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Technical

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This webinar graciously underwritten by GDSI.  Registration is free to all attendees.

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Belgium China France Germany Ireland Italy Japan South Korea Taiwan United States Register Now https://discover.semi.org/designing-mems-with-ge-polaris-process-webinar-on-dem… 20220302 MSIG Webinar GE Business Executive Technical Featured Speakers

About the Speaker:  Robert MacDonald is a MEMS engineer at GE’s Research. His research is focused on high performance inertial sensors. He has over 20 years of experience in the MEMS and semiconductor industries. His work has covered the product life cycle of chemical, inertial and optical sensors from design through market introduction and manufacturing.

United States

Robert MacDonald, GE Research
Robert MacDonald
MEMS Engineer
GE Research
MSIG

Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.

In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs.

8:00 am - 9:00 am Off Add to Calendar 2022-03-02 08:00:00 2022-03-02 09:00:00 MSIG Webinar GE Polaris Process Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication. In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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Registration

Complimentary for SEMI Members.

$99 Non-Members. 

Belgium France Germany Ireland Italy Japan Singapore South Korea Taiwan United States Register EMG Webinar tile Business Executive Expositions Technical Featured Speakers

Read the Speakers' Biographies.

United States

Scotten Jones
Scotten Jones
President
IC Knowledge
Naotao Horiguchi imec
Naoto Horiguchi
Program Director, Logic CMOS device technology
imec
Galya Stoeva
Galya Stoeva, moderator
Co-Chief Sales Officer
IceMOS Technology
EMG ESD Alliance FOA SOI Standards Workforce Development

Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET).  As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures based on Horizontal Nanosheet technology. Such a fundamental shift in transistor architecture will create new challenges to processes and materials, presenting opportunities for companies well-positioned for this shift.

In this webinar, SEMI EMG brings experts to explain the technology trends driving the industry adoption of Gate All Around, how the major players are approaching this transition, and the implications this will have on the material supply chain

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format
United States https://r6.ieee.org/scv-eps/?p=2865 Business Executive Technical
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Virtual, Online
United States

- CAST Standards

SEMI is pleased to once again partner with the HIR Symposium for this 5th Annual Symposium.  See the full Agenda.

Don't miss the plenary talk by SEMI President and CEO, Ajit Manocha at 7:40 am PST!

7:30 am - 12:30 pm Off Add to Calendar 2022-02-23 07:30:00 2022-02-24 12:30:00 Fifth Annual Symposium on Heterogeneous Integration SEMI is pleased to once again partner with the HIR Symposium for this 5th Annual Symposium.  See the full Agenda. Don't miss the plenary talk by SEMI President and CEO, Ajit Manocha at 7:40 am PST! Virtual, Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

REGISTRATION

China CSM forun Business Executive Expositions Technical

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Venue: 2F International Conference Room, A2 Building of Guangda We Valley (Headquarters 2nd Road, Songshanlake, Dongguan City, Guangdong Province)

  • Venue to Humen Railway Station 22 miles, 45 minutes’ drives.
  • Venue to Shenzhen Bao'an International Airport 55 miles, 65 minutes’ drive.
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China

8:30 am - 9:00 am

Registration

9:00 am - 9:15 am

Opening Remark

9:15 am - 9:45 am
wang jiangbo
Jiangbo Wang
Vice President
HC SemiTek Corporation

Key Technologies for Mass Manufacturing of MicroLEDs

9:45 am - 10:15 am
Neng Zhang
Neng Zhang
Product Director
Sinopatt Technology Co.,Ltd.

Application and Developing Trend for Patterned Sapphire Substrate

10:15 am - 10:45 am
Qian Fan
Qian Fan
Vice President
Suzhou HanHua Semiconductor Co.,Ltd

Applications and Prospects of 3DIC Technology in Compound Semiconductor Devices

10:45 am - 11:15 am
Liang Wu
Jason Wu
CEO
Ultratrend Technologies Inc.

Latest Progress and Challenges on High-quality and Large-size AlN Single Crystals Grown by the PVT Method

11:15 am - 11:45 am
Yang Wang
Yang Wang
Vice Director
Songshan Lake Materials Laboratory

Micro&Nano Fabrication Platform of Compound Semiconductor Materials and Devices

11:45 am - 1:30 pm

Break

1:30 pm - 2:00 pm
Tiejun Zhou
Terry Zhou
GM
Vital Micro-Electronics Technology Co., Ltd

Processing and Application Prospectives of Large-Scale Compound Semiconductors

2:00 pm - 2:30 pm
Zhengwei Chen
Zhengwei Chen
GM
Beijing Ming Gallium Semiconductor Co., Ltd.

Industrialization Analysis of Ultra-wide Bandgap Semiconductor Material Gallium Oxide and Its Devices

2:30 pm - 3:00 pm
De'ang Liu
De'ang Liu
Scientist
ETARESEARCH

HVPE Growth of 4 Inch GaN Freestanding Wafer

3:00 pm - 3:30 pm
Kangfu Ma
Kangfu Ma
GMA
Shanxi Shuoke Crystal Co.,Ltd.

Analysis of SiC Single Crystal Growth Technology and Application Prospect of SiC Materials

3:30 pm - 4:00 pm
Yong Ji
Yong Ji
CEO
Guizhou Haotian Optoelectronics Technology Co.,Ltd.

Large Scale Deposition Technology of AlN and AlScN for SMR BAW

4:00 pm - 4:30 pm
Zhang Xing
Xing Zhang
CEO
Compound Semiconductor (Xiamen) Technology Co., Ltd.

The Latest Progress in The Industrialization of Diamond Wafer and Diamond Heat Sink

Standards Workforce Development

Compound Semiconductor Materials Technology Forum

Time: TBD

Location:Dongguan, Guangdong, China

 

Event Contact information:

Cassie Li

SEMI China

Email: [email protected]

Phone: 86.21.6027.7645

 

Ein Wu

SEMI China

Email: [email protected]

Phone: 86.21.6027.8509

8:30 am - 5:00 pm Off Add to Calendar Disabled
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