In-person live event
March 08 - 09, 2023
MIDA Sentral, No. 5, Jalan Stesen Sentral 5
50470 Federal Territory of Kuala Lumpur
Kuala Lumpur
Malaysia
Interaction of Substrate and PCB to Microelectronics Packaging Assembly and Reliability
Substrate and PCB technologies are the building blocks for Microelectronics Packaging and surface mount packages
This course will cover:
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Substrate and PCB fabrication processes and its key processes and materials such as ABF, BT, FR5, etc.
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Build-up micro-via technologies with use of lasers, plasma, photo materials etc.
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Registration and tolerances of substrate design in relation to substrate and PCB fabrication processes which includes via to pattern, pattern to resist etc, which can affect microelectronics assembly processes.
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Materials, design and surface finishes (Cu, NiAu, ENIG , NiPdAu etc) with respect to assembly processes and parameters.
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Substrate defects and package reliability including failure of fatigue, kirkendall voids and intermetallics.
This workshop is HRDC Claimable, subjecting to terms and conditions.
Certificate of completion will be awarded at the end of the workshop.
Advanced Packaging Workshop
MIDA Sentral, No. 5, Jalan Stesen Sentral 5
50470 Federal Territory of Kuala Lumpur
Kuala Lumpur
Malaysia
UTC +08:00
CSTS
China Standard Time
Keynote Speakers
Agenda
UTC +08:00
CST
China Standard Time
Note: Program is subject to changes.
Note: Program is subject to changes.
Why should I attend?
- Provides necessary technical knowledge for industry professionals
- Enhance knowledge in manufacturing and R&D know-how in IC packaging
- Case studies discussion
- Networking Opportunity with industry peers
Who should attend?
- Directors, managers, process engineers, R&D engineers working in the areas of microelectronics
- Useful for sale or application engineers who supply packaging materials and tools to the industry