May 18, 2026 - May 20, 2026
Surface Preparation and Cleaning Conference (SPCC), formerly presented by Linx Consulting, brings together key business insights, IC manufacturers, equipment makers, materials and chemical providers, metrology experts, process technologists to address critical challenges, and innovations in surface preparation and cleaning.
Held at the Wild Horse Pass Resort in Chandler, Arizona, SPCC 2026 will feature technical sessions, poster presentations, and business-focused programming, creating a unique forum where technology and industry strategy converge.
Location
Wild Horse Pass
5040 Wild Horse Pass Blvd
Chandler, AZ , AZ 85226
United States
The Surface Preparation and Cleaning Conference (SPCC) is a premier technical forum dedicated to advancing surface preparation, cleaning technologies, and wet processes essential to semiconductor manufacturing. Formerly presented by Linx Consulting, SPCC continues its legacy of delivering high-quality technical content through invited presentations, peer-reviewed sessions, and poster presentations covering all aspects of cleaning science, process integration, materials, equipment, and metrology.
SPCC will feature invited business-focused presentations that examine macroeconomic, market, and structural trends shaping the global semiconductor industry that were formerly included in the Business Interface Conference (BIC). These sessions will provide attendees with valuable context on industry dynamics, supply chain, and strategic outlooks that complement the technical discussions at SPCC.
Now a unified conference, SPCC unites both business and technical aspects of industry into a comprehensive program that bridges technology development and business strategy, offering attendees enhanced opportunities for cross-disciplinary learning, collaboration, and networking with industry leaders, researchers, and decision-makers across the semiconductor ecosystem.
Join our premier technical forum with topics including—
- Cleaning Science
- Equipment
- Industry Dynamics
- Materials
- Metrology
- Process Integration
- Strategic Outlook
- Supply Chain
Agenda
MONDAY, MAY 18, 2026
Session 1
Breakfast
Opening Remarks
KEYNOTE—Semiconductor Industry Update
Dummy Gate Poly Wet Etch Studies in GAA Nanosheet Flow
Enabling Novel Innovation in Containers Profile Sculpting for Cell Structure Improvement
Networking Break
Particle Precursors and On-Wafer Defectivity: IRDS Collaborative Research Progress and Future Directions
Si/SiGe Selective Wet Etchant for BSPDN Application: Maximization of Selectivity in Single Wafer Spin Wet Processing
Optimization of Particle and Atmosphere Control in the SPM Process via Nozzle Cover
New Surface Preparation System; Batch-Single Hybrid Equipment
Lunch
Session 2
Market Outlook
Wet Cleaning Approaches to Remove Post-Etching AlOx Residues in Al/AlOx/Al Stacks
Silicon-Germanium Etchants with Excellent Silicon and Silicon Oxide Compatibility for Advanced Semiconductor Devices
Networking Break
Crystallographic Orientation-Dependent on Native Oxide Evolution for Advanced CMOS Surface Control
An Innovative Low-Azole Metal Hard Mask Etchant with an Environmentally Sustainable Cu/Co Integration Scheme
Impact of Wet Bevel Etching on WDC Films and Advanced Interconnect Structures
Approaches to Further Enhance Cut Accuracy
Advancements in Wafer Backside cleaning for DRAM Manufacturing
TUESDAY, MAY 19, 2026
Session 3
Breakfast
Day 2 Opening Remarks
Day 2 Keynote—Navigating the AI-driven Cycle: Fab Investments and Materials Dynamics in a Fragmented World
Megasonic Removal of Flux Entrained in Narrow Gaps in Packaging Structures
Molecular Dynamics Simulation of Megasonic Cavitation in Ammonia Peroxide Solution and its Impact on Silicon Surface
Networking Break
Ab Initio Study of Confined HF Etching Mechanism on SiO2
WSDL: AI-Enabled Wafer Surface Defect Localization for Cleaning Process Optimization
Challenges and Solution of Post Ceria CMP Clean
Lunch
Session 4
Advanced Topography Correction Planarization Technology for Yield Enhancement
Controlling the Molybdenum Dissolution and Oxidation During Post-CMP Cleaning
Controlled Cracking-Induced Delamination for Polymer-Based Cleaning
Design of the Buffing Cleaning Solution for Chemical Mechanical Cleaning on Advanced Technology Node
Networking Break
Impact of Supply Chain Conditions on IPA Product Quality
Trace Water Measurement in Organic Solvent Systems for Semiconductor Manufacturing
Thermal Vacuum Analysis and Identification of Contaminant Outgassing from Polymer Seals
Verifying PFAS Abatement in Fab-Relevant Waste Matrices Using Complementary Analytical Characterization Techniques
IR-PiFM: Molecular Detection and Identification of Nanoscale Surface Contamination
WEDNESDAY, MAY 20, 2026
Session 5
Breakfast
Day 3 Opening Remarks
Wet Etching and Cleaning Trends: Scaling x 3D Integration
Characterization of Particle Filtration Solutions in a Weak Acid
Networking Break
Wet-Etch Solutions Development for Advanced Node Devices
Improved Cu Recess Control via Surfactant-Modulated Electrochemical Kinetics in Post-CMP Cleaning
Wet Cleaning of Sulfur Residues Post RIE for Advanced BEOL Integration
Selective Surface Modification Using Amine Chemistry for Enhanced Semiconductor Cleaning Performance
Lunch
Session 6
Day 3 Keynote—Measuring the Future: CHIPS Metrology Program Updates
High Loading Capacity Solvent Blend for a Safe and Efficient Alternative to NMP and Amine-Based Strippers
TTV Optimization in Wet Chemical Thinning Using Integrated Metrology
Networking Break
Improvement of Hybrid Bonding By Controlling Surface with Copper Pads Using Functional Water
Eco-Conscious, High Etch Rate, and Metal/Non-Metal Compatibility Stripper for Advanced Packaging Photo Resist and SOG
Closing Remarks
Registration
Conference Pricing
SEMI Members: $1,500.00 (Use your corporate email address during log-in to be recognized as a SEMI Member.)
Non-Members: $1,800.00
Speakers and Students: $550.00
Cancellations received on or before April 26, 2026 will be refunded, less a $30 cancellation fee.
Krish Raghunath
Program Manager, Programs & Committees, SEMI
[email protected]
Hotel
Limited rooms are available at the Wild Horse Pass Resort. Reserve your stay within our room block using the link below.
Deadline: Friday, April 17
Sponsors
Sponsoring will associate your company with the industry's most respected senior executives. Sponsorship opportunities can be tailored to meet your specific branding and marketing objectives.
Contact Tim Janes at [email protected]
Gold
Silver
Bronze
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