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SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

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Abstract/Description

Current electromechanical design practice is predicated on the exercise of expert-level judgement through an interactive and iterative design and fabrication process that requires skilled humans at every step. This approach doesn't scale because it is labor intensive, and therefore biases robots toward longer-lasting, more general-purpose (and expensive) designs in order to justify the development and fabrication costs. Though appropriate in some cases, not all applications are well-served by this process. Many robot applications might be better-served by rapidly-built special-purpose or single-use machines, but automated design and fabrication tools will be critical to control costs, accelerate development, and be responsive to application needs.

The overall goal is to make electromechanical systems (robots) so easy to design and fabricate that we could enable people who are application experts (but not necessarily robot design or fabrication experts) to rapidly create robots for their specific needs. Although Roboticists claim that robots are for dull, dirty, and dangerous use-cases, the community predominantly uses them for the first case, because robots are currently expensive and slow to build, which makes them precious. If we change this situation by making robots practically disposable/expendable, we could potentially re-imagine many robot use-cases.

With this future in mind, new design tools to convert high-level requirements specified by non-experts into concrete electromechanical design plans, new materials that leverage multi-material additive manufacturing, and new multi-material 3D printing methods to automatically convert these designs into functional robots are being developed. During this course we will describe these various areas of current study as well as possible applications for 3D printed robotics.

About the Instructors

Dr. Robert MacCurdy is an assistant professor in Mechanical Engineering at the University of Colorado Boulder where he leads the Matter Assembly Computation Lab (MACLab). He is developing new algorithms, materials, and fabrication tools to automatically design and manufacture electromechanical systems, with a focus on robotics. Rob did his PhD work with Hod Lipson at Cornell University and his postdoctoral work at MIT with Daniela Rus. He holds a B.A. in Physics from Ithaca College, a B.S. in Electrical Engineering from Cornell University, and an M.S. and PhD in Mechanical Engineering from Cornell University.

Dr Gregory Whiting is an Associate Professor in the Department of Mechanical Engineering and a member of the Materials Science and Engineering Program at the University of Colorado Boulder (CU).  At CU he leads the Boulder Experimental Electronics and Manufacturing (BEEM) Laboratory, which is focused on studying and developing materials, processes and devices for novel and additively manufactured electronic systems used in applications including distributed sensing (particularly for environmental monitoring) and robotics. Prior to joining CU in 2017, Greg was a member of the Rapid Evaluation Team at Google[X] and managed the Novel Electronics Area at the Palo Alto Research Center. He received a PhD from Cambridge University in 2007 and a BS from UC Berkeley in 2002.

United States

Dr. Robert MacCurdy
Dr. Robert MacCurdy
Asst. Professor of Mechanical Engineering
University of Colorado, Boulder
Greg Whiting
Greg Whiting, PhD.
Assoc. Professor
University of Colorado, Boulder
FlexTech

Fabricating robots using additive design and manufacturing methods has the potential to transform when, where and how the advantages of robots are brought to bear.  

Take this FlexTech Master Class to explore the potential applications and how to use new design tools, 3D printing methods and multi-material additive manufacturing to convert ideas into solid electromechanical robotic systems.

Led by Dr. Robert MacCurdy and Prof. Greg Whiting of the University of Colorado, Boulder, this course will provide you new ways to approach manufacturing, additive design and the role of robots.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
Event format

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

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Printed, flexible and hybrid electronics (PFHE) enable emerging applications in IoT, medical sensing, smart packaging and labels, structural monitoring, human wellness and performance, monitors, extreme environment, and display applications. At the same time, PFHE approaches can also provide faster product development, prototyping, and manufacturing cycles for single, custom items to large areas, low-cost mass manufacturing scales in additive, more sustainable pathways for electronics as they become even more ubiquitous in our world.

This class covers the basics of PFHE processing technologies, from dispensing and inkjet printing to roll to roll printing and coating, along with the materials and supplementary thermal processes that enable these processes.

Next-generation technologies are also explored for high-resolution PFHE and additive manufacturing that could provide new form factors and manufacturing approaches and exceed the performance of conventionally-processed electronics.  These technologies also have impact on unmet heterogeneous integration possibilities in fields ranging from electronics to optics and quantum materials.

Example PFHE and printed energy materials topics:

  • Dispensing and 3D printing of electronic and energy materials
  • Aerosol printing
  • High resolution inkjet printing and coating
  • Screen Printing
  • Flexographic Printing
  • Gravure printing
  • Slot die coating
  • Convective, IR and photonic thermal processing
  • Microcontact printing and embossing
  • Submicron electrohydrodynamic printing

About the Instructor

Devin MacKenzie

J. Devin MacKenzie is the Washington Research Foundation Professor of Clean Energy and an Associate Professor of Materials Science and Engineering and Mechanical Engineering at UW.  Dr. MacKenzie is also the director of the Washington Clean Energy Testbeds, an open access laboratory with world-class printed electronics, flexible electronics and energy device fabrication and testing capabilities. 

Dr. MacKenzie has 20 years of experience co-founding or leading startups in novel fabrication including as a co-founder and CEO of Imprint Energy commercializing printed  flexible batteries, as CTO of Add-Vision, a printed flexible OLED display company that was acquired in 2011, and as a VP at Kovio, an MIT spin out, leading printed Si RF device integration.  Devin also co-founded the world’s first printed electronics company, Plastic Logic Ltd. in the United Kingdom.  Previously Dr. MacKenzie was a researcher at AT&T Bell Laboratories.

Prior to entering the start-up world, Devin was a postdoc in Physics at the University of Cambridge and earned PhD, MS, and BS degrees from the University of Florida and MIT. Dr. MacKenzie has over 220 patents and publications and has been cited over 10,000 times.

This is the 11th Flexible Electronics Master Class. This and previous classes are available On Demand.  See the full list.

United States

FlexTech

The field of printed, flexible and hybrid electronics (PFHE) and energy devices provides pathways to new products and form factors for ultralight, thin, flexible and large-area electronics, sensors, processing, I/O, photonics, and power.  Indeed, flexible electronics is quietly transforming packages and enabling radical changes in electronics from the inside out.

In this Flexible Electronics Experts Class (recorded on June 22, 2022) you will learn the basics and the next generation improvements in processing technologies, from dispensing and inkjet printing to roll-to-roll printing and coating.  The instructor also addressed the latest materials and updates on supplementary thermal processing needs.

This course is appropriate for newcomers to the field, as well as those looking to rapidly gain information on the latest materials and equipment advancements.

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On-Demand Registration

Member: $49
Non-Member: $99

Registrants will receive the presentation recording and PDFs of Webinar #1 

United States Register Now Business Technical

SiC—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon

Silicon (Si) power devices have dominated power electronics due to their excellent starting material quality, ease of fabrication, low cost volume production, and proven reliability. Although Si power devices continue to make progress, they are approaching their operational limits primarily due to their relatively low bandgap and critical electric field that result in high conduction and switching losses, and poor high temperature performance.

In this webinar, the favorable material properties of Silicon Carbide (SiC), which allow for highly efficient power devices with reduced form-factor and cooling requirements, will be outlined. High impact application opportunities, where SiC devices are displacing their incumbent Si counterparts, will be reported. Material and device fabrication aspects will be highlighted with an emphasis on the processes that do not carry over from the mature Si manufacturing world and are thus specific to SiC. Fab models will be analyzed, and the vibrant U.S. SiC manufacturing infrastructure (that mirrors that of Si) will be presented.

 

View Previous Webinar in the SiC Series

  • Webinar #1—Silicon Carbide Material Properties, Key Applications, and Fabrication Basics: Making the Transition from Silicon
  • Webinar #2—Non-CMOS Compatible SiC Power Device Fabrication in Volume Si Fabs
  • Webinar #3—Bidirectional SiC and GaN Switch Technology 
  • Webinar #4—Understanding Sic Chip Cost, the Impact of Defects, and the Case of Price Parity With Si at the System Level
  • Webinar #5—SiC Edge Termination Technology

 

Meet the Speaker
 

Biography

United States

Victor Veliadis, PowerAmerica
Victor Veliadis, PhD
Executive Director and Chief Technology Officer,
PowerAmerica

Now Available On-Demand!

Join us as we dive into the special properties of silicon carbide (SiC) and how they're displacing their incumbent silicon counterparts. 

 

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Registration Details

Attending this webinar is Free.

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Sponsored by

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Featured Speakers

About the Speaker

Dr. Chris Huang ASEDr. Chris Huang currently serves as Deputy Project Manager for MEMS & Photonics Engineering at ASE. In his current role, he is focused on MEMS and optical sensor packaging in automotive applications, as well as smart sensor and smart system technologies for emerging applications. Since joining ASE over four years ago, he has gained significant experience in the fields of sensor and actuator design, MEMS device and wafer manufacturing, and sensor packaging, including extensive work in the field of microfabrication of piezoresistive MEMS sensors and wafer bonding process.

Prior to ASE, he worked as an R&D Technologist at Asia Pacific Microsystems Inc., a pure-play MEMS foundry, where he managed the development of standard fabrication platforms for customizable sensors, such as MEMS optical actuators/piezoresistive pressure and force sensors. Dr. Huang has published over thirty-five technical SCI journal papers and international conference papers and holds eight worldwide patents on MEMS and sensor applications. Dr. Huang received his Ph.D. from National Tsing Hua University, Taiwan, where he also completed work as a post-doctoral researcher within the Department of Power Mechanical Engineering

United States

MSIG

The incredible power of MEMS technology and sensor applications has been elevated onto the world stage in recent times, given how they help enable technology and applications that are literally changing lives, from health to transportation, from robotics to AI, from edge to cloud, and from 5G to beyond. 

During this SEMI MSIG webinar, ASE’s Dr. Chris Huang will elaborate and put a spotlight on the role that packaging technologies play and the innovation evolving to progress miniaturization and integration, both key attributes within the MEMS and Sensors arena.

He will present unique approaches required to overcome MEMS and Sensor packaging and test challenges and achieve highest possible performance when responding and interacting with any external or environmental stimuli.

Q&A will follow.

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format

REGISTRATION

Registration
  • Registration Close: 5 pm, Friday, June 24(KST)
  • Registration Fee
    • SEMI Members / Students: KRW 250,000
    • Non-members: KRW 300,000
Registration
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SPONSOR

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NOTICE

  • The agenda will be subject to change without notice.
    Presentation files agreed by speakers will be provided to attendees.

 

CONTACT

Online
South Korea

[Keynote]

David Bruno
Davide Bruno
Regional Vice President of Marketing & Application for AMS MEMS; Head of Smartphone Competence Center– China and APeC Regions
STMicroelectronics

ST Journey to The OnLife Era Where The Fusion of Technology and Life is Possible

Keynote_Pierre Delbos_Biography & Abstract.jpg
Pierre Delbos
Technology & Market Analyst,
Yole Développement

What Future Lies Ahead For Automotive MEMS & Sensors?

[S1. Fusion Sensor]

S1-1 Abstract_Biography_MSIF Korea 2022(Chung Dohyoung).
Dohyung Chung
Executive Advisor,
TDK InvenSense

Sensor Solutions for Robotics

S1-2_Silvio Graf.png
Silvio Graf
Senior R&D Engineer MEMS,
Sensirion

Solving Contamination for Environmental Sensors in a High-Volume Production

S1-3_Daniel Goehl_Biography & Abstract._0.jpg
Dan Goehl
Co-founder and Chief Business Officer,
Ultrasense System

Mechanical Buttons Out, Solid State Interfaces In: How MEMS and silicon integration is changing the way we interact with the vehicle

MIke housholder
Mike Housholder
VP Marketing & Business Development,
xMEMS

Reinventing Sound with MEMS Speakers

[S2. Sensor for Mobility]

S2-1_Junhwan Kim.jpg
Junhwan Kim
CEO,
StradVision

Production-ready deep-learning-based perception software on embedded SoC for ADAS and autonomous driving

S2-2_HoCheol Suh.jpg
HoCheol Seo
CTO,
Han-Mech Controls

The Trend of H2 Sensor in the FCEV

Joon-Hyuk Lee
Joon-Hyuk Lee
Senior Researcher,
Fire Insurers Laboratories Korea (FILK)

Thermal Runaway Behavior of Li-Ion Battery

[S3. Innovative Applications]

blank
Dohyun Kim
Co-CEO,
Vtouch

Introduction of Vtouch, Inc. and Spatial touch solution

S3-2_Jinhwan Jung_Biography & Abstract.png
Jinhwan Jung
Chief Research Officer (CRO),
Asleep

Essential Solutions for Sleep tech: Contactless Sleep Tracking

S3-3_Nara Won_Photo.jpg
Nara Won
Smart Radar System

The evolution of radar technology for ADAS, Industrial, and Smart City applications

S3-4_Brett Goldsmith_0.png
Brett Goldsmith
CTO,
Cardea

Moving from Sensors to Biosignal Processing Units

- MSIG

[NOTICE] MEMS & Sensors Industry Forum(MSIF) 2022 will be held as a Virtual Conference. The registrants will receive the conference access guideline via email on June 27(Mon).

 

In the era of Digital Transformation, the Sensor industry has limitless potential for growth. From mobility to smart cities, it is possible to collect and analyze more data with the power of sensors, and various applications are being developed based on this.
MEMS & Sensors Industry Forum, the premier business conference in Korea that represents the MEMS & Sensors industry, consists of talks by domestic and foreign experts on the latest market information and key technologies needed to develop sensor applications. In particular, this year, we will discuss the present and future of sensor technology in a total of four sessions: Fusion Sensor, Sensor for Mobility, and Innovative Applications. Don't miss the opportunity to get a vision for the new business model and sensor industry.
 

Off Add to Calendar 2022-06-29 00:00:00 2022-07-08 00:00:00 MEMS & Sensors Industry Forum 2022 [NOTICE] MEMS & Sensors Industry Forum(MSIF) 2022 will be held as a Virtual Conference. The registrants will receive the conference access guideline via email on June 27(Mon).   In the era of Digital Transformation, the Sensor industry has limitless potential for growth. From mobility to smart cities, it is possible to collect and analyze more data with the power of sensors, and various applications are being developed based on this. MEMS & Sensors Industry Forum, the premier business conference in Korea that represents the MEMS & Sensors industry, consists of talks by domestic and foreign experts on the latest market information and key technologies needed to develop sensor applications. In particular, this year, we will discuss the present and future of sensor technology in a total of four sessions: Fusion Sensor, Sensor for Mobility, and Innovative Applications. Don't miss the opportunity to get a vision for the new business model and sensor industry.   Online South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul

REGISTRATION

Registration

REGISTRATION

  • Early-bird Registration Close: 5 pm, Friday, May 13(KST)
  • Registration Fee
    • Early Bird (~ May 13)
      • SEMI Member: KRW 280,000
      • Non Member: KRW 330,000
    • Regular (After Early-bird-May 25)
      • SEMI Member/ Student : KRW 330,000
      • Non Member: KRW 380,000
Registration
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SPONSORS

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NOTICE

  • The agenda will be subject to change without notice.
  • Translation(Korean subtitles) will be provided only for Keynote presentations.
  • Presentation files agreed by speakers will be provided to attendees.
  • Live session will be live-streamed on Afternoon, Wednesday, May 18(KST).
  • On-demand Session will be provided 24/7 during the event period(May 18-31)

 


 

CONTACT

South Korea

Live Session- May 18(Wed)

2:00 pm - 2:05 pm

Welcome

2:05 pm - 2:35 pm
1_Jae Hyun Kim.png
Jaehyun Kim
Fellow/ Material Development, Future Tech R&D Center,
SK hynix

[Collaboration] ESG & EUV

2:35 pm - 3:05 pm
2_Youn Joung Cho.jpg
Youn Joung Cho
Master of Material Development Team,
Samsung Electronics

[Collaboration] Challenges and Opportunities of Materials for Next Generation Semiconductors

On-demand Session- 24/7, May 18(Wed)-31(Tue)

K1_Christoph Adelmann
Christoph Adelmann
Scientific Director,
imec

[Keynote] Materials Aspects in Advanced Logic and Memory Technology

K2_Christophe Fouquet_Photo
Christophe Fouquet
Member of ASML Board of Management, EVP EUV,
ASML

[Keynote] Extending Lithography into the next decade with EUV 0.55 NA.

K3_Dan Hutcheson
G. Dan Hutcheson
Vice Chair,
TechInsights

[Keynote] New Challenges = Greater Opportunities - Semiconductor Industry Macro Trends

S1-1_Jae Hwan Sim
Jae Hwan Sim
R&D Manager,
DuPont Electronics & Industrial, Korea Technology Center

[Advanced Patterning] Thin Organic Underlayers for EUV Lithography

S1-3_Rich Wise.jpg
Rich Wise
Vice President, Dry Photoresist Products,
Lam Research

[Advanced Patterning] Defect free EUV Patterning with Dry Photoresist System

S1-4_Ming Feng Li
Ming Feng Li
Senior Marketing director in Surfscan-ADE division,
KLA

[Advanced Patterning] Material Qualification through Inspection and Wafer Geometry Metrology

S1-5_HakJoo Lee
HakJoo Lee
Process Development Manager / Plasma ALD Nitride Process Division,
ASM

[Advanced Patterning] Selective Nitride Deposition by Plasma ALD

S2-1_Yichen Liang
Yichen Liang, Ph. D.
Scientist/Team Lead,
Brewer Science

[Emerging Materials] Application of Underlayers on Printing High Resolution Line/Space and Contact Hole Patterning Using Extreme Ultraviolet Lithography

S2-2_Bing Han_Photo_re
Bing Han
Executive Director and Global Marketing Head,
Thin Film Solutions | Electronics business of Merck KGaA, Darmstadt, Germany

[Emerging Materials] Material Development Through Collaboration

S2-3_Young Soo Park
Young Soo Park
Executive Vice President,
Soulbrain

[Emerging Materials] Building Materials for a Sustainable Semiconductor Business

blank
Ashutosh Misra
Group Vice President, Sustainable Development,
Air Liquide

[GWP (Global Warming Potential)] Novel Etch Gases with Low Global Warming Potential

S3-2_Hyeong-Kwan Kim
Hyeong-Kwan Kim
Senior Managing Director,
Global Standard Technology

[GWP (Global Warming Potential)] Reduction Technologies of GHGs Emission in Semiconductor Production

S4-1_Mark Thirsk.jpg
Mark Thirsk
Managing Partner,
Linx Consulting

[Market Trends] Materials Market Dynamics

S4-2_Shumin Wang
Shumin Wang
Chairman & CEO,
Anji Microelectronics Technology (Shanghai)

[Market Trends] Viewing of the SEMI Materials Ecosystem in China

S4-3_Lita Shon-Roy
Lita Shon-Roy
President / CEO,
TECHCET

[Market Trends] Impact of Chip Expansions on Semiconductor Supply Chains – Critical Materials

-

[NOTICE] Due to the rapid spread of the Omicron variant, SMC Korea 2022 will be held as a Virtual Conference for the safety of attendees and speakers.

 

Materials- The Next Big Thing 

In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as ESG, GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together.
SMC Korea 2022 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) and ESG status in terms of materials. Please join us in the insights of global experts!

Off Add to Calendar 2022-05-18 00:00:00 2022-05-31 00:00:00 SMC Korea 2022 [NOTICE] Due to the rapid spread of the Omicron variant, SMC Korea 2022 will be held as a Virtual Conference for the safety of attendees and speakers.   Materials- The Next Big Thing  In the semiconductor industry, a stable and efficient global supply chain is as important as the continuous development of advanced technology. In addition to the trade conflict and reshoring, new trends such as ESG, GWP(Global Warming Potential) are highlighted, and prompt response of the Ecosystem is essential. Accordingly, SMC Korea is trying to provide an opportunity for the semiconductor industry to discuss issues that need to be spoken out together. SMC Korea 2022 prepares various presentations to share information on the latest technologies and markets through the participation of global leading companies while also checking global warming potential (GWP) and ESG status in terms of materials. Please join us in the insights of global experts! South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
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Registration Details

Registration is free of charge, but must be done in advance 

 

 

 

Belgium France Germany United States Register Now PNT 2 Gap Analysis 2023 Business Technical

Massachusetts Institute of Technology—MIT
50 Memorial Dr,
Samberg Conference Center, Chang Building (E52)
Cambridge, MA 02142
United States

1:00 pm - 3:00 pm

Phase 2 Project Introductions

- Low-SWaP-C, GPS-free PNT technology
- Novel materials, fabrication & packaging techniques and approaches
- Advancements in atomic clock and quantum sensor photonics

3:00 pm - 4:30 pm

Break Out Sessions

Thrust Area 1: Novel Materials, Fabrication, and Packaging Techniques for Low-SWaP Inertial and PNT Sensors
Thrust Area 2: Advanced Active and Passive Integrated Photonics for Low-SWaP Atomic Clocks, Quantum Systems, & PNT Sensors
Thrust Area 3: Advancements Towards Low-SWaP, GPS-Free PNT Technologies

4:30 pm - 5:00 pm

Group Reports & Wrap Up

MSIG

SEMI MSIG has another $5M in R&D funding for sensor positioning, navigation, and timing (PNT) technology development! Register now to attend our half-day Gap Analysis workshop, taking place May 22nd, the afternoon before our premier sensor technology-event, the MEMS & Sensors Technical Congress (MSTC). Meet US Gov’t subject matter experts (SME’s) to discuss PNT pain points and get insights into this year’s request for proposals (RFP) expected in June 2023.

The workshop will feature presentations from the new 2023 PNT projects and identify areas for this year’s RFP.

Have your voice heard, as SEMI MSIG and the Army Research Lab work to fund PNT R&D technology improvements in a 5-year (2022-2027) $25M program.  This gap analysis workshop is a critical component of the program’s 2nd year activities.

1:00 pm - 5:00 pm Off Add to Calendar Disabled America/Los_Angeles

Hotel

Cambridge hotels are expensive in late May, so we have made a deal for you, click here!

We have a room block reserved at DoubleTree Suites by Hilton Hotel Boston, Cambridge for May 21, 2023 through May 25, 2023. Booking your room is simple, just select "Book a Room" to receive your group's preferred rate. Must book rooms before May 12th to obtain discounted rate.

Please book your hotel reservations online for MSTC 2023 Conference or guests can call our 24-7 reservations desk to book your room or please ask for the Front Desk and then provide the Group Code: MSTC 

Book a Room Here

*must book rooms before May 12th to obtain discount rate. 

Registration Details

During Registration, you will have the option to also register for MEMS & Sensors Technical Congress (April 26-27) and the Positing, Navigation & Timing Gap Analysis Workshop (April 25).  3 Great Opportunities to Network, Learn, Share and Connect in 1 week.

CANCELLATION POLICY:

  • Substitution available anytime with written note from original registrant.
  • 75% Refund is cancelled before April 15, 2022. 
  • 50% Refund if cancelled between April 16 and date of workshop.
  • No refunds after April 28.
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Speaker Bios

Mahesh Chowdhary, Ph.D. is a Fellow and Director of Strategic Platforms & IoT Excellence Center at STMicroelectronics based in Santa Clara CA. He leads effort on development of solutions and reference designs for mobile phones, consumer electronic devices, automotive and industrial applications that utilize MEMS sensors, computing and connectivity products. His area of expertise includes AI/ML, MEMS sensors, IoT, digital transformation, and location technologies. He has been awarded 30 patents. He has spoken extensively internationally about Machine Learning, Smart Sensors, and IoT. Mahesh received PhD in Applied Science (Particle Accelerators) from the College of William & Mary in Virginia. He is also an Adjunct Professor at IIT, Delhi.

Mahaveer Jain - Mahaveer Jain is Application Principal Engineer at STMicroelectronics(Santa Clara, CA) and specializing in MEMS sensors, Algorithm, DSP, and Machine Learning . Over the course of his career, Mahaveer worked on indoor navigation, hybrid positioning , sensor calibration, and sensor fusion. His most recent work has been developing extremely low power machine learning models to run on sensors. Mahaveer received a Bachelor of Technology in Physics from IIT Delhi.

Denis Ciocca - Denis is Staff Applications Engineer at STMicroelectronics specializing in Linux OS, Linux device drivers, Android OS, and Smart sensors. He has developed a variety of solutions with MEMS sensors, a computational platform of STM32 microcontrollers and wireless connectivity solutions. Denis has received his Master’s degree in Computer Science and Engineering from the University of Pavia, Italy.

Featured Speakers
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Course Abstract:

This class will explain and demonstrate how AI/ML logic can be implemented on Edge devices such as Smart sensors. Power efficiency, latency, and bandwidth considerations are important for AI/ML implementation on Edge devices. Computing can be distributed between Edge devices and Cloud. The latest trends and applications of smart sensors in consumer electronics, automotive, and industrial use cases will be discussed.

Course Outline:

  1. AI / ML on Edge devices
    1. Why AI / ML on Edge devices?
      1. Power efficiency, latency and bandwidth considerations when executing AI / ML logic on Edge devices.
    2. Computing distribution between Edge device, gateway and Cloud.
    3. Assignment: Finite State Machine and Decision Tree applications
  2. Introduction to Inertial Sensors with AI / ML capabilities
    1. Background on inertial sensors including applications
    2. Typical performance characteristics of inertial sensors
    3. Lab: SensorTile.Box and use of custom sensors to change sensor sampling rate, filters, and other configuration. 
  3. Machine Learning Core (MLC) in Smart Sensor
    1. An introduction ML at Edge of the Edge, Smart Sensors: Latest trends Applications of Smart sensors applications in consume electronics, automotive, industrial use cases. Next generation of smart sensors.
    2. AI on the Edge and requirements of distributed intelligence system.
    3. Introduction to MLC framework
      1. Input data
      2. Filters and Feature selection
      3. Optimization
      4. Tools
    4. Rapid Prototyping with MLC: current consumption under 10 uA
    5. Lab: Motion Intensity detection using MLC. Lab conducted using AlgoBuilder tool.  
  4. Finite State Machines (FSM) in Smart Sensor
    1. Introduction to FSM
      1. Input data
      2. FSM definition and structure
      3. Conditions list
      4. Tools
    2. Rapid Prototyping using FSM:
    3. Lab: Gesture recognition using FSM. Lab conducted using AlgoBuilder Tool.

SEMI
673 South Milpitas Avenue
Milpitas, CA 95035
United States

Mahesh Chowdhary
Mahesh Chowdhary, Ph.D.
Fellow & Director of Strategic Platforms & IoT Excellence Center
STMicroelectronics
Mahaveer Jain
Mahaveer Jain
Applications Principal Engineer
STMicroelectronics
Dennis Cioccca
Denis Ciocca
Staff Applications Engineer
STMicroelectronics
MSIG

Earn CEUs and IEEE PDHs from this hands-on SEMI MSIG Master Class & Lab, where instructors will explain and demonstrate how AI/ML logic can be implemented on edge devices such as smart sensors. Attendees will build and operate their own edge device with AlgoBuilder tools in 2 lab sections of the course.

This course is designed for applications engineers wanting to learn how to add sensors to an existing or new product. Instructors are experienced STMicroelectronics engineers with many sensor design and implementations.

The course covers many topics including the importance of power efficiency, latency, and bandwidth considerations for AI/ML implementation on edge devices. Learn how computing can be distributed between the edge devices and the cloud. The latest trends and applications of smart sensors in consumer electronics, automotive, and industrial use cases will also be discussed.

Join us in person at SEMI HQ, for this hands-on learning experience. 

This course is underwritten by STMicroelectronics.

ST Logo

8:30 am - 5:30 pm Off Add to Calendar Disabled America/Los_Angeles

Registration

This meeting is open for FOA Members Only. 

If you are interested in becoming a member, please contact Karim Somani - [email protected].

 

United States Austin Marriott South Business Executive Expositions Technical

Hotel Information and Airport Information

Austin Marriott South

4415 South IH-35

Austin, Texas, 78744

Austin Marriott South for 219.00 USD per night - Last Day to Book: Monday, February 02, 2026

Booking link: Book your group rate for FOA Q1 Collaborative Forum

Austin-Bergstrom International Airport
3600 Presidential Blvd
Austin, TX 78719

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Austin Marriott South
4415 South IH-35
Austin, TX 78744
United States

10:30 am - 5:00 pm

FOA Golf Event (Tee Time Start) - Onion Creek Club

Onion Creek Club

2510 Onion Creek Parkway

Austin, TX 78747

5:00 pm - 9:00 pm

Women of FOA - Evening Dinner & Social Activity

Meeting room: Sycamore A&B

Day 1 -February 25, 2026 (times are subject to change)

8:00 am - 12:00 pm

Device Maker Morning Meeting - IDM's Only

Meeting room: Lone Star Ballroom

8:00 am - 8:30 am

Registration check-in & Gathering

8:30 am - 8:40 am
Karim Somani
SEMI

Meeting Start - Introductions, Agenda Review, Sponsor Recognition, Next Meetings

8:40 am - 9:40 am
Mark da Silva
SEMI

Open Forum Topics #1

9:40 am - 9:50 am
Rick Glasmann
MAX

Welcome Reception sponsor presentation - MAX

9:50 am - 10:30 am

Coffee Break

10:30 am - 10:40 am

Social Event sponsor presentation - INFICON

10:40 am
Mark da Silva
SEMI

Open Forum Topics #2

11:40 am - 11:50 am
Sean Tropsa
SEEQ

DM Lunch sponsor presentation - SEEQ

11:50 am - 1:00 pm

DM Lunch - IDM's Only

Lunch will be in rooms: Sycamore A&B and Bluebonnet

SEEQ

Continuation Day 1 - February 25, 2026 (times are subject to change)

12:00 pm - 6:00 pm

Exhibit Opens

Exhibits will be displayed in the foyer

1:00 pm - 6:00 pm

Session 1 - General Meeting for all FOA Members

Meeting Room: Lone Star Ballroom

1:00 pm - 1:10 pm
Mark da Silva

Welcome remarks & Updates

Removing Manufacturing Bottlenecks (Case Studies)

1:10 pm - 1:35 pm
GlobalFoundries & Semilab

Next-Generation In-Line AFM Metrology for Silicon and GaN Applications

1:35 pm - 2:00 pm
Northrop Grumman & Applied Materials

Reduction of Through-Silicon Via (TSV) Sidewall Roughness through Process Optimization in Bosch Dry Etch Process: A Collaborative Study

2:00 pm - 2:30 pm
Tosca Derrick
Baker Tilly

Industry – Tariff Updates

2:30 pm - 2:55 pm
Broadcom & Fabworx Solutions

Particles vs. Productivity: Root-Cause Solutions that Unlocked Tool Performance

2:55 pm - 3:25 pm

Coffee Break #1 – Sponsored by JST

JST

Improving Fab Efficiency (Case Study)

3:25 pm - 3:50 pm
ST Microelectronics & INFICON

From Insight to Action: Elevating Employee Efficiency with Smart Detection and Targeted Data Delivery

3:50 pm - 4:20 pm
Inna Skvortsova
Market Research Manager, SEMI’s Market Intelligence
SEMI

SEMI Market Outlook - Fab Investments, Equipment and Materials Forecast

4:20 pm - 4:50 pm
Michelle Williams-Vaden
Executive Director, SEMI Foundation
SEMI

SEMI Foundation

4:50 pm - 4:55 pm

Wrap-up & directions to Welcome Networking Reception (within the hotel)

7:00 pm - 10:00 pm

Welcome Networking Reception

Room: Sycamore A&B and Bluebonnet - Sponsored by MAX Group

MAX IEG

Day 2 - February 26 2026

8:00 am - 12:00 pm

Session 2 - General Meeting

Meeting Room: Lone Star Ballroom

8:00 am - 6:00 pm

Exhibits Open

8:00 am - 8:40 am
Karim Somani

Gathering & Welcome Remarks

Improve Long-Term Plant Viability (Case Studies)

8:40 am - 9:02 am
Qorvo & camLine

Lessons from the SPACE Deployment Project: Implementation at Qorvo Wafer Fab

9:05 am - 9:30 am
FormFactor & Olsson

Transforming a Mature Semiconductor Factory to Meet FormFactor’s Advanced Manufacturing Needs

9:30 am - 9:55 am
Polar Semiconductor & Mortenson

Polar Semiconductor Expansion and Modernization Project

9:55 am - 10:05 am
ControlSoft

Break Sponsor Presentation - ControlSoft

10:05 am - 10:35 am

Coffee Break #2 – Sponsored by ControlSoft

ControlSoft
10:35 am - 11:00 am
Analog Devices & ControlSoft

Transformation in Motion: A solution for 200mm fab AMHS upgrades

Agentic AI in Manufacturing (Case Study)

11:00 am - 11:25 am
Intel & Seeq

Intel + Seeq’s Multi-Agent Architecture to "Dim the lights" in facilities Operations

11:25 am - 11:35 am
Michelle Williams-Vaden
Executive Director, SEMI Foundation
SEMI

Thursday Lunch sponsor presentation - WFOA

11:35 am - 1:30 pm

Lunch - All Members & Speakers

Lunch will be in rooms: Sycamore A&B, Bluebonnet and Wrangler

SEMI Foundation

Continuation Day 2 - February 26, 2026

1:30 pm - 6:00 pm

Session 3 - General Meeting

Meeting room: Lone Star Ballroom

1:30 pm - 1:45 pm
Mark da Silva

SEMI Technology Community Update

Improving Fab Efficiency (Case Studies)

1:45 pm - 2:10 pm
Qorvo & Siconnex

Improved Fab Productivity

2:10 pm - 2:35 pm
FOA DM & Flexciton

Solving Fab-Level Execution Gaps with Intelligent Action Prioritization and Quantified Impact Modeling

2:35 pm - 3:05 pm
Taimur Burki
Sustainability Consultant
SEMI

Sustainability - Waste Management and how to Make $$ off of your waste

3:05 pm - 3:35 pm

Coffee Break #3

3:35 pm - 4:00 pm
Analog Devices & Seertech Solutions

Driving Fab Efficiency Through Automated Workforce Qualification and MES-Integrated OJT Enforcement

4:00 pm - 4:25 pm
M.I.T. Lincoln Laboratory & Eyelit

Enhancing Semiconductor R&D Workflow Flexibility and Traceability through Eyelit’s Manufacturing Operations Management Platform

Deployment of Digital Twins (Case Study)

4:25 pm - 4:50 pm
GlobalFoundries & D-SIMLAB Technologies

Dynamic Simulation Enabled Prescriptive Analytics for the AI-Driven Autonomous Factory of the Future

4:50 pm - 5:05 pm
Peilun Sun
Consortium Manager, SCC
SEMI

From Fab Floor to Climate Impact: How SCC Supports Manufacturing Decarbonization

5:05 pm - 5:25 pm
Karim Somani

FOA – Inside the Fab (@ Northrop Grumman Jul 28 – Jul 30) & Wrap-up

7:00 pm - 10:00 pm

FOA Annual Poker Tournament: Austin Marriott South

Poker Tournament: Sycamore A&B, Bluebonnet and Wrangler

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FOA Events - February 24, 2026

- FOA Workforce Development

Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits.  

This event is for FOA Members only.  To learn more about becoming an FOA member, email [email protected]Visit the FOA web pages.

8:00 am - 10:00 pm Off Add to Calendar 2026-02-24 08:00:00 2026-02-26 22:00:00 FOA Summit (Q1 Collaborative Forum) Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits.  This event is for FOA Members only.  To learn more about becoming an FOA member, email [email protected]. Visit the FOA web pages. Austin Marriott South 4415 South IH-35 Austin, TX 78744 United States SEMI.org [email protected] America/Chicago public America/Chicago
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Belgium China France Germany Ireland Italy Japan South Korea Taiwan United States Register Now https://discover.semi.org/new-gdsi-dicing-process-webinar-on-demand.html MSIG WEbinar tile Business Executive Technical Featured Speakers

About the Speaker:  Rich Boardman is a 15-year veteran of the Semiconductor industry whose expertise lies in equipment sets, process technology and consumables related to wafer or substrate dicing, grinding or polishing. Rich is a Senior Sales Engineer at GDSI, located in San Jose, California.

United States

Richard Boardman GDSI
Richard Boardman
Senior Sales Engineer
GDSI

Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication. 

In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications.

The Stealth laser dicing process is a water-free, particle-free wafer singulation method.  It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting.

Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. .

8:00 am - 9:00 am Off Add to Calendar 2022-03-30 08:00:00 2022-03-30 09:00:00 MSIG Webinar GDSI Dicing Process Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.  In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications. The Stealth laser dicing process is a water-free, particle-free wafer singulation method.  It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting. Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. . United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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