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Technical

Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #4.

Taylor Zhao
Manager, Programs & Committees
[email protected]

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United States Register Now Business Technical

SiC—Silicon Carbide Webinar #4: Understanding Sic Chip Cost, the Impact of Defects, and the Case of Price Parity With Si at the System Level

Silicon devices are dominating power electronics due to their excellent starting material quality, streamlined fabrication, low-cost volume production, proven reliability and ruggedness, and design/circuit legacy. Although Si power devices continue to make progress, they are approaching their operational limits primarily due to their relatively low bandgap and critical electric field that result in high conduction and switching losses, and poor high temperature performance.

SiC power chips are gaining significant market share and are projected to capture over 30% of the power chip market by 2029. Their cost, however, remains above that of similarly rated silicon chips and increases disproportionately with area. In this presentation, various elements of SiC chip cost will be qualitatively analyzed including contributions of substrate, epitaxy, and chip manufacturing. Material defects will be discussed in terms of their impact on chip area scalability and yields, and wafer test maps will be presented to elucidate their correlation. Finally, the case of system-level price parity between Si and SiC will be made, achieved primarily through reduced mass and volume of magnetic components, and simplified thermal management

 

View other webinars in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology 
  • Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity With Si at the System Level 
  • Webinar #5—SiC Edge Termination Technology

 

Meet the Speaker

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Now Available On-Demand!

Join us online for the fourth webinar in the Silicon Carbide Series—Understanding SiC chip cost, the impact of defects, and the case of price parity with Si at the system level.

Off Add to Calendar Disabled America/Los_Angeles 1
Event format
SEMICON West Technical
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Moscone Center
San Francisco, CA
United States

Device Maker Morning Meeting - Thursday, October 15th - Room TBD

9:00 am - 12:00 pm

Device Maker Morning Meeting

12:00 pm - 1:30 pm

Lunch - DMs Only - Room TBD

Sponsorship Available

Afternoon Speed Networking Event - Thursday, October 15th - Room TBD

1:30 pm - 4:30 pm

Speed Networking Event

10 Minute Mini Meetings (Scheduled in advance)

4:30 pm - 5:00 pm

Mini Reception

FOA

This is an FOA Members Only Event - For questions on membership or anything FOA-related contact us at [email protected]

 

Device Maker Morning Meeting and Speed Networking Event

9:00 am - 5:00 pm Off Add to Calendar 2026-10-15 09:00:00 2026-10-15 17:00:00 FOA Speed Networking Event This is an FOA Members Only Event - For questions on membership or anything FOA-related contact us at [email protected]   Device Maker Morning Meeting and Speed Networking Event Moscone Center San Francisco, CA United States SEMI.org [email protected] America/Los_Angeles public
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Belgium France Germany Ireland Italy United States Register Now ALD Web 2023 On Demand Technical Featured Speakers
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United States

Dilip Deshpande Beneq
Dilip Deshpande
Director, Business Development & Sales
Beneq
Paul Carey, SEMI
Moderator
Paul Carey
Sr. Director
SEMI MSIG
MSIG

Micro-electromechanical systems, or MEMS, constitute many devices that combine electrical and mechanical components, range in size from a few microns to millimeters, and are often fabricated using traditional semiconductor manufacturing processes. ALD builds material up Angstroms at a time with high conformality, even on complex geometries.

For MEMS and Sensor fabrication, including inkjet heads, pressure sensors, and microfluidics, ALD offers the most precision deposition technique on the market. Beneq ALD solutions include a wide range of materials and processes, making it simple to coat tiny, complicated components with anti-stiction, piezoelectric, or barrier films.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Vancouver
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Belgium France Germany Japan South Korea Taiwan United States Watch Now MS14 Webinar on demand Technical Featured Speakers
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SPEAKERS

 

Dr. Sreeni Rao has been in the MEMS sensing and semiconductor sector for the last 25 years, and has previously held technical and business leadership positions at Texas Instruments, IBM, Analog Devices, Qualtre, Inc., TDK and currently is GM, Gas and Environmental Sensing at Interlink Electronics. He has a PhD in ECE from University of California, Irvine and an MBA from Northeastern University. 

Radislav Potyrailo is a Principal Scientist at GE Research and the Chair of the Device Working Group of the MEMS and Sensors Industry Group. Radislav has been leading multiple programs for gas, chemical, and biological detection on inventing new sensing systems and bringing them from lab feasibility studies, to field validation, and to commercialization.  He has MS degree in Optoelectronics from Kyiv Polytechnic Institute and PhD in Analytical Chemistry from Indiana University. 

Ryotaro Sakauchi is a Senior Manager at Robert Bosch LLC and is responsible for Business Development of Bosch Sensortec’s MEMS sensors for the consumer market. He has been in the MEMS sensor sector for the last 13 years and has previously held technical and business positions at Bosch’s USA and Japan locations. He has a Bachelor’s degree of Liberal Arts from International Christian University in Japan.

Virtual, Online
United States

Paul Carey
Paul Carey
Sr. Director
SEMI MSIG
Sreeni Rao
Dr. Sreeni Rao
GM of Gas & Environmental Sensing
Interlink Electronics
Radislav Potyrailo
Radislav Potyrailo
Principle Scientist
GE Research
Ryotaro Sakauchi Bosch Sensortec
Ryotaro Sakauchi
Senior Manager Business Development
Bosch Sensortec
MSIG Standards

As miniature gas sensors become increasingly popular, especially for emerging applications, it is important for the gas sensor device community to adhere to standard ways of describing them. We propose that the first step in doing so is to standardize the set of functional parameters thatform the core of a gas sensor specification.

This presentation dives into the basic list of parameters, their definitions and measurement units, and where applicable, testing procedures, that we recommend be part of a standard gas sensor datasheet.

12:00 am - 12:00 am Off Add to Calendar Disabled America/Los_Angeles
United States SEMI SiC Silicon Carbide Webinar Series Business Technical

SiC—Silicon Carbide Webinar #5:

Topic: SiC Edge Termination Technology 

 

The nine to tenfold increase in critical electric field strength of SiC over Si allows high voltage blocking layers to be fabricated significantly thinner than those of similarly rated Si devices. This reduces device on-state resistance and capacitance, and therefore the associated conduction and switching losses, while maintaining high-voltage breakdown capability. However, lack of a well-designed edge termination structure diminishes the high voltage performance of SiC power devices. Indeed, under reverse bias, planar junctions exhibit breakdown voltages well below the ideal SiC drift layer limit because of electric field crowding at the junction periphery. Consequently, to maximize breakdown voltage, specialized edge termination structures are utilized. In this webinar, common structures that enhance the breakdown voltage of power SiC devices like metal field plates, floating guard rings, multiple-Junction-Termination-Extensions, and beveled edge terminations will be discussed. Emphasis will be placed on optimizing their fabrication by minimizing photolithography levels and processing complexity, while ensuring robust breakdown voltage capability at high wafer yields. 

 

Meet the Speaker

Biography

United States

Now Available On-Demand!

Join us online for the fifth webinar in the Silicon Carbide Series.

9:00 am - 10:00 am Off Add to Calendar 2023-12-07 09:00:00 2023-12-07 10:00:00 SiC—Silicon Carbide Webinar Series Now Available On-Demand! Join us online for the fifth webinar in the Silicon Carbide Series. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles 1 Register Now
Event format
United States Business Technical
  • Learn about 10,000+ semiconductor jobs you didn't know existed 

  • Meet with professionals and executives during the Networking Lunch and Networking Sessions 

  • Learn how you can connect with 2100+ employers in the microelectronics industry 

  • Engage a mentor for career development guidance, resume building, interview skills

  • Enjoy FREE FOOD 

  • Day in a Life

  • Students are welcome to come and go 

  • Students to join in-person

  • Raffle Prizes!

Edwards Vacuum, LLC
2411 E. Germann Road
Chandler, AZ 85286
United States

3:00 pm

Check in | Snacks & Water - Prizes, swags, gift cards, etc. 

3:15 pm

Welcome & SEMI Arizona Chapter Introduction  

3:30 pm

Semiconductor 101- Industry Overview and Career Opportunities   

3:50 pm

How to Find Employment, and How to Leverage Face to Face vs Online Relationships 

4:10 pm

Tips On How to Succeed in a Technical Interview and Preparing a Technical Resume, Skills Set Needed  

4:30 pm

Day in a Life of Technician, Production Supervisor and Engineer 

5:00 pm

Panel Discussion with Industry Leaders and Networking 

5:30 pm

Speed Interviews – Students and Industry  

6:00 pm

Adjourn 

A Professional Development Seminar Organized by SEMI Arizona Chapter

Jobs in the Micro- and Nano-Electronics Industry: Connecting College Students to Industry

Attendance is free, but registration is required. Register by April 15, 2023.  

3:00 pm - 6:00 pm Off Add to Calendar 2023-04-26 15:00:00 2023-04-26 18:00:00 SEMI Professional Development Seminar with Maricopa Community Colleges A Professional Development Seminar Organized by SEMI Arizona Chapter Jobs in the Micro- and Nano-Electronics Industry: Connecting College Students to Industry Attendance is free, but registration is required. Register by April 15, 2023.   Edwards Vacuum, LLC 2411 E. Germann Road Chandler, AZ 85286 United States SEMI.org [email protected] America/Los_Angeles public
United States Register Now Business Technical
  • Learn about 10,000+ semiconductor jobs you didn't know existed 

  • Meet with professionals and executives during the Networking Lunch and Networking Sessions 

  • Learn how you can connect with 2100+ employers in the microelectronics industry 

  • Engage a mentor for career development guidance 

  • Enjoy FREE FOOD 

  • Students are welcome to come and go 

  • Students may join In-Person (preferred) or virtually (if you cannot attend in person) 

  • Raffle Prizes every hour! 

Oregon State University
Kelley Engineering Room 1001  
Corvallis, OR 97331
United States

10:00 am

Welcome & SEMI PNW Chapter Introduction (Coffee + Pastries)

10:10 am

High Tech Companies 101

Industry Overview and Career Opportunities    

10:30 am

Resume Building + Interviewing Skills

10:50 am

Pitch Like A Pro

Landing a Job in Semiconductors (includes information on the average/median salary of the industry)

11:15 am

Diversity, Equity and Inclusion

11:30 am

Environmental/Sustainability

11:45 am

Day in the Life of an Engineer –Transitioning from University to Industry 

12:00 pm

Networking Lunch with Industry Leaders

Across the Hall-Room 1007

2:00 pm

Adjourn 

A Professional Development Seminar Organized by SEMI Pacific Northwest Chapter

Attendance is free, but registration is required. Register by April 3, 2023.  

10:00 am - 2:00 pm Off Add to Calendar 2023-04-12 10:00:00 2023-04-12 14:00:00 SEMI Professional Development Seminar with Oregon State University A Professional Development Seminar Organized by SEMI Pacific Northwest Chapter Attendance is free, but registration is required. Register by April 3, 2023.   Oregon State University Kelley Engineering Room 1001   Corvallis, OR 97331 United States SEMI.org [email protected] America/Los_Angeles public
Malaysia Singapore Register Now! Executive Technical

Co-Organizer

InvestSelangor_Logo

Supporting Partners

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This course will cover:

  • Substrate and PCB fabrication processes and its key processes and materials such as ABF, BT, FR5, etc.

  • Build-up micro-via technologies with use of lasers, plasma, photo materials etc.

  • Registration and tolerances of substrate design in relation to substrate and PCB fabrication processes which includes via to pattern, pattern to resist etc, which can affect microelectronics assembly processes.

  • Materials, design and surface finishes (Cu, NiAu, ENIG , NiPdAu etc) with respect to assembly processes and parameters.

  • Substrate defects and package reliability including failure of fatigue, kirkendall voids and intermetallics.

Why should I attend?

  • Provides necessary technical knowledge for industry professionals
  • Enhance knowledge in manufacturing and R&D know-how in IC packaging
  • Case studies discussion
  • Networking Opportunity with industry peers

Who should attend?

  • Directors, managers, process engineers, R&D engineers working in the areas of microelectronics
  • Useful for sale or application engineers who supply packaging materials and tools to the industry

Malaysian International Trade & Exhibition Centre (MITEC)
No. 8 Jalan Dutamas 2
50480 Kuala Lumpur
Kuala Lumpur
Malaysia

Image of Dr Lee Teck Kheng
MEET OUR TRAINER
Dr. Lee Teck Kheng
Director, Technology Development Centre, Institute of Technical Education Singapore,
SEMI SEA Advance Packaging Technical Committee Member

Note: Program is subject to changes.

9:00 am - 9:10 am

Opening Address by Invest Selangor

9:10 am - 12:00 pm

Substrate & PCB Materials and Fabrication Flow

- Introduction

- Core Materials – FR4, BT, ABF etc.

- Key Processes
- Mechanical, laser drilling
- Patterning exposure, develop, etch, strip
- Electroless and electrolytic plating
- Lamination and buildup
- 2 Layer fabrication flow

12:00 pm - 1:00 pm

Lunch

1:00 pm - 4:00 pm

Design and Tolerances Affecting Packaging

- Mechanical registration and tolerances

- Cu patterning registration and tolerances

- Solder registration and tolerances

- Substrate challenges and constraints

- Plating finishes

- Problem solving exercises on Assembly Challenges

4:00 pm - 5:00 pm

Q&A Discussion

5:00 pm

End of Day 1

9:00 am - 12:00 pm

Assembly Challenges and Defects

- Assembly differences in PCB and substrate

- Surface finishes for assembly
- Substrate surface finishes for packaging, soft Ni/Au for wirebonding, ball attach
- PCB surface finishes for 2nd interconnect, ENIG, NiPdAu and Cu with OSP

- Strip warpage
- Thermal stress and shrinkage affecting warpage
- Slots, Cu patterning and solder resist thickness impacting warpage

- Other assembly challenges

- Solder cracks, solder balling, component lifting, poor wetting, flux residue

12:00 pm - 1:00 pm

Lunch

1:00 pm - 2:30 pm

Reliability

- Interconnect reliability
- Intermetallic failure, interdiffusion
- Fatigue and creep failure

2:30 pm - 3:30 pm

Q&A Discussion

3:30 pm - 3:40 pm

Lucky Draw

3:40 pm

End of Workshop

- Workforce Development

Interaction of Substrate and PCB to Microelectronics Packaging Assembly and Reliability

Substrate and PCB technologies are the building blocks for Microelectronics Packaging and surface mount packages.

Course Fee:

Member Rate: SGD 750
Non-member Rate: SGD 935

Register before 6 March 2023 to enjoy Early Bird rate of up to 15% off the rates above.

This workshop is HRDC Claimable, subjecting to terms and conditions.

Certificate of completion will be awarded at the end of the workshop.

 

Off Add to Calendar 2023-03-08 00:00:00 2023-03-09 00:00:00 [IN-PERSON] Advanced Packaging Training Seminar 2023 Interaction of Substrate and PCB to Microelectronics Packaging Assembly and Reliability Substrate and PCB technologies are the building blocks for Microelectronics Packaging and surface mount packages. Course Fee: Member Rate: SGD 750 Non-member Rate: SGD 935 Register before 6 March 2023 to enjoy Early Bird rate of up to 15% off the rates above. This workshop is HRDC Claimable, subjecting to terms and conditions. Certificate of completion will be awarded at the end of the workshop.   Malaysian International Trade & Exhibition Centre (MITEC) No. 8 Jalan Dutamas 2 50480 Kuala Lumpur Kuala Lumpur Malaysia SEMI.org [email protected] Asia/Singapore public Asia/Singapore