Focusing on Key Semiconductor Technologies with a Spotlight on Advanced Packaging
(August 5, 2024 – Hsinchu) Taiwan is a global leader in semiconductor manufacturing and packaging technologies, boasting a multitude of top-tier wafer foundries, advanced packaging and testing plants, and the world’s most comprehensive semiconductor ecosystem. This also drives the technological development of the surrounding industrial chain. The SEMICON Taiwan 2024, scheduled for September 4-6, will feature the industry's most anticipated zones, including those dedicated to heterogeneous integration and materials. An all-star lineup of exhibitors, including Entegris, GlobalWafers, Samsung Electronics, and SK Hynix, is invited to participate in the Heterogeneous Integration Global Summit 2024, where they will share insights on advanced packaging and material technologies. SEMICON Taiwan is continually enhancing the competitiveness of the semiconductor supply chain through technological innovation. By fostering a complete AI semiconductor ecosystem, it contributes to the overall progress and prosperity of both Taiwan and the global industry.
SEMICON Taiwan 2024 Highlights Advanced Packaging and Material Technologies, Driving Industry Innovation
As semiconductor technologies evolve, new technologies are becoming increasingly complex, making forward-looking technology layouts and expanded supply chain collaborations essential. The continuous advancement in materials, is crucial for enhancing the performance and efficiency of semiconductor components, driving progress in advanced manufacturing processes. Meanwhile, advanced packaging technologies continue to move towards heterogeneous integration and 3D SiP (3D system-in-package).
This year, SEMICON Taiwan will bring together leaders in IC design, manufacturing, packaging, and end-system applications within the heterogeneous integration zone, showcasing emerging technologies and applications to present a comprehensive blueprint for the semiconductor industry’s future.
Additionally, the event will kick off with a four-day Heterogeneous Integration Global Summit 2024, featuring a strong all-star lineup of keynote speakers from AMD, Micron, Intel, Microsoft, Samsung Electronics, SK hynix, and TSMC. These executives will present breakthroughs and innovations in HBM, Chiplet, and FOPLP technologies, highlighting the latest advancements in essential heterogeneous integration technologies.
Rising AI Demand Spurs the FOPLP Innovation Forum, Paving the Way for the Latest Technologies
With the explosive demand for AI, the capacity for advanced packaging technologies required by AI chips is tight. Fan-out Wafer Level Packaging (FOPLP) uses a "rectangular" substrate for IC packaging, achieving higher utilization within the same unit area, and is becoming the most popular next-generation technology in heterogeneous integration advanced packaging. However, challenges such as panel warpage, uniformity, and yield remain to be addressed. In response, this year's SEMICON Taiwan will introduce the inaugural FOPLP Innovation Forum as part of the Heterogeneous Integration Global Summit 2024 series. Industry leaders from ASE, Innolux, and NXP are invited to explore the latest technological developments, aiming to accelerate technological breakthroughs and early adoption, thereby significantly enhancing semiconductor manufacturing capabilities.
Spillover Effects, Promoting Industry Co-Prosperity
In addition to packaging technologies, machinery and equipment are also vital segments of the semiconductor peripheral industry chain. Taiwan's advancements in semiconductor technology have simultaneously spurred the growth of the machinery sector. This year, SEMICON Taiwan will also feature a precision machinery zone, with participation from the Taiwan Association of Machinery Industry (TAMI) and the smart machinery team from the Taiwan Machine Tool & Accessory Builders’ Association (TMBA), supporting the deep cultivation of semiconductor equipment in Taiwan and its progression towards the international market.
Register for SEMICON Taiwan 2024 for free is now open. Register for the international forums for a super early-bird discount of 20%. For more information, please visit the official website.
About SEMI
Founded in 1970, SEMI operates 10 major offices globally and established the SEMI Taiwan in 1996. It connects over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. Since its inception, SEMI Taiwan has annually hosted SEMICON® Taiwan, international summits, and various major technical forums, enhancing Taiwan's international influence and competitiveness. SEMI upholds the principles of objectivity and neutrality, acting as a semiconductor industry think tank for Taiwanese member companies. It fosters deep global exchanges among industry, government, academia, and research sectors, promoting Taiwan's semiconductor industry to align with global standards, and establishing a two-way communication platform.
SEMI Taiwan currently hosts 18 technical committees to drive industry growth and innovation in design, devices, equipment, materials, services, and software. It provides comprehensive market intelligence, standardization, policy advocacy, talent cultivation, sustainability development, supply chain management, and program assistance to empower members in facing industry challenges. For more information, visit www.semi.org or join SEMI Facebook and SEMI LinkedIn.
Media Contacts
SEMI | Elma Fang | 03-560-1777 #211 | |
GOLIN | Roselie Chen | 0984-349-379 | |
GOLIN | Alice Lin | 0919-552-589 |
