【Sept. 8th, 2025 – Hsinchu】SEMICON Taiwan 2025, the region’s most influential semiconductor event, opens this week. At today’s pre-show press conference, Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI; Dr. Tien Wu, Chair of the SEMI International Board Executive Committee and CEO of ASE; Doris Hsu, SEMI International Board of Director and Chairperson and CEO of GlobalWafers; Professor Tzi-Dar Chiueh, Dean of the College of Advanced Technology at National Taiwan University (NTU) and CEO of the Taiwan Chip-based Industrial Innovation Program Office; and Clark Tseng, Senior Director of Market Intelligence at SEMI, joined leaders from industry, government, and academia to share forward-looking perspectives on the semiconductor industry.

▲Joined leaders from industry, government, and academia at the SEMICON Taiwan 2025 pre-show press conference

The focal point of International Semiconductor Week, this year’s SEMICON Taiwan adopts the theme Leading with Collaboration. Innovating with the World. The event features 25+ forums and 13 key technology themes, highlighting collaboration as the catalyst for the next wave of innovation. Industry leaders will share insights on AI-driven semiconductor trends, market strategies, and reveal key industry data.

AI Wave Drives Global Semiconductor Growth with Record Equipment Investments

According to SEMI’s latest Market Intelligence, AI is extending from the cloud to the edge and end devices, driving demand not only in data centers but also for local real-time computing. Capital expenditures by the top four cloud service providers are projected to grow from US$210 billion in 2024 to US$310 billion in 2025, fueling the demand for AI infrastructure. In 2025, AI and high-performance computing (HPC) related equipment investments are expected to account for 40% of global semiconductor equipment spending, and this share is anticipated to exceed 55% by 2030.

The global semiconductor equipment market is forecast to grow by 7.4% to $125.5 billion in 2025, with a further increase of 10% to reach a new high in 2026. Taiwan's investments are projected to reach $28 billion in 2025, an increase of over 70% year-on-year, driven by strong investments in HPC and advanced packaging. In terms of AI/HPC and memory transformation, GAA, HBM, 3D stacking, and chiplet packaging are becoming the focus of investment. 

▲Clark Tseng, Senior Director of Market Intelligence at SEMI

SEMI Leads New Model of Global Industry Collaboration with Standards and Alliances

Amid rising semiconductor investment, the industry is shifting from supply chains to ecosystem collaboration. “SEMI connects the entire value chain, from design and manufacturing to packaging and system applications, helping members seize emerging opportunities,” said Terry Tsao. “The theme of ‘Leading with Collaboration. Innovating with the World.’ captures this shift, as SEMICON has become the unique global platform uniting the full value chain, with SEMICON Taiwan bringing the top industry players from around the world together to advance technology.”

Building on this vision, SEMI has advanced key standards and alliances. After launching the Silicon Photonics Alliance (SiPhIA) in 2024 with TSMC, ASE, and over 100 companies, SEMICON Taiwan 2025 will introduce the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA). The event will also mark the launch of certification for SEMI E187, the world’s first semiconductor equipment cybersecurity standard initiated by Taiwan, reinforcing Taiwan’s role in shaping the global semiconductor ecosystem.
 

▲Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI

Tech Strength and Supply Chain Resilience Drive Confidence

Seizing vast AI opportunities, the semiconductor industry is demonstrating strong investment confidence. Dr. Tien Wu, Chair of the SEMI International Board Executive Committee and CEO of ASE, said: “The semiconductor industry is projected to surpass US$1 trillion in the next decade, reshaping the global value chain. Taiwan must leverage its leadership in advanced manufacturing processes for AI and data center applications, as well as capitalize on the region's robust semiconductor ecosystem to strengthen its competitiveness through effective communication and a strategic focus on collaboration,”.

Doris Hsu, SEMI International Board of Directors and Chairperson and CEO of GlobalWafers, said, "AI is driving the strongest growth in both demand and pricing, and Taiwan’s complete ecosystem enables the industry to respond quickly to global needs while serving as a vital hub for supply chain collaboration."
 

▲Dr. Tien Wu, Chair of the SEMI International Board Executive Committee and CEO of ASE

▲Doris Hsu, SEMI International Board of Director and Chairperson and CEO of GlobalWafers

Chip-based Industrial Innovation Program Boosts Industry Alignment and Talent Growth

To reinforce industry investment, the government has introduced forward-looking policies through the Taiwan Chip-based Industrial Innovation Program. Professor Tzi-Dar Chiueh, Dean of the College of Advanced Technology at NTU and CEO of the Taiwan Chip-based Industrial Innovation Program Office, said: “Amid intense global competition, supply chain shifts, and rising innovation demands, the program is enabling Taiwan’s transition from manufacturing to innovation leadership and positioning the economy as a driving force in global semiconductor development.”

In response to the talent shortage, industry and academia are joining forces to cultivate the next generation, with early outcomes already visible. This year, the SEMI Taiwan 20 Under 40 Award honored 24 outstanding professionals under 40, reflecting progress in developing a strong talent pipeline. As part of the selection committee, Professor Chiueh noted that aligning policy direction with industry investment needs will provide a solid foundation for strengthening competitiveness in the AI era.

▲Professor Tzi-Dar Chiueh, CEO of the Taiwan Chip-based Industrial Innovation Program Office

Startup Zone Debuts, Driving Innovation and Ecosystem Collaboration


SEMICON Taiwan 2025 will feature over 200 global speakers, with forums covering heterogeneous integration, leadership insights from top CEOs, and the Memory Executive Summit bringing SK hynix, Samsung, and Micron together for the first time. A major highlight is the debut of the Silicon Startups Zone, co-organized with the IC Taiwan Grand Challenge (ICTGC), showcasing next-generation technologies such as 5G/6G, post-quantum cryptography, AI silicon photonics, SiC power devices, Wi-Fi 7 RF integration, and wireless charging. The zone will connect Taiwan’s complete supply chain to drive global investment, collaboration, and market growth, embodying the event theme: Leading with Collaboration. Innovating with the World.

“With its complete ecosystem spanning equipment, manufacturing, and applications, Taiwan is indispensable in the global supply chain,” said Tsao. “As AI reshapes the industry, Taiwan’s US$27.9 billion investment in semiconductor equipment underscores its central role, with SEMICON Taiwan serving as a vital platform for global collaboration and innovation.”

For more information on SEMICON Taiwan 2025 visit the offical Website.
 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit  www.semi.org or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.

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Forums Begin September 8, Followed by Exhibitions September 10-12

【Sept. 3rd, 2025 – Hsinchu】SEMICON Taiwan 2025 enters its final countdown, spotlighting the global AI chip boom and the industry’s rapid transformation. Widely seen as the barometer of the global semiconductor industry, SEMICON Taiwan has hit a new pre-registration record this year. Celebrating its 30th anniversary by kicking off a full International Semiconductor Week, the event will gather 1,200+ companies, 4,100 booths, and industry partners from 56 countries. It opens with forums on September 8, followed by the exhibition at Taipei Nangang Exhibition Center, September 10-12.

Advanced Process Capacity Surges as Global Demand Accelerates

Soaring AI demand is fueling rapid semiconductor growth, with SEMI projecting sub-7nm capacity to reach a record 1.4 million wafers per month by 2028, a 69% jump from 2024. Leveraging robust ecosystems and resilient supply chains, the region continues to play a critical role in supporting global AI chip production. “The AI-driven growth wave is reshaping the industry,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “As the industry shifts to cross-domain collaboration, leading system companies are forging closer partnerships across the semiconductor value chain.”
 

▲Advanced Process Capacity to Grow 70% by 2028, Fueling Cross-Domain Collaboration

Record International Participation Positions SEMICON Taiwan 2025 as a Global Hub

Fueled by Taiwan’s strength in AI semiconductors and its comprehensive ecosystem, SEMICON Taiwan 2025 will feature a record-high 17 national pavilions, including first-time participants from Canada, Costa Rica, Lithuania, Sweden, and Vietnam. Beyond record country pavilion participation, international delegations from the U.S., Chile, Spain, Italy, and more are visiting independently, underscoring the exhibition’s global appeal and growing role in industry collaboration.

▲SEMICON Taiwan 2025 Feature a Record 17 National Pavilions, Highlighting Global Appeal and Industry Collaboration

SEMICON Taiwan Leads Industry Dialogue and Fosters Innovation

SEMICON Taiwan 2025 will serve as a global platform with high-profile forums and specialized zones addressing AI-driven breakthroughs and supply chain resilience. On September 9, the IC Forum-Advanced Chip Technology and Manufacturing will feature TSMC, ASML, and Applied Materials, while the Semiconductor Cybersecurity Global Summit on September 12 will mark the official launch of SEMI E187 Certification. SEMI E187 is the world’s first semiconductor equipment cybersecurity standard led by Taiwan. By establishing a trusted certification system, it allows suppliers to demonstrate compliance, strengthens the entire supply chain, and empowers fabs to confidently integrate safer equipment, minimizing their exposure to cyber risks. With participating leaders including Foxconn and ITRI, discussions will focus on proactive strategies to safeguard the AI-era semiconductor supply chain. 

The AI Technology Zone will present the full value chain, from chip manufacturing and IC design to specialized hardware, featuring leaders such as Advantech, ASE, ASM, Aspeed, Egis Technology, and Zhen Ding. Addressing the need for a secure and reliable supply chain, the Semiconductor Cybersecurity Pavilion will showcase solutions in industrial control security and zero-trust architecture, providing comprehensive support for the AI era.

With SEMICON Taiwan 2025 less than a week away, there is limited time to get free registration. Register early to skip the line. For more details, visit the offical Website.
 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit  www.semi.org or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.

• Read more about SEMICON Taiwan 2025 Hits Record Global Participation Amid AI-Driven Industry Shift

Featuring Chip Guru Jim Keller and Industry Pioneer Dr. Chih-Tay Shih

【Aug 28th, 2025 – Hsinchu】 SEMICON Taiwan 2025 is just two weeks away, and this year’s forums will welcome an extraordinary lineup of speakers. Silicon Valley “chip legend” Jim Keller will take the stage at the CEO Summit, while Dr. Chin-Tay Shih, a pioneering force in Taiwan’s semiconductor development, is confirmed to join the SEMI 20 Under 40 Awards Ceremony and Tech Master Forum. As the industry builds its central role in the AI era, global leaders will gather in Taipei to chart the future of semiconductor innovation.

▲SEMICON Taiwan Featuring Chip Guru Jim Keller and Industry Pioneer Dr. Chih-Tay Shih

Industry Legends Gather in Taiwan to Spotlight Innovation and Leadership

Tenstorrent CEO Jim Keller, renowned for his groundbreaking chip designs at Intel, Tesla, and AMD, will headline the CEO Summit with a keynote addressing the key technologies shaping the future of computing. A fireside chat focused on Taiwan’s strategic role in the global semiconductor landscape will follow, featuring co-moderators Dr. Tien Wu, CEO of ASE and Chair of the SEMI International Board Executive Committee, and Cliff Hou, Chairman of TSIA, along with panelists Jim Keller and Jochen Hanebeck, CEO of Infineon.

Also taking the stage, Dr. Chin-Tay Shih, a pioneering architect of Taiwan’s semiconductor rise, will reflect on his journey from ITRI to helping establish UMC, TSMC, and VIS, underscoring how Taiwan built a complete supply chain and laid the foundation for today’s AI era. Joining the Tech Masters Forum are Professor Y-W Peter Hong of NSTC, GC Hung, Senior VP of UMC, and Emily Hong, Chair and Chief Strategy Officer of Wiwynn Corporation.

Post-Moore Era: Heterogeneous Integration and Advanced Packaging Take Center Stage

With scaling reaching its limits, heterogeneous integration and advanced packaging have become the new frontier of innovation. SEMICON Taiwan will debut a dedicated Heterogeneous Integration Zone with nearly 60 companies. The zone includes the 3DIC Advanced Packaging Pavilion, Semiconductor Packaging Pavilion, and FOPLP Pavilion.

On September 9, the 3DIC Global Summit will bring together leaders from ASE, Chroma, GPTC, MediaTek and TSMC, to tackle key issues including efficiency, yield, cross-domain collaboration, and standardization. The day will also see the launch of the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), rallying global industry leaders to drive collective innovation and propel advanced packaging into its next wave of breakthroughs.

Register now for SEMICON Taiwan 2025 to skip the lines. Industry professionals can get a free admission code by August 31. For more details visit the offical Website.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit  www.semi.org or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.
 

• Read more about Semiconductor Heavyweights Descend on Taipei for SEMICON Taiwan 2025

【Aug 21st, 2025 – Hsinchu】The surge in AI demand is driving a new wave of semiconductor innovation and accelerating the shift to green manufacturing. As AI chip use grows, the industry must adopt low-carbon and circular solutions, making green transformation key to sustaining semiconductor competitiveness. Kicking off September 8, SEMICON Taiwan 2025 will unite global leaders to explore AI-driven sustainable computing and discuss how AI is shaping the future of energy-efficient manufacturing.

▲Industry Leaders to Explore How AI Can Advance Energy-Efficient Manufacturing at SEMICON Taiwan 2025

AI Powers Green Transformation in Global Semiconductor Industry

As computing power requirements continue to climb, the need for sustainable manufacturing has come into sharper focus. Institutions such as the International Energy Agency (IEA) stress the urgency of transitioning away from energy-intensive processes, while governments and leading tech companies worldwide have set net-zero roadmaps. This is driving upstream supply chains to adopt low-carbon and circular-economy solutions, making green transformation the common language of global competitiveness.

As the core of the global supply chain, Taiwan is leveraging AI to boost energy efficiency, recycle water, reduce pollution, and recover e-waste. Backed by the government’s NT$100 billion “AI 10 Major Projects”, expected to generate NT$7 trillion in output by 2028, Taiwan is advancing smart manufacturing and green technologies. With a carbon fee trial set for 2025 and full rollout in 2026, Taiwan is aligning with global sustainability policies while strengthening its long-term competitiveness.

Collaboration Across the Supply Chain: The Key to Sustainability

“Facing the sustainability challenges of the AI era, going it alone is no longer enough – green transformation requires collaboration across the entire supply chain,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “Taiwan’s complete semiconductor ecosystem is one of its greatest advantages in driving sustainable transformation. As a pivotal industry platform, SEMICON Taiwan 2025 will bring together solution providers spanning smart manufacturing, power materials, and green supply chains. With this ecosystem as our foundation, we aim to position Taiwan as a leading force in advancing AI-driven sustainable computing worldwide.”

▲Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI 

SEMICON Taiwan’s Green Manufacturing Area Highlights Circular Economy and Sustainability

The Green Manufacturing Area this year at SEMICON Taiwan will expand by nearly 30%, underscoring rising demand for AI-driven sustainable solutions. Centered on the theme of “Circular Economy Insights,” the area will spotlight diverse topics including water recycling, waste reduction and recovery, air pollution control, high-tech facility management, smart energy management, and carbon asset management, demonstrating the semiconductor industry’s progress in green transformation and sustainable manufacturing. Exhibitors include ABB, Atlas Copco, Atlas, DKK-TOA, Gradiant, Greenfiltec, KINGWAY, Trusval, and Yesiang, presenting comprehensive green solutions from energy efficiency and carbon reduction to circular reuse.

This year’s highly anticipated Semiconductor Sustainability Summit will gather top sustainability executives and green manufacturing leaders, with keynotes from TSMC and Micron, and presentations by Applied Materials, Edwards, Gradiant, Kanken, Lam Research, TEL, Yesiang, and more. Speakers will present practical strategies on leveraging innovation, AI applications, systems thinking, and supply chain collaboration to drive low-carbon processes, energy optimization, water management, and resource recycling, offering the semiconductor industry cutting-edge solutions and actionable pathways for carbon reduction. In addition, the High-Tech Facility International Forum will spotlight the Next-generation Intelligent and Sustainable High-Tech Facilities to explore how AI and digital twins enable smart factories, green manufacturing, and carbon reduction. Industry leaders from MIC, TSMC, and UIS will join a panel on innovations driving intelligent and sustainable infrastructure.

SEMICON Taiwan offers free admission codes for industry professionals through August 31, providing the opportunity to discover how leading global manufacturers achieve environmental sustainability. For more details: Offical Website.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit www.semi.org or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.

• Read more about Uniting for Sustainable Chips: Industry Leaders to Explore How AI Can Advance Energy-Efficient Manufacturing at SEMICON Taiwan 2025

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 10 - 12, 2025. Visit TRI's Booth No. K3070 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions.

TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology, μBump, Cu Pillar, Surface Topology, Profiling, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.

TRI will showcase the Wafer Inspection and metrology Platform, TR7950Q SII, capable of wafer macroscopic 3D inspection and micro measurement metrology. The TR7950Q SII has applications in Advanced WLP, Wafer Frame, Patterned Wafer, Wafer Bumping, WLCSP, Through Silicon Via (TSV), thin film, and more.

TRI will also exhibit the back-end inspection solutions, the TR7007Q SII-S for C4 bumps (~100 μm Ø), Mini-LED, and 008004 paste inspection applications, and the TR7900Q SII-R TRI's Reject Station with A-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps and Cu pillars.

Visit TRI's Booth No. K3070 at SEMICON Taiwan 2025 to explore TRI's SEMI solutions.

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About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

• Read more about Advanced WLP and Back-End Solutions at SEMICON Taiwan 2025

Brewer Science Named 2025 National Top Workplace in Manufacturing Industry

Ninth Consecutive Year Receiving 2025 Top Workplace in Greater St. Louis

Rolla, MO – August 7, 2025 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, has been named a 2025 National Top Workplace in the Manufacturing Industry, marking the fifth consecutive year the company has received this recognition.

Brewer Science has been named 2025 Top Workplaces based on employee feedback

This list is based solely on employee feedback gathered through a third-party survey administered by employee engagement technology partner Energage LLC, a research company with more than 18 years of experience surveying over 27 million employees at 70,000 organizations. Results are calculated by comparing the survey’s research-based statements, including 15 Culture Drivers proven to predict high performance against industry benchmarks.

In addition to being named a National Top Workplace in the Manufacturing Industry, Brewer Science received regional recognition as a 2025 Top Workplace in Greater St. Louis, marking the ninth consecutive year the company has received this recognition.

“Being recognized as a Top Workplace both on a national industry level, as well as locally within our community, speaks volumes to Brewer Science’s dedication in providing our employee-owners with the most fulfilling work experience,” states Dan Brewer, co-CEO at Brewer Science.

Providing customized solutions to customers’ unique, complex situations requires a high regard for a sense of purpose and commitment by everyone within the company. This dedication has been instilled through the company values and creates a workplace flourishing with culture. The employees at Brewer Science are attentive to their roles in the company and the value they articulate to the customers, suppliers, and industry. This has been exemplified by the company becoming Certified Employee-Owned in 2020. Additionally, the company was recognized for meeting the highest corporate social and environmental standards, transparency, and accountability to all stakeholders by becoming a Certified B Corporation™ in 2021.

Learn more about Brewer Science’s company culture and explore career opportunities by visiting our website: https://www.brewerscience.com/about-us/company/careers/

About Brewer Science

Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.

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Company Contact:

Nathan Ayres

Tel: (US) +1.573.364.0444, ext. 1923

Email: [email protected]

Brewer Science Named 2025 National Top Workplace in Manufacturing Industry

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Taiwan Leverages MEMS Strengths to Tap into AI Robotics Boom

【Aug 5th, 2025 – Hsinchu】SEMI today announced that globally acclaimed humanoid robotics expert Professor Hiroshi Ishiguro, known as the “father of android robots,” will return to Taiwan to speak at SEMICON Taiwan 2025. In his keynote, “Avatar and the Future Society,” Professor Ishiguro will explore how robotics is reshaping the global tech landscape. As curator of the “Future of Life” Pavilion at Expo 2025 Osaka-Kansai, his visit aligns with Taiwan’s AI policy vision and highlights new opportunities for the semiconductor and electronics sectors to tap into the rapidly emerging robotics market. His presence also reinforces Taiwan’s global edge in AI and MEMS technologies and SEMICON Taiwan’s role as a leading platform for innovation and collaboration.

▲MEMS & Sensors Forum – Expanding the Sensing Horizon, Ushering in the Robotics Era

"The global MEMS sensor market is on an impressive trajectory, set to grow to $29 billion by 2030, reflecting strong growth momentum," stated Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. "Taiwan's deep strengths covering the entire MEMS value chain – from chip design and sensor manufacturing to advanced packaging and signal processing – position it as a key player in this growth, supported by a complete semiconductor ecosystem. SEMICON Taiwan remains at the forefront of industry dialogue, and this year’s focus on robotics reflects our conviction that it will be the next major growth driver after EVs and AI. Through this global platform, we aim to empower Taiwan’s semiconductor and electronics sectors to capture emerging opportunities and stay ahead of the next wave of innovation.”

▲Robotics Marks Next Growth Driver, Said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI

From Policy to Progress: Robotics to Lead Taiwan’s Next Wave of Tech Innovation

Taiwan is making a massive push into smart robotics, investing NT$200 billion as part of its AI New Top 10 Infrastructure Projects, to generate NT$15 trillion in output by 2040. In line with this vision, SEMICON Taiwan 2025 will feature the MEMS & Sensors Forum – Expanding the Sensing Horizon, Ushering in the Robotics Era, spotlighting the groundbreaking research by Professor Ishiguro, reported by CNN as “Top 8 Geniuses Who Will Change Your Life.”

Famed for his groundbreaking Geminoid series of ultra-realistic humanoid robots, Ishiguro will delve into how avatar technologies promise a future where physical and spatial constraints are a thing of the past. In an era of rapid AI advancement, high-precision sensors are indispensable for equipping robots with autonomous perception. Taiwan's outstanding MEMS and sensor ecosystem, from chip design and advanced packaging to edge computing, offers a powerful springboard for capitalizing on the vast opportunities in this dynamic field.

Taiwan's Tech Prowess: Fostering Global Collaboration in Robotics

"The secret to integrating robots into our daily lives lies in their ability to see, hear, and behave, just like us," explains Ishiguro. "Taiwan's complete ecosystem, spanning everything from chip design to advanced manufacturing, makes it the perfect collaborator. I'm looking forward to presenting my newest research on humanoid robot interaction and discovering fresh avenues for partnership."

▲Professor Hiroshi Ishiguro Will Return to Speak at SEMICON Taiwan 2025

Driving Global Robotics Innovation Through MEMS and Sensor Technologies

At SEMICON Taiwan 2025, Professor Ishiguro will join top industry experts at the MEMS & Sensors Forum to explore the future of robotics and global strategies. Dr. Scott Huang, VP of Techman Robot, will discuss the evolution of cobots toward intelligent integration in the humanoid era. Mina Rezk, Co-founder and CTO of Aeva, will highlight how MEMS and sensor technologies are driving lifelike perception, motion, and interaction in humanoid robots. Dr. Gavin Ho, Chief Strategy Officer at TDK, will offer insights into sensor innovation and its integration in robotics, while Dr. Jwu-Sheng Hu, Executive VP of ITRI, will share the latest trends in AI robotics and industry advancements.

In a critical moment of global tech realignment, the Forum provides a strategic platform for global partnership and ecosystem building with the expected presence of over 200 industry leaders.

Register now and enjoy early bird discounts until August 20. Discover the momentum of AI robotics under the theme “MEMS & Sensors Forum – Expanding the Sensing Horizon, Ushering in the Robotics Era.”For more details: Offical Website.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics.  Visit  www.semi.org  or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.
 

• Read more about Prof. Hiroshi Ishiguro to Share How Humanoid Robotics Will Reshape Society at SEMICON Taiwan 2025

【July 29, 2025 – Hsinchu】Amid soaring demand for high-performance memory in AI computing, Taiwan is solidifying its position as a key hub for memory innovation, powered by its robust supply chain, advanced packaging expertise, and system integration strengths. To meet this industry shift, SEMICON Taiwan 2025 will debut the “Memory Executive Summit” on September 9 at Taipei Nangang Exhibition Center, Hall 2. Centered on the theme “Empowering AI: Exploring the Possibilities of Memory Innovation,” the summit will spotlight breakthroughs and challenges in AI-driven memory, from co-designing memory and compute chips to integrating advanced packaging and fostering collaboration across the entire value chain.

Memory Titans SK hynix, Samsung, and Micron Share the Stage to Shape the AI Era

For the first time, the Memory Executive Summit unites top executives from the world's three leading memory industry giants on a single stage to unveil their respective AI-era R&D innovations and views on market prospects. The discussion will spotlight next-gen technologies, like High-Bandwidth Memory (HBM) and DDR5, and future memory architectures driving AI and accelerated computing.

• Jeff (Joonyong) Choi, VP of SK hynix – Examining key trends in the AI-era memory industry and partnering to redefine standards for HBM and AI computing infrastructure.
• Jangseok Choi, VP, Memory Product Planning of Samsung Electronics – Exploring how next-generation memory innovations are driving AI performance gains and shaping the diverse evolution of memory technologies.
• Nirmal Ramaswamy, Corporate VP of DRAM Technology Development, Micron – Showcasing how the company advances AI with breakthrough DRAM, spotlighting the global memory industry’s diverse innovation paths.

From Design to Integration, SEMICON Taiwan Sparks Industry-Wide Dialogue

The Summit will encompass the full memory supply chain, featuring in-depth conversations between memory executives and industry pioneers in AI chip design, system integration, and specialized applications. This multifaceted dialogue will examine the industry’s future from all perspectives, addressing market demand, real-world applications, and core technology breakthroughs.

• Anki Nalamalpu, Senior VP, Datacenter and AI of MediaTek – Focusing on how leading AI chip designers leverage global partnerships to build the next-generation smart computing ecosystem and define the new industrial framework for the AI era.
• Pei-Ming Chen, President of Winbond – Sharing how Taiwan’s memory makers are securing niche technology advantages amid the AI wave and capturing future growth through customized memory solutions.
• Keh-Chung Wang, Head of Emerging R&D of Macronix – The seasoned Macronix technology leader will share how customized memory innovations address diverse AI-era applications, showcasing the technical strengths of Taiwanese companies.

Register now and enjoy early bird discounts until August 17. Discover the momentum of memory-driven AI under the theme “Leading with Collaboration. Innovating with the World.” For more details: Official website.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics.  Visit  www.semi.org  or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.
 

• Read more about Memory Titans to Unveil Visions for Seizing the AI Lead and Driving Innovation at SEMICON Taiwan