Massachusetts Institute of Technology—MIT 50 Memorial Dr, Samberg Conference Center, Chang Building (E52) Cambridge, MA02142 United States
1:00 pm
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3:00 pm
Phase 2 Project Introductions
- Low-SWaP-C, GPS-free PNT technology
- Novel materials, fabrication & packaging techniques and approaches
- Advancements in atomic clock and quantum sensor photonics
3:00 pm
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4:30 pm
Break Out Sessions
Thrust Area 1: Novel Materials, Fabrication, and Packaging Techniques for Low-SWaP Inertial and PNT Sensors
Thrust Area 2: Advanced Active and Passive Integrated Photonics for Low-SWaP Atomic Clocks, Quantum Systems, & PNT Sensors
Thrust Area 3: Advancements Towards Low-SWaP, GPS-Free PNT Technologies
SEMI MSIG has another $5M in R&D funding for sensor positioning, navigation, and timing (PNT) technology development! Register now to attend our half-day Gap Analysis workshop, taking place May 22nd, the afternoon before our premier sensor technology-event, the MEMS & Sensors Technical Congress (MSTC). Meet US Gov’t subject matter experts (SME’s) to discuss PNT pain points and get insights into this year’s request for proposals (RFP) expected in June 2023.
The workshop will feature presentations from the new 2023 PNT projects and identify areas for this year’s RFP.
Have your voice heard, as SEMI MSIG and the Army Research Lab work to fund PNT R&D technology improvements in a 5-year (2022-2027) $25M program. This gap analysis workshop is a critical component of the program’s 2nd year activities.
SEMI MSIG PNT Gap Analysis Workshop
Learn About Phase 2 of the Positioning, Navigation and Timing (PNT) Funding Program
1:00 pm - 5:00 pm
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Hotel
Cambridge hotels are expensive in late May, so we have made a deal for you, click here!
We have a room block reserved at DoubleTree Suites by Hilton Hotel Boston, Cambridge for May 21, 2023 through May 25, 2023. Booking your room is simple, just select "Book a Room" to receive your group's preferred rate. Must book rooms before May 12th to obtain discounted rate.
Please book your hotel reservations online for MSTC 2023 Conference or guests can call our 24-7 reservations desk to book your room or please ask for the Front Desk and then provide the Group Code: MSTC
Mahesh Chowdhary, Ph.D. is a Fellow and Director of Strategic Platforms & IoT Excellence Center at STMicroelectronics based in Santa Clara CA. He leads effort on development of solutions and reference designs for mobile phones, consumer electronic devices, automotive and industrial applications that utilize MEMS sensors, computing and connectivity products. His area of expertise includes AI/ML, MEMS sensors, IoT, digital transformation, and location technologies. He has been awarded 30 patents. He has spoken extensively internationally about Machine Learning, Smart Sensors, and IoT. Mahesh received PhD in Applied Science (Particle Accelerators) from the College of William & Mary in Virginia. He is also an Adjunct Professor at IIT, Delhi.
Mahaveer Jain - Mahaveer Jain is Application Principal Engineer at STMicroelectronics(Santa Clara, CA) and specializing in MEMS sensors, Algorithm, DSP, and Machine Learning . Over the course of his career, Mahaveer worked on indoor navigation, hybrid positioning , sensor calibration, and sensor fusion. His most recent work has been developing extremely low power machine learning models to run on sensors. Mahaveer received a Bachelor of Technology in Physics from IIT Delhi.
Denis Ciocca - Denis is Staff Applications Engineer at STMicroelectronics specializing in Linux OS, Linux device drivers, Android OS, and Smart sensors. He has developed a variety of solutions with MEMS sensors, a computational platform of STM32 microcontrollers and wireless connectivity solutions. Denis has received his Master’s degree in Computer Science and Engineering from the University of Pavia, Italy.
This class will explain and demonstrate how AI/ML logic can be implemented on Edge devices such as Smart sensors. Power efficiency, latency, and bandwidth considerations are important for AI/ML implementation on Edge devices. Computing can be distributed between Edge devices and Cloud. The latest trends and applications of smart sensors in consumer electronics, automotive, and industrial use cases will be discussed.
Course Outline:
AI / ML on Edge devices
Why AI / ML on Edge devices?
Power efficiency, latency and bandwidth considerations when executing AI / ML logic on Edge devices.
Computing distribution between Edge device, gateway and Cloud.
Assignment: Finite State Machine and Decision Tree applications
Introduction to Inertial Sensors with AI / ML capabilities
Background on inertial sensors including applications
Typical performance characteristics of inertial sensors
Lab: SensorTile.Box and use of custom sensors to change sensor sampling rate, filters, and other configuration.
Machine Learning Core (MLC) in Smart Sensor
An introduction ML at Edge of the Edge, Smart Sensors: Latest trends Applications of Smart sensors applications in consume electronics, automotive, industrial use cases. Next generation of smart sensors.
AI on the Edge and requirements of distributed intelligence system.
Introduction to MLC framework
Input data
Filters and Feature selection
Optimization
Tools
Rapid Prototyping with MLC: current consumption under 10 uA
Lab: Motion Intensity detection using MLC. Lab conducted using AlgoBuilder tool.
Finite State Machines (FSM) in Smart Sensor
Introduction to FSM
Input data
FSM definition and structure
Conditions list
Tools
Rapid Prototyping using FSM:
Lab: Gesture recognition using FSM. Lab conducted using AlgoBuilder Tool.
SEMI 673 South Milpitas Avenue Milpitas, CA95035 United States
Mahesh Chowdhary, Ph.D.
Fellow & Director of Strategic Platforms & IoT Excellence Center
Earn CEUs and IEEE PDHs from this hands-on SEMI MSIG Master Class & Lab, where instructors will explain and demonstrate how AI/ML logic can be implemented on edge devices such as smart sensors. Attendees will build and operate their own edge device with AlgoBuilder tools in 2 lab sections of the course.
This course is designed for applications engineers wanting to learn how to add sensors to an existing or new product. Instructors are experienced STMicroelectronics engineers with many sensor design and implementations.
The course covers many topics including the importance of power efficiency, latency, and bandwidth considerations for AI/ML implementation on edge devices. Learn how computing can be distributed between the edge devices and the cloud. The latest trends and applications of smart sensors in consumer electronics, automotive, and industrial use cases will also be discussed.
Join us in person at SEMI HQ, for this hands-on learning experience.
This course is underwritten by STMicroelectronics.
Ai/ML on Edge Devices and Smart Sensor Integration Master Class
8:30 am - 5:30 pm
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FOA Summit (Q1 Collaborative Forum)
Registration
This meeting is open for FOA Members Only.
If you are interested in becoming a member, please contact Karim Somani - [email protected].
Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits.
8:00 am - 10:00 pm
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Add to Calendar2026-02-24 08:00:002026-02-26 22:00:00FOA Summit (Q1 Collaborative Forum)Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits. This event is for FOA Members only. To learn more about becoming an FOA member, email [email protected]. Visit the FOA web pages.Austin Marriott South 4415 South IH-35 Austin, TX 78744 United StatesSEMI.org[email protected]America/Chicagopublic
America/Chicago
About the Speaker: Rich Boardman is a 15-year veteran of the Semiconductor industry whose expertise lies in equipment sets, process technology and consumables related to wafer or substrate dicing, grinding or polishing. Rich is a Senior Sales Engineer at GDSI, located in San Jose, California.
United States
Richard Boardman
Senior Sales Engineer
GDSI
Join us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.
In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications.
The Stealth laser dicing process is a water-free, particle-free wafer singulation method. It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting.
Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. .
MSIG Webinar: The New GDSI Dicing Process
March 30, 2002 8-9 AM PT
8:00 am - 9:00 am
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Add to Calendar2022-03-30 08:00:002022-03-30 09:00:00MSIG Webinar GDSI Dicing ProcessJoin us for this second webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.
In this session, GDSI will provide an introduction of the Stealth Dicing process, highlight the applications it is most well suited to, and share design rules and process window specifications.
The Stealth laser dicing process is a water-free, particle-free wafer singulation method. It is particularly well suited to MEMS, Quantum, bio-sensing and Silicon Photonics to name a few use cases. Secondarily, it offers great value for multi-project wafer (MPW) applications since it allows singulation of the whole wafer in a single process step, negating the need for wafer sub-dicing and remounting.
Find out if your current wafer layout is compatible with the Stealth Dicing process, and if not, what must be done to ensure initial success with this innovative dicing technology. .United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
About the Speaker: Robert MacDonald is a MEMS engineer at GE’s Research. His research is focused on high performance inertial sensors. He has over 20 years of experience in the MEMS and semiconductor industries. His work has covered the product life cycle of chemical, inertial and optical sensors from design through market introduction and manufacturing.
Join us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.
In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs.
Designing MEMS with GE’s Polaris Process for Motion Sensor Fabrication
8:00 am - 9:00 am
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Add to Calendar2022-03-02 08:00:002022-03-02 09:00:00MSIG Webinar GE Polaris ProcessJoin us for this first webinar in the MSIG series on foundries, dicing, and packaging considerations in MEMS fabrication.
In this first in the series, GE Research will present their new MEMS process suitable for bulk silicon motion sensors. The process aims to deliver many features of complex MEMS flows, such as wafer level packaging with through silicon vias (TSVs), with a short cycle times and low mask counts. This webinar will introduce the Polaris process within the GE Research foundry and explain how to design the process, and our model for delivering new designs.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET). As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures based on Horizontal Nanosheet technology. Such a fundamental shift in transistor architecture will create new challenges to processes and materials, presenting opportunities for companies well-positioned for this shift.
In this webinar, SEMI EMG brings experts to explain the technology trends driving the industry adoption of Gate All Around, how the major players are approaching this transition, and the implications this will have on the material supply chain
Gate All Around Transistors - Opportunities Abound
Position yourself for the next chapter of Moore's Law
10:00 am - 11:00 am
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SEMI is pleased to once again partner with the HIR Symposium for this 5th Annual Symposium. See the full Agenda.
Don't miss the plenary talk by SEMI President and CEO, Ajit Manocha at 7:40 am PST!
7:30 am - 12:30 pm
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Add to Calendar2022-02-23 07:30:002022-02-24 12:30:00Fifth Annual Symposium on Heterogeneous IntegrationSEMI is pleased to once again partner with the HIR Symposium for this 5th Annual Symposium. See the full Agenda.
Don't miss the plenary talk by SEMI President and CEO, Ajit Manocha at 7:40 am PST!Virtual, Online United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Fifth Annual Symposium on Heterogeneous Integration
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CASTStandards
7:30 am - 12:30 pm
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Add to Calendar2022-02-23 07:30:002022-02-24 12:30:00Fifth Annual Symposium on Heterogeneous IntegrationVirtual, Online United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
SEMI Compound Semiconductor Materials Technology Forum
