TAIPEI, Taiwan– September 5, 2023 – Industry luminaries gathered today for a press conference to kick off SEMICON Taiwan 2023, opening tomorrow with companies from across the electronics design and manufacturing supply chain coming together for insights into the latest trends, developments and innovations driving industry growth. Registration is open for the exhibition and conferences, September 6-8, 2023, at TaiNEX 1 and 2 in Taipei.
“The semiconductor industry has entered a new era of opportunities for global cooperation to solve some of its greatest challenges,” Terry Tsao, President of SEMI Taiwan and SEMI Chief Marketing Officer, said at the conference. “Achieving net zero carbon emissions, building the workforce of the future and ensuring supply chain resilience as the chip industry drives toward $1 trillion in annual revenue will require nothing less than a whole-industry effort. We look forward to hosting industry experts and visionaries from around the world at SEMICON Taiwan 2023 to focus on these and other key opportunities for the chip industry ecosystem to fulfill its tremendous potential.”
Tsao was joined at the press conference by Tsung-Tsong Wu, Minister of the National Science and Technology Council (NSTC); Tien Wu, CEO of ASE; Doris Hsu, Chairperson and CEO of GlobalWafers; and John Lee, Managing Director of Merck Group in Taiwan.
The largest SEMICON Taiwan ever, the event is expected to draw more than 50,000 attendees while featuring 3,000 booths and 950 exhibitors. Themed Inspire Innovation. Empower Sustainability, SEMICON Taiwan 2023 will offer more than 20 forums spotlighting critical industry topics including:
- Advanced Manufacturing
- Heterogeneous Integration
- Compound Semiconductors
- Automotive Chips
- Smart Manufacturing
- Sustainable Manufacturing
- Semiconductor Cybersecurity
- Talent
Other SEMICON Taiwan 2023 Highlights
Top semiconductor industry executives will gather at the CEO Summit to examine vital innovation trends and keys to the industry’s success over the next 20 years. Featured speakers will include:
- Tien Wu, CEO of Advanced Semiconductor Engineering (ASE)
- Mark Liu, Chairman of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC)
- Anirudh Devgan, President and CEO of Cadence Design Systems
- Tim Archer, President and CEO of Lam Research
- Toshiki Kawai, President and CEO of Tokyo Electron (TEL)
Market and Industry Trend Forum
Top industry analysts will explore market trends, present industry forecasts, and provide insights into how companies across the semiconductor ecosystem can navigate the unpredictable market environment. Speakers will include analysts from Gartner, McKinsey & Company, Morgan Stanley, Mizuho Bank, the SEMI Market Intelligent Team (MIT), and TechInsights.
With Taiwan a vital partner in the global semiconductor industry, SEMICON Taiwan 2023 will feature country pavilions including Australia, the Czech Republic, Germany, Italy, Japan, Netherlands, Poland, Singapore, the UK and the United States.
13 Theme Pavilions and Multiple International Forums
SEMICON Taiwan 2023 theme pavilions will showcase areas key to semiconductor industry growth including Heterogeneous Integration, Compound Semiconductor, Materials, Green Manufacturing, and Workforce Development.
Smart Manufacturing Journey, themed AI-Driven Innovation of Future Automation, will also highlight SEMICON Taiwan 2023. The interactive exhibition will feature leading-edge artificial intelligence (AI) technologies and the latest developments in factory robotics and automation.
SEMICON Taiwan 2023 will also include:
- Smart Manufacturing Expo Taiwan
- Heterogeneous Integration Global Summit
- Strategic Materials Conference Taiwan
- FLEX Taiwan 2023
About SEMI
SEMI® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.
Association Contacts
Monica Hung/SEMI Taiwan
Phone: +886.3.560.1777 ext. 209
Email: [email protected]
Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]
Phil Wang/One For All PR Agency
Phone: +886.2.8712.8681 ext. 389
Email: [email protected]
Urven Chang/One For All PR Agency
Phone: +886.2.8712.8681 ext. 335
Email: [email protected]
