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Add to Calendar2025-04-25 14:00:002025-04-25 17:00:00Gases and Facilities Japan Joint TC Chapter MeetingGases and Facilities Japan Joint TC Chapter MeetingFriday, April 25, 20252:00pm – 5:00pm JSTvia OVTCCM/ SEMI Japan Office (Hybrid) AGENDA Standards Contact Information:Akiko YoshidaSr. Coordinator, Standards & EHS, SEMI JapanEmail: [email protected] Phone: +81.3.3222.6018 NOTE:Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!Questions? Contact your local staff coordinator: Click hereSEMI Japan Office 26F, xLINK Marunouchi Eiraku Bldg. 1-4-1 Marunouchi, Chiyoda-ku Tokyo 1000005 JapanSEMI.org[email protected]Asia/Tokyopublic
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Add to Calendar2024-11-14 00:00:002024-11-14 00:00:00SEMI半导体供应链国际论坛—主题四：先进封装（异构集成）Guangzhou ChinaSEMI.org[email protected]America/Los_Angelespublic
Heterogeneous Integration (HI) has come a long way in 50 years. The world of multi-chip modules (MCMs) has given way to a vast ecosystem of chiplets, 3D stacked die, and co-packaging of antenna, high-bandwidth memory (HBM), and optics. HI is at the center of “More than Moore” development activities, as innovative engineers look for creative ways to overcome the slower scaling of silicon technology. The promise of HI is new devices with superior power, performance, area, and cost (PPAC). All these promises come with new challenges. Managing different process nodes, physical characteristics, mechanical stresses, and other system-level challenges not found in monolithic system-on-chip (SoC) devices, creates a great opportunity for design and manufacturing companies to reshape our industry.
In this webinar, we’ll explore this enabling technology from both the device maker and material supplier perspectives. We will learn about demands placed on devices by new applications and what new tools are needed to meet these demands. We will also hear about the challenges placed on materials and equipment suppliers to develop processes capable of manufacturing the individual components and integrating them into final products. Join us as our panel of experts address the issues and opportunities involved with heterogeneous integration.
United States
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging
2nd Generation 3D V-Cache™ Enablement
Andrea Chacko, PhD
Director of Packaging Solutions
Brewer Science
Dongshun Bai, PhD
Business Development Director and Senior Technologist of Packaging Solutions
Brewer Science
Enabling Heterogeneous Integration through Material Design
The realization of Heterogeneous Integration (HI) has been key in driving advancements in semiconductor technology. The complexities of integrating dissimilar materials continue to be a challenge for HI. All advanced packaging technologies rely on advanced materials to address the many challenges in achieving continued shrinking and improved performance of devices. Novel materials capable of managing mechanical stresses and increased thermal budgets with strict cleanliness requirements are required for processes such as wafer thinning, fan-out wafer-level packaging, and hybrid bonding. This presentation will highlight how advanced materials can address the growing challenges in the industry.
Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.
Heterogenous Integration finds its place
Webinar
10:00 am - 11:00 am PT
Zoom
10:00 am - 11:00 am
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Add to Calendar2024-10-16 10:00:002024-10-16 11:00:00Heterogeneous Integration finds its placeDive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
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