Application Engineering Director, DSG SEA, Cadence
Ms. Ice Li has been working in the semiconductor industry for over 20 years, including Avanti, Trident, NVidia, and 17 years in Cadence. She is currently the Application Engineering Director and is based in Singapore. Her Digital and Sign-off Group team of Application Engineers supports all Southeast Asia customers on Cadence Digital solution suite.
Presentation Title: Boosting Productivity by Using AI for Semiconductor Chip Design
Cadence as a company offers a comprehensive suite of AI-enabled chip design solutions ranging from Digital Design, IP, Functional Verification, 3D-IC, Systems Design, and Custom Analog Design, enabling compute of intelligent decisions on target workloads. The vision is to provide key benefits of improving design efficiency by ease of debugging, faster turnaround time, higher engineering productivity, and improved chip performance. This presentation will provide an overview of Cadence AI offerings with a focus on how Digital Implementation products are using AI, positively impacting design cycle and boosting PPA.