Vahedi, PhD
Vahid Vahedi
CTO
Lam Research

Equipment Perspective: Scaling Low-GWP Gas Substitution

Hear from a top equipment leader on the process innovations and industry collaboration required to scale low-GWP gas substitution from R&D to high-volume manufacturing

10:45 am - 11:05 am
Steven Scheer
Steve Scheer
SVP Compute System Scaling
imec

imec’s Gas Assessment Platform for Sustainability (GAPS) 

Learn about imec’s Gas Assessment Platform for Sustainability (GAPS) project and how it can be leveraged as an industry test bed for low GWP gas substitution

11:05 am - 11:35 am
Bruce Gall Google
Moderator
Bruce Gall
Google
Rachel Potter EMD
Rachel Potter
VP of Specialty Gas
EMD / Merck
Vahid Vahedi, PhD
Vahid Vahedi
CTO
Lam Research
Steven Scheer
Steve Scheer
SVP Compute System Scaling
imec

It Takes an Ecosystem: A Value Chain Panel on Accelerating Low-GWP Adoption

Hear perspectives from leaders in electronic design automation (EDA), materials, and equipment OEMs on the challenges and opportunities in driving industry adoption of low GWP gases

11:35 am - 11:45 am
Bruce Gall Google
Bruce Gall
Strategic Partnerships
Google

Calls to Action

From Commitment to Action: Outlining the roadmap and action plan for the Gas Substitution Initiative.

11:45 am - 12:45 pm

Networking Lunch

Priority Initiative: Abatement

12:45 pm - 1:10 pm
Beth Elroy
Elizabeth Elroy
VP Sustainability
Micron

Opening Remarks & Keynote

Industry-wide collaboration is critical to accelerate technology innovation and unlock scalable, cost-effective abatement solutions to ease abatement deployment challenges on cost, facilities, space, utilities and operational complexity. Micron will deliver a keynote sharing the abatement journey and the state of current efforts in emission measurement.

1:10 pm - 1:50 pm
Josh Robbins
Moderator
Josh Robbins
Google
Phil Kester
Phil Kester, PhD
Senior Chemical Engineer
Guild Associates
HK KIM KIMM
Dr. Hak-Joon Kim
Korea Institute of Machinery & Materials

F-GHG Catalyst Development & Funding Vehicles

Catalytic abatement remains an important technology, but further research and efforts are needed to identify new catalytic materials, scale performance, and improve their recyclability. Hear from a leading fab and a leading catalyst developer and learn about a promising funding opportunity lead by the Korean government.

1:50 pm - 2:20 pm
Yong Keong Goh
Moderator
Yong Keong Goh
Senior Manager
Micron
Martin Tollner
Martin Tollner
President, Semiconductor Division
Edwards
Morihara Kanken
Atsushi Morihara
Chief Technical Officer
Kanken
Rene Reichardt
Rene Reichardt
CEO
DAS EE
Jong Pil Yoon
Jong Pil Yoon
President
EcoEnergen

F-GHG and Nitrous Oxide Abatement Technology Panel

Abatement technologies are advancing rapidly, and new breakthroughs are on the horizon. Engage with leading abatement suppliers on their outlook on technology roadmaps, strategic priorities and collaborative opportunities.

2:20 pm - 2:30 pm
Kongyeong Goh
YongKeong Goh
Micron
Josh Robbins
Joshua Robbins
Google

Closing Remarks: Abatement

Call-to-actions for commitment to drive high efficiency and low-fuel abatement solutions to accelerate carbon footprint reduction and commercialization, and advance emission measurement technologies to simplify performance verification.

2:30 pm - 2:45 pm
Saifi Usmani, EMD Electronics
Saifi Usmani
VP Global Sustainability
SEMI

Calls to Action Summary & Closing

Hear the takeaways from the Summit and actions for moving forward in our decarbonization journey.

- Sustainability

Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far.  Together, we will forge an actionable plan for global industry collaboration in three focus areas:  direct emissions, energy-related emissions, and reporting.  This invite-only event will be conducive to accelerating the decarbonization across the industry.

9:00 am - 5:00 pm Off Add to Calendar 2025-12-15 09:00:00 2025-12-16 17:00:00 Global Executive Summit Tokyo 2025 Semiconductor value-chain executives will gather to align on key initiatives and calls to action, based on our shared decarbonization ambitions, insights and progress thus far.  Together, we will forge an actionable plan for global industry collaboration in three focus areas:  direct emissions, energy-related emissions, and reporting.  This invite-only event will be conducive to accelerating the decarbonization across the industry. Okura Hotel Tokyo Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Event format
Promote in calendar
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【Aug 21st, 2025 – Hsinchu】The surge in AI demand is driving a new wave of semiconductor innovation and accelerating the shift to green manufacturing. As AI chip use grows, the industry must adopt low-carbon and circular solutions, making green transformation key to sustaining semiconductor competitiveness. Kicking off September 8, SEMICON Taiwan 2025 will unite global leaders to explore AI-driven sustainable computing and discuss how AI is shaping the future of energy-efficient manufacturing.

 

SEMICON Taiwan 2025關注AI永續運算 產官學研攜手共創解方

▲Industry Leaders to Explore How AI Can Advance Energy-Efficient Manufacturing at SEMICON Taiwan 2025

 

AI Powers Green Transformation in Global Semiconductor Industry

As computing power requirements continue to climb, the need for sustainable manufacturing has come into sharper focus. Institutions such as the International Energy Agency (IEA) stress the urgency of transitioning away from energy-intensive processes, while governments and leading tech companies worldwide have set net-zero roadmaps. This is driving upstream supply chains to adopt low-carbon and circular-economy solutions, making green transformation the common language of global competitiveness.

 

As the core of the global supply chain, Taiwan is leveraging AI to boost energy efficiency, recycle water, reduce pollution, and recover e-waste. Backed by the government’s NT$100 billion “AI 10 Major Projects”, expected to generate NT$7 trillion in output by 2028, Taiwan is advancing smart manufacturing and green technologies. With a carbon fee trial set for 2025 and full rollout in 2026, Taiwan is aligning with global sustainability policies while strengthening its long-term competitiveness.

 

Collaboration Across the Supply Chain: The Key to Sustainability

“Facing the sustainability challenges of the AI era, going it alone is no longer enough – green transformation requires collaboration across the entire supply chain,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “Taiwan’s complete semiconductor ecosystem is one of its greatest advantages in driving sustainable transformation. As a pivotal industry platform, SEMICON Taiwan 2025 will bring together solution providers spanning smart manufacturing, power materials, and green supply chains. With this ecosystem as our foundation, we aim to position Taiwan as a leading force in advancing AI-driven sustainable computing worldwide.”

 

▲Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI 

 

SEMICON Taiwan’s Green Manufacturing Area Highlights Circular Economy and Sustainability

The Green Manufacturing Area this year at SEMICON Taiwan will expand by nearly 30%, underscoring rising demand for AI-driven sustainable solutions. Centered on the theme of “Circular Economy Insights,” the area will spotlight diverse topics including water recycling, waste reduction and recovery, air pollution control, high-tech facility management, smart energy management, and carbon asset management, demonstrating the semiconductor industry’s progress in green transformation and sustainable manufacturing. Exhibitors include ABB, Atlas Copco, Atlas, DKK-TOA, Gradiant, Greenfiltec, KINGWAY, Trusval, and Yesiang, presenting comprehensive green solutions from energy efficiency and carbon reduction to circular reuse.

 

This year’s highly anticipated Semiconductor Sustainability Summit will gather top sustainability executives and green manufacturing leaders, with keynotes from TSMC and Micron, and presentations by Applied Materials, Edwards, Gradiant, Kanken, Lam Research, TEL, Yesiang, and more. Speakers will present practical strategies on leveraging innovation, AI applications, systems thinking, and supply chain collaboration to drive low-carbon processes, energy optimization, water management, and resource recycling, offering the semiconductor industry cutting-edge solutions and actionable pathways for carbon reduction. In addition, the High-Tech Facility International Forum will spotlight the Next-generation Intelligent and Sustainable High-Tech Facilities to explore how AI and digital twins enable smart factories, green manufacturing, and carbon reduction. Industry leaders from MIC, TSMC, and UIS will join a panel on innovations driving intelligent and sustainable infrastructure.

 

SEMICON Taiwan offers free admission codes for industry professionals through August 31, providing the opportunity to discover how leading global manufacturers achieve environmental sustainability. For more details: Offical Website.

 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit www.semi.org or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025. Visit TRI's Booth No. K3070 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions.

TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology, μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.

TRI will showcase the Wafer Inspection and metrology Platform, TR7950Q SII, capable of wafer macroscopic 3D inspection and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Through Silicon Via (TSV), thin film, and more.

TRI will also exhibit the back-end inspection solutions, the TR7007Q SII-S for C4 bumps (~100 μm Ø), Mini-LED, and 008004 paste inspection applications, and the TR7900Q SII-R TRI's Reject Station with A-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps and Cu pillars.

Visit TRI's Booth No. K3070 at SEMICON Taiwan 2025 to explore TRI's SEMI solutions.

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About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

Brewer Science Named 2025 National Top Workplace in Manufacturing Industry

Ninth Consecutive Year Receiving 2025 Top Workplace in Greater St. Louis

Rolla, MO – August 7, 2025 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, has been named a 2025 National Top Workplace in the Manufacturing Industry, marking the fifth consecutive year the company has received this recognition.

Brewer Science has been named 2025 Top Workplaces based on employee feedback

This list is based solely on employee feedback gathered through a third-party survey administered by employee engagement technology partner Energage LLC, a research company with more than 18 years of experience surveying over 27 million employees at 70,000 organizations. Results are calculated by comparing the survey’s research-based statements, including 15 Culture Drivers proven to predict high performance against industry benchmarks.

In addition to being named a National Top Workplace in the Manufacturing Industry, Brewer Science received regional recognition as a 2025 Top Workplace in Greater St. Louis, marking the ninth consecutive year the company has received this recognition.

“Being recognized as a Top Workplace both on a national industry level, as well as locally within our community, speaks volumes to Brewer Science’s dedication in providing our employee-owners with the most fulfilling work experience,” states Dan Brewer, co-CEO at Brewer Science.

Providing customized solutions to customers’ unique, complex situations requires a high regard for a sense of purpose and commitment by everyone within the company. This dedication has been instilled through the company values and creates a workplace flourishing with culture. The employees at Brewer Science are attentive to their roles in the company and the value they articulate to the customers, suppliers, and industry. This has been exemplified by the company becoming Certified Employee-Owned in 2020. Additionally, the company was recognized for meeting the highest corporate social and environmental standards, transparency, and accountability to all stakeholders by becoming a Certified B Corporation™ in 2021.

Learn more about Brewer Science’s company culture and explore career opportunities by visiting our website: https://www.brewerscience.com/about-us/company/careers/

About Brewer Science

Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.

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Company Contact:

Nathan Ayres

Tel: (US) +1.573.364.0444, ext. 1923

Email: [email protected]

Brewer Science Named 2025 National Top Workplace in Manufacturing Industry

【Aug 5th, 2025 – Hsinchu】SEMI today announced that globally acclaimed humanoid robotics expert Professor Hiroshi Ishiguro, known as the “father of android robots,” will return to Taiwan to speak at SEMICON Taiwan 2025. In his keynote, “Avatar and the Future Society,” Professor Ishiguro will explore how robotics is reshaping the global tech landscape. As curator of the “Future of Life” Pavilion at Expo 2025 Osaka-Kansai, his visit aligns with Taiwan’s AI policy vision and highlights new opportunities for the semiconductor and electronics sectors to tap into the rapidly emerging robotics market. His presence also reinforces Taiwan’s global edge in AI and MEMS technologies and SEMICON Taiwan’s role as a leading platform for innovation and collaboration.

 

MEMS & Sensors Forum – Expanding the Sensing Horizon, Ushering in the Robotics Era

▲MEMS & Sensors Forum – Expanding the Sensing Horizon, Ushering in the Robotics Era

 

"The global MEMS sensor market is on an impressive trajectory, set to grow to $29 billion by 2030, reflecting strong growth momentum," stated Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. "Taiwan's deep strengths covering the entire MEMS value chain – from chip design and sensor manufacturing to advanced packaging and signal processing – position it as a key player in this growth, supported by a complete semiconductor ecosystem. SEMICON Taiwan remains at the forefront of industry dialogue, and this year’s focus on robotics reflects our conviction that it will be the next major growth driver after EVs and AI. Through this global platform, we aim to empower Taiwan’s semiconductor and electronics sectors to capture emerging opportunities and stay ahead of the next wave of innovation.”

 

Robotics Marks Next Growth Driver, Said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI

▲Robotics Marks Next Growth Driver, Said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI

 

From Policy to Progress: Robotics to Lead Taiwan’s Next Wave of Tech Innovation

Taiwan is making a massive push into smart robotics, investing NT$200 billion as part of its AI New Top 10 Infrastructure Projects, to generate NT$15 trillion in output by 2040. In line with this vision, SEMICON Taiwan 2025 will feature the MEMS & Sensors Forum – Expanding the Sensing Horizon, Ushering in the Robotics Era, spotlighting the groundbreaking research by Professor Ishiguro, reported by CNN as “Top 8 Geniuses Who Will Change Your Life.”

Famed for his groundbreaking Geminoid series of ultra-realistic humanoid robots, Ishiguro will delve into how avatar technologies promise a future where physical and spatial constraints are a thing of the past. In an era of rapid AI advancement, high-precision sensors are indispensable for equipping robots with autonomous perception. Taiwan's outstanding MEMS and sensor ecosystem, from chip design and advanced packaging to edge computing, offers a powerful springboard for capitalizing on the vast opportunities in this dynamic field.

 

Taiwan's Tech Prowess: Fostering Global Collaboration in Robotics

"The secret to integrating robots into our daily lives lies in their ability to see, hear, and behave, just like us," explains Ishiguro. "Taiwan's complete ecosystem, spanning everything from chip design to advanced manufacturing, makes it the perfect collaborator. I'm looking forward to presenting my newest research on humanoid robot interaction and discovering fresh avenues for partnership."

 

Professor Hiroshi Ishiguro Will Return to Speak at SEMICON Taiwan 2025

▲Professor Hiroshi Ishiguro Will Return to Speak at SEMICON Taiwan 2025

 

Driving Global Robotics Innovation Through MEMS and Sensor Technologies

At SEMICON Taiwan 2025, Professor Ishiguro will join top industry experts at the MEMS & Sensors Forum to explore the future of robotics and global strategies. Dr. Scott Huang, VP of Techman Robot, will discuss the evolution of cobots toward intelligent integration in the humanoid era. Mina Rezk, Co-founder and CTO of Aeva, will highlight how MEMS and sensor technologies are driving lifelike perception, motion, and interaction in humanoid robots. Dr. Gavin Ho, Chief Strategy Officer at TDK, will offer insights into sensor innovation and its integration in robotics, while Dr. Jwu-Sheng Hu, Executive VP of ITRI, will share the latest trends in AI robotics and industry advancements.

In a critical moment of global tech realignment, the Forum provides a strategic platform for global partnership and ecosystem building with the expected presence of over 200 industry leaders.

Register now and enjoy early bird discounts until August 20. Discover the momentum of AI robotics under the theme “MEMS & Sensors Forum – Expanding the Sensing Horizon, Ushering in the Robotics Era.”For more details: Offical Website.

 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics.  Visit  www.semi.org  or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.
 

【July 29, 2025 – Hsinchu】Amid soaring demand for high-performance memory in AI computing, Taiwan is solidifying its position as a key hub for memory innovation, powered by its robust supply chain, advanced packaging expertise, and system integration strengths. To meet this industry shift, SEMICON Taiwan 2025 will debut the “Memory Executive Summit” on September 9 at Taipei Nangang Exhibition Center, Hall 2. Centered on the theme “Empowering AI: Exploring the Possibilities of Memory Innovation,” the summit will spotlight breakthroughs and challenges in AI-driven memory, from co-designing memory and compute chips to integrating advanced packaging and fostering collaboration across the entire value chain.

Memory Titans SK hynix, Samsung, and Micron Share the Stage to Shape the AI Era

For the first time, the Memory Executive Summit unites top executives from the world's three leading memory industry giants on a single stage to unveil their respective AI-era R&D innovations and views on market prospects. The discussion will spotlight next-gen technologies, like High-Bandwidth Memory (HBM) and DDR5, and future memory architectures driving AI and accelerated computing.

  • Jeff (Joonyong) Choi, VP of SK hynix – Examining key trends in the AI-era memory industry and partnering to redefine standards for HBM and AI computing infrastructure.
  • Jangseok Choi, VP, Memory Product Planning of Samsung Electronics – Exploring how next-generation memory innovations are driving AI performance gains and shaping the diverse evolution of memory technologies.
  • Nirmal Ramaswamy, Corporate VP of DRAM Technology Development, Micron – Showcasing how the company advances AI with breakthrough DRAM, spotlighting the global memory industry’s diverse innovation paths.

From Design to Integration, SEMICON Taiwan Sparks Industry-Wide Dialogue

The Summit will encompass the full memory supply chain, featuring in-depth conversations between memory executives and industry pioneers in AI chip design, system integration, and specialized applications. This multifaceted dialogue will examine the industry’s future from all perspectives, addressing market demand, real-world applications, and core technology breakthroughs.

  • Anki Nalamalpu, Senior VP, Datacenter and AI of MediaTek – Focusing on how leading AI chip designers leverage global partnerships to build the next-generation smart computing ecosystem and define the new industrial framework for the AI era.
  • Pei-Ming Chen, President of Winbond – Sharing how Taiwan’s memory makers are securing niche technology advantages amid the AI wave and capturing future growth through customized memory solutions.
  • Keh-Chung Wang, Head of Emerging R&D of Macronix – The seasoned Macronix technology leader will share how customized memory innovations address diverse AI-era applications, showcasing the technical strengths of Taiwanese companies.

Register now and enjoy early bird discounts until August 17. Discover the momentum of memory-driven AI under the theme “Leading with Collaboration. Innovating with the World.” For more details: Official website.

 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics.  Visit  www.semi.org  or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.
 

 

Germany Japan South Korea Taiwan United States ESDA Advocacy Webinar Tile 800x800 Business Technical
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Join us for a webinar that will explore the role of SEMI’s Public Policy and Advocacy (PP&A) team in driving policy developments that are relevant to the ESDA community. PP&A staff will present on SEMI’s advocacy efforts, how you can interface with our team in DC, and how we work with member companies to advance key legislative and advocacy priorities in specific policy areas including:

  • Trade and Export Controls
  • Tax Policy
  • CHIPS Implementation
  • Workforce Development

United States

APHI ESD Alliance SiPAT

The ESD Alliance, a SEMI Technology Community, is hosting a free webinar, "SEMI's Public Policy & Advocacy Office—A Valuable Resource for The Electronic Design Automation Industry," to share how this team can help you navigate global trade complexities and stay ahead of evolving policy challenges. 

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles REGISTER NOW
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SEMI Members:  $75

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $149

Students:  Free

Contact Basak Ulutas Ozturkler ([email protected]) with a picture of your student ID to receive your discount code.

Belgium Germany Singapore Taiwan United States Masterclass #28 Business Executive Technical
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Improved materials are required for progress in fields including printed electronics, semiconductors, aerospace & defense, energy, and life sciences/medical care.  Developing such materials and chemicals involves considerations of performance, cost, manufacturability, safety, and stability.  Scaling production of new materials is a very different challenge than making 50 grams in a laboratory.  Transitioning/commercializing new materials is a separate effort where intellectual property, regulation, quality control, system documentation, supply chain development, and business relationships become key.  This talk will address these aspects of introducing a new material into our enterprise.

ABOUT THE SPEAKER:

Larry Takiff, PhD

Larry Takiff is co-Founder and President of Akita Innovations LLC, a small business in Massachusetts that develops and produces novel chemicals and materials for government and commercial customers.  He founded Akita in 2012 with Lawrence Hancock after working at Polaroid Corporation, Aprilis Inc., and Nomadics/ICx/FLIR Systems.  He is a chemist by training and a businessman by necessity.  At Akita, he has initiated and led projects in materials R&D and pilot production for a variety of government agencies/DoD components and for commercial partners.  Currently he is leading an effort to scale production of a decontamination fluid for the Defense Threat Reduction Agency (DTRA), and a FlexTech project to advance the TRL/MRL of a dielectric ink for printed electronics, as well as several Phase II SBIR development projects.

United States

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Larry Takiff, PhD
President
Akita Innovations LLC
Gity Samadi
Moderator
Gity Samadi
Sr. Director, R&D Programs
SEMI
NBMC Smart MedTech FlexTech

Join us for this insightful Master Class with Larry Takiff, PhD, Co-Founder and CEO of Akita Innovations LLC, as he explores the path from lab-scale breakthroughs to scalable material solutions across high-impact industries. Dr. Takiff will dive into the challenges and strategies of transitioning novel materials such as those used in printed electronics, semiconductors, aerospace, and medical devices into commercial success.

10:00 am - 11:30 am Off Add to Calendar 2025-11-12 10:00:00 2025-11-12 11:30:00 FEMC#28 Development, Scaling, and Transition of Novel Chemicals & Materials Join us for this insightful Master Class with Larry Takiff, PhD, Co-Founder and CEO of Akita Innovations LLC, as he explores the path from lab-scale breakthroughs to scalable material solutions across high-impact industries. Dr. Takiff will dive into the challenges and strategies of transitioning novel materials such as those used in printed electronics, semiconductors, aerospace, and medical devices into commercial success. United States SEMI.org [email protected] America/Los_Angeles public Watch on-demand
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【July 17, 2025 – Hsinchu】SEMICON Taiwan 2025 , the premier annual event for the global semiconductor industry, kicks off on September 8, launching International Semiconductor Week in Taipei. The SEMICON Taiwan spotlight shines brightest on the highly anticipated CEO Summit, set for September 10 at Nangang Exhibition Center, with a high-profile speaker lineup generating significant attention across the industry.

This year’s SEMICON Taiwan theme, “Leading with Collaboration. Innovating with the World,” arrives at a pivotal moment for the global semiconductor industry, marked by groundbreaking technological advances and supply chain redesign. Tech leaders from Europe, North America, and Asia will converge in Taiwan to shape the future of innovation and forge new paths for cross-regional collaborations.

Last year’s CEO Summit drew more than 450 top executives from around the globe, featuring keynotes from leading tech firms and an influential audience across semiconductors, AI, and cloud tech. As SEMICON Taiwan’s premier closed-door forum, it remains a vital hub for high-level dialogue and global strategy.

Building on last year’s success, the CEO Summit 2025 will deliver deeper insights with heavyweight voices from chip design, manufacturing, equipment, automotive, and cloud sectors. They’ll dive into global trends, emerging tech, and new avenues for regional cooperation, bringing fresh insights and renewed momentum to the semiconductor industry.

 

▲CEO Summit 2025 will Gather Chip design, Manufacturing, Equipment, Automotive, and Cloud Sector Leaders

 

Star-Studded Speaker Lineup Unveiled for SEMICON Taiwan 2025 CEO Summit

  • Kurt Sievers, CEO of NXP – Making his SEMICON Taiwan CEO Summit debut, Sievers will address Edge AI and Autonomous Future.
  • Jochen Hanebeck, CEO of Infineon – In his first public address in Taiwan, he will highlight how semiconductors power global sustainability, from EVs to AI infrastructure, through innovation, scale, and ecosystem collaboration.
  • Hirotsugu Takeuchi, CTO of DENSO – From a leading automotive supplier’s view, he will reveal how semiconductors are fueling the next revolution and becoming the auto industry's new competitive edge.
  • George Elissaios, VP, Product Management, GCE & AI Infrastructure, Google – He will share how innovation and cross-sector collaboration are shaping the future of AI and cloud, sharing insights from Google’s chip design efforts.
  • Stefan Joeres, VP for Business Development, Semiconductor Strategy and Strategic Projects of Robert Bosch GmbH – With over a decade of experience, he will share his perspective on Europe’s chip strategy and vision for smarter mobility through APAC collaboration.
  • Sesha Varadarajan, SVP, Global Products Group, Lam Research – He will highlight how atomic-scale innovations in semiconductor manufacturing equipment development are unlocking the next wave of AI breakthroughs. He will also discuss the critical role of AI in accelerating future innovations of the semiconductor industry.
  • Luc Van den hove, President and CEO of imec – The head of Europe’s leading chip research hub returns to Taiwan to reveal how open collaboration can overcome AI compute limits.

The centerpiece of this year’s CEO Forum is a distinguished Fireside Chat, co-hosted by Dr. Tien Wu, CEO of ASE and Chair of the SEMI International Board Executive Committee, and Cliff Hou, Chairman of TSIA. The session will examine emerging applications and industry trends, offering key insights into the next wave of innovation and Taiwan’s pivotal role in the global semiconductor landscape. This dialogue will officially open SEMICON Taiwan and set the tone for the year’s premier tech event.

The CEO Summit offers a rare opportunity to engage with top industry leaders and gain early insight into the future of semiconductors and global collaboration. Secure your spot and be part of this landmark moment. For more details:  Official website.

 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics.  Visit  www.semi.org  or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.

Lightium, MPI Corporation, and Axiomatic_AI Announce Strategic Partnership to Revolutionize Photonic Integrated Circuit (PIC) Device Testing with AI-Driven Solutions
Zurich, Switzerland; Hsinchu, Taiwan; and Boston, USA – January 6, 2025 – Lightium AG, MPI Corporation, and Axiomatic_AI Inc. have entered into a Memorandum of Understanding (MoU) to jointly develop the world's first Intelligent, Autonomous, and Integrated Test Solution (IAITS) for photonic devices.
This strategic collaboration aims to revolutionize the testing and qualification processes of photonic integrated circuit (PIC) devices by uniting state-of-the-art artificial intelligence, next-generation hardware, and deep domain expertise. The IAITS platform will deliver breakthrough performance in testing workflows—enabling unmatched efficiency, precision, and scalability to meet the ever-evolving demands of the photonics industry.
A Unified Vision for the Future of Photonics Testing
This partnership is driven by a shared commitment to deliver groundbreaking AI driven and self-optimizing solutions to the photonics industry. By combining Axiomatic_AI’s cutting-edge, reasoning-based, self-learning artificial intelligence with MPI Corporation’s industry-leading wafer probing systems and automation software, and leveraging Lightium AG’s advanced testing infrastructure and deep expertise in ultra-high-speed photonic device measurements, the collaboration aims to bring fully integrated, intelligent photonic integrated circuit (PIC) test solutions to market.
Together, the three companies are creating a unified AI platform that addresses the growing complexity and performance demands of characterizing photonic integrated circuits—unlocking new levels of automation, precision, and scalability for next-generation applications.
Disruptive Value Creation Across Hardware and Human Resources
The Intelligent, Autonomous, and Integrated Test Solution (IAITS) introduces a new paradigm in photonic integrated circuit (PIC) testing, delivering transformative value across both technology infrastructure and human capital.
Key Benefits of IAITS:
• Increased Throughput: By automating complex test routines, minimizing downtime, and optimizing measurement system utilization, IAITS significantly accelerates test cycles and reduces iteration times.
• Enhanced Human Efficiency: The system reduces reliance on manual operation, programming, and debugging—freeing skilled personnel to focus on high-value engineering and strategic innovation tasks.
IAITS will be commercially available as an advanced software add-on package for MPI Corporation’s wafer probing systems. Designed to support both R&D and high-volume production environments, the solution sets a new industry benchmark for efficiency, precision, and scalability—ultimately lowering the total cost of testing and accelerating time-to-market for next-generation PIC devices.
About Lightium AG
Lightium AG is a Swiss-based startup specializing in Photonic Integrated Circuit (PIC) foundry and design services, built on its proprietary, production-grade Thin-Film Lithium Niobate (TFLN) platform. Lightium accelerates customer innovation by delivering unmatched photonic performance, a streamlined and cost-efficient supply chain, and seamless scalability from prototyping to high-volume manufacturing.
As Europe’s first production-grade TFLN foundry, Lightium plays a pivotal role in enabling next-generation photonic solutions across a diverse range of industries, including telecommunications, data communications, quantum computing, artificial intelligence, and space technologies.
Further information can be found at: Lightium - Thin Film Lithium Niobate (TFLN) Photonic Foundry
About MPI Corporation
MPI Corporation, headquartered in Taiwan, is a global leader in advanced probe systems and testing solutions for the semiconductor, photonic, and photonic integrated circuit (PIC) industries. The company designs and manufactures high-performance wafer probing systems known for their exceptional precision, automation capabilities, and scalability—empowering cutting-edge testing across research, development, and high-volume production.
MPI’s innovations play a critical role in advancing next-generation technologies in wireless communication, electronics, and photonics. The company is publicly listed on the Taipei Exchange (TAIEX: 6223).
For more information, please visit: About MPI Corporation – Global Semiconductor Testing Leader
About Axiomatic_AI Inc.
Axiomatic_AI Inc., headquartered in Boston, is a pioneering startup developing physics-based reasoning artificial intelligence to accelerate innovation and reduce the cost and risk associated with deep-tech development. Its cutting-edge AI technologies are redefining how high-tech industries design, measure, and optimize complex systems—enabling faster, smarter decision-making across R&D and production environments.
Axiomatic_AI’s mission is to unlock new efficiencies and capabilities in fields where precision and complexity are paramount.
Learn more at: https://axiomatic-ai.com/mission/