Substrate and PCB fabrication processes and its key processes and materials such as ABF, BT, FR5, etc.
Build-up micro-via technologies with use of lasers, plasma, photo materials etc.
Industry 5.0 builds and adapts the components of Industry 4.0 (robotization, automation, IoT, connected machines, smart systems, data analytics, AI, ML) with a focus on sustainability, environmental, social, and well-being of the worker, and optimized human-robot interactions.
With the renewed interest in on-shoring manufacturing in the United States, this breakfast forum is a great opportunity to learn about Industry 5.0 and the ecosystem partners developing these future ideas.
Join the conversation on—
Market Trends, Forecast & Outlook
Industry 4.0 + Transition to 5.0—Challenges + Solutions
Digital Journey–AI/ML, Autonomous Solutions, Digital Twin, etc.
Supply Chain / Disruptions: Linear to Circular Economy and Localized Sourcing
Green Factories of Future—Sustainability
Talent Gap for Upcoming Transformation
Lin Tso | Sr. Program Manager | [email protected]
Analog Devices—ADI
OR
United States
Hosted by Analog Devices
Presented by the SEMI Pacific Northwest Chapter
We Are Excited to Welcome You Back to the Pacific Northwest Forum
Your health and safety are our top priority. SEMI Americas (“SEMI”) monitors developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events.
SEMI will comply with and follow current facility and local government jurisdiction guidelines of the venue's location. The health and safety guidelines outlined below continue to evolve and will be updated as necessary to help support a safe experience for all attendees onsite.
FACE COVERINGS
RELEASE AND WAIVER FORM
ADDITIONAL SAFETY PROTOCOLS
SEMI is committed to upholding the health and safety standards outlined on this page. We will continue to monitor the guidance of public health authorities and government agencies going forward and will make appropriate adjustments in the future based on that guidance. Additional details about policies and procedures will be posted here as they are made available.
Subject to Change. Updated August 18, 2022
Member: $49
Non-Member: $99
Registrants will receive the presentation recording and PDFs of Webinar #2
Taylor Zhao
Manager, Programs & Committees
[email protected]
SiC devices are displacing their incumbent Si counterparts in several high-volume power applications. As SiC market share continues to grow, the industry is lifting the last barriers to mass commercialization that include higher than Si device cost, relative lack of wafer planarity, the presence of defects like basal plane dislocations, reliability and ruggedness concerns, and the need for a workforce skilled in SiC power technology to keep up with the rising demand. To enable cost-effective manufacturing, high-yielding SiC fabrication in conventional Si fabs is desirable.
In this webinar, I will summarize key aspects of SiC fabrication technology and outline non-CMOS compatible processes that have been streamlined to allow for mass SiC chip fabrication in conventional Si mature fabs. The SiC industry has successfully leveraged the Si fab infrastructure and has made the relatively small financial investments required to allow existing Si fabs to process SiC. Consequently, SiC chip fabrication in volume fabs alongside Si has emerged as a “cost reduction” model that exploits “silicon” manufacturing economies of scale. Today’s SiC fab infrastructure is vibrant, mirrors that of silicon, and is rapidly expanding.
United States
Now Available On-Demand!
Join us online as we dive into SiC fabrication technology and non-CMOS compatible processes that have been streamlined to allow for mass SiC chip fabrication in conventional Si mature fabs.
PRICING
Regular Pricing:
Member: $100 | Non-member: $125
Cancellation Policy
Registration is final. No refunds provided. No substitutions.
Become a Sponsor
Sponsorships can be tailored to meet your branding and marketing objectives. Become a sponsor and brand your company at the Texas Chapter Spring Breakfast Forum.
Contact Tim Janes, [email protected] to learn about available sponsorship opportunities.
Program Questions
Contact Eric Rude, [email protected]
The SEMI Texas Spring Forum brings together industry executives, technologists, policymakers, academic leaders, and downstream enterprises — from GPU/accelerator companies to cloud, automotive, industrial, and system OEMs. Together, we will explore how Texas can harness AI, digitalization, and cross-ecosystem collaboration to lead in next-generation chip production and full-stack system integration.
A central focus will be aligning materials and equipment suppliers, foundries, OSATs, and EDA providers, and advanced packaging organizations with the roadmaps of AI and HPC leaders, ensuring silicon, systems, and software evolve cohesively and efficiently.
Applied Materials
9700 US HWY 290 East, Building 32
Austin, TX 78724
United States
Hear from leaders across the ecosystem, including Applied Materials, AMD, Cadence, Entegris NVIDIA, Texas Instrument, and Texas Chip Office.
San Francisco
United States
Milpitas, CA 95035
United States
No Registration Fee Required.
Thermal Interface Materials (TIMs) come in a wide variety of options and are used in a range of applications. Thermal greases, phase-change materials, and silicon pads are just a few examples of TIMs that are used in today’s devices. Each has its own benefits and downsides, but they are all limited in their effectiveness in performing the one essential function of a TIM, conducting heat in an efficient manner. Zeon’s new technology combines the physical characteristics of an elastomer pad with the thermal benefits of a carbon filler to achieve a thermal conductivity of 38 W/mK, a value that is unmatched in the industry.
Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.
This webinar will focus on the performance and technology of such a material while also discussing how it can best benefit the MEMs and Sensors community by creating solutions to thermal problems plaguing the packaging space.
Nikhil Jani is a Business Development Specialist representing Zeon Specialty Materials, a San Jose based company and subsidiary of the Zeon corporation a company you may be familiar with for its widely used Electron Beam Resist ZEP520A. He studied Material Science and Engineering at Rutgers University with a focus on semiconductors and polymers. He has co-authored a paper on polymer nanocomposites titled “Non-Destructive Investigation of Dispersion, Bonding, and Thermal Properties of Emerging Polymer Nanocomposites Using Close-Up Lens Assisted Infrared Thermography”. Prior to joining Zeon, he had worked at Morgan Advanced Materials.
Online, Virtual
United States
Technology has been miniaturizing at a rapid pace, while the demand for processing power has increased. This has led to a bottleneck in thermal management, that Zeon aims to remedy with it’s high-performance TIM pads.
Join us for the 3rd in our Innovative Sensors Webinar Series to explore how Zeon has solved this perennial issue for electronics.
Registration is underwritten by SEMI MSIG
Tom Kornack, Chief Scientist, Twinleaf LLC
Abstract: Quantum sensing often uses atomic systems in vapor phase. This talk will briefly review Twinleaf’s wafer-scale atomic vapor cell fabrication capabilities and some of the applications that have been addressed.
Speaker Bio: Dr. Kornack is an expert in the design, fabrication and operation of atomic magnetometers. At Twinleaf, he has commercialized a wide variety of high performance magnetic field sensors. As a graduate student and a postdoctoral research assistant working with the magnetometer research group at Princeton University, he developed the first laser zero-field SERF magnetometer. He has also developed co-magnetometers for use as a sensitive gyroscope and as a probe into fundamental laws of physics.
Dr. Dirk Lewke, Team Leader Technology Innovation Management
Abstract: This presentation provides a deep inside into a laser-based annealing technology for GMR/TMR sensors, which enables the programming of advanced sensor structures at wafer level. The key feature is the combination of reaching the Curie-Temperature by applying a selective laser spot and an in-situ rotatable magnetic field while wafer travelling at high speed. Unique single sensor field programming enables high quality sensor read-out repeatability.
Speaker Bio: Dr. Dirk Lewke studied mechatronic engineering at the University of Erlangen-Nuremberg. He received his doctorate in 2017. From 2011 to 2017 he worked at Fraunhofer IISB in the field of semiconductor manufacturing equipment as a scientist. Since 2017, Dr. Lewke has been working working at 3D-Micromac as a team leader for process development and technology manager for laser production equipment for semiconductor and photovoltaic industry.
Online, Virtual
United States
We continue our Advanced Sensor webinar series with dual webinar presentations from technical leads at Twinleaf and 3D-Micromac, covering advanced magnetic sensor design and fabrication.
These amazing devices play a critical role in measuring what we cannot see by their ultra-sensitivity to magnetic currents. Thinking about adding a magnetic sensor to extend the functionality of your device? Then this is the webinar series for you.
Join these technology experts to see how magnetic sensors work, are built and how to utilize them in your products or research.
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Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.
Crocus has cracked the code to fabricating and integrating TMR sensors with its XtremeSense(tm) range of magnetic sensors. XtremeSense TMR technology is integrated in the back-end of a standard CMOS process on 8” and 12” wafers enabling single-die sensor products. In fact, Crocus has successfully shipped >100 Million ICs based on the XtremeSense process.
This webinar will focus on the principles of TMR sensor and the technology gains made by Crocus to enable Mass Production of TMR sensors.
Speaker Biography
Dr. Mohan is currently serving as VP of Engineering at Crocus Technology, a Silicon-Valley based Magnetic Sensor Company. He is responsible for Worldwide Applications Engineering and New Product Introduction. He has developed next generation of Integrated Magnetic Devices since 2007 and has 15+ granted patents in the field. Prior to joining Crocus Technology, he has worked at Texas Instruments, Maxim Integrated and Bosch Sensortec.
Virtual, Online
United States
Tunnel Magnetoresistance Sensors (TMS) have been demonstrated to have high sensitivity and low power consumption compared to other magnetic sensing methods. However, challenges in fabricating the TMR element has prevented mass-production and adoption of these sensors in wider industrial and automotive applications.
During this webinar, hear how Crocus Technology has cracked the code on fabricating and integrating TMR sensors.
