Long promised by science fiction stories, we're now at the threshold of a real revolution where sensors, flexible electronics and printed batteries could finally be playing a key role in the way people mediate their social image through fashion. As an industry veteran, I trust that fashion—not industrial designers—will be in charge of designing successful form factors (plus, it won't be long before IBM Watson helps quantify the "cool" index", the "chic" index, the "comfy" index of any given product).The global apparel market is valued at US$3 trillion, accounting for two percent of the world's GDP. Premium and luxury segments are doing well. In fact, The McKinsey Global Fashion Index forecasts industry sales growth to nearly triple between 2016 and 2018, from 1.5 percent to between 3.5 to 4.5 percent. Yes, some still regard fashion as a frivolous topic, instead of the social identity tool it has always been. It is especially powerful with Millennials, for whom it belongs to pop culture, like social media, music, TV series, sports or gaming.Photo: The author's display on the intersection of fashion and tech at Collette, a luxury retail store in ParisThis in fact might have been the missing key of success for the first generations of "wearables". Although they started by targeting the fashion market, they somehow missed seducing the prestige market. No doubt that their current re-marketing shift into the health sector—especially obvious during the recent CES—will make these devices more relevant and sought-after tools.But as they're stepping into their smart age, fashion brands will have to be more proactive in understanding and integrating electronics. Most of the luxury groupsin Europe and the US have opened some sort of tech pathway. But what about the indie designers, usually the most creative and copied talent of the fashion industry? How can they even dream of getting to the Silicon Valley designers and integrators, with their $500K to $1M prototype price tags?This is why I am excited to be leading the messaging to these brands on the electronics developments and their implications. I am participating at technology industry events (including the upcoming 2018FLEX in Monterrey, California) to gather my own data. Some of the things I am excited about: In a couple of years, mixed reality goggles will miniaturized enough to become a chic accessory on my nose, branded by Saint Laurent or Dior, powered by ODG or Ostendo Technologies. My fashion friends won't be troubled any longer by the "douchetooth" look coming from their Apple Airpods: Cartier Smart Jewelry will work its magic on chic hybrids, gold earrings/airbuds. Instead of lighting Lady Gaga's dresses, designers will finally turn the LEDs inside our garments for a discreet pro-collagen treatment. The NBA Nike jerseys will collect sweat, via fabrics powered by bacteria and movements. Those athletes' biometrics data will be a bounty for coaches and doctors eager to prevent health issues. At home, the NFC tag of my coat will remind me that it could use laundry. All my electronics will power on-the-go thanks to induction charging hidden (printed? woven? embroidered?) in my pockets. Which of these trends can you help start? Send me an invite to meet with you at 2018FLEX! Download the 2018FLEX app to request meetings with any attendees!

EDA companies Cadence, Synopsys and Silvaco all gave excellent presentations at the SOI Consortium forums in Nanjing and Shanghai.Here's a recap of what the Cadence folks said. (I'll cover the Synopsys and Silvaco presentations in my next posts.)Design WinsAt the Shanghai FD-SOI Forum. Dr. Qui Wang, VP Chief of Staff, talked about FD-SOI Foundry Enablement: From Concept to Mass Production. Cadence, he reminded the packed ballroom, is not just EDA, but also system design enablement targeting verticals. “We’re ready!” he stated.In the last three years, they’ve done a lot of work on FD-SOI, he said, even working with ARM, GF and Dream Chip on the demo board as a reference design for automotive or vision applications, to show real data to their customers. It uses a quad implementation of the configurable Tensilica Vision P6 core.To simplify back biasing for the library folks, they worked with the foundries to create interpolations. And as Cadence is traditionally strong in RF/mixed-signal, there’s a new back-biasing tool to simplify board-chip communications, and make the bridge between power and thermal analysis.Cadence Has It All Jonathon Smith, Director of Strategic Alliances at Cadence, presented Enabling an Interconnected Digital World -- Cadence EDA IP Update at the Nanjing SOI summit. As he explained, his job is to ensure that design customers can use Cadence tools effectively, not just with Cadence IP, but also with 3rd party IP for the foundry nodes.He pointed out that the numbers for IoT predictions vary widely, and that industrial IoT (IIoT) will probably account for about 10% of the market. What is sure is that it will contain a large mixed-signal component (RF/digital/analog) and complex packaging.His customers want to know how fast and easy it is to work in FD-SOI. “Cadence custom and digital tools are ready for FD-SOI,” he said. They have the PDKs and tech files, and the EDA tools are enabled. The reference flows (both digital and custom analog) are tested and ready (Cadence customers who use p-cells and RF look especially for a good mixed-signal flow). [caption id="attachment_11432" align="alignnone" width="768"] EDA requirements for FD-SOI are complete. (Courtesy: Cadence SOI Consortium)[/caption] Customers also ask for proof points, and want to know the number of tape-outs they’ve done, performance benchmarks for working silicon and proven IP: this is what gives designers confidence, he said. Examples like Dream Chip’s Computer Vision Processor Chip Design for automotive ADAS CNN applications in 22nm FD-SOI (which they announced at Mobile World Congress in 2017 – see the press release here) have really helped build confidence further, he observed. (In case you missed it, DreamChip presented at the Silicon Valley SOI event in April 2017 – you can get that presentation here.)Cadence sees SOI as a driving force in IoT markets. They’ve also had some big digital wins recently, he added, and have made some major announcements with the foundries.For example, in September, they announced that their set of Design for Manufacturing (DFM) tools (signoff solutions) are now qualified on Samsung’s 28nm FD-SOI. This enables customers to create complex, advanced-node designs for the automotive, mobile, IoT, high-performance compute (HPC) and consumer markets (read the press release here). The Samsung Foundry's PDKs for 28nm FD-SOI are available for download now and incorporate the Cadence Litho Physical Analyzer (LPA), Physical Verification System (PVS) and Cadence CMP Predictor (CCP). In addition to signoff quality, the Cadence DFM tools offer an integration with the Virtuoso® platform and the Innovus™ Implementation System, providing designers with automated fixing capabilities and overall ease of use.And in October, Cadence announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for GlobalFoundries 22FDX™ (read the press release here). The Cadence® tools enable advanced-node customers across a variety of vertical markets—including automotive, mobile, IoT and consumer applications—to use GF’s FD-SOI architecture to optimize power, performance and area (PPA).Cadence tools for ST’s 28nm FD-SOI foundry process were ready in 2016, btw – there’s a nice video testimonial from ST on power signoff, for example, which you can see here.

In my first six months at SEMI, I’ve visited with many member companies and industry leaders. One theme I hear repeatedly is a concern about our most fundamental source of innovation and productivity – people.Our industry has a significant need for additional workers and several trends are working against us.For one, only 11 percent of elementary students in the U.S. indicate an interest in science, technology, engineering, and mathematics (STEM) education according to the National Science Foundation. In other regions, recruiting and retaining high-skilled workers remains a constant challenge.Ironically, the incredible electronics manufacturing technology that we create has enabled many of the new-tech industries in software, social media, internet services and applications that now directly compete for the best and brightest technical talent. Young engineers have other choices and many are lured to newer growth industries with familiar internet brands.Today, due to continued industry advancement and robust growth, capital equipment companies, device makers and materials companies collectively have thousands to tens-of-thousands of open unfilled positions. Furthermore, the representation of women in the high-tech workplace remains disproportionately low.We have long been aware of the need to support a diverse pipeline for high-skilled workers. In 2001, the SEMI Foundation was established to encourage STEM education and stimulate interest in high-tech careers. SEMI and its Foundation launched the High-Tech U (HTU) program to engage and excite high school students. HTU enlists industry volunteers to work with local high school students in a three-day interactive hands-on curriculum. Young people get a fun and inspirational exposure to binary logic, circuit making, a fab or electronics manufacturing setting and other aspects of professional development.To date, we’ve delivered 216 HTU programs and reached nearly 7,000 students in 12 states and nine countries. The results are compelling. Our 2016 survey of HTU alumni shows that they enter college at five times the national rates and 70 percent that graduated college are employed in a STEM field. By any measure, the initiative is successful and worthwhile.However, the talent problem statement has grown. Industry needs are greater and the time has come to redouble our effort to attract and retain talent for our high-skilled manufacturing sector. Therefore, SEMI is elevating workforce development as a top strategic priority.The SEMI HTU team is already engaged with key member companies to develop our enhanced roadmap for workforce development including a comprehensive study with Deloitte Consulting to underpin the key problems and solutions in areas of focus for decisive and systematic SEMI action.Belle Wei, SEMI Foundation Board member and the Carolyn Guidry Chair in Engineering Education and Innovative Learning at San Jose State University said, "It is critical that we work to prepare the future workforce. This requires a high level of collaboration between industry and higher education. We appreciate SEMI's leadership role in this collaboration to further develop the workforce pipeline."We have launched a HTU Certified Partner Program (CPP) with the goal of reaching more students through industry partners who commit to long-term participation and independent delivery of High Tech U. In addition, we are expanding outreach to universities and community colleges and preparing to launch an industry image campaign to better tell the remarkable story of opportunity in our industry.The capacity to innovate and the skills to manage complex design, engineering and manufacturing processes are essential factors that sustains our high-tech industry – and they are dependent on people.Finally, as mentioned above, we have already started some new initiatives to enhance our HTU. A SEMI workforce development roadmap and execution plan will be detailed in a future SEMI Global Update article following the upcoming SEMI International Board Meeting. SEMI welcomes any inputs in addition to your continued support.This endeavor is increasingly urgent and recruiting the industry’s future innovators is well-aligned with SEMI’s mantra to connect, collaborate, innovate, grow and prosper.

As China embarks on the Made in China 2025 plan with electronics and semiconductor technology as one of the Top 10 focus areas, China's semiconductor industry has an unprecedented growth opportunity. However, besides the huge investment required, the China IC industry is faced with strong competition in terms of technology, products, talent, and supply chain access from many leading global layers in an increasingly interconnected world and a highly global semiconductor market.To be successful, it is critical that China's semiconductor industry speed up its integration into the global industry supply chain. The goal is to achieve sustainable growth through “win-win” collaboration with global partners and leveraging industry platforms to become a significant player and partner in the international semiconductor manufacturing industry ecosystem.China Semiconductor Industry GrowthIn recent years, many new 12-inch fab projects have been announced, started construction, or in ramp-up stage in China, including UMC in Xiamen, PSC in Hefei, TSMC in Nanjing, YMTC in Wuhan and Nanjing, as well as GLOBALFOUNDRIES in Chengdu. Many China-based foundries are adding 12-inch capacity including SMIC fabs in Shanghai, Beijing and Shenzhen, and HLMC in Shanghai area. The production capacity of these ~20 new fabs is expected to come online in the next three to five years.SEMI has seen active interest in several local cities in attracting global and China-based companies to set up semiconductor fabrication facilities. The strong trend for expansion and investment shows no signs of slowdown in China. The current investment fever in semiconductors in China is a balancing act ─ it will lead both to the development of a regional industry supply chain and the demand for capital investment in China. However, as with any expansion bubble, new production capacity in some mature nodes might create overcapacity and raises questions of sustainability paired with the severe shortage of skilled workers/engineers and uncertainty of future fund availability for continuing operations and investment.Rise of ChinaChina’s expansion in semiconductor manufacturing should be viewed through a global context. SEMI advocates for free trade and open markets, international cooperation for intellectual property (IP) rights protection, industry Standards, and environmental protection. SEMI promotes the global electronics manufacturing supply chain and works to positively influence the growth and prosperity of its members.In 2016, before stepping down, the U.S. Obama administration delivered a report from the Council of Advisors on Science and Technology. Part of the report addressed the rise of China's semiconductor industry and recommended the United States should improve its environment for development of the semiconductor and high-tech industry and continue to invest in advanced technologies.Each country will evaluate their own course as the China market expands. However, the rise of the semiconductor industry in China need not be viewed simply as a threat to the world; instead, it is a significant growth driver and business opportunity for global suppliers. IC chips top the list of all Chinese bulk imports in terms of dollar value. China desires to develop its IC chip industry to better fulfill its inherent demand. China currently has low market share and limited technical capability in four major areas identified in the China National IC Development Guideline: IC design, manufacturing, package/testing, and equipment/material.China is clear about its intentions with regard to growing its own semiconductor supply chain. In the short term, heavy dependency on foreign suppliers (especially equipment and material) is inevitable. Going forward, cooperation with foreign semiconductor suppliers/partners with an open-minded and “win-win” attitude is an imperative strategy in solving the development bottleneck issues concerning equipment/materials and other key areas in China's semiconductor industry.Learn more about developments in China by visiting the “Window on China.”

Despite the unfortunate withdrawal of an individual government from the voluntary international accord on climate change, SEMI and our industry remains dedicated to sustainable manufacturing and reiterates our strong commitment to reducing our industry’s carbon footprint.SEMI takes seriously our global responsibility to work closely with member companies and like-minded organizations to address environmental, health and safety performance. We are proud to advanced industry agreements necessary for the reduction of energy, resource consumption, and greenhouse gas emissions in semiconductor manufacturing.While serving as the CEO of GLOBALFOUNDRIES, I was honored to be a recipient of the SEMI Outstanding EHS Achievement Award. As a semiconductor manufacturer, I strongly believed that environmental performance is a mandate that we set for ourselves in addition to being a fundamental expectation of our customers and the communities where we operate. Now, as the head of SEMI, I am doubly committed to driving industry-wide impact.Significant energy savings and greenhouse gas reduction efforts require close collaboration between chip makers, equipment providers and subsystem suppliers. SEMI facilitates this collaboration through our International Standards and Sustainable Manufacturing initiatives. Working with SEMI Standards Technical Committees, Sustainable Manufacturing Working Groups and other industry bodies such as the World Semiconductor Council, SEMI actively drives productive solutions to reduce our industry’s carbon footprint. For example, SEMI International Standards S23 and S29 codify performance-based guidelines for semiconductor manufacturing equipment targeting reduction in energy use and greenhouse gas emissions. Extensive SEMI standardization efforts for idle and sleep-mode energy conservation will drive significant reductions in fab power consumption. One manufacturer reports that green mode vacuum pumps alone can produce a nearly 2,000-ton reduction in CO2 emissions in a typical 300mm semiconductor fab.Our members are at the forefront of innovation that is driving a smart economy. SEMI supports industry collaboration to advance leading edge manufacturing technology; which, in turn, produces intelligent devices essential for clean energy solutions, environment monitoring and the capacity to mitigate the impacts of a warming planet. A momentary setback in international efforts to address climate change will not change the path forward. I am confident that SEMI and our members will continue to make positive contributions for the benefit of our industry, our environment and our planet.

This is an exciting year to be in the semiconductor industry: semiconductor-related companies are trading at all-time highs and most expect record device shipments and revenues as well as equipment revenues. This growth is primarily fueled by demand drivers such as Automotive Electronics, Medical Electronics, Mobile Phones, and Industrial Electronics. With this recent growth spurt and the proliferation of end-market applications that consume ever increasing numbers of semiconductors, it is tempting to conclude that the industry has seen the end of cycles.At the annual SEMI/Gartner, Bulls Bears Industry Outlook symposium, Stifel’s Patrick Ho, asserted that “Gone are the days of your grandfather's cycles.” Robert Marie of Semiconductor Advisors, maintained that “Cycle shape has changed due to demand drivers, consolidation, maturation and other factors.”However, Gartner’s Bob Johnson was quick to assert, “Whenever people say that cycles are over and that the industry is going to grow forever ─ the industry is at a peak.” He noted that Gartner expects semiconductor revenues to surpass $400 billion this year, increase two percent next year, but decline in 2019. He indicated that Memory is driving this year’s market expansion but will drag down market growth next year as pricing gains achieved will be lost beginning in the fourth quarter of this year. The softness in 2018 is expected to have a detrimental impact on the industry’s spending plans. Gartner predicts that capital spending will shrink to just under one percent next year and contract 7 percent in 2019.In addition to softer memory pricing in the near term, Gartner does not anticipate that China will invest significant amounts until 2020/2021. SEMI on the other hand is currently modeling an increase of 9 percent in fab equipment expenditures in 2018, which is largely driven by China. China is expected to have an even greater impact on global fab capital expenditures, claiming the top position in 2019, according to SEMI.Looking at demand drivers, more specifically the “Internet of Things”, it is clear that the explosion of connected “things” is fundamentally reshaping our industry. The fragmented nature of these markets require niche applications and device architectures with the majority of these devices being commoditized MEMS and other solid-state sensors. Growing market revenue does not necessarily translate into industry profitability as the declining average selling price.So how can the industry benefit from all of this connectivity? Dr. Sam Wang from Gartner discussed how the Internet of Things has made AI practical, and how artificial intelligence brings out the value of IoT. He noted that AI: Drives the demand for advanced wafer process technologies Encourages the adoption of HMC, HBM, eDRAM, ReRAM, PCM, STT-MRAM, memristors processing in memory Incorporates ADC within sensors and computing in sensors Increases the use of 2.5D, 3D, TSV and SiP technologies Enables chip design flow optimization in EDA Fuels the need of new ATE testers for testing complex AI chips Prompts more start-ups and M A opportunities The overwhelming majority of semiconductor devices used in IoT are commodities, creating a renaissance for smaller wafer diameter fabs (200mm and smaller; see related 200mm article). The value of the IoT will come from the ecosystem that supports it, such as data centers and networks that enable connectivity. There are also opportunities for the adoption of new processor technologies, as Gartner’s Werner Goertz pointed out. He stated that the current processors used in IoT processing were designed for very different use cases, and that conditions are now ripe for a disruptive processor supply chain to optimize edge-based AI.2017 is indeed going to be a great year for the semiconductor industry: device average selling prices have improved dramatically, device manufacturers are investing in new capacity, while stock prices of suppliers throughout the supply chain are trading at elevated levels. 2018 is anticipated by many industry pundits to be another growth year, albeit at more conservative growth levels. Although the Internet of Things literally offers the industry billions of applications, its full impact on the industry remains to be seen. And we’ll definitely keep a close eye on developments in China.For SEMI market research, visit www.semi.org/en/MarketInfo

In the shadow of other more trendy news about China and Memory fab investments, 200mm fabs continue to “flex their muscles.” At least 500,000 wafers per month (wpm) capacity, or a 10 percent expansion, is forecast for 200mm fabs from this year through 2021. This includes capacity from a number of new 200mm fabs expected to start operation in 2017. The recently published report "Global 200mm Fab Outlook to 2021" by SEMI is tracking production, pilot, and R D 200mm facilities worldwide with a special focus on capacity expansions and new facilities. Driven by mobile and wireless applications, IOT, and automotive, the 200mm market is thriving. Many of the products used in these applications are produced on 200mm wafers, so companies are expanding capacity in their facilities to the limit, and there are nine new 200mm facilities in the pipeline. Looking only at IC volume fabs, the report shows 188 fabs in production in 2016 and expanding to 197 fabs by 2021. China will add most of the 200mm capacity through 2021, with 34 percent growth rate from 2017 to 2021, followed by South East Asia with 29 percent and the Americas with 12 percent. SEMI’s recent publication of the “Global 200mm Fab Outlook report to 2021” (July 2017) is the third update since the report was first launched in 2015. Since the last release in November 2016, the SEMI Industry Research and Statistics analyst team has made 232 changes and updates to 132 fabs. The report tracks over 300 facilities using 200mm wafers from R D, EPI, LED fabs to volume IC fabs. For more information, visit: https://discover.semi.org/global-200mm-fab-outlook-registration.html

SEMI reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase 19.8 percent to total $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000. In 2018, 7.7 percent growth is expected, resulting in another record-breaking year ─ totaling $53.2 billion for the global semiconductor equipment market. The SEMI Mid-year Forecast predicts wafer processing equipment is anticipated to increase 21.7 percent in 2017 to total $39.8 billion. The other front-end segment, which consists of fab facilities equipment, wafer manufacturing, and mask/reticle equipment, will increase 25.6 percent to total $2.3 billion. The assembly and packaging equipment segment is projected to grow by 12.8 percent to $3.4 billion in 2017 while semiconductor test equipment is forecast to increase by 6.4 percent, to a total of $3.9 billion this year. In 2017, South Korea will be the largest equipment market for the first time. After maintaining the top spot for five years, Taiwan will place second, while China will come in third. All regions tracked will experience growth, with the exception of Rest of World (primarily Southeast Asia). South Korea will lead in growth with 68.7 percent, followed by Europe at 58.6 percent, and North America at 16.3 percent. SEMI forecasts that in 2018, equipment sales in China will climb the most, 61.4 percent, to a total of $11.0 billion, following 5.9 percent growth in 2017. In 2018, South Korea, Taiwan, and China are forecast to remain the top three markets, with South Korea maintaining the top spot to total $13.4 billion. China is forecasted to become the second largest market at $11.0 billion, while equipment sales to Taiwan are expected to reach $10.9 billion. The following results are in terms of market size in billions of U.S. dollars: The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Billings Report, which offers an early perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and over 22 market segments; and the SEMI Mid-year Forecast, which provides an outlook for the semiconductor equipment market. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.). For more information online, visit: https://discover.semi.org/equipment-market-data-registration.html

By Clark Tseng, Industry Research Statistics Group, SEMI China’s ambitious plans to build a world-class semiconductor manufacturing supply chain domestically certainly has the industry’s attention. With over a dozen new 300mm fab announcements lately from Foundries, DRAM, 3D NAND, and as well as CMOS image sensor companies (either from international semiconductor makers or from indigenous players), China has launched a huge investment in wafer fab capacity that is expected to ramp in the next five years. While advanced 300mm fab investment attracts most of the attention and resources, China does not skimp on the more “matured” 200mm fabs. China will have the most new 200mm fab projects and capacity additions in the next few years compared to other regions. According to SEMI’s latest 200mm Fab Outlook report, China currently has about 700,000 wafers per month (wpm) installed fab capacity, and this is forecasted to surpass 900,000 wpm by the end of 2021, or over 28 percent growth in five years. By then, China’s 200mm capacity is expected to surpass America, Japan, and Taiwan, and be second only to Europe. A further examination of China’s new 200mm fab projects shows a wide diversity in products. Beyond the usual 200mm foundry investment led by SMIC and Hua Hong Semiconductor, an increasing number of new projects are focusing on analog, power, and MEMS applications. According to SEMI’s latest 200mm fab Outlook report, China will add eight new 200mm volume fabs between 2016-2021: two for foundries, two for analog, two for MEMS, one for power, and one for logic. In the meantime, China is not limiting itself to adding wafer capacity. It is also developing material and equipment capabilities around 200mm wafer manufacturing. A number of silicon wafer suppliers are emerging in China targeting 200mm and smaller wafer markets. On the equipment side, the 200mm tool availability remains the biggest challenge for the industry in adding more 200mm capacity; some projects have been postponed because of it. China equipment suppliers are expected to take the opportunity to develop the tool sets needed to satisfy the upcoming demand for these fabs. China’s 200mm capacity will evolve to make more than “legacy” products, e.g., smart card, Analog IC, and Discrete IC. These manufacturers will become more versatile advancing into MCU, PMIC, CIS, fingerprints sensor, power, MEMS, and other devices. With the rise of China’s electronic OEMs and automakers, these 200mm fabs will play an even more important role supporting various manufacturing ecosystems in China. For more information, visit https://discover.semi.org/global-200mm-fab-outlook-registration.html

Big News: Samsung has officially revealed that their next FD-SOI node is 18nm. The announcement was made at the recent Samsung Foundry Forum, which showcased a number of new technologies that the company says will help enable the development of new devices connecting consumers in entirely new ways. (You can read the full press release here.) Samsung also announced new features for its 28nm FD-SOI offering, which is called 28FDS. Noting that it is well suited for IoT applications, Samsung said it will gradually expand its 28FDS technology into a broader platform offering by incorporating RF and eMRAM(embedded Magnetic RAM) options. 18FDS is the next generation node on Samsung’s FD-SOI roadmap with enhanced PPA (Power/Performance/Area). [caption id="attachment_10762" align="alignnone" width="705"] Kinam Kim, President of Samsung Electronics’ Semiconductor Business, introduces the company’s newest foundry process technologies and solutions. (Courtesy: Samsung)[/caption] The FD-SOI news was part of an announcement covering Samsung's newest process technology roadmap. “The ubiquitous nature of smart, connected machines and everyday consumer devices signals the beginning of the next industrial revolution,” said Jong Shik Yoon, Executive Vice President of the Foundry Business at Samsung Electronics. “To successfully compete in today’s fast-paced business environment, our customers need a foundry partner with a comprehensive roadmap at the advanced process nodes to achieve their business goals and objectives.”