Thermal Interface Materials (TIMs) come in a wide variety of options and are used in a range of applications. Thermal greases, phase-change materials, and silicon pads are just a few examples of TIMs that are used in today’s devices. Each has its own benefits and downsides, but they are all limited in their effectiveness in performing the one essential function of a TIM, conducting heat in an efficient manner. Zeon’s new technology combines the physical characteristics of an elastomer pad with the thermal benefits of a carbon filler to achieve a thermal conductivity of 38 W/mK, a value that is unmatched in the industry.
Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.
This webinar will focus on the performance and technology of such a material while also discussing how it can best benefit the MEMs and Sensors community by creating solutions to thermal problems plaguing the packaging space.
Speaker Bio
Nikhil Jani is a Business Development Specialist representing Zeon Specialty Materials, a San Jose based company and subsidiary of the Zeon corporation a company you may be familiar with for its widely used Electron Beam Resist ZEP520A. He studied Material Science and Engineering at Rutgers University with a focus on semiconductors and polymers. He has co-authored a paper on polymer nanocomposites titled “Non-Destructive Investigation of Dispersion, Bonding, and Thermal Properties of Emerging Polymer Nanocomposites Using Close-Up Lens Assisted Infrared Thermography”. Prior to joining Zeon, he had worked at Morgan Advanced Materials.
Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.
Join us for the 3rd in our Innovative Sensors Webinar Series to explore how Zeon has solved this perennial issue for electronics.
High Efficiency Thermal Interface Materials for the Next Generation of MEMs and Sensor Packages
The MSIG Advanced Sensor Webinar Series
8:00 am - 9:00 am
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Abstract: Quantum sensing often uses atomic systems in vapor phase. This talk will briefly review Twinleaf’s wafer-scale atomic vapor cell fabrication capabilities and some of the applications that have been addressed.
Speaker Bio: Dr. Kornack is an expert in the design, fabrication and operation of atomic magnetometers. At Twinleaf, he has commercialized a wide variety of high performance magnetic field sensors. As a graduate student and a postdoctoral research assistant working with the magnetometer research group at Princeton University, he developed the first laser zero-field SERF magnetometer. He has also developed co-magnetometers for use as a sensitive gyroscope and as a probe into fundamental laws of physics.
Laser Based Magnetic Field Sensor Formation for GMR / TMR Sensor Arrays
Dr. Dirk Lewke, Team Leader Technology Innovation Management
Abstract: This presentation provides a deep inside into a laser-based annealing technology for GMR/TMR sensors, which enables the programming of advanced sensor structures at wafer level. The key feature is the combination of reaching the Curie-Temperature by applying a selective laser spot and an in-situ rotatable magnetic field while wafer travelling at high speed. Unique single sensor field programming enables high quality sensor read-out repeatability.
Speaker Bio: Dr. Dirk Lewke studied mechatronic engineering at the University of Erlangen-Nuremberg. He received his doctorate in 2017. From 2011 to 2017 he worked at Fraunhofer IISB in the field of semiconductor manufacturing equipment as a scientist. Since 2017, Dr. Lewke has been working working at 3D-Micromac as a team leader for process development and technology manager for laser production equipment for semiconductor and photovoltaic industry.
We continue our Advanced Sensor webinar series with dual webinar presentations from technical leads at Twinleaf and 3D-Micromac, covering advanced magnetic sensor design and fabrication.
These amazing devices play a critical role in measuring what we cannot see by their ultra-sensitivity to magnetic currents. Thinking about adding a magnetic sensor to extend the functionality of your device? Then this is the webinar series for you.
Join these technology experts to see how magnetic sensors work, are built and how to utilize them in your products or research.
Design & Fabrication of Ultra-Sensitive Magnetic Sensors
The MSIG Advanced Sensors Webinar Series
8:00 am - 9:00 am
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Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.
Crocus has cracked the code to fabricating and integrating TMR sensors with its XtremeSense(tm) range of magnetic sensors. XtremeSense TMR technology is integrated in the back-end of a standard CMOS process on 8” and 12” wafers enabling single-die sensor products. In fact, Crocus has successfully shipped >100 Million ICs based on the XtremeSense process.
This webinar will focus on the principles of TMR sensor and the technology gains made by Crocus to enable Mass Production of TMR sensors.
Speaker Biography
Dr. Mohan is currently serving as VP of Engineering at Crocus Technology, a Silicon-Valley based Magnetic Sensor Company. He is responsible for Worldwide Applications Engineering and New Product Introduction. He has developed next generation of Integrated Magnetic Devices since 2007 and has 15+ granted patents in the field. Prior to joining Crocus Technology, he has worked at Texas Instruments, Maxim Integrated and Bosch Sensortec.
Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.
During this webinar, hear how Crocus Technology has cracked the code on fabricating and integrating TMR sensors.
Tunnel Magnetoresistance Sensors: From Concept to Commercialization
Innovations in Sensors Webinar Series
8:00 am - 9:00 am
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Add to Calendar2022-12-14 08:00:002022-12-14 09:00:00Tunnel Magnetoresistance Sensors WebinarTunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.
During this webinar, hear how Crocus Technology has cracked the code on fabricating and integrating TMR sensors.Virtual, Online United StatesSEMI.org[email protected]America/Los_Angelespublic
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The Evolution of Electronics
Registration
Registration covers all 3 days of Workshops. No discounts given for partial attendance. Full refunds through December 17, 2022. December 18-January 19 - substitutions only.
SEMI, FlexTech, NBMC & NextFlex Members: $199
Non-Members: $499
If you have any questions, please contact Gity Samadi, [email protected].
Step 2 – Choose Rate Preference, then group rate, type in SJ1
Alternatively, you may email the General Manager at [email protected]
HEALTH AND SAFETY
Your health and safety are our top priority. We monitor developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events. For international attendees arriving from outside of the United States, please review the government travel guidance to confirm eligibility and requirements for travel.
FACE COVERINGS
Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.
Highlighted content
SEMI FlexTech FHE Technical Gap Analysis Workshop - Tues. 1/17 - 8 am-12 noon
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA
During this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop.
SEMI NBMC Technical Gap Analysis Workshop - Tues. 1/17 - 1:00-5:00 pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA
Attendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives. A networking reception will follow the workshop.
Many topics and paths were identified at the previous, very successful workshop in July 2022. This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components. This workshop includes a continental breakfast and lunch.
NextFlex - Hybrid Electronics for Advanced Packaging Workshop - Wed 1/18 2:00 - 7:00 pm & Thurs 1/19 - 8:00 am - 5:00 pm
@NextFlex, 2244 Blach Place, Suite 150, San Jose, CA
As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act, NextFlex is hosting a workshop to align the ecosystem’s vision on how additive hybrid electronics manufacturing can shape the future of domestic advanced semiconductor packaging. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing, proposal concept refinement, and formation of proposal teams.
Breakout topics include:
Direct Write Interconnects
Substrates and Buildup Layers
Interposers, Bridges & Architectures
Circuitization
SEMI & NEXTFLEX Milpitas & San Jose, CA United States
Tuesday, January 17 @ SEMI Milpitas
8:00 am
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8:30 am
Continental Breakfast
SEMI FlexTech FHE Technical Gap Analysis Workshop
8:30 am
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8:45 am
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI
Introduction
8:45 am
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9:00 am
Eric Forsythe, PhD
Program Manager
ARL
RFP Process and Background
9:00 am
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9:15 am
Robert Praino
Chief Innovation Officer & Co-Founder
CHASM Advanced Materials
A Look Back and The Path Ahead & RFP Process
9:15 am
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10:45 am
Breakout Sessions for Technical Gap Analysis
10:45 am
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11:00 am
Break
11:00 am
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11:45 am
Break out Review & Summary
11:45 am
Wrap-Up
12:00 pm
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1:00 pm
Lunch
NBMC Technical Gap Analysis Workshop
1:00 pm
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1:15 pm
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI
Introduction
1:15 pm
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1:30 pm
Gina Tollefson
Program Manager
AFRL
NBMC 2023
1:30 pm
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1:45 pm
Azar Alizadeh
Principal Scientist
GE Research
RFP Process & Insights
1:45 pm
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2:00 pm
Break
2:00 pm
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4:00 pm
NBMC Break Out Sessions
4:00 pm
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4:45 pm
Final Review & Summary
4:45 pm
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5:00 pm
Wrap-Up
5:00 pm
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7:00 pm
Reception & Networking
Wednesday, January 18, 2022
FHE Standards Workshop
8:00 am
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8:30 am
Continental Breakfast
8:30 am
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8:45 am
Gity Samadi
Sr. Director of R&D Programs
SEMI
Paul Trio
Director, SEMI Standards
SEMI
Introduction of Project & Status
8:45 am
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9:15 am
Randall Parker
American Semiconductor
The Need for Standards in Flexible & Printed Electronics
9:15 am
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10:45 am
Breakout Session on Selected Topics
10:45 am
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11:00 am
Break
11:00 am
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11:45 am
Review and Summaries from Breakouts
11:45 am
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12:00 pm
Wrap-Up
12:00 pm
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1:00 pm
Lunch
1:00 pm
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2:00 pm
Travel Time to NextFlex -
For a detailed program agenda for this workshop visit NextFlex.us
Join us for three-days of technology assessments, updates, discovery and planning workshops focused on the development of the electronics ecosystem and flexible, hybrid electronics, medical monitoring sensors, and their application to driving development in new electronics packaging approaches.
Industry experts and leaders will come together to focus on identifying gaps in technology development, including in design, manufacturing, standards and environmental sustainability.
The Evolution of Electronics
2023 Technology Workshops:
- NBMC Gap Analysis
- FHE Gap Analysis
- FHE Standards
- Hybrid Electronics for Advanced Packaging
8:00 am - 5:00 pm
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How to Protect Your Invention
Registration
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
Harvey Kauget practices in the firm's Corporate Practice Group with a focus on intellectual property litigation and prosecution.
Harvey serves a wide-range of clients in the areas of patent, trademark and trade secret litigation, patent and trademark prosecution, IP risk management, portfolio licensing, and client counseling.
Harvey’s litigation and patent prosecution background consists of dealing with matters related to technologies such as: semiconductor processing, plasma dicing, welding systems, lighting and LEDs, hot plates, software, computer integration and networking, satellites, solar power, hydrogen fuel cells, biodiesel, gaming, jewelry, gift cards, cups, davit lift, suntan lotions, power tools, paint rollers, flow systems, nuclear control rods, shirt pressers, air filters, hot water systems, fans, contact lenses, blood plasma expander, disposable blood measuring device, urine analysis, teeth whitening, suture anchors, and medical devices. In addition, he also has experience in a wide-range of other areas including firearms, speakers, waste fuel flare stacks, furniture, exercise equipment, recycling equipment, cement materials, fence posts, and tidal gates.
Mr. Kauget has experience presenting cases before the Court of Appeals for the Federal Circuit and Eleventh Circuit. He is also a registered patent attorney admitted to practice before the U.S. Patent and Trademark office. Before Harvey began his legal career, he worked as an engineer and as a product manager in the semiconductor industry as well as a certified high school chemistry and physics teacher.
Honors & Recognitions
Listed in The Best Lawyers in America®️, "Lawyer of the Year," Trademark Law, Tampa, Florida (2022 & 2023)
Listed in The Best Lawyers in America®️, Information Technology Law since 2008, Litigation - Intellectual Property since 2011, Litigation - Patent since 2011, Patent Law since 2011, Technology Law since 2010, Trademark Law since 2011, Trade Secrets Law since 2021
Named, Chambers USA, Intellectual Property (2021-2022)
Listed in The Best Lawyers in America®️, "Lawyer of the Year," Patent Law, Tampa, Florida (2015, 2018, 2019, & 2021)
Receive practical information on designing, writing and protecting your patents from an experienced and knowledgeable source. This course will review the latest thinking in what is a patentable invention and how to protect your invention. You will learn the basics of disclosing your invention for maximizing your protection, with an opportunity for Q&A at the end. A course useful to inventors at every stage of your careers and every stop in our industry ecosystem.
How to Protect your patent
Flexible Electronics Master Class #14
10:00 am - 12:00 pm
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Add to Calendar2022-11-17 00:00:002022-11-18 00:00:002022 SEMI China Semiconductor Supply Chain International Forum （SEMI China Member Day）Shenzhen ChinaSEMI.org[email protected]America/Los_Angelespublic
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Semiconductor technology advancements and added device complexity put ever more stringent requirements on semiconductor manufacturing process monitor and control. Pressure exerted on devices during grinding, CMP, polishing, lamination, bonding, pick and place encapsulation, electrical testing, and packaging can cause failures that may not even be measurable using conventional sensors.
Currently chip test, monitoring and packaging process control is widely done via optical displacement sensors and electrical testing which do not adequately measure the pressure on devices. Without the ability to adequately monitor these processes, root cause failure identification is challenging and maintaining or improving process quality and yield are difficult.
In this webinar the piezoelectric sensor technology will be described and how it used to improve chip test, monitoring and packaging semiconductor processes.
Learn how high-sensitivity, high dynamic range piezo dynamic force measurement sensors can be used to better measure strain during grinding, CMP, polishing, lamination, and electrical test.
MSIG Webinar: Ultra-sensitive, high bandwidth piezoelectric pressure sensors
First in the Innovative Sensors Webinar Series
8:00 am - 9:00 am
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