Weihai
China
Wuhu
China
Wuhu
China
Registration
Member: $49
Non-Member: $99
Registrants will receive the presentation recording and PDFs of Webinar #6.
Taylor Zhao
Manager, Programs & Committees
[email protected]
SiC—Silicon Carbide Webinar #6: Basal Plane Dislocation Defects and the Impact on Device Performance
Silicon carbide (SiC) chips are displacing their incumbent silicon counterparts in several high-volume power applications. As SiC market share continues to grow, the industry is lifting remaining barriers to mass commercialization including the higher-than-silicon chip cost that increases disproportionately with area, defects that limit chip yield and area, reliability and ruggedness concerns, and the need for a trained workforce to skillfully insert SiC into power electronics circuits.
With respect to fabrication, the SiC industry is successfully leveraging the fully depreciated legacy silicon fab infrastructure and is making the relatively small financial investments that allow mature silicon fabs to process SiC. A key aspect of cost-effective fabrication is limiting defects that degrade device performance and compromise yields. Over the past twenty years, significant progress has been made in improving SiC material quality, and Basal-Plane-Dislocations (BPDs) are the last major catastrophic defect. In this presentation, I will discuss how bipolar-current induced electron-hole pair recombination at basal plane dislocations generates stacking fault (SF) formation and expansion, which degrade on-state current conduction. I will present and interpret experimental data of several transistors that exhibit severe BPD related electrical degradation, and of others that demonstrate “intermediate” or no degradation at all. For impacted transistors, I will identify and analyze the electrical characteristics that exhibit degradation as well as those that remain unaffected under bipolar stress. Finally, I will show that BPD related degradation is fully reversed by high temperature annealing, and the transistor returns to its original “undamaged” operational state.
View other webinars in the SiC Series
- Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
- Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
- Webinar #3—Bidirectional SiC and GaN Switch Technology
- Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level
- Webinar #5—SiC Edge Termination Technology
Meet the Speaker
Biography
United States
Join us online for the sixth webinar in the Silicon Carbide Series.
9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles 1 Register NowREGISTRATION
Member Price: Complimentary
Non-Member Price: $49
SAP Employees, Customers & Partners: Use the Promo Code provided via email from SAP or contact Dyan Schertler, [email protected].
Registration is final. No refunds provided. Following the Virtual Forum, all registrants will receive a link with content.
EVENT CONTACT—
Mark da Silva
[email protected]
Partner & Sponsor
![]()
Accelerate Your Industry 4.0 Transformation
by Combining Your ERP and Manufacturing Data
WHAT IF YOU—
-
Accurately can assess your cost of yield and products?
-
Track your sales from order entry to delivery and, if needed, trace them back to the lot with accurate genealogy?
-
Receive financial insights into areas such as manufacturing waste, capacity, or utilization, and the impact they have on corporate profitability?
-
Visualize cause-and-effect relationships across your financial, supply chain, and manufacturing data sets?
JOIN US for insights on the possibilities and use cases by combining the shop floor and top floor in semiconductor manufacturing.
United States
THURSDAY, SEPTEMBER 22, 2022
Welcome Remarks
Executive Panel Discussion & Q&A—Accelerate Your Industry 4.0 Transformation by Combining Your ERP and Manufacturing Data
Closing Remarks
WEBINAR: 10–11am Pacific Time
Organized by SEMI in Partnership with SAP
Join us for insights on the possibilities and use cases by combining the shop floor and top floor in semiconductor manufacturing.
10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_AngelesIn 2019, SEMI launched a special thought leadership” initiative – SEMI Think Tanks – where the leading minds of our industry gather to address the challenges and opportunities for the semiconductor and broader electronics industries with a 20-30 year horizon. SEMI is honored to be the rallying force behind bringing together the industry stalwarts and thought leaders to share their prophetic views in our pioneering Think Tank series on The Future of Computing.
In December 2021, we shared with you an introduction to the SEMI “Future of Computing” Think Tank, a thought leadership group that is tasked with creating an “Intellectual Blueprint” of what computing might look like in 2040 – and what the semiconductor industry can do now to get ready for the next era of disruption.
In this 2nd session, Dr. Alessandro Curioni, Vice President of Research Europe and Africa and Director of Research Lab in Switzerland at IBM, will host and showcase the progress the group has made in 2022. Next, Jim Sexton, Department Group Manager of Data Centric Systems at IBM, will introduce a White Paper the Think Tank is currently drafting as a first steppingstone towards an industry blueprint. Both he and James Clarke, Director of Quantum Hardware, Intel will then go deeper into two of the White Paper sections, one on Classical, the other on Quantum Computing.
Reserve your spot now to learn about how you and your company can contribute to shaping the future!
United States
Welcome, brief SEMI Think Tank Intro
The importance of Future of Computing effort to the industry, intro to the speaker
Introduction to White Paper draft
Deeper Dive into Quantum Computing
Co-Organizer
Supporting Partners
Platinum Sponsors
Gold Sponsors
Silver Sponsors
Sponsorship Opportunities
Advanced Semiconductor Technology Conference (ASTC) is supported through corporate sponsorship. Be recognized as part of the key players to this event that bridge the industry, leading the congregation of leaders and technologists to drive new development and adoption enabling advanced manufacturing landscapes.
Please contact our sales team for more information on Sponsorships.
| Ms. Fiona Seetoh Email: [email protected] Tel.: +65.6391.9511 |
Mr. Redford Lee Email: [email protected] Tel.: +65.6339.6361 |
|---|
Theme: Connecting Electronics and the Real World
New sensor technologies enabling dramatically reduced size, weight, power, and cost are creating exciting opportunities for future applications. ASTC 2023 presents to you a conference and exhibition that gathers companies, industry leaders, semiconductor experts, and academia to help gain insights on the latest development and trends, as well as challenges in design, manufacturing, integration, and applications. Visit the exhibition booths to find out the latest technologies, products, services, and solutions.
Photo Gallery for ASTC2023
Click here to view full gallery
Photo Gallery for SEMI SEA Members' Networking Night
Click here to view full gallery
Advertisements
ITE College Central
Theatre@illuminITE College Central, Level 2 Blk A
2 Ang Mo Kio Drive
567720
Singapore
17 Jan 2023 (Day 1)
Registration @ Theatre@illuminITE at 2nd Floor
Singapore Electronics Week Opening, Arrival of GoH: Minister Gan Siow Huang, Minister of State, Ministry of Education and Ministry of Manpower
at Tay Eng Soon Convention Centre 4th Floor
Welcome Speech by Ms Low Khah Gek, CEO of ITE
at Tay Eng Soon Convention Centre 4th Floor
Opening Address by Ms Jennifer Teong, Chairman of SSIA
at Tay Eng Soon Convention Centre 4th Floor
Launching of Semiconductor Active Youth (SAY) Ambassador Program
at Tay Eng Soon Convention Centre 4th Floor
Signing of MOU between SSIA and ITE
at Tay Eng Soon Convention Centre 4th Floor
Tea Break | Networking
at Tay Eng Soon Convention Centre 4th Floor
Semiconductors: The "Intelligent Steel of the 21st Century" | Mr. Francois Guibert | Former EVP and President | STMicroelectronics Greater China and South Asia
at Tay Eng Soon Convention Centre 4th Floor
Panel Discussion: Why the Electronics Sector is still a Beacon of Light?
at Tay Eng Soon Convention Centre 4th Floor
Moderator:
Mr. Chan Si En | Process Support Engineer | Applied Materials
Panelists:
Mr. Goh Ru Gene | Senior Director | AMD
Mr. Foo Kuo Yang | HR Director | STMicroelectronics
Prof. Kelvin Fong Xuanyao | National University of Singapore
Mr. Teo Zhi Sen | Student | National University of Singapore
Networking Lunch
at Theatre@illuminITE College Central, 2nd Floor
ASTC Registration
at Theatre@illuminITE College Central, 2nd Floor
Welcome Address
Opening Keynote
Presentation of SEMI-MSIG Global Emerging Young Leader Award
MEMS Market Outlook and MEMS & Sensors Industry Group update
AI-Enhanced Sensors - Leveraging the Cloud Computing Towards AIoT Enabled Smart Home, Digital Twin and Metaverse Applications
Thermal Imaging Using a CMOS Compatible, Hybrid MEMS Structure
Adhesive Solutions to Enable MEMS and Sensor Packages
A Glimpse into MEMS Packaging and its Future
Plaque Presentation & Lucky Draw
End of Day 1
18 Jan 2023 (Day 2)
Registration |Coffee & Tea| Networking
Opening Keynote
New Piezoelectric and Infrared Technologies for Emerging Opportunities
MEMS Manufacturing Equipment Market
Advanced MEMS & Sensor as functional device Fabrications enabled by thin film sputtering technologies
Fireside Chat | Moderated by Tim Brosnihan | Executive Director, MSIG
Anton Hofmeister; Zhu Yao; Dr. Koukou Suu
Plaque Presentation
Lunch Break | Networking | Exhibits
How the Semiconductor Industry is Driving Future Healthcare
Image Sensor Solutions for Automotive Imaging Applications
The New "SIP" Sensor in Package for Sensor Fusion & IoT
Stealth Dicing for MEMS
Ball Bonding Process Optimization on MEMS Devices
Plaque Presentation and Lucky Draw
Closing Speech
End of Day 2
*Agenda is subjected to changes
Advanced Semiconductor Technology Conference (ASTC) 2023
With MEMS and Sensor innovations driving an explosion of automotive, consumer electronics, healthcare, mobile, industrial space, and Internet of Things (IoT) applications, the stage is set for the SEMI Southeast Asia ASTC Conference & Exhibition focusing on MEMS & Sensors.
Visit the exhibition booths to discover the latest technologies, products, services, and solutions. This event will also provide many opportunities for delegates to engage and network with other semiconductor peers.
NOTE: ASTC is a paid conference. Visitor registration for the exhibition is free.
Held in:

ASTC 2023 Conference Materials is available on demand here.
9:00 am - 5:00 pm Off Add to Calendar 2023-01-17 09:00:00 2023-01-18 17:00:00 [IN-PERSON EVENT] Advanced Semiconductor Technology Conference (ASTC) 2023 January Advanced Semiconductor Technology Conference (ASTC) 2023 With MEMS and Sensor innovations driving an explosion of automotive, consumer electronics, healthcare, mobile, industrial space, and Internet of Things (IoT) applications, the stage is set for the SEMI Southeast Asia ASTC Conference & Exhibition focusing on MEMS & Sensors. Visit the exhibition booths to discover the latest technologies, products, services, and solutions. This event will also provide many opportunities for delegates to engage and network with other semiconductor peers. NOTE: ASTC is a paid conference. Visitor registration for the exhibition is free. Held in: ASTC 2023 Conference Materials is available on demand here. ITE College Central Theatre@illuminITE College Central, Level 2 Blk A 2 Ang Mo Kio Drive 567720 Singapore SEMI.org [email protected] Asia/Singapore public Asia/SingaporeOn-Demand Pricing
FULL CONFERENCE
SEMI Member: $149.00
Non-Member: $225.00
DAY 1—Tuesday, November 8, 2022
SEMI Member: $49.00
Non-Member: $75.00
DAY 2—Wednesday, November 9, 2022
SEMI Member: $49.00
Non-Member: $75.00
DAY 3—Thursday, November 10, 2022
SEMI Member: $49.00
Non-Member: $75.00
STUDENTS—FREE
Contact us at [email protected] with a picture of your student ID to receive your discount code.
CONTACT—
Mark da Silva
[email protected]
Sponsorship Contact
[email protected]
Sr. Sales Manager, SEMI
Tel: +1.408.943.7047
Email: [email protected]
HOW TO NAVIGATE THE VIRTUAL SITE
HOW TO LOGIN VIRTUAL GSMC
FOR ASSISTANCE CONTACT
CREATE YOUR OWN PASSWORD
- Click to Create a Password. You'll need your password for all three days.
- Click to Login to the Virtual Platform
AUTONOMOUS FACTORY OF THE FUTURE
GSMC On-Demand gives you access to approved presentations and videos. You'll hear global experts share strategies and best practices to improve manufacturing data capture and analysis. Find ideas and solutions to maintain business continuity and meet the increasing demands of customers.
- ACCESS GSMC On-Demand 24/7 until December 11, 2022.
- WATCH available presentations and video recordings.
- DOWNLOAD and save a copy of approved PDFs
2022 Organizing Committee
-
John Behnke | INFICON
-
Holland Smith | INFICON
-
Chan Pin Chong | KULICKE & SOFFA
-
Michael Arnold | PEER GROUP
-
Bobby Mitra | TEXAS INSTRUMENTS
-
James Lin | UMC
United States
TUESDAY, NOVEMBER 8, 2022 | TIMES IN PT
SESSION 1—Intelligent ACQUIRE: Data Sources, Variety and Acquisition
Opening Remarks
Conference Opening Remarks
Keynote: Autonomous Smart Factory of the Future
Moderator Welcome
Azure Data Estate for Foundry Data Connectivity and Architecture Modernization
Azure Data Estate for Foundry Data Connectivity and Architecture Modernization
End-to-End Smart Manufacturing: Using EDA to Advance the Backend
Challenges in Edge to Cloud Level Data Sharing Across Value Chains in Semiconductor Industry
Data Connectivity in Semiconductor Test—Challenges
Seeing is Understanding: Improving the Visibility into Smart Manufacturing Operations by Raising Our Standards
Closing Remarks
SESSION 2—Intelligent INSIGHTS: Current Point Systems
Welcome Remarks
Product/Process Digitalization for Smart Manufacturing—Future is OPTIMIZED
Deep Learning Denoiser Assisted Framework for Robust SEM Contour Extraction and Analysis for Advanced Semiconductor Node
Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory
A New Technique of Continuous Wave Cameraless T-Ray Imaging for Semiconductor Interfaces Analysis and Wafer Scale Die Sorting
Closing Remarks
WEDNESDAY, NOVEMBER 9, 2022 | TIMES IN PT
SESSION 3—Intelligent DIGITAL TWIN: Multi-Level Digital Twin
Welcome Remarks
How Existing Semiconductor Equipment Can Benefit From Digital Twins
Development of Digital Twins for Manufacturing Applications
Wire Bonding Digital Twin Enhancements for Smart Manufacturing
Scalable Options to Support Semiconductor Capital Equipment's
Ensuring Trust & Traceability: Secure Data Exchanges for Real-Time, Multi-Party Data Sharing in Industry 4.0 and Smart Manufacturing
Cleanroom Redefined—Addressing the Wafer Transport Challenge
Closing Remarks
SESSION 4—Intelligent PREDICT: AI/ML Solution Integration
Welcome Remarks
KEYNOTE: Empowering Process Engineers With Self-Service AI/ML
An Overview of How AI Is Reshaping Semiconductor Manufacturing: A Case Study in Fab Scheduling Using Deep Reinforcement Learning
Blurring Boundaries: Overcoming Context to Enable Deep Learning on Process Data
Automated, Field Deployed, Time Series Anomaly Detection With Time Series AI
Effective Use of Vacuum Assets Through Smart Manufacturing
SMT Electronic Smart Close-Loop Prediction System
Closing Remarks
THURSDAY, NOVEMBER 10, 2022 | TIMES IN PT
SESSION 5—Intelligent AUTONOMY: Smart, Autonomous Control
Welcome Remarks
A Flood of Problems Drained—Fixing Valves the Smart Way
Enhanced Predictions, Smarter Actions: A Few Lessons Learnt on the Path towards 'Autonomy' in Frontend Production
Road to Autonomous Wire Bonder
Closing Remarks
SESSION 6 — Foundational Topics
Welcome Remarks
KEYNOTE: Leveraging Smart Manufacturing to Achieve Sustainability Goals
Toward Digital Resilience – Transforming Management Practices Based on Cybersecurity 2.0 Standards
Is Wait-and-See a Good OT Security Strategy?
Advanced Automation for Smart Manufacturing
SEMI Smart Manufacturing Maturity Assessment Model
Conference Closing Discussion—Where do we go from here?
Closing Remarks
Get access to approved GSMC 2022 presentations and videos.
Discover ideas and solutions for making your manufacturing smarter.
Registration Details
Registration is Required. There are no fees.
If you are registering to attend the Workshop Virtually, please follow the same registration procedure (via the Button Below) and we will email you the Dial-In information a week before the session.
Registration for this Workshop is separate from SEMICON West registration, but necessary to access the workshop room. To waive the SEMICON West Registration fee, use code "STANDARDSGUEST22" when registering on the SEMICON West Registration page.
Questions? Contact Laura Nguyen at [email protected].
In this workshop, our journey of navigating the detection limit obstacle course begins with a broad view of the problem focused on developing a conceptual understanding of key detection limit concepts and limitations. Statistics plays a key role in effective detection limit definition; but need to be the last and final piece of solving the detection limit puzzle where they drive the development of an appropriate statistical practice for detection limit standards.
The current version of SEMI C10 - Guide for Determination of Method Detection Limits sets out important and useful guidance for these concepts. Key detection limit concepts, including the problems caused by our natural biases must be explored and understood. Issues in detection limit and rule-set application will be probed since it is at the application level that detection limit standards succeed or fail.
Workshop Agenda
Part 1: Detecting the Detection Limit – Broad View of Detection Limit Standards / Issues
- The Swamp: Why so much disagreement?
- Basic Detection Limit concepts
- Calibration’s under-appreciated role
- Detection Limit Quantification Uncertainty
- DL Usage Contexts and Reporting Practices
- What’s required to build a Detection Limit standard?
Part 2: SEMI C10 – Guide for Determination of Method Detection Limits
- How does it work?
- What does it assume?
- What are its strengths and limitations?
- How should Semi C10 derived Detection Limits be applied?
- What form could an update to SEMI C10 take and why?
@ SEMICON WEST
Moscone Center
San Francisco, CA
United States
Join this workshop during SEMICON West 2022 to explore SEMI C10 and discuss how its application to your procedures will improve your yields and manufacturing processes. Quality experts, analytical experts, statisticians and those involved with product quality and process metrics should attend.
10:00 am - 11:30 am Off Add to Calendar 2022-07-12 10:00:00 2022-07-12 11:30:00 Determining the Detection Limit - SEMI C10 Join this workshop during SEMICON West 2022 to explore SEMI C10 and discuss how its application to your procedures will improve your yields and manufacturing processes. Quality experts, analytical experts, statisticians and those involved with product quality and process metrics should attend. @ SEMICON WEST Moscone Center San Francisco, CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_AngelesRegistration Details
Members: $113.00
Non-Members: $150.00
Registration includes a copy of the RITdb Standard - SEMI E183
No refunds for cancellations; Substitutions can be made at any time.
Contact: Michelle Sun, [email protected]
Industry 4.0 brings machine to machine IOT, human augmentation, cloud, edge, and AI together to enable a better manufacturing process. Before we can take advantage of the promise we need a efficient means to share the very complex and wide ranging data which is created and used on the test floor. This data comes from many sources, has latency and security issues with constantly changing sources and applications. RITdb solves the sharing issues via extensible machine focused data structures and transport formats which have been validated in an advanced test environment.
This 2 hour workshop is divided into three sections: and introduction to the problems and values, a walk through on how RI and TI implemented the POC in a working production environment and finally a deep technical dive into the implementation effort needed to get started.
Course Outline
- Introducation
- Topology
- Topic
- Structure
- Usage with Examples
- Body
- Structure (CBOR*)
- CBOR (include embedded OMAP)
- Events
- Data
- Usage
- Examples
- Structure (CBOR*)
- Proof of Concept (POC) findings
- Identity Requirements
- Connection Process
- Review use of Channels in Messaging
- Admin
- Logging
- Events
- Object Save(OS)/ Object Read (OR) Message
- Demonstrate link between the messaging and repo
- Demonstrate embedded OMAP
*CBOR – Concise Binary Object Representation
Virtual, Online
United States
Looking to take advantage of Industry 4.0 to bring order to the chaos of your semiconductor test process? Attend this course online and learn how an implementation of the latest SEMI Standard for test floor data and events sharing can improve the productivity of your test operations.
This 2 hour workshop is a follow-on from this July STEP Class.