SiC—Silicon Carbide Webinar #3: Bidirectional SiC and GaN Switch Technology
There are numerous mass volume power applications where it is necessary to control the flow of bidirectional power, including electric vehicles (vehicle to grid, vehicle to home, and vehicle to vehicle), distributed and grid-tie power systems using regenerated energy and/or energy storage components, and solid-state circuit breaker protection. Silicon carbide (SiC) and gallium nitride (GaN) based bidirectional power switches can enable these applications with their compelling advantages of high efficiency, high blocking voltage capability, and low system weight and volume. In particular, monolithic switches that allow for bidirectional symmetric conduction and voltage blocking with a chip area close to that of a similarly rated unidirectional switch are ideally suited to fuel a revolution in power electronics technology. Today, monolithic bidirectional (MBD) power semiconductor switches are not commercially available. Instead, back-to-back (anti-series) connection schemes of unidirectional power MOSFETs or IGBTs are typically used, resulting in a 4X penalty in chip area and high cost. However, various types of SiC and GaN bidirectional concepts are being investigated including bonded-wafer bidirectional IGBTs, monolithic dual-gate bidirectional GaN switches, and monolithic back-to-back connected SiC MOSFETs and JFETs.
In this presentation, the semiconductor technology of SiC and GaN bidirectional switches will be reviewed including their operating principles, and their lateral and vertical geometry configurations. The performance advantages of MBD switches will be highlighted. Promising MBD devices reported to date will be analyzed, and the key bidirectional switch applications of solid-state circuit breakers and current-source-inverters will be discussed. As SiC and GaN devices approach mass commercialization propelled by insertion in electric vehicles and consumer electronics, respectively, fabrication of SiC/GaN MBD switches is becoming economically viable enabling their wide adoption in key volume applications.
View other webinars in the SiC Series
Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
Webinar #3—Bidirectional SiC and GaN Switch Technology
Webinar #4—Understanding SiC Chip Cost, the Impact of Defects, and the Case of Price Parity with Si at the System Level
Join us online for the third webinar in the Silicon Carbide Series as we review the semiconductor technology of SiC and GaN bidrectional switches, analyze promising MBD devices, and discuss the key bidrectional switch applications of solid-state circuit breakers and current-source-inverters.
SiC—Silicon Carbide Webinar Series
Webinar #3: Bidirectional SiC and GaN Switch Technology
February 21, 2023
9:00-10:00 AM Pacific Time
9:00 am - 10:00 am
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America/Los_Angeles
1
Day 1: 8:30 am - 5:30 pm PT Day 2: 8:30 am - 12:30 pm PT
Registration will be closed at 12:00am on May 7.
Learning Objectives:
Gain a comprehensive understanding of the semiconductor industry and the manufacturing process, design and eco-system of the semiconductor industry and understand the jargon, tools, and materials used in the design and fabrication of an IC
Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals
Who Should Attend:
New personnel entering the field
Any one wanting an understanding of semiconductor manufacturing
Course Topics:
Basic electronics and microelectronics terms and definitions
Microelectronics and the role of integrated circuits
Define process nodes : explanation of process nodes and how they relate to device performance and cost
Device physics and transistor operation: understanding of the physical principles behind device operation and the functioning of transistors
Crystal growth and wafer prep: overview of crystal growth techniques used in semiconductor manufacturing
Explanation of wafer preparation techniques and materials used
FDSOI, fin fets, gate all around (GAA) transistors
Circuit design and layout
Mask making techniques and materials used in lithography
Clean rooms
Lithographic techniques
Plasma etch, wet etch and cleaning processes
Ion implantation
Diffusion techniques
RTP, CVD, ALD, ALE techniques and their impact on device performance
The purpose of this course will provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit (IC). The course is designed for new personnel entering the field or individuals who are looking for a well-rounded understanding of all the jargon, tools, and materials used in the IC manufacturing process.
Limited time offer!
Members: $1295 $1195
Non-members: $1495 $1395
Students/Veterans: $1195 $1095
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] * Coffee, refreshments, and lunch will be provided for all attendees, ensuring a satisfying and energizing experience throughout the day.
Overview of Semiconductor Manufacturing
In-person training
Location: Milpitas, CA
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Add to Calendar2024-05-08 00:00:002024-05-09 00:00:00Overview of Semiconductor ManufacturingThe purpose of this course will provide a comprehensive understanding of the semiconductor industry and the manufacturing process of an integrated circuit (IC). The course is designed for new personnel entering the field or individuals who are looking for a well-rounded understanding of all the jargon, tools, and materials used in the IC manufacturing process.Limited time offer!Members: $1295 $1195Non-members: $1495 $1395Students/Veterans: $1195 $1095* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]* Coffee, refreshments, and lunch will be provided for all attendees, ensuring a satisfying and energizing experience throughout the day.SEMI Headquarters 673 S Milpitas Blvd Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_AngelespublicRegister Today
The Heterogeneous Integration Roadmap activities are sponsored by IEEE Electronics Packaging Society (EPS), SEMI, IEEE Electron Devices Society (EDS), IEEE Photonics Society and the ASME EPPD Division with the intention of expanding the roadmap collaboration to other IEEE Technical Societies that share interest in the Heterogeneous Technology Roadmap as well as to organizations outside IEEE that share this common vision for the roadmap. A document with definition of the mission, purpose, structure and governance for this Heterogeneous Integration Roadmap program was prepared and approved.
1:00 pm - 5:00 pm
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Add to Calendar2024-02-21 13:00:002024-02-23 17:00:00Heterogeneous Integration Roadmap SymposiumThe Heterogeneous Integration Roadmap activities are sponsored by IEEE Electronics Packaging Society (EPS), SEMI, IEEE Electron Devices Society (EDS), IEEE Photonics Society and the ASME EPPD Division with the intention of expanding the roadmap collaboration to other IEEE Technical Societies that share interest in the Heterogeneous Technology Roadmap as well as to organizations outside IEEE that share this common vision for the roadmap. A document with definition of the mission, purpose, structure and governance for this Heterogeneous Integration Roadmap program was prepared and approved.Samsung Electronics Campus 3655 N First Street San Jose, CA 95134 United StatesSEMI.org[email protected]America/Los_Angelespublic
- Low-SWaP-C, GPS-free PNT technology
- Novel materials, fabrication & packaging techniques and approaches
- Advancements in atomic clock and quantum sensor photonics
3:00 pm
-
4:30 pm
Break Out Sessions
Thrust Area 1: Novel Materials, Fabrication, and Packaging Techniques for Low-SWaP Inertial and PNT Sensors
Thrust Area 2: Advanced Active and Passive Integrated Photonics for Low-SWaP Atomic Clocks, Quantum Systems, & PNT Sensors
Thrust Area 3: Advancements Towards Low-SWaP, GPS-Free PNT Technologies
SEMI MSIG has another $5M in R&D funding for sensor positioning, navigation, and timing (PNT) technology development! Register now to attend our half-day Gap Analysis workshop, taking place April 30, the afternoon before our premier sensor technology-event, the MEMS & Sensors Technical Congress (MSTC). Meet US Gov’t subject matter experts (SME’s) to discuss PNT pain points and get insights into this year’s request for proposals (RFP).
The workshop will feature presentations from the new 2024 PNT projects and identify areas for this year’s RFP.
Have your voice heard, as SEMI MSIG and the Army Research Lab work to fund PNT R&D technology improvements in a 5-year (2022-2027) $25M program. This gap analysis workshop is a critical component of the program’s 2nd year activities.
SEMI MSIG PNT Gap Analysis Workshop
Learn About Phase 2 of the Positioning, Navigation and Timing (PNT) Funding Program
1:00 pm - 5:00 pm
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America/Los_Angeles
Hotel
Cambridge hotels are expensive in late May, so we have made a deal for you, click here!
We have a room block reserved at DoubleTree Suites by Hilton Hotel Boston, Cambridge for May 21, 2023 through May 25, 2023. Booking your room is simple, just select "Book a Room" to receive your group's preferred rate. Must book rooms before May 12th to obtain discounted rate.
Please book your hotel reservations online for MSTC 2023 Conference or guests can call our 24-7 reservations desk to book your room or please ask for the Front Desk and then provide the Group Code: MSTC
Kevin (Cheng-Hao) Ko received his Physics Ph.D. from State University of New York, Stony Brook (SUNY, Stony Brook) in 1995. During his thesis research, he worked at Beamline X1A of the National Synchrotron Light Source (NSLS) at Brookhaven National Laboratory (BNL) to construct the world's first Mult-channel Scanning Photoemission Electron Microscope (SPEM) by focusing soft X-rays using a zone plate under the supervision of Prof. Janos Kirz. After receiving his Ph.D. degree, he was invited by Taiwan Nation Synchrotron Radiation Research Center (NSRRC) to lead a team to develop X-ray Microcopy technology in Taiwan. By 1999 Ko’s team had successfully developed the world’s most advanced SPEM. After that, Dr. Ko started to devote his efforts to developing the SpectroChip technology. After nearly 20 years of research and development, Ko’s team was finally able to mass produce the SpectroChip using wafer-based methodology and founded the company SpectroChip, Inc. This technology received 9 national best innovation awards in Taiwan and one international best application award in Asia. To enable further global business development of the SpectoChip technology, in 2023, Dr. Ko and Dr. Sean Lin founded SPU System Inc.
SpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card.It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology.The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization.This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.
In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology.
8:00 am - 9:00 am
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Add to Calendar2024-02-21 08:00:002024-02-21 09:00:00SpectroChip: an Optical System-on-Chip Enabling Ultra-Portable Devices for Broad Industrial Sensing ApplicationsSpectroChip is a breakthrough technology that integrates all the functions of an optical spectrometer on a chip with the size of half an SD card. It is designed and fabricated using X-ray lithography and microelectromechanical systems (MEMS) technology. The current chip module includes the slit, micro concave grating and mirror and has a spectral range from 300 to 1000 nm. SpectroChip technology has the advantage of high performance with high sensitivity and accuracy while achieving chip-size miniaturization. This technology is being applied to the development of ultra-compact optical sensors and/or devices that can deliver real-time spectral data and analysis. Examples include novel optical sensor modules and ultra-compact, high-performance spectrophotometers capable of UV/VIS and florescence analysis for research lab and educational purposes.In this webinar Dr. Ko will describe the SpectroChip technology, its integration into optical spectrum processing units, and real-world sensing applications in Health Care, Food Safety, and Semiconductor Processing and Metrology.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Watch On-demand
Standardizing the Semiconductor Manufacturing Backend
About Collaborative Alliance of Semiconductor Test (CAST)
CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.
Unlike the semiconductor ‘frontend’, the ‘backend’ has little standardization with lots of different interfaces and behaviors between different equipment suppliers. How can we standardize it and gain the efficiencies that standards brought to the frontend? SEMI has several standards suites that could be used depending on the customer’s needs, including SECS/GEM, EDA/Interface A and RITdb. This webinar will describe the benefits of each, as well discuss challenges around traceability and other issues commonly encountered in the backend, and how standards can benefit the equipment users.
United States
3:00 pm
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3:05 pm
Alan Weber
Vice President, New Product Innovations
Cimetrix
Opening Remarks
Alan Weber is currently the Vice President, New Product Innovations for Cimetrix Incorporated. Previously he served on the Board of Directors for eight years before joining the company as a full-time employee in 2011.
Alan has been a part of the semiconductor and manufacturing automation industries for over 40 years. He holds bachelor's and master's degrees in Electrical Engineering from Rice University.
3:05 pm
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3:15 pm
Brian Rubow
Director of Solutions Engineering
Cimetrix
SECS/GEM
Brian Rubow is the Director of Solutions Engineering for Cimetrix. He is well-known within the industry due to his involvement with the SEMI standards committees. He currently serves as the co-chairs for the North America Information and Control Committee, the North America GEM300 Task Force, and the North America DDA Task Force. Rubow has both a bachelor’s and a master’s in engineering from Brigham Young University.
3:15 pm
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3:25 pm
Albert Fuchigami
Senior Software Developer
PEER Group
EDA/Interface A
Albert Fuchigami is a senior software developer at PEER Group Inc. and has spent more than 20 years helping semiconductor OEMs integrate their equipment into factories around the world. He is a globally recognized leader in the SEMI Standards Program, co-leads the North America Data Diagnostic Acquisition (DDA) Task Force, and contributes to the Information & Control Technical Committee. Albert enjoys demonstrating how standards can maximize data communication with factory host systems and is a champion for integrating HTTP/2 with gRPC and Protocol Buffers technology into the Equipment Data Acquisition (EDA) / Interface A standards. He holds a Bachelor of Mathematics (Computer Science) degree from the University of Waterloo.
3:25 pm
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3:35 pm
Stacy Ajouri
Senior Member of Technical
Texas Instruments
Mark Roos
CEO
Roos Instruments
RITdB
Stacy Ajouri is a Senior Member of Technical Staff at Texas Instruments in the Test Technology Group. She is the co-chair of the North America Automated Test Equipment (ATE) Technical Committee and the RITdb Task Force. She has over 30 years of experience across multiple disciplines related to test and test operations. Pulling from that experience, she supports the implementation of RITdb proof of concepts (POCs) focusing what is needed by the manufacturing and engineering community.
Mark Roos is CEO of Roos Instruments, a longtime producer of semiconductor ATE. He co-chairs the North America ATE Technical Committee and the RITdb Task Force. Roos has been involved in standards development for ATE for the past 20 years. He is currently heavily involved in the focus of RITdb POCs on scaling and latency.
3:35 pm
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3:45 pm
Dave Huntley
Product Manager Assembly Products
PDF Solutions
Traceability and E142
Dave Huntley was the founder and president of KINESYS Software in 1992 which developed the Assembly Line Production Supervisor (ALPS). PDF Solutions acquired the ALPS in 2017 and Dave now works in Strategic Marketing, Business Development & Standards Liaison focused on defect / process tracking and single device traceability across the supply chain.
He has a long history working with SEMI. He was co-lead of the Sort Map task force responsible for the SEMI E142 Specification for Substrate Mapping Standard. Dave is now the co-lead for the Traceability committee and two SEMI task forces; 1) Advanced Backend Factory Integration working on applying and extending wafer fab automation standards to assembly and test and 2) Single Device Traceability task force working on blockchain traceability for the supply chain.
Standardizing the Semiconductor Manufacturing Backend
Taming the Wild West of Semiconductor Backend Manufacturing
3:00-4:00 PM (PT)
Zoom
A CAST technology community webinar
3:00 pm - 4:00 pm
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Add to Calendar2024-02-22 15:00:002024-02-22 16:00:00Standardizing the Semiconductor Manufacturing BackendUnited StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
About Collaborative Alliance of Semiconductor Test (CAST)
CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.
2024 Technology Workshops Enabling the Future of Electronics
Registration
Registration Fee (April 16 & 17 only)
$250 members $399 non-members
SEMI members who wish to join the NextFlex Workshop on April 19th should contact [email protected] for a special discount code.
Cancellation Policy
Cancellations received on or before March 16, 2024, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after March 16, 2024, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to Michelle Fabiano at [email protected].
4610 Vestal Pkwy E, Vestal, NY 13850 TEL: (607) 770-8500
SEMI NBMC Technical Gap Analysis Workshop - Tues. 4/16 - 8 am-6 pm During this workshop, attendees will address the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives. Breakfast, and lunch will be included and reception at the end of the day will be included.
SEMI FlexTech FHE Technical Gap Analysis Workshop - Wed. 4/17 - 8 am-4 pm, followed by tours of Binghamton University labs Attendees will then turn their sights to completing a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Breakfast, lunch and tours of Binghamton University lab tours will conclude the day.
Binghamton University Tours - Wed. 4/17 - 4:00pm - 5:30pm The tour will include facilities that are part of the S3IP (Small Scale Systems Integration & Packaging) a New York State Center of Excellence, CAMM (Center for Advanced Microelectronics Manufacturing) a New York State Center of Advanced Technology and home to the New York Node of NextFlex, the Analytical & Diagnostics Laboratory, the IEEC (Integrated Electronics Engineering Center) a New York State Center of Advanced Technology and NECCES (the Northeast Center for Chemical Energy Storage).
Binghamton University 2024 Art of Science Exhibit - Wed. 4/17 - 4:00pm - 5:30pm Binghamton University holds an annual contest that celebrates the beauty of science through photographs and images that describe some aspect of research and captured visually. The advances in imaging technology and tools mean that scientists have an increased ability to generate exciting data as well as to create compelling works of art and workshop attendees are invited to the opening reception for the 2024 Art of Science Exhibit in the atrium of the Center of Excellence Building. Contest winners will be announced, and refreshments will be served.
In addition: NextFlex Workshop– Thurs, 4/18 NextFlex will convene the hybrid electronics community for a one-day workshop at Binghamton University in New York on April 18 to explore and define collaborative responses to soon to be announced opportunities under the CHIPS and Science Act, including the National Advanced Packaging Manufacturing Program (NAPMP), with a specific focus on advancing hybrid electronics for industrial and medical applications.
Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.
Additively Manufactured Flexible " Smart" Packaging and Reconfigurable On-Package Antenna Arrays for Next Generation 5G/mm Wave System on Package Designs
Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.
2:35 pm
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2:50 pm
Break
2:50 pm
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4:00 pm
Breakout Sessions Readout
4:00 pm
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5:30 pm
Binghamton University Laboratory Tours & 2024 Art of Science Exhibit and Reception
The tour will include facilities that are part of the S3IP (Small Scale Systems Integration & Packaging) a New York State Center of Excellence, CAMM (Center for Advanced Microelectronics Manufacturing) a New York State Center of Advanced Technology and home to the New York Node of NextFlex, the Analytical & Diagnostics Laboratory, the IEEC (Integrated Electronics Engineering Center) a New York State Center of Advanced Technology and NECCES (the Northeast Center for Chemical Energy Storage).
Join leaders from FlexTech, NBMC, NextFlex and the microelectronics industry in this dynamic workshop, where we'll explore advancements, challenges, and solutions in critical technologies like flexible hybrid electronics, hybrid electronics, wearables, bio-signal sensing for real-time cognitive and physical state monitoring, and more. Participate in hands-on sessions, cross-disciplinary discussions, and gain insights from industry and academia through impactful talks. Contribute your suggestions in dynamic breakout sessions to shape and enable the future of these technologies.
2024 Technology Workshops Enabling the Future of Electronics
- NBMC Gap Analysis
- FHE Gap Analysis
- NextFlex Workshop (April 18 - separate registration)
7:30 am - 6:00 pm
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Add to Calendar2024-04-16 07:30:002024-04-17 18:00:002024 Technology Workshops Enabling the Future of ElectronicsPresented by Hosted by Join leaders from FlexTech, NBMC, NextFlex and the microelectronics industry in this dynamic workshop, where we'll explore advancements, challenges, and solutions in critical technologies like flexible hybrid electronics, hybrid electronics, wearables, bio-signal sensing for real-time cognitive and physical state monitoring, and more. Participate in hands-on sessions, cross-disciplinary discussions, and gain insights from industry and academia through impactful talks. Contribute your suggestions in dynamic breakout sessions to shape and enable the future of these technologies.Binghamton University, Innovative Technologies Complex (ITC) 85 Murray Hill Rd Vestal, NY 13850 United StatesSEMI.org[email protected]America/Los_Angelespublic
Event Contact
For questions, please contact Michelle Fabiano at [email protected].
Evolution of IC Packaging – Fan-in, Fan-out WLP, Embedded Packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc.
Principles of Interconnects ranging from TAB, Wirebond to various Flip Chip bonding such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development
Board level assembly and its soldering materials and failure mechanisms for 2nd level interconnect
Overview of interposer of lead frame, ceramic, flex to BT substrates for Microelectronics Packaging
Assembly flow and new assembly techniques such as stealth dicing, compression molding, underfill molding etc., and its assembly materials for Microelectronics packaging
Material characterization from bulk to interfaces for Microelectronics packaging
Why should I attend?
Gain technical knowledge for industry professionals
Enhance knowledge in manufacturing and R&D know-how in IC packaging
Apply Key Technical Concepts in Problem Solving through Real Case Studies
Networking opportunities with industry peers
Who should attend?
Beneficial for directors, managers, process & equipment engineers, R&D engineers and Quality & Reliability engineers working in the areas of microelectronics packaging
Useful for sale or application engineers who supply packaging materials and tools to the industry
Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300Penang Pulau Pinang Malaysia
MEET OUR SPEAKER
Dr. Lee Teck Kheng
Director, Technology Development Centre, Institute of Technical Education Singapore,
SEMI SEA Advance Packaging Technical Committee Member
9:00 am
Introduction to IC Packaging & Interconnects
Introduction to IC Packaging
• Functions of Packaging – Mechanical, Material, Electrical and Chemical
• Review of Packaging Trend – BGA, CSP, Fan-in & Fan-out WLP, 3D Packaging, SoC vs SiP etc
• Challenges in Assembly and Packaging
Board Assembly and Soldering & PCB and IC Carriers
Board Assembly and Soldering
• Through Hole & SMT – Stencil Print Process, Reflow Profile
• Solder Materials – Alloy, Flux, Solvents, self-alignment effect
• Pb Free Solder – Ternary phase diagram, SnAgCu
• Intermetallics and Growth – Diffusion mechanism, Arrhenius equation
• Testing and Reliability – Ball shear & pull failure strength and modes, Fatigue, Weibull distribution
PCB and IC Carriers
• PCB Technology – Material properties, PCB fabrication process, drilling, patterning, plating, solder resist, laminating
• IC Carriers – Design rule, Leadframe, LTCC, Flex and BT substrates
• Substrate Development
4:00 pm
Q&A | Case Studies
5:00 pm
End of Day 1
9:00 am
Assembly Process
• Thickness Reduction – Grinding, Lapping, Polishing, CMP
• Dicing/Singulation – Blade, Laser, Stealth dicing, Dicing after grind
• Die Attach – Eutectic bonding, DA materials, Collets
• Plasma – Argon, Oxygen plasma, Surface tension
• Encapsulation – Mold constitutes and properties, Transfer, Film and compression molding, Dam and fill
• Plating – Solder plating, NiPd finish, PPF
• Trim & Form – ESD, Lead formation, Spring back mechanism
Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935
*The above rates are inclusive of coffee/tea breaks and luncheon for both days
Register before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates.
A certificate of completion will be awarded at the end of the seminar.
*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information). For HRDC claims, please refer to the following links on the claiming matrix and guidelines:
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Add to Calendar2024-03-06 00:00:002024-03-07 00:00:00Penang Business Summit Seminar 1: Advanced PackagingAdvanced Packaging and Material Characterization*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar Participating Fee:Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935 *The above rates are inclusive of coffee/tea breaks and luncheon for both daysRegister before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates. A certificate of completion will be awarded at the end of the seminar. *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Ms. Cecelia Fong | [email protected] | +65.9750.2382 For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123 Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang MalaysiaSEMI.org[email protected]Asia/Kuala_Lumpurpublic
Asia/Kuala_Lumpur
SOLD OUT
2024 EHS Summit
Registration Details
Registration is required for this event as it is likely to reach maximum room capacity, at which point interested attendees will be waitlisted.
SEMI Members: $100
Non-Members of SEMI: $150
Refunds possible before January 10, 2024. Substitutions allowed up to January 24.
The Summit includes strategic business and technical information for many levels and sectors of the ecosystem, including:
Government relations/advocacy staff
EHS regulatory professionals
Senior executives
Business development
Device manufacturers
Equipment suppliers
Materials suppliers
Component suppliers
Fab and facility systems construction companies
SEMI 673 South Milpitas Avenue Milpitas, CA95035 United States
8:30 am
-
9:00 am
Registration & Networking
9:00 am
-
9:05 am
James Amano
Senior Director, EHS
SEMI
Welcome
9:05 am
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9:20 am
James Amano
Sr. Director, EHS
SEMI
Europe PFAS Restriction Proposal
9:20 am
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9:45 am
Russ LaMotte
Principal
Beveridge & Diamond PC
US EPA PFAS Reporting rule
9:45 am
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10:10 am
Andrew Petraszak
Tokyo Electron
Ben Kallen
SEMI
PFAS US States Proposals & Positions
10:10 am
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10:30 am
Break
10:30 am
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11:00 am
Lauren Crane
Lam Research
European Regulations
Including: EU Machinery Regulation, Battery Regulation, Cybersecurity Resiliency Act (CRA), AI regulation, the Ecodesign “passport” concept. UK Conformity Assessed (UKCA) mark. California fan efficiency regulation. SEMI EHS Standards update.
11:00 am
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11:25 am
Allen Karpman
Arkema
AIM Act: HFC Allocations
11:25 am
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11:50 am
Kristine Baranski, PE
Global Air Program Manager
Intel
AIM Act: challenges with new refrigerants
11:50 am
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12:10 pm
Katelyn Walck
Chemours
James Snow
SCREEN
SIA PFAS Consortium
12:10 pm
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1:15 pm
Lunch & Networking
1:15 pm
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1:35 pm
James Amano
SEMI
SEMI PFAS Initiative
1:35 pm
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2:00 pm
Russ LaMotte
Principal
Beveridge & Diamond
TSCA PBT: PIP, DecaBDE, What's Next?
2:00 pm
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2:35 pm
Ben Gross
Applied Materials
Supika Mashiro
TEL
Katelyn Walck
Chemours
Lauren Crane
Lam Research
Supply Chain Inquiry Panel - sharing best practices
Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry.
Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include:
US EPA PFAS Reporting Rule
US AIM Act HFC phasedown: challenges with new refrigerants
Updates from SEMI PFAS Initiative and other collaborative industry efforts.
US EPA TSCA: PIP 3:1, DecaBDE…what's next?
Panel discussion on supply chain communication.
Plan now to attend, network and strategically prepare your company. This event is offered as an in-person briefing only.
EHS Summit 2024
Regulations, Rules, Allocations & Proposals
8:30 am - 3:30 pm
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Add to Calendar2024-01-25 08:30:002024-01-25 15:30:002024 EHS Summit Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry.
Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include:
US EPA PFAS Reporting Rule
US AIM Act HFC phasedown: challenges with new refrigerants
US AIM Act HFC Allocation
EU: PFAS Restriction Proposal, F-gas, Revised Machinery Regulation, Revised Battery Regulation, Pending Cybersecurity resiliency regulation, Pending AI regulation, the ecodesign “passport” concept.
Updates from SEMI PFAS Initiative and other collaborative industry efforts.
US EPA TSCA: PIP 3:1, DecaBDE…what's next?
Panel discussion on supply chain communication.
Plan now to attend, network and strategically prepare your company. This event is offered as an in-person briefing only.SEMI 673 South Milpitas Avenue Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
