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Technical

Registration

Sponsor tile for Jan workshops

Registration covers all 3 days of Workshops.  No discounts given for partial attendance.  Full refunds through December 17, 2022.  December 18-January 19 - substitutions only.

SEMI, FlexTech, NBMC & NextFlex Members:  $199

Non-Members:  $499

If you have any questions, please contact Gity Samadi, [email protected].

Sponsor tile for Jan workshops
United States Register Now EofE Vertical Sponsor Logos Business Executive Technical

Hotel Information

SEMI has secured a Group Rate at the Staybridge Suites at 321 Cypress Drive, Milpitas, CA, at the special rate of $202/night with breakfast included.  

To reserve the rate visit Staybridge Suite website and follow these steps:

Step 1 – Enter your dates

Step 2 – Choose Rate Preference, then group rate, type in SJ1

Alternatively, you may email the General Manager at [email protected]

HEALTH AND SAFETY

Your health and safety are our top priority.  We monitor developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events.  For international attendees arriving from outside of the United States, please review the government travel guidance to confirm eligibility and requirements for travel.

FACE COVERINGS 

  • Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.

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SEMI FlexTech FHE Technical Gap Analysis Workshop  - Tues. 1/17 - 8 am-12 noon
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

During this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop.

SEMI NBMC Technical Gap Analysis Workshop - Tues. 1/17 - 1:00-5:00 pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

Attendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives.  A networking reception will follow the workshop.

SEMI FlexTech - FHE Standards Workshop - Wed 1/18 - 8:00am - 1:00pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA

Many topics and paths were identified at the previous, very successful workshop in July 2022.  This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components.  This workshop includes a continental breakfast and lunch.

NextFlex - Hybrid Electronics for Advanced Packaging Workshop - Wed 1/18 2:00 - 7:00 pm & Thurs 1/19 - 8:00 am - 5:00 pm
@NextFlex, 2244 Blach Place, Suite 150, San Jose, CA

As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act, NextFlex is hosting a workshop to align the ecosystem’s vision on how additive hybrid electronics manufacturing can shape the future of domestic advanced semiconductor packaging. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing, proposal concept refinement, and formation of proposal teams.

Breakout topics include:

  • Direct Write Interconnects
  • Substrates and Buildup Layers
  • Interposers, Bridges & Architectures
  • Circuitization

SEMI & NEXTFLEX
Milpitas & San Jose, CA
United States

Tuesday, January 17 @ SEMI Milpitas

8:00 am - 8:30 am

Continental Breakfast

SEMI FlexTech FHE Technical Gap Analysis Workshop

8:30 am - 8:45 am
Melissa Grupen-Shemansky, SEMI
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI

Introduction

8:45 am - 9:00 am
Eric Forsythe, PhD
Program Manager
ARL

RFP Process and Background

9:00 am - 9:15 am
Bob Pranio, CHASM
Robert Praino
Chief Innovation Officer & Co-Founder
CHASM Advanced Materials

A Look Back and The Path Ahead & RFP Process

9:15 am - 10:45 am

Breakout Sessions for Technical Gap Analysis

10:45 am - 11:00 am

Break

11:00 am - 11:45 am

Break out Review & Summary

11:45 am

Wrap-Up

12:00 pm - 1:00 pm

Lunch

CHASM Technologies Logo

NBMC Technical Gap Analysis Workshop

1:00 pm - 1:15 pm
Melissa Grupen-Shemansky, SEMI
Melissa Grupen-Shemansky
CTO & VP, Technology Communities
SEMI

Introduction

1:15 pm - 1:30 pm
Gina Tollefson
Program Manager
AFRL

NBMC 2023

1:30 pm - 1:45 pm
Azar Alizadeh
Principal Scientist
GE Research

RFP Process & Insights

1:45 pm - 2:00 pm

Break

2:00 pm - 4:00 pm

NBMC Break Out Sessions

4:00 pm - 4:45 pm

Final Review & Summary

4:45 pm - 5:00 pm

Wrap-Up

5:00 pm - 7:00 pm

Reception & Networking

CMU Logo

Wednesday, January 18, 2022

FHE Standards Workshop

8:00 am - 8:30 am

Continental Breakfast

8:30 am - 8:45 am
Gity Samadi
Gity Samadi
Sr. Director of R&D Programs
SEMI
PT
Paul Trio
Director, SEMI Standards
SEMI

Introduction of Project & Status

8:45 am - 9:15 am
Randall Parker
Randall Parker
American Semiconductor

The Need for Standards in Flexible & Printed Electronics

Bayflex logo
9:15 am - 10:45 am

Breakout Session on Selected Topics

10:45 am - 11:00 am

Break

11:00 am - 11:45 am

Review and Summaries from Breakouts

11:45 am - 12:00 pm

Wrap-Up

12:00 pm - 1:00 pm

Lunch

UW SoEngineering logo
1:00 pm - 2:00 pm

Travel Time to NextFlex -

For a detailed program agenda for this workshop visit NextFlex.us

- FlexTech MSIG Standards

Join us for three-days of technology assessments, updates, discovery and planning workshops focused on the development of the electronics ecosystem and flexible, hybrid electronics, medical monitoring sensors, and their application to driving development in new electronics packaging approaches.

Industry experts and leaders will come together to focus on identifying gaps in technology development, including in design, manufacturing, standards and environmental sustainability. 

8:00 am - 5:00 pm Off Add to Calendar Disabled America/Los_Angeles

Registration

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

United States Harvey Kauget with Title Business Technical
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Harvey Kauget practices in the firm's Corporate Practice Group with a focus on intellectual property litigation and prosecution.

Harvey serves a wide-range of clients in the areas of patent, trademark and trade secret litigation, patent and trademark prosecution, IP risk management, portfolio licensing, and client counseling.

Harvey’s litigation and patent prosecution background consists of dealing with matters related to technologies such as: semiconductor processing, plasma dicing, welding systems, lighting and LEDs, hot plates, software, computer integration and networking, satellites, solar power, hydrogen fuel cells, biodiesel, gaming, jewelry, gift cards, cups, davit lift, suntan lotions, power tools, paint rollers, flow systems, nuclear control rods, shirt pressers, air filters, hot water systems, fans, contact lenses, blood plasma expander, disposable blood measuring device, urine analysis, teeth whitening, suture anchors, and medical devices. In addition, he also has experience in a wide-range of other areas including firearms, speakers, waste fuel flare stacks, furniture, exercise equipment, recycling equipment, cement materials, fence posts, and tidal gates.

Mr. Kauget has experience presenting cases before the Court of Appeals for the Federal Circuit and Eleventh Circuit. He is also a registered patent attorney admitted to practice before the U.S. Patent and Trademark office. Before Harvey began his legal career, he worked as an engineer and as a product manager in the semiconductor industry as well as a certified high school chemistry and physics teacher.

Honors & Recognitions

  • Listed in The Best Lawyers in America®️, "Lawyer of the Year," Trademark Law, Tampa, Florida (2022 & 2023)
  • Listed in The Best Lawyers in America®️, Information Technology Law since 2008, Litigation - Intellectual Property since 2011, Litigation - Patent since 2011, Patent Law since 2011, Technology Law since 2010, Trademark Law since 2011, Trade Secrets Law since 2021
  • Named, Chambers USA, Intellectual Property (2021-2022)
  • Listed in The Best Lawyers in America®️, "Lawyer of the Year," Patent Law, Tampa, Florida (2015, 2018, 2019, & 2021)
  • Florida Trend, "Legal Elite," Intellectual Property Rights (2005, 2007-2008, 2010-2016, 2018, 2020-2021)
  • Florida Super Lawyers, Intellectual Property (2009, 2011-2021)

United States

CAST EMG ESD Alliance FlexTech MSIG SOI

Receive practical information on designing, writing and protecting your patents from an experienced and knowledgeable source. This course will review the latest thinking in what is a patentable invention and how to protect your invention. You will learn the basics of disclosing your invention for maximizing your protection, with an opportunity for Q&A at the end.  A course useful to inventors at every stage of your careers and every stop in our industry ecosystem.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
Event format
United States Register Now MSIG PZ Webinar tile Business Technical Featured Speakers

Semiconductor technology advancements and added device complexity put ever more stringent requirements on semiconductor manufacturing process monitor and control. Pressure exerted on devices during grinding, CMP, polishing, lamination, bonding, pick and place encapsulation, electrical testing, and packaging can cause failures that may not even be measurable using conventional sensors.

Currently chip test, monitoring and packaging process control is widely done via optical displacement sensors and electrical testing which do not adequately measure the pressure on devices. Without the ability to adequately monitor these processes, root cause failure identification is challenging and maintaining or improving process quality and yield are difficult.

In this webinar the piezoelectric sensor technology will be described and how it used to improve chip test, monitoring and packaging semiconductor processes.

United States

Jim Macy Kistler
Jim Macy
Application Expert BU Advanced Manufacturing
Kistler Instrument Corp.
Robert Hillinger
Robert Hillinger
Kistler Instrument Corp.
Paul Carey, SEMI
Paul Carey
Director
SEMI MSIG
MSIG

Learn how high-sensitivity, high dynamic range piezo dynamic force measurement sensors can be used to better measure strain during grinding, CMP, polishing, lamination, and electrical test. 

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
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Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #6.

Krish Raghunath
Sr Specialist, Conferences & Committees
[email protected]

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United States SiC Webinar 6 Business Technical

SiC—Silicon Carbide Webinar #6: Basal Plane Dislocation Defects and the Impact on Device Performance

 

Silicon carbide (SiC) chips are displacing their incumbent silicon counterparts in several high-volume power applications. As SiC market share continues to grow, the industry is lifting remaining barriers to mass commercialization including the higher-than-silicon chip cost that increases disproportionately with area, defects that limit chip yield and area, reliability and ruggedness concerns, and the need for a trained workforce to skillfully insert SiC into power electronics circuits.

With respect to fabrication, the SiC industry is successfully leveraging the fully depreciated legacy silicon fab infrastructure and is making the relatively small financial investments that allow mature silicon fabs to process SiC. A key aspect of cost-effective fabrication is limiting defects that degrade device performance and compromise yields. Over the past twenty years, significant progress has been made in improving SiC material quality, and Basal-Plane-Dislocations (BPDs) are the last major catastrophic defect. In this presentation, I will discuss how bipolar-current induced electron-hole pair recombination at basal plane dislocations generates stacking fault (SF) formation and expansion, which degrade on-state current conduction. I will present and interpret experimental data of several transistors that exhibit severe BPD related electrical degradation, and of others that demonstrate “intermediate” or no degradation at all. For impacted transistors, I will identify and analyze the electrical characteristics that exhibit degradation as well as those that remain unaffected under bipolar stress. Finally, I will show that BPD related degradation is fully reversed by high temperature annealing, and the transistor returns to its original “undamaged” operational state.

 

View other webinars in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology
  • Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level
  • Webinar #5—SiC Edge Termination Technology

 

Meet the Speaker

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Join us online for the sixth webinar in the Silicon Carbide Series.

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles 1 Register Now
Event format