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The semiconductor industry is expected to reach US$1 trillion by the end of the decade.  The next big technology revolutions (AI, 5G/6G, VR/AR, qubit computing, and more) are driving the need to manage exponential amounts of data. Everything from cars to coffee machines are generating data that needs to be moved, stored, computed, secured, and converted to end-user information. To make this a vision a reality requires innovation throughout the semiconductor industry, from new materials to new and improved process equipment to new device architectures designed to perform at speeds and densities once thought unachievable. In this webinar, we will hear from industry experts on what the 10-year technology trends look like and how semiconductor material and equipment suppliers are responding to the trends.  

Dr. Todd Younkin, President and CEO of Semiconductor Research Corporation (SRC) will discuss the evolving challenges and five “seismic shifts” that are driving advancement in the semiconductor industry.

Following Dr. Younkin’s talk, David Medeiros, Senior Director, CTO Office of Entegris, Inc. will address these challenges and describe how Entegris is driving materials innovation to overcome the obstacles faced by chip manufacturers.

United States

10:00 am - 10:03 am
Darron Jurajda Brewer Science
Darron Jurajda
Director, Semiconductor Business Operations
Brewer Science

Session Introduction

Biography: Darron Jurajda is the Director of Semiconductor Business Operations at Brewer Science. He is an expert in materials and process research for anti-reflective materials, multilayer materials, and processes for lithography. He has a diverse background including photolithography, chemical operations, and laboratory research. Darron has published in several technical proceedings and publications including SPIE, IEEE, and Solid State Technology. He has been a member of multiple SEMI Committees over the last 10 years. Darron holds a BS in chemical engineering from the University of Texas at Austin.

10:03 am - 10:25 am
Dr. Todd Younkin
Todd Younkin
President and CEO
Semiconductor Research Corporation (SRC)

Biography: Dr. Todd Younkin is a talented and seasoned executive with more than 20 years of experience in technology innovation. His extensive Research and Development experience spans Intel’s 0.18um to 5nm nodes with technical contributions in novel materials, nanotechnology, integration, advanced lithography, and integrated photonics. Most recently, he engineered, launched, and led all programmatic aspects of the five-year, $240 million JUMP research initiative. It has six multi-university, multi-disciplinary innovation Centers with 133 faculty, 835 students, and 360 industrial engineering liaisons. It emphasizes the advancement of Computer Science, Electrical Engineering, and Materials to secure continued U.S. thought leadership.

Todd brings a wealth of expertise with strengths in areas such as cultivating relationships with strategic partners, entrepreneurship and investment strategies, technology innovation, operational excellence, and talent management. He has spent much of his career working alongside young minds that are aspiring to influence the ever-changing world of smart and autonomous electronics. He has built programs from the ground up, leveraging his entrepreneurial leadership to drive new business development that has generated multi-millions in funding. He has been a key contributor in introducing new technology advances and starting new global research in the U.S., Europe, and Asia.
Dr. Younkin holds a Ph.D. from the California Institute of Technology in Pasadena, California. He completed his Bachelor of Science at the University of Florida in Gainesville, Florida. He aspires to continue to influence the next generation of technology and inventors, bringing ideas and investors together to drive heterogeneous electronic solutions that will deliver a smarter, shared future.

10:25 am - 10:45 am
Dave Medeiros
Dave Medeiros
Senior Director, CTO Office
Entegris

Biography: David Medeiros joined Entegris as a Senior Director of Engineering in the office of the CTO in April of 2021. His responsibilities involve developing an enterprise-wide lithography strategy, with a primary focus on the rapidly expanding field of EUV. Previously he spent six years at GLOBALFOUNDRIES (GF), first as the Senior Director of Patterning at Fab 8 in Malta, NY, and later as the Vice President of Central Engineering. Prior to GF, he spent seventeen years at IBM, starting as a Research Staff Member at T. J. Watson Research Center and culminating as the Director of Patterning R&D in the Microelectronics Division. His career began in the semiconductor industry as a synthetic chemist at Shipley Company, which is now part of DuPont. David holds a Ph.D. in Organic Chemistry from the University of Texas, Austin, where he was an Eastman Kodak fellow, and a B.S. in Chemistry from the University of Massachusetts, Amherst.

10:45 am - 10:55 am

Q&A with Audience Input

10:55 am - 11:00 am

EMG Overview & Wrap up

EMG

EMG Logo

10:00 am - 11:00 am Off Add to Calendar 2021-10-13 10:00:00 2021-10-13 11:00:00 Throwing the Kitchen Sink at IT - Innovations Driving towards a US$1 Trillion Semiconductor Industry United States SEMI.org [email protected] America/Los_Angeles public
Event format

The Electronic System Design Alliance, a SEMI Technology Community, welcomes Aselta Nanographics, of Grenoble, France, provider of advanced software solutions for wafer and mask patterning based on e-beam technology, as its newest member.

“Joining the ESD Alliance is a great opportunity to stay connected with the EDA community and take an active part in the discussions driving the future of semiconductor manufacturing,” remarks Yorick Trouiller, Aselta Nanographics’ CEO.

“Aselta Nanographics is making its mark in the semiconductor industry, and we are pleased it is joining as a member of the ESD Alliance,” comments Bob Smith, its executive director. “Companies like Aselta are helping manage increased complexity of mask data preparation due to technology improvements such as multi-beam mask writers and EUV lithography, and the ability to measure/inspect the effects both on reticle and on wafer.”

A spin-off of CEA-Leti, Aselta Nanographics maintains strong links with cutting-edge fundamental research and applies it to deliver advanced industrial solutions to customers in the U.S., Europe and Asia. It initially developed e-beam proximity effect correction software and now offers a portfolio of products that includes mask data preparation and metrology.

As a member of the ESD Alliance, Aselta Nanographics is also a member of SEMI, the global industry association representing the worldwide electronic product design and manufacturing supply chain.

About Aselta Nanographics
Aselta Nanographics of Grenoble, France, develops software tools to improve the quality process of chip production. It operates in the IC manufacturing world providing advanced software solutions for wafer and mask patterning based on e-beam technology as well as solutions for contour-based metrology. Aselta is currently developing cutting-edge software solutions for improving wafer fab and maskshop production yield for next generation nodes. For more information, see: www.aselta.com

About the SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry.

Follow SEMI ESD Alliance
www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://china.semi.org.cn/article/171 Business Executive Technical
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China

CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-09-24 00:00:00 2021-09-24 00:00:00 SEMI China Smart Mobility Webinar China SEMI.org [email protected] America/Los_Angeles public
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ESPOO, Finland, 7th of September 2021 – Picosun Group has taken into use new facilities at its production laboratory in Kirkkonummi, Finland. The Picosun Innovation Lab will be used for the company’s own research and development projects, for demo purposes and most importantly for serving the company’s global semiconductor customers operating in the 300 mm market.

The Innovation Lab hosts Picosun’s new generation tools PICOSUN® Morpher and PICOSUN® Sprinter. Morpher was launched in 2019 and it started a completely new era in Picosun products. Its adaptive and versatile nature makes it an ideal ALD solution for to the changing needs of different business verticals in the up to 200 mm wafer industries. Sprinter was launched late 2020 for the 300 mm wafer markets to meet the ever-increasing demands of semiconductor, display and IoT component manufacturing lines. It has brought single wafer film quality and uniformity for fast batch processing and met the challenges in high volume ALD manufacturing.

The Innovation Lab increases the laboratory capacity Picosun currently has on its premises significantly. The new facilities will have the ability to host tens of ALD tool modules. The facilities also support a variety of process gases including for example N2, O2, O3, Ar, H2, NH3 and NF3. Furthermore, special attention has also been paid for the best-in-class building management and safety systems.

“The opening of the new Innovation Lab reflects our role in being the pioneer in ALD and continuing the daily work in setting the standards for future innovations in the ALD sphere. The Innovation Lab has been a big investment for the company, but we see this as an essential investment to our and our customers’ future”, says Jussi Rautee, CEO of Picosun Group.

Watch the video on Picosun Innovation Lab: https://press.picosun.com/picosun-invests-in-future-with-its-innovation…

More information:
Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

United States Standards%20.jpg

Online, Pacific Time
United States

Standards

Liquid Chemicals

North America TC Chapter

Fall Meeting

Date: Wednesday, October 6, 2021

Time: 10:00-11:30 AM Pacific 

via Virtual Meeting

 

AGENDA

(Subject to change)

Last updated: September 6, 2021

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here

 

10:00 am - 11:30 am Off Add to Calendar 2021-10-06 10:00:00 2021-10-06 11:30:00 Liquid Chemicals North America TC Chapter Fall Meeting 2021 Liquid Chemicals North America TC Chapter Fall Meeting Date: Wednesday, October 6, 2021 Time: 10:00-11:30 AM Pacific  via Virtual Meeting   AGENDA (Subject to change) Last updated: September 6, 2021   NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here   Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public

The SEMI Electronics System Design (ESD) Alliance today announced completion of the anti-piracy SEMI Server Certification Protocol (SSCP) for software license management, a year-long joint development effort led by the ESD Alliance, a SEMI Technology Community.

The SSCP, approved by development committee members Cadence, Siemens EDA and Synopsys, uniquely identifies each customer license server to assure that licenses are issued only by authorized servers to help protect against software piracy. The SCCP is now undergoing standardization and will be managed by the SEMI Standards group after its finalization as an industry standard. The committee members intend to implement the protocol in their respective license management software.

"A big thank you to Cadence, Siemens EDA, and Synopsys, our joint development association partners, for their work to push the protocol forward," said Bob Smith, executive director of the SEMI ESD Alliance. "It took a concerted effort to reach this key milestone and that push will continue as we move forward to finalizing SSCP as an industry standard. Software piracy costs industry billions of dollars per year and hurts both vendors and their customers, a problem the protocol will help mitigate."

An industry-standard protocol to combat software piracy is a growing necessity for design automation software suppliers to ensure only authorized servers are issuing licenses. Design automation software is complex and requires ongoing and significant R&D investments. Bad actors can apply server cloning techniques to access unlicensed copies of the software, putting legitimate users and software vendors at a competitive disadvantage by forcing software vendors to increase prices to support continuing investments in R&D.

"The SSCP is a significant step forward for the semiconductor industry in its efforts to stem software piracy," said Nimish Modi, senior vice president of market and business development at Cadence. "The collaboration among design automation suppliers ensures a wide-ranging and inclusive anti-piracy strategy."

"Completing the server certification protocol is a huge achievement," said Joe Sawicki, executive vice president of IC EDA for Siemens. "Congratulations to everyone who worked to establish this anti-piracy standard that protects against theft and provides a level playing field for all our users."

"Synopsys is pleased to collaborate across the design automation industry to define a method to combat piracy," said Arun Venkatachar, vice president of Synopsys central engineering. "It is critical for the industry to level the playing field for legitimate users. We are committed to working with SEMI and the industry to implement the protocol and make it an industry standard."

"Ansys applauds the anti-piracy initiative led by the SEMI ESD Alliance to develop the SSPC," said Shane Emswiler, senior vice president at Ansys. "Ansys is committed to ensuring fair access for all users and combating piracy. We are proud to stand with our peers in this effort."

To learn more about SSCP, contact the SEMI ESD Alliance at [email protected].

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global Electronics industry.

Follow the ESD Alliance
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

ESPOO, Finland, 31st of August 2021 – Picosun Group strengthens its position in the 300 mm semiconductor market with its new generation ALD tool PICOSUN® Sprinter.

PICOSUN® Sprinter was first launched in December 2020 as a stand-alone module. Now also customer deliveries and installations of PICOSUN® Sprinter clusters have started.

“A Sprinter cluster consist of two Sprinter modules and a central vacuum wafer-handling robot utilizing 5 wafers handling. The set-up enables a throughput of more than 100 wafers an hour with 10nm aluminium oxide target film thickness”, explains Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

“The throughput capability combined with the unique design of the tool’s reaction chamber, the record-breaking batch film quality and the fact that the tool can be fully integrated with the customers’ production line, makes PICOSUN® Sprinter the tool of choice for semiconductor, display and IoT component industries who need a future-proof tool with single wafer film quality and uniformity in fast batch processing”, Kostamo concludes.

Read more about PICOSUN® Sprinter and watch the video:
https://www.picosun.com/products/300mm-wafers/picosun-sprinter/

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

United States Standards%20.jpg

Online, Pacific Time
United States

Standards

MEMS/NEMS

North America TC Chapter

Fall Meeting

Date: Wednesday, September 29, 2021

Time: 1:30-2:30 PM Pacific 

via Virtual Meeting

 

AGENDA

(Subject to change)

Last updated: September 20, 2021

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here

 

1:30 pm - 2:30 pm Off Add to Calendar 2021-09-29 13:30:00 2021-09-29 14:30:00 MEMS/NEMS North America TC Chapter Fall Meeting 2021 MEMS/NEMS North America TC Chapter Fall Meeting Date: Wednesday, September 29, 2021 Time: 1:30-2:30 PM Pacific  via Virtual Meeting   AGENDA (Subject to change) Last updated: September 20, 2021   NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here   Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public

Lanza techVentures, an early-stage investment firm that supports entrepreneurs to realize their innovative, new ideas in technologies, products and business models, today became a member of the Electronic System Design Alliance, a SEMI Technology Community.
As a member of the ESD Alliance, Lanza techVentures is also a member of SEMI, the global industry association representing the worldwide electronics design and manufacturing supply chain.

In welcoming Lanza techVentures, Bob Smith, executive director of the ESD Alliance, comments: “Lanza techVentures has played a key role since 2001 in bringing innovative computer and system design technologies to market. It continues to make an impact on our ecosystem through sound strategic and financial assistance.”

“The ESD Alliance is a well-regarded organization,” remarks Lucio Lanza, Lanza techVentures’ managing partner and recipient of the 2014 Phil Kaufman Award for Distinguished Contributions to EDA presented annually by the ESD Alliance and IEEE CEDA. “It is a hub for all matters related to the system design ecosystem and a valuable resource for its members to help them make sound business decisions.”

Additionally, Dr. Lanza joined the SEMI Nano-Bio Materials Consortium (NBMC) Governing Council, a group proactively building an ecosystem to accelerate innovation in healthcare and medical electronics. “Lucio’s profound interest in MedTech will be an asset to SEMI NBMC,” notes Dr. Melissa Grupen-Shemansky, SEMI VP of Technology Communities and CTO. “He has a unique vision and comprehensive understanding of the opportunities in digital health and personalized medicine.”

About SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global Electronics industry.

Follow SEMI ESD Alliance
https://www.semi.org/en/communities/esda/about-esda
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

About Lanza techVentures
Lanza techVentures is an early-stage investment firm that transforms innovative startups into high-value companies through unique vision, insight and a profound understanding of technology and its trends. Founded in 2001 by technology luminary Lucio Lanza, Lanza techVentures has acted as a strategic partner and advisor for early- to mid-stage companies in the design software and intellectual property (IP), semiconductor and biotechnology market sectors.

Follow Lanza techVentures at:
Website: http://lanzatechventures.com/
Twitter: @LTechventures
LinkedIn: https://bit.ly/3CFKlxn