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The SEMI Electronics System Design (ESD) Alliance today announced completion of the anti-piracy SEMI Server Certification Protocol (SSCP) for software license management, a year-long joint development effort led by the ESD Alliance, a SEMI Technology Community.

The SSCP, approved by development committee members Cadence, Siemens EDA and Synopsys, uniquely identifies each customer license server to assure that licenses are issued only by authorized servers to help protect against software piracy. The SCCP is now undergoing standardization and will be managed by the SEMI Standards group after its finalization as an industry standard. The committee members intend to implement the protocol in their respective license management software.

"A big thank you to Cadence, Siemens EDA, and Synopsys, our joint development association partners, for their work to push the protocol forward," said Bob Smith, executive director of the SEMI ESD Alliance. "It took a concerted effort to reach this key milestone and that push will continue as we move forward to finalizing SSCP as an industry standard. Software piracy costs industry billions of dollars per year and hurts both vendors and their customers, a problem the protocol will help mitigate."

An industry-standard protocol to combat software piracy is a growing necessity for design automation software suppliers to ensure only authorized servers are issuing licenses. Design automation software is complex and requires ongoing and significant R&D investments. Bad actors can apply server cloning techniques to access unlicensed copies of the software, putting legitimate users and software vendors at a competitive disadvantage by forcing software vendors to increase prices to support continuing investments in R&D.

"The SSCP is a significant step forward for the semiconductor industry in its efforts to stem software piracy," said Nimish Modi, senior vice president of market and business development at Cadence. "The collaboration among design automation suppliers ensures a wide-ranging and inclusive anti-piracy strategy."

"Completing the server certification protocol is a huge achievement," said Joe Sawicki, executive vice president of IC EDA for Siemens. "Congratulations to everyone who worked to establish this anti-piracy standard that protects against theft and provides a level playing field for all our users."

"Synopsys is pleased to collaborate across the design automation industry to define a method to combat piracy," said Arun Venkatachar, vice president of Synopsys central engineering. "It is critical for the industry to level the playing field for legitimate users. We are committed to working with SEMI and the industry to implement the protocol and make it an industry standard."

"Ansys applauds the anti-piracy initiative led by the SEMI ESD Alliance to develop the SSPC," said Shane Emswiler, senior vice president at Ansys. "Ansys is committed to ensuring fair access for all users and combating piracy. We are proud to stand with our peers in this effort."

To learn more about SSCP, contact the SEMI ESD Alliance at [email protected].

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global Electronics industry.

Follow the ESD Alliance
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
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ESPOO, Finland, 31st of August 2021 – Picosun Group strengthens its position in the 300 mm semiconductor market with its new generation ALD tool PICOSUN® Sprinter.

PICOSUN® Sprinter was first launched in December 2020 as a stand-alone module. Now also customer deliveries and installations of PICOSUN® Sprinter clusters have started.

“A Sprinter cluster consist of two Sprinter modules and a central vacuum wafer-handling robot utilizing 5 wafers handling. The set-up enables a throughput of more than 100 wafers an hour with 10nm aluminium oxide target film thickness”, explains Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

“The throughput capability combined with the unique design of the tool’s reaction chamber, the record-breaking batch film quality and the fact that the tool can be fully integrated with the customers’ production line, makes PICOSUN® Sprinter the tool of choice for semiconductor, display and IoT component industries who need a future-proof tool with single wafer film quality and uniformity in fast batch processing”, Kostamo concludes.

Read more about PICOSUN® Sprinter and watch the video:
https://www.picosun.com/products/300mm-wafers/picosun-sprinter/

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

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Online, Pacific Time
United States

Standards

MEMS/NEMS

North America TC Chapter

Fall Meeting

Date: Wednesday, September 29, 2021

Time: 1:30-2:30 PM Pacific 

via Virtual Meeting

 

AGENDA

(Subject to change)

Last updated: September 20, 2021

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here

 

1:30 pm - 2:30 pm Off Add to Calendar 2021-09-29 13:30:00 2021-09-29 14:30:00 MEMS/NEMS North America TC Chapter Fall Meeting 2021 MEMS/NEMS North America TC Chapter Fall Meeting Date: Wednesday, September 29, 2021 Time: 1:30-2:30 PM Pacific  via Virtual Meeting   AGENDA (Subject to change) Last updated: September 20, 2021   NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here   Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public

Lanza techVentures, an early-stage investment firm that supports entrepreneurs to realize their innovative, new ideas in technologies, products and business models, today became a member of the Electronic System Design Alliance, a SEMI Technology Community.
As a member of the ESD Alliance, Lanza techVentures is also a member of SEMI, the global industry association representing the worldwide electronics design and manufacturing supply chain.

In welcoming Lanza techVentures, Bob Smith, executive director of the ESD Alliance, comments: “Lanza techVentures has played a key role since 2001 in bringing innovative computer and system design technologies to market. It continues to make an impact on our ecosystem through sound strategic and financial assistance.”

“The ESD Alliance is a well-regarded organization,” remarks Lucio Lanza, Lanza techVentures’ managing partner and recipient of the 2014 Phil Kaufman Award for Distinguished Contributions to EDA presented annually by the ESD Alliance and IEEE CEDA. “It is a hub for all matters related to the system design ecosystem and a valuable resource for its members to help them make sound business decisions.”

Additionally, Dr. Lanza joined the SEMI Nano-Bio Materials Consortium (NBMC) Governing Council, a group proactively building an ecosystem to accelerate innovation in healthcare and medical electronics. “Lucio’s profound interest in MedTech will be an asset to SEMI NBMC,” notes Dr. Melissa Grupen-Shemansky, SEMI VP of Technology Communities and CTO. “He has a unique vision and comprehensive understanding of the opportunities in digital health and personalized medicine.”

About SEMI Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global Electronics industry.

Follow SEMI ESD Alliance
https://www.semi.org/en/communities/esda/about-esda
ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

About Lanza techVentures
Lanza techVentures is an early-stage investment firm that transforms innovative startups into high-value companies through unique vision, insight and a profound understanding of technology and its trends. Founded in 2001 by technology luminary Lucio Lanza, Lanza techVentures has acted as a strategic partner and advisor for early- to mid-stage companies in the design software and intellectual property (IP), semiconductor and biotechnology market sectors.

Follow Lanza techVentures at:
Website: http://lanzatechventures.com/
Twitter: @LTechventures
LinkedIn: https://bit.ly/3CFKlxn

Brooks Instrument, a leader in precision fluid measurement and control technology, has released the new GP200 Series, the first fully pressure-insensitive pressure-based mass flow controller (P-MFC) designed specifically for etch and chemical vapor deposition (CVD) processes in semiconductor manufacturing.

Mass flow controllers (MFCs) are the most important component in the gas delivery systems used to produce silicon wafers. MFCs must precisely deliver inert, corrosive and reactive gases to the process chamber, even when operating at very low vapor pressures.

The GP200 Series P-MFC operates well in high-vacuum conditions and above atmospheric pressure conditions that are intrinsic to etch and CVD processes. In comparison, conventional discrete P-MFCs can operate under high-vacuum conditions but degrade in performance and control range as the outlet pressures increase. By offering a greater operating range than conventional P-MFCs, the GP200 Series can improve etch process performance and expand the application scope to include CVD processes.

“Historically, thermal MFCs have been more heavily used in semiconductor manufacturing gas delivery systems; however, pressure-based MFCs are growing in popularity, as they provide significant advantages,” said Dr. Mohamed Saleem, Chief Technology Officer at Brooks Instrument. “We specifically designed our pressure-insensitive GP200 Series to optimize etch and CVD processes with highly precise, repeatable gas delivery.”

The GP200 Series unit features a patented architecture that overcomes the limitations of conventional P-MFCs to provide the most precise process gas delivery even when delivering low vapor pressure process gases. It includes several unique design aspects, including:
Integrated Differential Pressure Sensor: The GP200 Series uses an integrated differential pressure sensor paired with an absolute pressure sensor to compute pressure drop, instead of using two discrete pressure sensors, typically found in conventional P-MFCs. This combination reduces measurement uncertainty from calibration issues and improves the accuracy, repeatability and drift performance in semiconductor processes.

Laminar Flow Element: The GP200 Series also features a laminar flow element designed for low pressure drop, with a differential pressure sensor that is optimally ranged. This design makes it possible to accurately measure the flow of challenging low vapor pressure process gases used in etch processes, including silicon tetrachloride, boron trichloride and hexafluorobutadiene. Whereas conventional P-MFCs require high inlet pressures to operate, the high accuracy and repeatability of the GP200 Series in all operating conditions make it suitable for both standard pressure and critical low vapor pressure gases.

Downstream Valve Architecture: By positioning the control valve downstream of the flow restrictor, the GP200 Series is essentially immune to downstream pressure fluctuations as well as upstream pressure fluctuations This enables flow delivery into pressures as high as 1200 Torr.

Ultra-Fast, Highly Repeatable Transient Response: This downstream valve architecture also enables rapid shutdown and switching of recipe set points for pulsed gas delivery. Fast response times enable tighter process control, providing precise, highly repeatable gas flow delivery with matched transient response.

As the GP200 Series supports such a broad range of process conditions, it can be used as a drop-in replacement and upgrade for many traditional P-MFCs and thermal MFCs. It reduces the complexity and cost of ownership of the gas delivery system because it eliminates the need for components such as pressure regulators and transducers.

Visit experience.brooksinstrument.com/pressure-based-mass-flow-controller-gp200 to access a data sheet, explanatory videos and a white paper detailing how the GP200 Series improves accuracy and repeatability compared to discrete pressure sensors.

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in the semiconductor, pharmaceutical and biopharmaceutical, fiber optics, thin film manufacturing, solar cells, LED, alternative energy, oil and gas, chemical and petrochemical industries.

With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers. Its broad family of products includes brands such as UNIT Instruments, Tylan, Key Instruments and Celerity.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).
# # #

PENANG MALAYSIA - August 2021 - ViTrox Technologies, the world’s most trusted technology company for the semiconductor and electronic packaging industries, announces its participation in the SEMICON SEA 2021 Virtual Exhibition from 23rd to 27th August 2021.

As one of the Silver Sponsors of the SEMICON SEA 2021, ViTrox is showcasing its one-stop vision solutions, from Middle-end & Back-end Semiconductor Vision Solutions, PCBA SMT Vision Solutions, Electronic Communication Systems, to Industry 4.0 Smart Factory Solutions through the virtual platform. In addition, ViTrox is also showcasing a series of On-Demand Webinars from 23rd to 27th August 2021. Visitors are recommended to register their seats with ViTrox now at https://vitrox.com/exhibitions/sea-2021/index.php

Apart from the solutions showcase, Mr Gary Leong Chee Yeong, the Senior Director of ViTrox’s Industry 4.0 & Ecosystem Development is representing ViTrox to conduct a sharing during the “Meet The Experts” session. Mr Gary Leong is sharing the insights under the topic of “Smart Manufacturing Solutions: V-ONE for the Legacy Machines and Automated Vision Inspections (AVI) in the Semiconductor Manufacturing industries”. This session will be held on 23rd August 2021, from 4 PM to 4.30 PM. Visitors are invited to join this insightful sharing session.

Another key highlight of ViTrox virtual booth is the official launch of the 360° Virtual Tour of ViTrox Campus 2.0! Visitors may grab this opportunity to take a closer look at ViTrox Campus 2.0 and further understand about ViTrox's background. Please register now for exploring the 360° Virtual Tour through this link! >> https://vitrox.com/contact-us/virtual-tour-register.php > https://www.gevme.com/SEMICON-SEA-2021 > https://docs.google.com/forms/d/e/1FAIpQLScguSCbadSuIPX_Eir2iDv6DG9ryE-… About ViTrox Technologies
Since its inception in 2000, ViTrox is committed to providing the most innovative, advanced and cost-effective machine vision solution of excellent quality to its customers through integrating ViTrox’s technologies, their people and their strategic alliances. ViTrox is the exclusive company that offers a full spectrum of automated 2D/3D vision inspection solutions for Front-end Semiconductor, Back-end Semiconductor, PCB SMT Assembly, Advanced Robotic Vision Systems, Electronic Communication Systems, and Industry 4.0 Smart Solutions - V-ONE. ViTrox is headquartered in Penang, Malaysia, and with offices in Asia, Germany, and the United States, along with sales and support sites globally. ViTrox has more than 600 customers in over 40 countries, along with 8 overseas subsidiaries and R&D sites globally.

For more information about ViTrox’s products and services, please visit www.vitrox.com.

PENANG MALAYSIA - August 2021 - ViTrox Technologies, the world’s most trusted technology company for the semiconductor and electronic packaging industries, is pleased to announce that its 360-Degree Virtual Tour will be officially launched from 23 August 2021, in conjunction with SEMICON Southeast Asia 2021 which will be held virtually from 23 to 27 August 2021!

The world is undergoing challenges imposed by Covid-19 pandemic where travelling is restricted, it offers an opportunity for ViTrox to showcase its beautiful Campus 2.0 through virtual mode. The virtual tour operates 24-hour a day, 365 days a year where you can access it at anytime and anywhere! With just a few clicks, you will be able to learn about ViTrox from various perspectives.

FIVE key highlights of the 360-degree panoramic virtual tour:
i. Spectacular exterior scenery of ViTrox Campus 2.0
ii. V-Gallery encompasses 20 Years Journey of ViTrox
iii. Body. Mind. Soul (BMS) Theme illustrates a second home concept and humane corporate culture
iv. Learning & Growth Theme for continuous learning and sharing
v. Resource Centre Theme serves as a one-stop centre for experience and knowledge sharing

ViTrox embraces the core values, I.A.C.T.G. (Integrity . Accountability . Courage . Trust & Respect . Gratitude & Care), ESG (Environmental, Social, and Governance) and the philosophy of Body . Mind . Soul (BMS), cultivating humanism and compassionate corporate culture for ViTroxians. From this virtual tour, you will experience and feel about all these in every corner of ViTrox.

ViTrox is excited to bring you to explore the 360-Degree Virtual Tour during its official launch at SEMICON SEA 2021. You are welcome to visit ViTrox virtual booth for the comprehensive solutions showcase, 360-degree virtual tour, and also the insightful webinar sessions!

The virtual tour will also be available at ViTrox Corporate Website, ViTrox LinkedIn Page and ViTrox Facebook Page from 23 August 2021 onwards. Please register and join us for the virtual tour!
____________________________________________________________________________

About ViTrox Technologies
Since 2000, ViTrox is committed to providing the most innovative, advanced and cost-effective machine vision solution of excellent quality to its customers through integrating ViTrox’s technologies, their people and their strategic alliances. ViTrox is the exclusive company that offers a full spectrum of automated 3D vision inspection solutions including Intelligent Advanced Robotic Vision System, PCB Assembly SMT Vision Inspection Solutions and Industry 4.0 smart Solution. ViTrox is headquartered in Penang, Malaysia, and with offices in Asia, Germany, and the United States, along with sales and support sites globally. For more information about ViTrox’s products and services, please visit www.vitrox.com.

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Bioh Kim has joined its management team as President of YES Korea. Based in the YES Korea office in Dongtan, he will be responsible for establishing the regional business structure and growing the company’s presence in Korea.

Bioh is a highly experienced executive with strong technology, business, and management credentials in the semiconductor and display industries. Prior to joining YES, he served in various executive roles for over a decade at leading equipment manufacturers, including Vice President of the ECD business unit and worldwide sales & service for TEL NEXX (Tokyo Electron US), Managing Director of packaging field technology for Applied Materials, and General Manager for APEVA (a subsidiary of Aixtron).

Bioh started his career at Samsung in Korea after earning his BS and MS degrees in Materials Science and Engineering from Seoul National University. He then spent 20 years in the US semiconductor industry, returning to Korea in early 2020.

“We are very pleased to welcome Bioh to our senior team,” said Rezwan Lateef, President of YES. “His track record of successful business development, coupled with his understanding of our customer base in current and emerging markets, will be valuable resources for YES as we continue to expand our business in Asia.”

First on Bioh’s to-do list will be the establishment of YES’s new office in Dongtan, enabling a closer relationship with the company’s longtime key customers in the Korea region. “Our company’s mission is to be the preferred provider in the markets we serve,” said YES CEO Rama Alapati. “As our systems have become increasingly critical to our customers’ operations, having physical proximity enables us to be more responsive to their needs, and better able to anticipate and address their roadmaps. We have high expectations for this new chapter of YES’s ongoing global growth.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit http://www.yieldengineering.com.

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

Flexible Hybrid Master Classes are offered on many topics!  Visit this page for entire list and links to more detailed information on each one.

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Course Outline

  1. Flexible hybrid electronics:  definition, design, and fabrication
  2. Challenges to interface hard and soft electronic components
  3. Introduction to the IEEE Heterogeneous Integration Roadmap (HIR)
  4. Overview of inks and encapsulants
  5. Printing methods: dispense, inkjet, screen printing, multi-axis aerosol jet printing
  6. Electromechanical evaluation of printed interconnects
  7. Additive manufacturing of resistors and capacitors
  8. Highly stretchable conductors
  9. Interconnecting in the z direction - printed vias
  10. Printed RF devices and antennas
  11. Device and component placement and assembly
  12. Thinned semiconductor devices
  13. Approaches to bond devices and components to flexible substrates
  14. Concepts of operation and evaluation of performance and reliability
  15. Applications to medical and industrial sensors will be incorporated throughout

About the Instructor

Mark PoliksMark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton.  He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex.  He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus. 

His research is in the areas of industry relevant topics that include high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics.  He is the recipient of the SUNY Chancellor’s Award for Excellence in Research. 

He received SEMI FLEXI awards for leadership in Technology and Education in 2009 and 2019.  He has authored over one hundred fifty technical papers and holds forty-eight US patents.   He was the General Chair of the 69th IEEE ECTC and serves as a IEEE Electronics Packaging Society (EPS) Distinguished Lecturer and an elected member of the IEEE EPS Board of Governors. 

United States

EMG FlexTech Standards

This course, the 9th in the FlexTech Master Class Series, takes a deep dive into best known methods for optimizing flexible electronics into medical devices and industrial products.  Our expert speaker cover the most important considerations when designing flexible and printable parts and circuits into systems or subsystems and the many approaches to consider.

This course is appropriate for those new to electronics design, as well as those familiar but looking for a refresher on the latest materials and techniques.  

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
Event format

Odyssey Technical Solutions, world leader in RF, DC, and microwave repairs, is pleased to announce a new distribution agreement with EKK Eagle Semicon Components for both the Americas and European markets. EKK Eagle Semicon Components (EKKSC), a leader in O-ring and vacuum sealing technologies, was established as the sales and engineering division of EKK Eagle for all semiconductor markets outside Japan since 2010, located in San Jose, California.

“In looking for additional products that addressed our existing customers’ needs, EKKSC’s O-rings and related products are an excellent fit,” said Jim Plourde, president of Odyssey Technical Solutions. “Odyssey, with a twenty-year history and over 100,000 successful worldwide repairs, is already working with many of the same people within the wafer fabs and other industries. This agreement offers an excellent opportunity for Odyssey to work with yet another world leader.”

EKKSC became a world leader due to its vertical integration, including manufacturing its own monomers and controlling the entire process from base monomer structure to polymerization. EKKSC’s wide range of Superior® elastomers from FKMs to next generation FFKMs gives it the ability to provide the best solution to the markets it serves. An agreement with EKKSC only further expands Odyssey’s ability to make high-quality repairs with outstanding customer service.

“When we were looking for partners to help support our existing and potential customers, Odyssey Technical Solutions jumped to the forefront. Odyssey is already supporting the semiconductor and industrial markets where EKKSC products are used,” remarked Patrick Giorda, president of EKKSC. “As Odyssey also distributes other critical components, it has an experienced understanding of customers’ needs and expectations within those markets. It is the perfect partner for EKKSC.”

For more information about EKK Eagle Semicon Components, visit www.ekksc.com.

For more information about Odyssey Technical Solutions, call +1.512.989.7007, email [email protected], or visit our website at www.odysseyrf.com.

About Odyssey Technical Solutions
Odyssey Technical Solutions' technology center is a state-of-the-art repair facility located in Round Rock, Texas. The engineering staff consists of highly skilled professionals working in a meticulously maintained facility, specializing in RF Generators, Automatch Networks, DC Power Supplies, and Microwave Generators / Power Supplies. Odyssey's reputation for quick turnaround times and customer satisfaction has provided it the opportunity to become involved with an array of different processes and equipment within the industry. The Odyssey team is engaged, motivated, customer focused, and current with the latest advancements in process and equipment engineering. Services include repair, refurbishment, core exchanges, process and equipment engineering, and equipment sales. Odyssey is an ISO 9001:2015 and ANSI/ESD S20.20 Certified company, and a US veteran-owned company.

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For more information please contact:

Larry Broome
Senior Director of Global Sales and Marketing
Odyssey Technical Solutions
+1.512.989.7007
[email protected]