Global Manufacturing Growth has Slowed, but is Still Positive (Chart 1)Most key countries/regions saw a slowdown in growth in March based on their respective Purchasing Managers Indices. And in one case – South Korea – manufacturing moved into contraction. February 2018 March 2018 Japan 54.1 53.1 South Korea 50.3 49.1 Taiwan 56.0 55.3 China 51.6 51.0 Europe 58.6 56.6 USA 60.8 59.3 PMI Points to More Modest Expansion (Chart 2)The global Purchasing Managers Index is a timely and readily available leading indicator for both world semiconductor and semiconductor capital equipment shipments. PMI values greater than 50 indicate expanding manufacturing activity. See www.markiteconomics.com for PMI values for all major countries.Recent semiconductor equipment, semiconductor and PMI 3-month (3/12) world growth rates were: SEMI Equipment +29% February Semiconductors +21% February PMI (squared) +4% March The PMI leading indicator now points to more modest but still positive growth ahead. Semiconductor Industry Still has Legs (Chart 3)Another useful and timely leading indicator is a composite of monthly Taiwan Chip Foundry sales. Taiwan-listed companies publish their revenues about 10 days after the month closes. Chart 3 compares the composite monthly revenues of 14 Taiwan listed foundries vs. global semiconductor sales. Due to Lunar New year shutdowns, February 2018 was weak but foundry sales rebounded in March. Chip demand appears to be holding! Walt [email protected]

SEMI’s mantra is: Connect, Collaborate, Innovate. This mantra has delivered industry-enabling value to our members since SEMI’s beginnings in 1970. It has been essential for SEMI members to grow and prosper locally, while being synchronized globally. As the electronics manufacturing business has become more complex and interdependent, SEMI’s mantra has increasingly been applied across the full span of electronics manufacturing.With the IC industry now worth over $400 billion in annual revenue, developing a single new chip can cost hundreds of millions of dollars. Consequently, industry players now connect, collaborate, and innovate in new, but more often, deeper ways. This is especially true with IC design – what’s possible in chip design is only possible if the manufacturing processes can be developed as projected. It makes sense, as complexity grows and the stakes get higher, that design and manufacturing are closely linked and apply the SEMI mantra together. Where Electronics Begin“Where Electronics Begin” is the tagline of the Electronics System Design Alliance, or the ESD Alliance. It aptly distills the fact that all IC manufacturing begins with design – and the design ecosystem. This week, SEMI announced it reached an agreement with the ESD Alliance to join SEMI as a SEMI Strategic Association Partner. The ESD Alliance will become part of the SEMI organization in 2018. With the ESD Alliance and its community joining SEMI, its membership will complete the full electronics design and manufacturing span.This is a momentous step forward. The ESD Alliance’s ecosystem is vital and thriving and includes the world’s leading EDA and IP companies. Within the ESD Alliance community, Aart de Geus (Synopsys), Wally Rhines (Mentor, a Siemens Company), Simon Segars (Arm), and Lip-Bu Tan (Cadence), among others, are already familiar figures, having brought their thought leadership to SEMI platforms in the past. Now they, and the rest of the ESD Alliance members, will be able to more directly work with semiconductor equipment manufacturers, devices makers, and the rest of SEMI’s membership.At events like SEMICON China, which recently concluded in March and attracted over 90,000 attendees, SEMI and the ESD Alliance members will be able to efficiently connect and engage the supply chain players and find new areas for collaboration. As SEMI’s membership looks out towards new applications and systems opportunities, having both ecosystems together will find possibilities faster and innovate approaches more practically. The ESD Alliance will maintain its distinct community identity and governance while having access to, and the ability to augment, SEMI’s global platforms including seven regional offices, programs and expositions (including SEMICONs), advocacy (including trade, tax, talent, and technology), industry research and statistics, and other SEMI Strategic Association Partner and technology communities.SEMI will gain direct access to the electronics design ecosystems to provide a deeper and wider value – to its combined membership – with SEMI’s mantra. SEMI and its more than 2,000 corporate members and more than 1.2 million stakeholders look forward to connecting, collaborating, and innovating with the ESD Alliance and its members. SEMI’s global reach and wide span of membership with ESD Alliance’s deep expertise in design and IP is truly the best of both worlds for all stakeholders.Connect: Design ManufacturingSEMI’s members have been reaching into the electronics design ecosystem and the ESD Alliance members have been reaching into SEMI’s ecosystem to optimize design and manufacturing process for lowest cost and highest yield. This week’s announcement is a step forward to directly and more intimately connect electronics design and manufacturing for the supply chain to work more closely together in full synchronization. Collaborate: From Beginning to End in Electronics ApplicationsWith the ESD Alliance joining SEMI as a Strategic Association Partner, SEMI members can better collaborate across the full supply chain. Gone are the days when it was enough to collaborate only with one’s direct customer. Today, for example, components and c-subs suppliers frequently collaborate not just with their OEM equipment manufacturer customers, but with device manufacturers – and even system integrators. To be successful, companies are striving for connection to their customers’ customers.The ESD Alliance, with its design ecosystem and linkage to the fabless community, will join three existing SEMI Strategic Association Partners: Fab Owners Alliance (FOA), MEMS Sensors Industry Group (MSIG), and FlexTech (the association representing the flexible hybrid electronics ecosystem). These relationships now cover the entire span of electronics manufacturing.To provide focused collaboration across the full supply chain, SEMI has developed five vertical application platforms: IoT, Smart Manufacturing, Smart Transportation, Smart MedTech, and Smart Data. These have been chosen because of unique and pressing needs to synchronize the supply chain and to engage and develop solutions collectively.Innovate: Faster FutureWith the confluence of emerging digital disruptions and new demand drivers, forecasts suggest the IC industry could grow to over $1 trillion in annual revenue by 2030. To deliver this growth, the supply chain must efficiently innovate together. SEMI’s value proposition is to speed the time to better business results for its members across the global electronics (design and) manufacturing supply chain. The addition of the ESD Alliance as a Strategic Association Partner is a key contributor to deliver this value proposition for the industry to grow and prosper now and in the future.

With technology moving at breakneck speed, MEMS and sensors professionals whose job is to stay on top of industry developments must be able to find useful information—fast. Podcasts are one rich source of insight. In All Ears, I share roundups of recent podcast interviews with entrepreneurs and CEOs and episodes covering emerging technologies, breakthroughs and even the unexpected – like a MEMS pinball machine. For the seasoned MEMS and sensors professional or the curious onlooker who loves to learn, here are 5 podcast episode recommendations. 1. Embedded.fm – Episode 214: Tiny Sensor ProblemsChristopher White (@stoneymonster) and Elecia White (@logicalelegance) host Embedded.fm, a weekly podcast about the 5Ws of engineering. They’re both embedded software engineers by trade and their guests include everyone from entrepreneurs and makers to educators and engineers.Tiny Sensor Problems is a good introduction for people who have little to no knowledge of MEMS sensors. Kristen Dorsey, Assistant Professor of Engineering at Smith College, provides a brief overview of MEMS and touches on the manufacturing processes, including temperature sensitivity and sensors hype over the years. You’ll learn facts about interesting MEMS applications that were created, like the pinball machine I mentioned. Dorsey also elaborates on her work in flexible strain and pressure sensors for possible applications in AR and robotics in the future. 2. NPT – Episode 4: MEMS Directional SensorsLet’s dig deeper and learn about some of the applications for MEMS and Sensors. In this case, Erdos Miller, The Drilling Technology Podcast focuses on an extreme niche: oil and gas drilling technology. Ken Miller and David Erdos make up two of the engineering, developers and architect team at Erdos Miller that specializes in creating custom solutions for oil and gas downhole devices. Throughout the episode, they explore surveying sensors starting from the 1920s. History buffs would appreciate the stroll down memory lane and the ingenuity behind the first survey sensor, which involved a glass bottle filled with acid. Texas Instruments’ DLP technology gets a mention towards the end of the episode when micromirrors became a topic of discussion. 3. The Early Stage Podcast – Episode 15: Vesper – Tiny Microphones That Listen ForeverMEMS and sensors are a huge part of IoT—no doubt about it. The Early Stage Podcast captures insights from entrepreneurs into their company’s journey including their innovative approaches to developing cutting-edge technologies and overcome business and technology challenges they encounter. This episode focuses on Matt Crowley, CEO at Vesper, and how piezoelectric microphones will affect the voice interfaces as AI grows more sophisticated. Enthusiastic about the subject, John Valentine, host of the Early Stage Podcast, poses thoughtful questions and Crowley is eloquent and clearly passionate about his trade. They touch upon the race to produce the best voice interfaces for the AI ecosystem and tool kits for companies interested in voice enablement—but lacking a dedicated audio team—and looking for a simple solution. 4. IoT Podcast – Episode 155: New toys, Pi Day and insect-tracking LIDARHost Stacey Higginbotham, a technology journalist covering cloud computing, data centers and IoT, joins IT expert and veteran podcaster Kevin Tofel, in a weekly conversation about IoT developments. They’re entertaining and informative with a knack for making complex concepts easily digestible. In this episode, they discussed their thoughts on how the Broadcom/Qualcomm merger played out. While not explicitly focused on MEMS and sensors, the episode and the podcast in general touches upon overarching challenges the MEMS and sensors industry faces with security, standards, product development and applications usage. The highlight of the show included the guest of this week, Tobias Menne, global head of digital farming at Bayer AG who discusses Agriculture Technology (AgTech). 5. Amelia’s Weekly Fish Fry – Silicon Stagnation: How Emerging Technologies and Non-Traditional Materials Are Changing the Future of MEMSHosted by visionary Amelia Dalton, this episode of Fish Fry addresses the prospect of paper and plastic displacing silicon in MEMS manufacturing. Dalton interviews A.M. Fitzgerald Associates founder Alissa Fitzgerald about her research on the threat of waning research to silicon sensor technology. And more importantly, they discuss its implications for the MEMS and sensor industry 10 to 20 years down the line.Can’t get enough of MEMS? Register to listen in on MEMS and Sensors Industry Group’s free webinar, “Process Control and Root Cause Analysis for More-than Moore and Advanced IC Technologies” on April 25 at 8:00 AM PDT.

Automakers are currently evaluating prototypes of Viper from AdaSky, a Far Infrared (FIR) thermal camera that embeds custom silicon co-designed with and manufactured by ST in 28nm FD-SOI. The complete sensing solution aims to enable autonomous vehicles to see and understand the roads and their surroundings in any condition. “With the help of ST, we have created the first high-resolution thermal camera for autonomous vehicles with minimal size, weight, and power consumption--and no moving parts. ST’s access to, and expertise in, ultra-low-power design, IP that is fully qualified for automotive applications, and 28nm FD-SOI technology have been vital to meeting the severe power constraints that would challenge our sensors’ performance,” said Amotz Kats, Vice President Hardware, AdaSky. “We’re in a position to deliver a breakthrough solution to revolutionize and disrupt the autonomous vehicle market because of ST’s mastery of automotive qualification and its strong manufacturing supply chain, which grants reliability, long-term support, and business continuity to car makers throughout the whole life of their production.” Passive infrared vision, like that in AdaSky’s Viper, when used in a fusion solution, can help close the gaps to provide accurate sight and perception without fail in dynamic lighting conditions, in direct sunlight, in the face of oncoming headlights, and in harsh weather. The new camera uses an FIR micro-bolometer sensor to detect the temperature of an object. In an ADAS solution, Viper uses proprietary algorithms based on Convolutional Neural Networks to classify obstacles and show them in a cockpit display to give the driver an early warning. This warning comes several seconds earlier than it would when using a conventional sensor in the visible wavelength and is even faster than what is possible with the human eye. The two companies say that the Far-Infrared thermal camera extends ADAS sensor fusion capability with a new layer of information, helping pave the way to fully-autonomous driving in any condition. Prototypes are now under evaluation by carmakers with initial production targeted for 2020. (Read the full press release here.)

SEMI and 106 other associations today joined forces to express deep concern to congressional leaders about the Trump Administration’s decision to use tariffs to address China’s unfair trade practices. In a letter from the collective to House Ways and Means Committee Chairman Kevin Brady and Ranking Member Richard Neal ahead of today’s hearing on "Effects of Tariff Increases on the U.S. Economy and Jobs," we expressed our strong support to better protect valuable intellectual property, the crown jewel of our industry.However, we worry that these tariffs will hurt companies in the semiconductor supply chain, introduce significant uncertainty, impose greater costs, open companies to retaliatory tariffs, and ultimately do nothing to address our concerns regarding China’s trade practices. We strongly encourage Congress to work together and with the Trump administration to jointly develop and execute a plan that will address the longstanding problems with China. As part of the SEMI Washington Forum (April 17-18), SEMI staff and senior executives from across the industry will raise this and other issues with policymakers in Washington, DC. SEMI will continue to engage as trade tensions continue.

GlobalFoundries' new ecosystem partner program, called RFwave™, aims to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks (read the full press release here). The program aims to give designers a low-risk, cost-effective path to highly optimized solutions that leverage GF's platforms including RF on FD-SOI and RF-SOI. The target is wireless applications such as IoT across various wireless connectivity and cellular standards, standalone or transceiver integrated 5G front end modules, mmWave backhaul, automotive radar, small cell and fixed wireless and satellite broadband. As such, the RFwave™ partner program provides GF customers with IP design elements, EDA tools, design consultation and services and OSAT product packaging and test solutions. These products and services are validated, and comprise a plug-and-play catalog of design solutions. With this level of integration, GF customers can create high-performance designs while minimizing development costs. Bami Bastani, senior vice president of GF’S RF Business Unit, says, “As a leader in RF, GF’s RFwave program takes industry collaboration to a new level, enabling our customers to build differentiated, highly integrated RF-tailored solutions that are designed to accelerate the next wave of technology.” Initial members of the RFwave Partner Program are: asicNorth, Cadence, CoreHW, CWS, Keysight Technologies, Spectral Design, and WEASIC.

Worried that you’re underhydrated after a heart-pounding run or bike ride? SEMI’s Nano-Bio Manufacturing Consortium (NBMC) has you covered – with a patch. A few years after the group undertook the sweaty task of creating a non-invasive health monitor, the patch that tracks electrolyte levels recently ended up stuck to the skin of U.S. Air Force volunteers.“During extra workout sessions at the Air Force Research Laboratory in Ohio, the volunteers wore on their backs adhesive patches that collected their perspiration," according to GE Reports. "Sensors in the patches were able to detect the specific levels of electrolytes in the sweat the volunteers released. That data was transmitted wirelessly to a laptop computer app where researchers could analyze it in real time.” Read more about the project in the GE Reports blog.The project came together when NBMC, a diverse group of companies, universities and organizations, brought their enthusiasm and interdisciplinary know-how across nanotechnology, biotechnology, advanced (additive) manufacturing, and flexible electronics to tackle the challenge of underhydration and dehydration. The idea was to develop a device that delivers reliable, wireless, actionable human performance data in a non-invasive way.Congratulations to GE Global Research, and the partners from the Air Force Research Laboratory, University of Connecticut, University of Massachusetts-Amherst, American Semiconductor Inc., University of Arizona, UES, Dublin City University and NBMC on these impressive strides in the field of health monitoring!Watch this video to see the patch in action! (https://www.facebook.com/GE/videos/1667584156643205/)Visit www.nbmc.org for more information.

Sales revenues for fluid management subsystems grew 28 percent in 2017 to $1.28 billion, breaking the $1 billion mark for the first time. Fluid management subsystems have now seen five years of consecutive growth, and 2018 is expected to extend the growth streak to six years for the segment.Fluid management subsystems control the delivery of process gases and chemicals onto the wafer during processing and may be located either on-tool or near the tool. This segment can be further divided into two main categories – gas delivery and liquid delivery subsystems. Gas delivery subsystems, such as mass flow controllers (MFCs), deliver gases or speciality chemicals to a vacuum process chamber, and liquid delivery subsystems typically deliver liquid chemicals to a wet processing module. Demand for gas and liquid delivery subsystems is roughly 54 percent and 46 percent respectively – a ratio that has not changed significantly over the past few years.Although fluid management subsystems account for approximately 10 percent of expenditures on all critical subsystems used on semiconductor manufacturing equipment, growth of other critical subsystems such as vacuum processing subsystems has been sluggish.Mass flow controllers (MFCs), however, are showing strong growth potential and are set to buck their historical slow growth trend as the industry transitions into sub 10 nm processing. At the leading edge, processes are becoming more vacuum intensive and the importance (and difficulty) of accurately controlling chemical delivery for deposition onto the wafer is increasing. Process operating windows are getting tighter and the specification ranges demanded by chipmakers are shrinking, posing challenges for existing MFC technology. The upshot is that new MFC solutions and technologies are needed to enable transitions to smaller nodes, providing an opportunity for growth in this segment.The fluid management subsystems market is currently dominated by Japanese- and U.S.-based vendors. Horiba is the largest player, accounting for 30 percent of total fluid management sales, and the rest of the market is extremely fragmented, with a raft of companies competing in this space.Given the large size and fragmentation of this segment, interest in these products in the coming year is sure to intensify as the race to find lucrative solutions to enable sub 10 nm processing heats up.For more information about VLSI Research and Critical Subsystems, visit www.vlsiresearch.com.

Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year. Congressional spending has been allocated in fits and starts since the end of FY 2017 last September, with patchwork deals keeping things running amid pervasive uncertainty. While this clearly isn’t an ideal way to fund the federal government, the end result will make many in the business of research and development pleased with the addition of more resources for science and innovation.There was grave concern over the future of federal spending with the release of the president’s FY 2018 budget, which would have cut the National Science Foundation (NSF) budget by 11 percent and National Institutes of Standards Technology (NIST) spending by 30 percent. Relief came with early drafts from Congress that whittled those cuts down to between 2-9 percent. But the real boost was a February bipartisan Congressional agreement that lifted self-imposed spending caps and introduced a generous dose of non-defense discretionary spending, increasing NSF spending 3.9 percent over the previous year and the NIST budget an astounding 25.9 percent over FY 2017 levels.SEMI applauds this much-needed support for basic research and development (R D) at these agencies after their budgets were cut or flat-funded for multiple cycles. It is well understood that federal R D funding is critical to U.S. competitiveness and future economic prosperity. With the stakes that high, full funding of R D programs at the NSF and NIST should be a bipartisan national priority backed by a strong and united community of stakeholders and advocates in the business, professional, research, and education communities.With the work for FY 2018 completed, Congress will now turn to FY 2019 spending – already behind schedule due to the belated completion of the previous year’s budget. With 2018 an election year, Congress will likely begin work on the FY 2019 budget in short order, but probably won’t complete its work prior to the November elections. SEMI will continue to work with lawmakers to support the R D budgets at the agencies and their important basic science research. If you’d like to know how you can be more involved with SEMI’s public policy work, please contact Jamie Girard, Sr. Director, Public Policy at [email protected].

Following the immense success of last year's FD-SOI training day in Silicon Valley, the SOI Consortium has another one planned for the end of April this year. If you want to start learning how to leverage FD-SOI in your chip designs, this is a great place to start. Click here for information on how to sign up. ST Fellow Dr. Andreia Cathelin has put together another great line-up. World renowned professors and experts from industry will deliver a series of four training sections of 1.5 hours each, focused on energy efficient and low-power, low-voltage design techniques for analog, RF, high-speed, mmW and mixed-signal design. You'll learn about design techniques that take full advantage of the unique features of FD-SOI, including body biasing capabilities that further enhance the excellent analog/RF performances of these devices. Each section of this training day will take you through concrete design examples that illustrate new implementation techniques enabled by FD-SOI technologies at the 28nm and 22nm nodes – and beyond. The design examples will cover basic building blocks through SoC implementations. A global Q A session will close the day. Here's a little more info on how the day will unfold. Click on the slides to see them in full screen. Morning sessionsFDSOI-specific design techniques for analog, RF and mmW applications - Andreia Cathelin, Fellow, STMicroelectronics [caption id="attachment_11714" align="alignleft" width="300"] Quick preview from Andreia Cathelin's FD-SOI training session (Courtesy: STMicroelectronics, SOI Consortium)[/caption] Andreia Cathelin is ST's key design scientist for all advanced CMOS technologies, and is arguably the world's leading expert on leveraging FD-SOI in high-performance, low-power RF/AMS SoCs. Her course will first present a very short overview of the major analog and RF technology features of 28nm FDSOI technology. Then the focus moves to the benefits of FD-SOI technology for analog/RF and millimeter-wave circuits. She'll give design examples such as analog low-pass filters, inverter-based analog amplifiers and 30GHz and 60GHz Power Amplifiers, as well as mmW oscillators. There will be particular focus on the advantages of body biasing and special design techniques offering state-of-the-art performance. Circuit Design Techniques in 22nm FD-SOI for 5G 28GHz Applications - Frank Zhang, Principal Member of Technical Staff, GlobalFoundries [caption id="attachment_11716" align="alignright" width="300"] Quick preview from Frank Zhang's FD-SOI training session (Courtesy: GlobalFoundries, SOI Consortium)[/caption] Frank Zhang has designed chips using GF's 22nm FD-SOI (22FDX) process for WLAN, 5G cellular and automotive radar applications. His course will focus on how to take advantages of FD-SOI’s high-frequency performance at relatively low-current density to design high performance RF/mmWave circuits. Examples circuits include a 28GHz LNA, a 28GHz PA and an RF switch for 5G applications. The FD-SOI advantages such as low capacitance, high breakdown voltage and high-output impedance will be exploited in these design examples. This course will also discuss how to extend these techniques to applications at higher frequencies and/or higher current densities that are subject to extreme temperatures and EM requirements. Afternoon sessionsEnergy-Efficient Design in FDSOI - Bora Nikolic, Professor, UC Berkeley [caption id="attachment_11715" align="alignleft" width="300"] Quick preview from Bora Nikolić's FD-SOI training session (Courtesy: UC Berkeley, SOI Consortium)[/caption] Borivoje (“Bora”) Nikolić is known as one of the world’s top experts in body-biasing for digital logic (he and his team have designed more than ten chips in ST’s 28nm FD-SOI.) If you missed it, his team's RISC-V chip was cited as one of Dr. Cathelin's “Outstanding 28nm FD-SOI Chips Taped Out Through CMP” – read more about that here. His talk at the training day will present options for energy-efficient mixed-signal and digital design in FD-SOI technologies. He'll explain how to generate body bias and use it to improve efficiency, with examples in RF and baseband building blocks, temperature sensors, data converters and voltage regulators. The techniques will be presented in the context of UC Berkeley's latest RISC-V-based SoC, designed to operate in a very wide voltage range using 28nm FD-SOI. mm-Wave and Fiber-Optics Design in FD-SOI CMOS Technologies - Sorin Voinigescu, Professor, University of Toronto [caption id="attachment_11713" align="alignright" width="300"] Quick preview from Sorin Voinigescu's FD-SOI training session (Courtesy: U. Toronto, SOI Consortium)[/caption] Sorin Voinigescu is a world renowned expert on millimeter-wave and 100+Gb/s ICs and atomic-scale semiconductor device technologies. His lecture will cover the main features of FD-SOI CMOS technology and how to efficiently use its unique features and suitable circuit topologies for mm-wave and broadband SoCs. He'll begin with an overview of the impact of the back-gate bias and temperature on the measured I-V, transconductance, fT, and fMAX characteristics. Then he'll compare the maximum available gain, MAG, of FDSOI MOSFETs with those of planar bulk CMOS and SiGe BiCMOS transistors through measurements up to 325 GHz. Next, he'll provide biasing, sizing and step-by-step design examples for VCO, doubler, switches, PA, large swing optical modulator drivers and quasi-CML circuit topologies and layouts that make efficient use of the back-gate bias to overcome the limitations associated with the low breakdown voltage of 20nm and 12nm FD-SOI CMOS technologies. Sign Up Now!With over 100 attendees filling every chair in the auditorium, last year's training day was sold out. Although it was in Silicon Valley, people actually flew in from all over the world to be there. During the Q A at the end, most everyone prefaced their questions by saying, “Thank you. I really learned a lot today.” 2018 will be no different – except that it's sure to sell out even faster. Please note, though, that this is not a free event, so only the attendees will get copies of the slide decks. Here's key info you need to sign up. See you there!What: SOI Consortium's FD-SOI Training DayWhen: 27 April 2018, 7:30am – 5pm.Where: Crowne Plaza San Jose, Milpitas CA (parking is free)Registration fee: US $485.00 (includes training book, breakfast, box lunch and refreshments during breaks)How to sign up: Click here to go directly to the registration site.