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Technical

CAST logo

About Collaborative Alliance of Semiconductor Test (CAST)

CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.

CAST logo
United States 453x388_Homepage_Ad_tile_Spectro_3.png Technical
Highlighted content

Unlike the semiconductor ‘frontend’, the ‘backend’ has little standardization with lots of different interfaces and behaviors between different equipment suppliers.  How can we standardize it and gain the efficiencies that standards brought to the frontend?  SEMI has several standards suites that could be used depending on the customer’s needs, including SECS/GEM, EDA/Interface A and RITdb.  This webinar will describe the benefits of each, as well discuss challenges around traceability and other issues commonly encountered in the backend, and how standards can benefit the equipment users.

United States

3:00 pm - 3:05 pm
Alan Weber
Vice President, New Product Innovations
Cimetrix

Opening Remarks

Alan Weber is currently the Vice President, New Product Innovations for Cimetrix Incorporated. Previously he served on the Board of Directors for eight years before joining the company as a full-time employee in 2011.

Alan has been a part of the semiconductor and manufacturing automation industries for over 40 years. He holds bachelor's and master's degrees in Electrical Engineering from Rice University.

3:05 pm - 3:15 pm
Brian Rubow
Director of Solutions Engineering
Cimetrix

SECS/GEM

Brian Rubow is the Director of Solutions Engineering for Cimetrix. He is well-known within the industry due to his involvement with the SEMI standards committees. He currently serves as the co-chairs for the North America Information and Control Committee, the North America GEM300 Task Force, and the North America DDA Task Force. Rubow has both a bachelor’s and a master’s in engineering from Brigham Young University.

3:15 pm - 3:25 pm
Albert Fuchigami
Senior Software Developer
PEER Group

EDA/Interface A

Albert Fuchigami is a senior software developer at PEER Group Inc. and has spent more than 20 years helping semiconductor OEMs integrate their equipment into factories around the world. He is a globally recognized leader in the SEMI Standards Program, co-leads the North America Data Diagnostic Acquisition (DDA) Task Force, and contributes to the Information & Control Technical Committee. Albert enjoys demonstrating how standards can maximize data communication with factory host systems and is a champion for integrating HTTP/2 with gRPC and Protocol Buffers technology into the Equipment Data Acquisition (EDA) / Interface A standards. He holds a Bachelor of Mathematics (Computer Science) degree from the University of Waterloo.

3:25 pm - 3:35 pm
Stacy Ajouri
Senior Member of Technical
Texas Instruments
Mark Roos
CEO
Roos Instruments

RITdB

Stacy Ajouri is a Senior Member of Technical Staff at Texas Instruments in the Test Technology Group. She is the co-chair of the North America Automated Test Equipment (ATE) Technical Committee and the RITdb Task Force. She has over 30 years of experience across multiple disciplines related to test and test operations. Pulling from that experience, she supports the implementation of RITdb proof of concepts (POCs) focusing what is needed by the manufacturing and engineering community.

Mark Roos is CEO of Roos Instruments, a longtime producer of semiconductor ATE. He co-chairs the North America ATE Technical Committee and the RITdb Task Force. Roos has been involved in standards development for ATE for the past 20 years. He is currently heavily involved in the focus of RITdb POCs on scaling and latency.

3:35 pm - 3:45 pm
Dave Huntley
Product Manager Assembly Products
PDF Solutions

Traceability and E142

Dave Huntley was the founder and president of KINESYS Software in 1992 which developed the Assembly Line Production Supervisor (ALPS). PDF Solutions acquired the ALPS in 2017 and Dave now works in Strategic Marketing, Business Development & Standards Liaison focused on defect / process tracking and single device traceability across the supply chain.

He has a long history working with SEMI. He was co-lead of the Sort Map task force responsible for the SEMI E142 Specification for Substrate Mapping Standard. Dave is now the co-lead for the Traceability committee and two SEMI task forces; 1) Advanced Backend Factory Integration working on applying and extending wafer fab automation standards to assembly and test and 2) Single Device Traceability task force working on blockchain traceability for the supply chain.

3:45 pm - 3:55 pm
Alan Weber
Vice President, New Product Innovations
Cimetrix

Closing Remarks

CAST 3:00 pm - 4:00 pm Off Add to Calendar 2024-02-22 15:00:00 2024-02-22 16:00:00 Standardizing the Semiconductor Manufacturing Backend United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

CAST logo

About Collaborative Alliance of Semiconductor Test (CAST)

CAST serves SEMI members and other stakeholders in the semiconductor test area. CAST members include leaders from automated test equipment (ATE) companies, fabless, IDMs, and OSAT companies. CAST members work with their customers, suppliers, and industry colleagues to develop industry standards that reduce costs and spur innovation.

Watch On-demand
Event format

Registration

2024 Technology Workshops Enabling the Future of Electronics

Registration Fee
(April 16 & 17 only)

$250 members
$399 non-members

SEMI members who wish to join the NextFlex Workshop on April 19th should contact [email protected] for a special discount code.

Cancellation Policy

Cancellations received on or before March 16, 2024, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after March 16, 2024, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to Michelle Fabiano at [email protected].

2024 Technology Workshops Enabling the Future of Electronics
United States Future of Electronics Tile Technical

Recommended Hotel

Hotel Room

Residence Inn by Marriott

4610 Vestal Pkwy E, Vestal, NY 13850
TEL: (607) 770-8500

Hotel Room
https://www.idsnm.com/
https://www.engr.washington.edu/

SEMI NBMC Technical Gap Analysis Workshop - Tues. 4/16 - 8 am-6 pm 
During this workshop, attendees will address the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives. Breakfast, and lunch will be included and reception at the end of the day will be included.

SEMI FlexTech FHE Technical Gap Analysis Workshop - Wed. 4/17 - 8 am-4 pm, followed by tours of Binghamton University labs
Attendees will then turn their sights to completing a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Breakfast, lunch and tours of Binghamton University lab tours will conclude the day.

Binghamton University Tours - Wed. 4/17 - 4:00pm - 5:30pm
The tour will include facilities that are part of the S3IP (Small Scale Systems Integration & Packaging) a New York State Center of Excellence, CAMM (Center for Advanced Microelectronics Manufacturing) a New York State Center of Advanced Technology and home to the New York Node of NextFlex, the Analytical & Diagnostics Laboratory, the IEEC (Integrated Electronics Engineering Center) a New York State Center of Advanced Technology and NECCES (the Northeast Center for Chemical Energy Storage). 

Register for Tour

Binghamton University 2024 Art of Science Exhibit - Wed. 4/17 - 4:00pm - 5:30pm
Binghamton University holds an annual contest that celebrates the beauty of science through photographs and images that describe some aspect of research and captured visually.  The advances in imaging technology and tools mean that scientists have an increased ability to generate exciting data as well as to create compelling works of art and workshop attendees are invited to the opening reception for the 2024 Art of Science Exhibit in the atrium of the Center of Excellence Building. Contest winners will be announced, and refreshments will be served. 

In addition:
NextFlex Workshop– Thurs, 4/18 
NextFlex will convene the hybrid electronics community for a one-day workshop at Binghamton University in New York on April 18 to explore and define collaborative responses to soon to be announced opportunities under the CHIPS and Science Act, including the National Advanced Packaging Manufacturing Program (NAPMP), with a specific focus on advancing hybrid electronics for industrial and medical applications.

Additional information and separate registration
SEMI members who wish to join the NextFlex Workshop on April 19th should contact [email protected] for a special discount code.

Binghamton University, Innovative Technologies Complex (ITC)
85 Murray Hill Rd
Vestal, NY 13850
United States

Tuesday, April 16

7:00 am - 8:00 am

Registration and Breakfast

8:00 am
Dr. Grupen-Shemansky is the Chief Technology Officer and VP of Technology Communities at SEMI.
Melissa Grupen-Shemansky
Vice President, Technology Communities
SEMI

Opening Remarks

8:15 am
Stephaney Shanks
Stephaney Shanks
Division Director, Integrative Health and Performance Sciences
UES, a BlueHalo company

Vision and Mission of NBMC

8:30 am
Gina Tollefson
Air Force Research Laboratory

NBMC Gap Analysis Workshop - AFRL Perspective

8:40 am
Robert Andosca
Robert Andosca
Co-founder, President, and CEO/CTO
INVIZA® Health

Energy Harvesting for Wearables

9:10 am
Muyang Lin
Muyang Lin
University of California, San Diego

A Fully Integrated Wearable Ultrasound System to Monitor Deep Tissues in Moving Subjects

9:25 am - 9:55 am

Break

9:55 am
Dylan Shah
Dylan Shah
Arieca

Self-Powered Wireless Soft Electronics

10:10 am
Teresa Abraham
Teresa Abraham
Sapphiros

Low-cost, Connected Blood Collection Device with Onboard Biosensors to Detect Biomarkers for Human/Cognitive Performance

10:25 am
Robert Andosca
Robert Andosca
Co-founder, President, and CEO/CTO
INVIZA® Health

Smart Remote Patient / Airmen Monitoring (RPM / RAM) Platform

10:35 am
Azar Alizadeh
Principal Scientist
GE HealthCare Technology & Innovation Center

Multiplexed Wireless Interstitial Fluid Monitoring Devices for Stress Assessment

10:50 am
Jack Ly
Jack Ly
UES

Transdermal Optical Microneedle Sensors for Continuous Monitoring of Physiological Analytes in Interstitial Fluid

11:05 am
Anthony Wertz
Anthony Wertz
Research Intern
Carnegie Mellon University

Liquid Metal Embedded Elastomers: Electromigration Characterization and Use in Stretchable Sensors

11:20 am
John Strang
John Strang
CEO
Dermisense

Crossing the Chasm to Commercialization

11:35 am
David Kim
David Kim
North Carolina State University

Liquid Metal Filled Fibers for Next Generation E-Textiles

11:50 am
William Jamie Tyler
William "Jamie" Tyler
Co-founder, Executive Leader and Professor
IST, LLC

Auricular Bioelectronics for Medicine and Augmented Human-Machine Cognition

12:05 pm
Cameron Good
Carmeron Good
Vice President, Research and Product Development
Attune

Individualized Focused Ultrasound Stimulation of the Brain to Enhance Alertness and Cognitive Performance

12:20 pm - 1:30 pm

Networking Lunch

1:30 pm - 3:00 pm

Breakout Strategy Sessions

Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.

3:00 pm - 3:15 pm

Break

3:15 pm - 4:45 pm

Breakout Sessions Readout

4:45 pm - 6:15 pm

Networking Reception

Wednesday, April 17

7:00 am - 8:00 am

Registration and Breakfast

8:00 am
Gity Samadi
Gity Samadi
Senior Director
SEMI

Opening Remarks

8:05 am
Robert Bob Praino
Bob Praino
Chief Operating Officer (COO) and Co-founder
CHASM Advanced Materials

FHE Consortium Mission and Vision

8:20 am
Dan Balder
Dan Balder
Engineering Manager
SunRay Scientific
Madhu Stemmermann
Madhu Stemmermann
CEO and Co-Founder
Sunray Scientific

Advancements in Scalable Anisotropic Adhesive for FHE Manufacturing

8:40 am
Rafael Tudela
Rafael Tudela
Technical Program Leader for Flexible and Printed Electronics
Tapecon

Bending the Future: The Expanding Horizons of Flexible Hybrid Electronics

8:55 am
Eric Acome
Eric Acome
CEO and Co-Founder
Artimus Robotics

HASEL Artificial Muscles: High Performance Electrostatic Transducers Enabled by the Combination of Flexible Electronics and Liquid Dielectrics

9:10 am - 9:40 am

Break

9:40 am
Mike Mastropietro
Michael A. Mastropietro
CTO/Director of R&D
ACI Materials, Inc.

Materials and Processes for High Volume Integration of Stretchable Circuits into E-Textile

9:55 am
Devin MacKenzie
Devin MacKenzie
Washington University

Breaking Through 10 Micron Barrier to Enable 3D Structuring of RF Antennas Interconnects Arrays for FHE

10:10 am
Dave Keicher
Dave Keicher
IDS

Aerosol Printing with Industrial Reliability - Performance Results for the NanoJet Gen2 Printhead

10:25 am
Robert Bob Praino
Bob Praino
CHASM Advanced Materials

Revisiting Transparent Antennas for 5G and Beyond - FT19-21-203

10:40 am
Amit Lal
Cornell University

Minimum Viable Virtual Fab for Accelerated Innovation of Semiconductor Manufacturing Processes and Future Devices

10:55 am
Felippe Pavinatto
Felippe Pavinatto
GE Aerospace

Printed RF Passive Sensors for High-Temperature Applications in Aerospace

11:10 am
Peter Doerschuck
Peter Doerschuk
Cornell University

AI Models for Optimizing FHE Printing Aided by Ultrasound Metrology

11:25 am
Emmanouil Tentzeris
Emmanouil Tentzeris
Ed and Pat Joy Chair Professor
Georgia Institute of Technology, School of ECE

Additively Manufactured Flexible " Smart" Packaging and Reconfigurable On-Package Antenna Arrays for Next Generation 5G/mm Wave System on Package Designs

11:40 am
Deepak Trivedi
Deepak Trivedi
GE Aerospace

CogniWorm: Compliant and Autonomous Grub for Navigation and Inspection fo Warped, Complex and Rough Environments

11:55 am - 1:05 pm

Networking Lunch

1:05 pm - 2:35 pm

Breakout Strategy Sessions

Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the morning session.

2:35 pm - 2:50 pm

Break

2:50 pm - 4:00 pm

Breakout Sessions Readout

4:00 pm - 5:30 pm

Binghamton University Laboratory Tours & 2024 Art of Science Exhibit and Reception

The tour will include facilities that are part of the S3IP (Small Scale Systems Integration & Packaging) a New York State Center of Excellence, CAMM (Center for Advanced Microelectronics Manufacturing) a New York State Center of Advanced Technology and home to the New York Node of NextFlex, the Analytical & Diagnostics Laboratory, the IEEC (Integrated Electronics Engineering Center) a New York State Center of Advanced Technology and NECCES (the Northeast Center for Chemical Energy Storage).

- FlexTech


Presented by

FlexTech nbmc and NextFlex logo

 

Hosted by

Binghamton University Logo

 

Join leaders from FlexTech, NBMC, NextFlex and the microelectronics industry in this dynamic workshop, where we'll explore advancements, challenges, and solutions in critical technologies like flexible hybrid electronics, hybrid electronics, wearables, bio-signal sensing for real-time cognitive and physical state monitoring, and more. Participate in hands-on sessions, cross-disciplinary discussions, and gain insights from industry and academia through impactful talks. Contribute your suggestions in dynamic breakout sessions to shape and enable the future of these technologies.

7:30 am - 6:00 pm Off Add to Calendar 2024-04-16 07:30:00 2024-04-17 18:00:00 2024 Technology Workshops Enabling the Future of Electronics Presented by Hosted by Join leaders from FlexTech, NBMC, NextFlex and the microelectronics industry in this dynamic workshop, where we'll explore advancements, challenges, and solutions in critical technologies like flexible hybrid electronics, hybrid electronics, wearables, bio-signal sensing for real-time cognitive and physical state monitoring, and more. Participate in hands-on sessions, cross-disciplinary discussions, and gain insights from industry and academia through impactful talks. Contribute your suggestions in dynamic breakout sessions to shape and enable the future of these technologies. Binghamton University, Innovative Technologies Complex (ITC) 85 Murray Hill Rd Vestal, NY 13850 United States SEMI.org [email protected] America/Los_Angeles public

Event Contact

For questions, please contact Michelle Fabiano at [email protected].

Register Now
Malaysia Singapore APS Workshop Mar 2024 Executive Technical

Supporting Partners

HRDC_2023
InvestPenang_logo_2022
MSIA_logo_2022
Featured Speakers
Highlighted content

This course will cover:

  • Evolution of IC Packaging – Fan-in, Fan-out WLP, Embedded Packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc.
  • Principles of Interconnects ranging from TAB, Wirebond to various Flip Chip bonding such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development
  • Board level assembly and its soldering materials and failure mechanisms for 2nd level interconnect
  • Overview of interposer of lead frame, ceramic, flex to BT substrates for Microelectronics Packaging
  • Assembly flow and new assembly techniques such as stealth dicing, compression molding, underfill molding etc., and its assembly materials for Microelectronics packaging
  • Material characterization from bulk to interfaces for Microelectronics packaging

Why should I attend?

  • Gain technical knowledge for industry professionals
  • Enhance knowledge in manufacturing and R&D know-how in IC packaging
  • Apply Key Technical Concepts in Problem Solving through Real Case Studies
  • Networking opportunities with industry peers

Who should attend?

  • Beneficial for directors, managers, process & equipment engineers, R&D engineers and Quality & Reliability engineers working in the areas of microelectronics packaging
  • Useful for sale or application engineers who supply packaging materials and tools to the industry

BROWSE OUR PHOTO GALLERY

Penang Business Summit Seminar 1: Advanced Packaging

Royale Chulan Penang
No 1 & 2, Pengkalan Weld, Georgetown
10300 Penang
Pulau Pinang
Malaysia

Image of Dr Lee Teck Kheng
MEET OUR SPEAKER
Dr. Lee Teck Kheng
Director, Technology Development Centre, Institute of Technical Education Singapore,
SEMI SEA Advance Packaging Technical Committee Member
9:00 am

Introduction to IC Packaging & Interconnects

Introduction to IC Packaging
• Functions of Packaging – Mechanical, Material, Electrical and Chemical
• Review of Packaging Trend – BGA, CSP, Fan-in & Fan-out WLP, 3D Packaging, SoC vs SiP etc
• Challenges in Assembly and Packaging

Interconnects
• Overview
• TAB Bonding
• Wirebonding – Ultrasonic, Thermocompression, Thermosonic mechanisms
• Flip Chip Bondings – Thermocompression, C4, Re-cap reflow, solid-state, ACF, Conductive paste bonding

12:00 pm

Lunch

1:00 pm

Board Assembly and Soldering & PCB and IC Carriers

Board Assembly and Soldering
• Through Hole & SMT – Stencil Print Process, Reflow Profile
• Solder Materials – Alloy, Flux, Solvents, self-alignment effect
• Pb Free Solder – Ternary phase diagram, SnAgCu
• Intermetallics and Growth – Diffusion mechanism, Arrhenius equation
• Testing and Reliability – Ball shear & pull failure strength and modes, Fatigue, Weibull distribution

PCB and IC Carriers
• PCB Technology – Material properties, PCB fabrication process, drilling, patterning, plating, solder resist, laminating
• IC Carriers – Design rule, Leadframe, LTCC, Flex and BT substrates
• Substrate Development

4:00 pm

Q&A | Case Studies

5:00 pm

End of Day 1

9:00 am

Assembly Process

• Thickness Reduction – Grinding, Lapping, Polishing, CMP
• Dicing/Singulation – Blade, Laser, Stealth dicing, Dicing after grind
• Die Attach – Eutectic bonding, DA materials, Collets
• Plasma – Argon, Oxygen plasma, Surface tension
• Encapsulation – Mold constitutes and properties, Transfer, Film and compression molding, Dam and fill
• Plating – Solder plating, NiPd finish, PPF
• Trim & Form – ESD, Lead formation, Spring back mechanism

12:00 pm

Lunch

1:00 pm

Material Characterization Techniques

• Introduction
• Bulk Material Characterization – Stress strain, Bending, Impact toughness, TGA, DSC, TMA, DMA
• Interfaces Characterization – Failure mode and strength, Wire pull, Ball pull, Double cantilever bending, Die shear, Mold button shear, Ball shear

2:30 pm

Q&A | Case Studies

3:30 pm

Lucky Draw

3:35 pm

End of Workshop

Note: Program is subject to changes.

Seminar 1 and Seminar 2 timing will overlap on 7 Mar .

- APHI Workforce Development

Advanced Packaging and Material Characterization

*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar

 

Participating Fee:

Usual Member Rate: SGD 750 
Usual Non-member Rate: SGD 935 

*The above rates are inclusive of coffee/tea breaks and luncheon for both days

Register before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates.

 

A certificate of completion will be awarded at the end of the seminar.

 

HRD Corp Logo
 

*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).
For HRDC claims, please refer to the following links on the claiming matrix and guidelines:

 

Contact us for enquiries!

For Program: 

Ms. Cecelia Fong | [email protected] | +65.9750.2382 

For Registration / HRDC Claims: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

 

Off Add to Calendar 2024-03-06 00:00:00 2024-03-07 00:00:00 Penang Business Summit Seminar 1: Advanced Packaging Advanced Packaging and Material Characterization*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar Participating Fee:Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935 *The above rates are inclusive of coffee/tea breaks and luncheon for both daysRegister before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates. A certificate of completion will be awarded at the end of the seminar.  *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Ms. Cecelia Fong | [email protected] | +65.9750.2382 For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123  Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Asia/Kuala_Lumpur SOLD OUT

Registration Details

Registration is required for this event as it is likely to reach maximum room capacity, at which point interested attendees will be waitlisted.

SEMI Members:  $100

Non-Members of SEMI:  $150

Refunds possible before January 10, 2024.  Substitutions allowed up to January 24.

Questions? Contact James Amano at [email protected].

Belgium France Germany Ireland Italy United States Register Now 2024 EHS Summit Business Executive Technical

The Summit includes strategic business and technical information for many levels and sectors of the ecosystem, including:

  • Government relations/advocacy staff
  • EHS regulatory professionals
  • Senior executives
  • Business development
  • Device manufacturers
  • Equipment suppliers
  • Materials suppliers
  • Component suppliers
  • Fab and facility systems construction companies

SEMI
673 South Milpitas Avenue
Milpitas, CA 95035
United States

8:30 am - 9:00 am

Registration & Networking

9:00 am - 9:05 am
James Amano, SEMI
James Amano
Senior Director, EHS
SEMI

Welcome

9:05 am - 9:20 am
James Amano, SEMI
James Amano
Sr. Director, EHS
SEMI

Europe PFAS Restriction Proposal

9:20 am - 9:45 am
Russ LaMotte
Russ LaMotte
Principal
Beveridge & Diamond PC

US EPA PFAS Reporting rule

9:45 am - 10:10 am
Andrew Petraszak
Andrew Petraszak
Tokyo Electron
Ben Kallen, SEMI
Ben Kallen
SEMI

PFAS US States Proposals & Positions

10:10 am - 10:30 am

Break

10:30 am - 11:00 am
Lauren Crane
Lauren Crane
Lam Research

European Regulations

Including: EU Machinery Regulation, Battery Regulation, Cybersecurity Resiliency Act (CRA), AI regulation, the Ecodesign “passport” concept. UK Conformity Assessed (UKCA) mark. California fan efficiency regulation. SEMI EHS Standards update.

11:00 am - 11:25 am
Allen Karpman
Allen Karpman
Arkema

AIM Act: HFC Allocations

11:25 am - 11:50 am
Kristine Baranski, PE, Intel
Kristine Baranski, PE
Global Air Program Manager
Intel

AIM Act: challenges with new refrigerants

11:50 am - 12:10 pm
Katelyn Walck
Katelyn Walck
Chemours
Jim Snow SCREEN
James Snow
SCREEN

SIA PFAS Consortium

12:10 pm - 1:15 pm

Lunch & Networking

1:15 pm - 1:35 pm
James Amano, SEMI
James Amano
SEMI

SEMI PFAS Initiative

1:35 pm - 2:00 pm
Russ LaMotte
Russ LaMotte
Principal
Beveridge & Diamond

TSCA PBT: PIP, DecaBDE, What's Next?

2:00 pm - 2:35 pm
Ben Gross, Applied Materials
Ben Gross
Applied Materials
Supika Mashiro
Supika Mashiro
TEL
Katelyn Walck
Katelyn Walck
Chemours
Lauren Crane
Lauren Crane
Lam Research

Supply Chain Inquiry Panel - sharing best practices

2:35 pm - 2:55 pm

Q&A

2:55 pm - 3:00 pm

Wrap-Up

3:00 pm - 3:30 pm

Networking

Standards

Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry.

Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include:

  • US EPA PFAS Reporting Rule 
  • US AIM Act HFC phasedown: challenges with new refrigerants 
  • US AIM Act HFC Allocation 
  • EU: PFAS Restriction Proposal, F-gas, Revised Machinery Regulation, Revised Battery Regulation, Pending Cybersecurity resiliency regulation, Pending AI regulation, the ecodesign “passport” concept.
  • Updates from SEMI PFAS Initiative and other collaborative industry efforts.
  • US EPA TSCA: PIP 3:1, DecaBDE…what's next?
  • Panel discussion on supply chain communication.

Plan now to attend, network and strategically prepare your company.  This event is offered as an in-person briefing only.

8:30 am - 3:30 pm Off Add to Calendar 2024-01-25 08:30:00 2024-01-25 15:30:00 2024 EHS Summit Plan now to join fellow semiconductor industry professionals at SEMI Headquarters in Milpitas, California for presentations and discussions around critical EHS regulatory issues impacting the industry. Industry experts will address regulations in Europe and the United States that could significantly threaten our capability to continue manufacturing. Topics will include: US EPA PFAS Reporting Rule  US AIM Act HFC phasedown: challenges with new refrigerants  US AIM Act HFC Allocation  EU: PFAS Restriction Proposal, F-gas, Revised Machinery Regulation, Revised Battery Regulation, Pending Cybersecurity resiliency regulation, Pending AI regulation, the ecodesign “passport” concept. Updates from SEMI PFAS Initiative and other collaborative industry efforts. US EPA TSCA: PIP 3:1, DecaBDE…what's next? Panel discussion on supply chain communication. Plan now to attend, network and strategically prepare your company.  This event is offered as an in-person briefing only. SEMI 673 South Milpitas Avenue Milpitas, CA 95035 United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Registration

Registration for this workshop is free.

For questions, please contact Mayura Padmanabhan at [email protected].

 

+
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Cybersecurity workshop new location Business Executive Technical
Highlighted content

SEMI Cybersecurity Launch Workshop

Join us for a 2-day working session to align our industry on concrete next steps to secure semiconductor manufacturing against an ever-evolving threat environment. With our complex and interconnected supply chains, no single company can be safe unless all companies are safe. Our consortium of device makers, foundries, equipment makers, component suppliers, and software suppliers are working together to rapidly develop a practical plan to improve security now, and for years to come while minimizing costs and avoiding duplication.

 

Who should attend:

• Device makers • Foundries • Tool suppliers • Component makers • Software suppliers ​and CISOs • Executives • Decision-makers • Managers • Security professionals

Intel - SC12 - Santa Clara 12
CA
United States

Day 1: December 6, 2023 - Noon - 7 pm PT

12:00 pm - 7:00 pm

• Consortia governance, structure, deliverables, and roadmap for 2024
• E187 SEMI Standard implementation ideation session
• Develop a method to survey, evaluate, and certify manufacturing equipment cybersecurity protections
• Globalization of SEMI Taiwan’s E187 reference architecture and checklist

Day 2: December 7, 2023 - 8 am - 3 pm PT

8:00 am - 3:00 pm

• Opportunities for collaboration and information sharing for cyber threats and incidents
• Supply Chain Cybersecurity working session
• Create a semiconductor industry-specific framework to measure security and implementation approach across the entire ecosystem
• Review NIST industry profiles and evaluate for suitability in semiconductor
• Next steps: Including forming working groups and assigning leaders

- Standards

Join us for a 2-day workshop aimed at developing and advocating a practical, standards-based, industry-wide approach to improving cybersecurity and resilience across the semiconductor supply chain.

Time:

Day 1: Noon - 7 pm PT

Day 2: 8 am – 3 pm PT

In-person registration has reached capacity. However, you can still register to participate online.

 

Off Add to Calendar Disabled America/Los_Angeles Register now
Event format
United States Mesoline Webinar Graphic Business Technical

United States

MSIG

Introduction to Mesoline’s Emerging 3D Micro Printing Technology, Microchannel Particle Deposition (MPD), Used for MEMS & Sensors

Mesoline’s Microchannel particle deposition (MPD) is a wafer-scale thick-film deposition process where a polymeric stamp is used to transfer ink onto a substrate. This novel microfabrication technology offers ultra-small and reproducible micro features fabricated with extensive parallelization and high scalability. Unique process features include: (1) full wafers patterning in 15-minutes, (2) 1 to 50mm structures with up to 5/1 aspect ratios and 3) full 3D-control of the printed structures. Many different sensor applications of this technology will be introduced, including: (1) printing sensing electrodes for metal oxide gas sensors, (2)printing of getters for microbolometers, (3) printing of porous electrodes for biosensing applications and (4) accurate deposition of glass frit for advanced packaging applications.

8:00 am - 9:00 am Off Add to Calendar 2023-12-06 08:00:00 2023-12-06 09:00:00 Mesoline’s 3D Micro Printing Technology & Microchannel Particle Deposition Introduction to Mesoline’s Emerging 3D Micro Printing Technology, Microchannel Particle Deposition (MPD), Used for MEMS & Sensors Mesoline’s Microchannel particle deposition (MPD) is a wafer-scale thick-film deposition process where a polymeric stamp is used to transfer ink onto a substrate. This novel microfabrication technology offers ultra-small and reproducible micro features fabricated with extensive parallelization and high scalability. Unique process features include: (1) full wafers patterning in 15-minutes, (2) 1 to 50mm structures with up to 5/1 aspect ratios and 3) full 3D-control of the printed structures. Many different sensor applications of this technology will be introduced, including: (1) printing sensing electrodes for metal oxide gas sensors, (2)printing of getters for microbolometers, (3) printing of porous electrodes for biosensing applications and (4) accurate deposition of glass frit for advanced packaging applications. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
Event format
Belgium China France Germany Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Register Now EMG tile Business Executive Technical Featured Speakers

PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

This webinar will address the what, why, and how of PFAS in the semiconductor industry. Laurie Beu, noted semiconductor EHS consultant and leader of SIA’s Semiconductor PFAS Consortium, will provide an overview of PFAS materials, concerns about health effects, and the current state of regulatory response. Laurie’s talk will be followed by Ralph Dammel, Technology Fellow at EMD Electronics, who will provide insights from a materials manufacturer’s perspective on the use of PFAS in the multiple markets addressed by EMD. He will discuss the importance of PFAS in lithography chemicals, the impact of potential new regulations, and options to reduce or eliminate the use of PFAS in semiconductor applications.

Virtual, Online
United States

Laurie Beu
Laurie S. Beu, P.E.
Consultant
Laurie S. Beu Consulting
Ralph R. Dammel
Ralph R. Dammel
Technology Fellow, CTO Office
EMD Electronics
James Amano
Moderator
James Amano
Sr. Director, EHS
SEMI
EMG FOA Standards

PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector. 

 

10:00 am - 11:00 am Off Add to Calendar 2023-10-18 10:00:00 2023-10-18 11:00:00 Spelling semiconductors without “F” (luorine) PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue. Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector.    Virtual, Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

Registration

SEMI Member: $99

Non-Members: $199

Cancellations received on or before October 30, 2023, are fully refunded with a $50 processing fee. Refunds will not be issued for cancellations (including no-shows) made after October 30, 2023, and only substitutions are accepted with a written note from the registered attendee. Please email your cancellations or substitutions on company letterhead to Michelle Fabiano at [email protected].

For questions, please contact Michelle Fabiano at [email protected].

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United States MedTech Workshop tile 2023 Business Executive Technical

Hotels

The workshop will take place at the EMD Serono Research Center.

Address: 45 A Middlesex Turnpike, Billerica, MA 01821-3936 | Room: Three Sisters

Please remember to bring your photo ID or passport for check-in.

 

Suggested hotels in proximity are:

Merck new logo
EMD Electronics

THINK BIG, START SMALL, ACT FAST

As we witness a paradigm shift in the Healthcare Revolution – moving from a provider-centric model to one of personalized care that democratizes healthcare access - it becomes evident that the core of this transformation revolves around microelectronics and associated technologies. The "Navigating the Digital Health Revolution" workshop serves as a conduit between engineering and life sciences, emphasizing the confluence of Medicine and Digital Technology in reshaping digital healthcare.

We invite you to join this exciting workshop hosted by Merck, EMD to prepare for an increasingly intelligent future for all humanity!

Who Should Attend?

Scientists  ●  Entrepreneurs  ●  Microelectronics engineers  ●  Data analysts  ●  Broader community of MedTech innovators

Why Attend?

  • Identify industry challenges (such as Data Transparency, Technology Limitations, Supply Chain Weaknesses, Regulatory Challenges, Cybersecurity)
  • Prioritize these challenges.
  • Identify solutions that are better addressed collectively.
  • Develop an execution plan for these solutions.

EMD Serono Research Center
45 A Middlesex Turnpike
Room: Three Sisters (Photo ID or passport needed for check-in)
Billerica, MA 01821
United States

7:00 am - 7:30 am

Registration

7:30 am - 8:00 am

Breakfast

8:00 am - 8:10 am
Dr. Grupen-Shemansky is the Chief Technology Officer and VP of Technology Communities at SEMI.
Melissa Grupen-Shemansky
Vice President, Technology Communities
SEMI

Opening Remarks

8:10 am - 8:35 am
Laura circle
Laura Matz
Chief Science and Technology Officer
Merck KGaA

Unleashing the Potential: How Merck is enabling Healthcare with Digital Health

8:35 am - 8:40 am
Gity
Gity Samadi
Director, FlexTech Group
SEMI

SEMI NBMC R&D Overview

8:40 am - 9:05 am
Laila circle
Laila Salah
Sales Technical Lead
Senso Medical

The Rise of Biochemical Signals

9:05 am - 9:20 am

Break

9:20 am - 9:45 am
Sujay circle
Sujay Viswanath
Managing Director, MedTech Commercial Strategy
Deloitte Consulting

Articulating The Value of DigitalHealth

9:45 am - 10:15 am
Michael circle
Michael Chen
Co-founder & CEO
Nuclera

Rapid Protein Access for Drug Discovery Through a Semiconductor-based Technology

10:15 am - 10:45 am
Emre circle
Emre Ozcan, PhD
VP, Global Head of Digital Health
Merck KGaA (EMD Serono)

From Devices to Digital: How EMD Serono achieved Impact in Human Growth Space

10:45 am - 11:15 am
Azar Alizadeh, GE Research
Azar Alizadeh
Principal Scientist
GE HealthCare Technology & Innovation Center

Remote Patient Care Monitoring - Opportunities and Challenges for Wearable Device Development

11:15 am - 11:45 am
Robert circle
Robert Irwin
Manager, Advanced Development & Project Management
Molex

Harnessing the Power of Smart Medical Devices in the Digital Healthcare Revolution

11:45 am - 1:00 pm

Networking Lunch

1:00 pm - 3:00 pm

Breakout Strategy Sessions

Attendees will break into groups for smaller discussions to identify challenges, prioritize those challenges and identify opportunities on critical issues discussed throughout the day which may include the role of AI in MedTech, data security and privacy in digital health and emerging technologies in MedTech.

Topics:
1. Electronics Supply Chain for Medical Applications
2. Data, AI & Cyber Security
3. Bridging the Gap Between Electronics & Medical Device Technology

3:00 pm - 3:15 pm

Break

3:15 pm - 4:00 pm

Breakout Sessions Readout

4:00 pm - 5:30 pm

Networking Reception

Join us for a one-day MedTech workshop to explore the convergence of semiconductor engineering and life sciences and engage in enriching breakout sessions led by experts. Discover how industry leaders can collaborate on semiconductor-driven solutions to improve healthcare care delivery to everyone, everywhere.

Please note that seats are limited to 80 attendees.

This event is organized by the SEMI Smart MedTech Initiative. 

7:30 am - 5:30 pm Off Add to Calendar 2023-11-30 07:30:00 2023-11-30 17:30:00 MedTech Workshop - Navigating the Digital Health Revolution Join us for a one-day MedTech workshop to explore the convergence of semiconductor engineering and life sciences and engage in enriching breakout sessions led by experts. Discover how industry leaders can collaborate on semiconductor-driven solutions to improve healthcare care delivery to everyone, everywhere. Please note that seats are limited to 80 attendees. This event is organized by the SEMI Smart MedTech Initiative.  EMD Serono Research Center 45 A Middlesex Turnpike Room: Three Sisters (Photo ID or passport needed for check-in) Billerica, MA 01821 United States SEMI.org [email protected] America/New_York public America/New_York Register now