Senior Director, Innovation Engineering, Smart Manufacturing & AI, Micron Semiconductor Asia Pte Ltd
Theng Cheng graduated with an engineering degree from National University of Singapore with electives in Computing & Artificial Intelligence. He has over 25 years of experience in semiconductor manufacturing. His recent roles include Chief of Staff of Assembly & Test Global Operations & Site Director of Micron Malaysia. He currently leads Micron’s Smart Manufacturing & AI team innovating AI/ML solutions for Engineering groups.
Presentation Title: Applying artificial intelligence and machine learning for optimization in increasingly complex semiconductor manufacturing processes.
In today’s data driven world where AI applications permeate every moment of our lives, faster and higher quality memory & storage solution can be key performance differentiator for our customers. However semiconductor manufacturing processes are becoming increasingly challenging : smaller wafer fab process geometry, more complex packaging technology & exponentially growing testing requirements. Manufacturing optimization has gone beyond conventional engineering methods, requiring extensive application of End-to-End data analytics, deployment of Artificial Intelligence & Machine Learning methods. This presentation discusses some approaches key to improve manufacturing yields, optimize test experience to ensure quality levels meet our customer’s expectations.