晶片供應鏈巨頭齊聚秀實力，台灣半導體聚落成全球半導體版圖中關鍵角色

【2024年9月5日 – 新竹訊】全球指標性的半導體國際盛事 SEMICON Taiwan 熱烈開展第二天，今年首度亮相的 AI 半導體技術概念區，以及 AI 互動體驗區，持續吸引大量觀展者前來探索劃時代的半導體演進歷程，體驗數位分身的創新技術，成為今年展期一大亮點。一系列國際論壇進入第三天，除了向來是展中焦點的2024 異質整合國際高峰論壇外，後續輔以多場精彩論壇輪番接力，深入探討當前火熱議題，包括高科技智慧製造技術、先進測試至半導體設備材料創新，全方位解析半導體產業邁向破兆美元新契機。

SEMI指出在汽車電子、AI、智慧應用等日益增長的需求驅動下，全球半導體產值有望在2030年突破一兆美元大關，AI 也可望在 2025 年開始呈現兩位數穩健成長，並在 2030年達到 24% 年複合成長率，並將同步帶動半導體設備市場兩位數成長，市場規模可望超過 1270億美元。SEMICON Taiwan今年聚集了全球 AI 晶片巨擘，與會者可以第一時間掌握產業先進技術與未來趨勢。SEMI 全球行銷長暨台灣區總裁曹世綸表示：「異質整合技術將半導體產業的下一個突破口，也是推動整個科技生態系統向前發展關鍵力量。」

賦能 AI無極限，SEMICON Taiwan 大秀半導體技術創新

今年展會同樣關注半導體從製造到封裝各環節的技術突破，兩館展區匯聚各個廠商秀出 AI戰力，完整展現台灣 AI供應鏈並串連全球。常設展區之外，重點論壇如高科技智慧製造論壇，今年邀請產學界重量級講者分享生成式 AI發展如何驅動晶片製造轉型與製程技術優化，並探討透過最新的 智慧製造技術擴大 AI 價值鏈的機遇與突破點。歷屆門票同樣秒殺的先進測試論壇今年主題聚焦 AI賦能的先進測試技術，展現 AI 工具在提升測試效率與精度方面的優勢與亮點，達成以 AI測試 AI 的展望。

異質整合技術領航未來發展  精密機械接軌國際半導體供應鏈搶商機

當異質整合、先進封裝成為全球熱搜關鍵字，今年國際半導體展將一連三天針對異質整合技術與發展舉行「2024異質整合國際高峰論壇」主題演講。此外，受惠產業外溢效應帶動精密機械業者與半導體齊步成長，在 2024策略材料高峰論壇中，邀請台積電李明機博士及日月光半導體李基銘等產業專家，探討異質整合封裝技術如何優化 AI加速器性能與能效，並推動 AI系統前瞻設計，深入剖析 AI與 HPC 邏輯技術背後的材料創新，強化運算效率，助力 AI晶片製造實現低碳化等關鍵議題。展會期間，化合物半導體、設備與材料創新專區亦大秀技術與產品創新，向全球展示了台灣在先進封裝領域的實力，已準備好邁向半導體製造新紀元。

SEMICON Taiwan 2024 將進入展期倒數，今年展覽以多元主題展區全面剖析半導體從晶圓製造到人才培育，包含半導體先進製程科技論壇、2024異質整合國際高峰論壇–第三天、半導體資安趨勢高峰論壇及半導體研發大師論壇等專業論壇輪番登場，剖析半導體供應鏈的先進技術及市場趨勢。未來，隨著技術的不斷進步和市場需求的增長，台灣半導體供應鏈將繼續在全球半導體產業中發揮其關鍵作用，推動全球科技的持續創新和進步。一覽 20場聚焦半導體技術創新論壇、360度全方位拆解先進封裝技術，皆在 SEMICON Taiwan 2024。開展兩日已創下觀展人潮新高峰，相較去年統計數據已達 25% 成長，敬請把握開展最後一日前往觀展，即時獲取半導體產業最新動態。

SEMICON Taiwan 2024 展會精華速覽、每日新聞稿、新聞圖片等素材請參考此連結：連結

關於SEMI國際半導體產業協會

成立於1970年，SEMI於全球設有10大營運據點，並於1996年正式成立SEMI國際半導體產業協會台灣分會，致力協助連結全球半導體和電子設計及製造供應鏈3,000多家會員企業，以及150萬名專業人士。自同年起固定舉辦年度SEMICON^® Taiwan國際半導體展、國際高峰會與各項大型技術論壇，持續推升台灣之國際影響力及競爭力。SEMI國際半導體產業協會始終秉持客觀中立原則，為台灣企業會員提供半導體產業智庫角色，促進國際間產、官、學、研各界深度交流，推動台灣半導體產業與全球接軌，搭建雙向溝通對話機制。

SEMI國際半導體產業協會目前在台灣成立十八大技術委員會，以持續推動設計、裝置、設備、材料、服務和軟體方面的產業成長和技術創新為目標，並竭力提供企業會員完整的市場產業情報、標準制定、政策倡議、人才培育、永續發展、供應鏈管理和各式計劃協助，助力會員應對產業挑戰。更多資訊歡迎瀏覽www.semi.org，或加入SEMI Facebook粉絲團、SEMI LinkedIn。

新聞聯絡人

• Read more about 先進製程再升級 SEMICON Taiwan催生半導體新未來

【2024年9月4日 – 新竹訊】SEMICON Taiwan 2024 國際半導體展今日正式開展，今年主辦單位SEMI 國際半導體產業協會首度攜手台北 101，將於開展首日（9月4日）晚間 6 時 30 分至 10 時，以點燈方式表達對半導體點亮台灣，照耀國際的支持，並邀請各界一同為台灣半導體的亮麗表現喝采。

除了協助全球半導體與台灣建立產業交流，今年 SEMICON Taiwan 也首度與台北 101 跨界攜手，透過點燈儀式向全球強力放送。今日點燈特別打上「Breaking Limits」、「半導體點亮台灣、台灣照耀全球」以及「讓世界聚焦台灣、讓世界看見未來」等文字，誠摯邀請大家共同參與，見證半導體產業的榮耀時刻。

SEMI 全球行銷長暨台灣區總裁曹世綸表示：「台灣半導體產業是支持全球科技發展重要推手，而台北 101 做為世界知名地標，不僅是一道點綴台北夜空的亮麗風景線，同時也藉此機會向世界發聲，透過點燈儀式，讓更多人看見台灣半導體產業點亮世界的深刻意涵。」

台灣半導體產業陣容堅強，橫跨 IC 設計、半導體製造、封測等，在全球市場具有舉足輕重的地位，面對新興市場的機會與挑戰，台灣半導體產業始終是全球半導體供應鏈中最堅強的夥伴。SEMI 邀請民眾在 9 月 4 日點燈日，一同為台灣半導體產業加油，記錄下夜空中閃耀的半導體之光，協力串流社群放閃，拍照打卡並分享上傳標記 #半導體點亮台灣，讓世界看見台灣半導體產業的卓越成就與重要地位。

關於SEMI國際半導體產業協會

成立於 1970 年，SEMI 於全球設有 10 大營運據點，並於 1996 年正式成立 SEMI 國際半導體產業協會台灣分會，致力協助連結全球半導體和電子設計及製造供應鏈3,000多家會員企業，以及150萬名專業人士。自同年起固定舉辦年度 SEMICON^® Taiwan 國際半導體展、國際高峰會與各項大型技術論壇，持續推升台灣之國際影響力及競爭力。SEMI 國際半導體產業協會始終秉持客觀中立原則，為台灣企業會員提供半導體產業智庫角色，促進國際間產、官、學、研各界深度交流，推動台灣半導體產業與全球接軌，搭建雙向溝通對話機制。

SEMI 國際半導體產業協會目前在台灣成立十八大技術委員會，以持續推動設計、裝置、設備、材料、服務和軟體方面的產業成長和技術創新為目標，並竭力提供企業會員完整的市場產業情報、標準制定、政策倡議、人才培育、永續發展、供應鏈管理和各式計劃協助，助力會員應對產業挑戰。更多資訊歡迎瀏覽www.semi.org，或加入SEMI Facebook粉絲團、SEMI LinkedIn。

新聞聯絡人

• Read more about SEMICON Taiwan 2024 首度跨界台北 101 攜手為台灣半導體點亮台灣

[September 4, 2024 – Hsinchu] SEMICON Taiwan 2024 officially opened today. This year, the event marks a milestone as SEMI collaborates for the first time with Taipei 101. From 6:30 PM to 10:00 PM on the opening day (September 4), a lighting ceremony will be held to express support for the semiconductor industry’s role in illuminating Taiwan and shining on the global stage. The event invites everyone to celebrate Taiwan’s semiconductor industry’s brilliant performance.

In addition to fostering global semiconductor industry exchanges with Taiwan, SEMICON Taiwan has partnered with Taipei 101 this year for a groundbreaking cross-industry collaboration, broadcasting Taiwan’s impact worldwide through the lighting ceremony. The special lighting will feature phrases such as "Breaking Limits," "Semiconductors Illuminate Taiwan, Taiwan Shines Globally," and "Let the World Focus on Taiwan, Let the World See the Future." Everyone is invited to join in and witness this moment of glory for the semiconductor industry.

Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI commented: “Taiwan's semiconductor industry is a crucial driver of global technological advancement. Taipei 101, as a renowned global landmark, not only adds a brilliant touch to Taipei’s night sky but also uses this opportunity to make a statement to the world. Through this lighting ceremony, we aim to let more people understand the profound significance of Taiwan’s semiconductor industry illuminating the world.”

With a robust presence spanning IC design, semiconductor manufacturing, and packaging and testing, Taiwan’s semiconductor industry plays a critical role in the global market. Despite the accelerating challenges of innovation and transformation, Taiwan remains a steadfast partner in the global semiconductor supply chain. SEMI invites the public to join in on September 4 to support Taiwan’s semiconductor industry, capture the shining light of semiconductors in the night sky, and share their photos on social media with the hashtag #SemiconductorsIlluminateTaiwan, showcasing Taiwan's unwavering unity and strength to the world.

About SEMI

Founded in 1970, SEMI operates 10 major offices globally and established the SEMI Taiwan in 1996. It connects over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. Since its inception, SEMI Taiwan has annually hosted SEMICON® Taiwan, international summits, and various major technical forums, enhancing Taiwan's international influence and competitiveness. SEMI upholds the principles of objectivity and neutrality, acting as a semiconductor industry think tank for Taiwanese member companies. It fosters deep global exchanges among industry, government, academia, and research sectors, promoting Taiwan's semiconductor industry to align with global standards, and establishing a two-way communication platform.

SEMI Taiwan currently hosts 18 technical committees to drive industry growth and innovation in design, devices, equipment, materials, services, and software. It provides comprehensive market intelligence, standardization, policy advocacy, talent cultivation, sustainability development, supply chain management, and program assistance to empower members in facing industry challenges. For more information, visit www.semi.org or join SEMI Facebook and SEMI LinkedIn.

Media Contacts

• Read more about SEMICON Taiwan 2024 Partners with Taipei 101 to Illuminate Taiwan's Semiconductor Industry

[September 4, 2024 – Hsinchu] SEMICON Taiwan 2024 officially opened today (September 4) at the Taipei Nangang Exhibition Center. The opening ceremony was witnessed by Premier of Executive Yuan, Jung-Tai Cho, SEMI President and CEO Ajit Manocha, Executive Director of TSIA & CEO & Founder of Etron Technology Inc. , Nicky Lu, and numerous government and industry representatives. This year's exhibition has attracted more than 85,000 domestic and international industry professionals from 56 countries, showcasing over 1,100 leading companies and 3,700 booths. Additionally, more than 20 international forums are being held concurrently, featuring insights and trends from over 200 distinguished experts.

Ajit Manocha, SEMI President and CEO, stated: " Taiwan boasts a comprehensive and robust semiconductor supply chain, covering every stage from front-end manufacturing and packaging to design and R&D, playing a pivotal role in the AI industry and making significant contributions to global economic growth. Over the next seven years, it is expected that more than 50% of industry growth will stem from AI-related applications, with the industry scale projected to increase from the current $600 billion to $1 trillion. By 2040 to 2050, during the quantum era, the industry could reach a scale of $4 to $5 trillion, with Taiwan continuing to play an indispensable role. Today, the semiconductor industry faces multiple challenges, including talent shortages, supply chain disruptions, and sustainability concerns, which require global collaboration. Taiwan, with its leading position and comprehensive supply chain, will play a critical role in addressing these challenges. "

Premier of Executive Yuan, Jung-Tai Cho emphasized: "Among the five core industries outlined by the government, AI and semiconductors undoubtedly form the central part. We will continue to provide an excellent environment for investment, manufacturing, and production, and will timely adjust and relax policies to fully support the global semiconductor development. SEMICON Taiwan once again showcases Taiwan's capabilities to the world, allowing us to move forward bravely in the AI wave. As long as the world needs Taiwan, the government will shoulder its responsibilities, working hand in hand with the industry and the people to elevate the high-tech industry to new heights. "

Furthermore, Minister of Economic Affairs Minister of Economic Affairs Jyh-Huei Kuo, Minister of Digital Affairs Yennun Huang, and Vice Minister of the National Science and Technology Council  Chen-Kang Su also attended the event, underscoring the government's strong commitment to the semiconductor industry. As one of the five major focus industries of the Taiwanese government, the semiconductor industry is not only the driving force behind Taiwan's economic growth but also the cornerstone of future technological innovation and global competitiveness.

As semiconductor applications continue to expand, high-tech applications like semiconductors have flourished. As the world's most influential semiconductor exhibition, this year's SEMICON Taiwan is being held for the first time across two main venues. In addition to continuing the focus on popular semiconductor topics, including advanced processes, equipment and materials, heterogeneous integration, compound semiconductors, smart manufacturing, green manufacturing, cybersecurity, and talent, leading companies are showcasing the latest developments and technological applications. This year, newly added areas such as the "Smart Mobility Innovation Zone," "AI Technology Zone," and "Silicon Photonics Pavilion" will showcase the limitless applications of semiconductors in empowering AI, helping all attendees explore the latest trends in the semiconductor market.

Gathering of Semiconductor Giants at the CEO Summit, The Big Four Discuss AI Chip Century

The highly anticipated CEO Summit made its debut on the first day of the exhibition, inviting global semiconductor supply chain giants such as TSMC, Applied Materials, Google, imec, Marvell, Microsoft, Samsung Electronics, and SK hynix to analyze industry dynamics, market innovation trends, and advanced semiconductor technologies from four key areas: manufacturing, packaging, memory, and chip design. This year, for the first time, the forum also featured the "AI Chip Fireside Chat," moderated by Dr. Tien Wu, CEO of ASE Group. Dr. Y.J. Mii, Executive Vice President and Co-Chief Operating Officer of TSMC, Dr. Jung-Bae Lee, Corporate Head of Memory Business at Samsung Electronics, and Hamidou Dia, Vice President of Applied AI Engineering at Google, gathered to explore various issues in the AI era, ranging from technological integration, social impact, and the construction of industrial chains to changes in geopolitical dynamics, and how AI technology will shape the future of the world.

Diverse Topics on Heterogeneous Integration, 3D IC/CoWoS Become Industry Focus

With the advent of the HPC/AI era, the SEMICON Taiwan Heterogeneous Integration Global Summit 2024 has become increasingly diverse, with four consecutive days of forums exploring key technologies such as HBM, silicon photonics, CPO, hybrid bonding, and liquid cooling. Through cross-sector collaboration and exchange, the forum aims to drive the emergence of complete new technologies and applications. Given Taiwan's leading position in advanced packaging within the global supply chain, this year's exhibition will also host the 3D IC/CoWoS for AI Summit and the FOPLP Innovation Forum for the first time. Led by TSMC and ASE, these forums will discuss the latest developments and breakthroughs in packaging technologies, attracting over 2,500 industry professionals to participate in this grand event. The FOPLP technology, which has also gained significant attention as the next-generation technology, will be explored by industry pioneers such as ASE, Innolux, and NXP, focusing on accelerating technological breakthroughs and enhancing semiconductor manufacturing capabilities.

As key semiconductor events, the Power and Opto Semiconductor Forum and the Quantum Taiwan Forum attract industry experts each year. This year's Power and Opto Semiconductor Forum will feature leaders such as Broadcom, Infineon Technologies, and Texas Instruments to discuss the latest technological breakthroughs and application trends in the power and optoelectronics sectors. Meanwhile, the Quantum Taiwan Forum will bring together key players in quantum computing, including IBM, Foxconn, and Keysight, to explore cutting-edge developments in quantum technology and its potential applications in the semiconductor industry. These high-profile sessions will continue to drive global semiconductor technology progress and enhance Taiwan's influence in the international semiconductor arena.

About SEMI

Founded in 1970, SEMI operates 10 major offices globally and established the SEMI Taiwan in 1996. It connects over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. Since its inception, SEMI Taiwan has annually hosted SEMICON® Taiwan, international summits, and various major technical forums, enhancing Taiwan's international influence and competitiveness. SEMI upholds the principles of objectivity and neutrality, acting as a semiconductor industry think tank for Taiwanese member companies. It fosters deep global exchanges among industry, government, academia, and research sectors, promoting Taiwan's semiconductor industry to align with global standards, and establishing a two-way communication platform.

SEMI Taiwan currently hosts 18 technical committees to drive industry growth and innovation in design, devices, equipment, materials, services, and software. It provides comprehensive market intelligence, standardization, policy advocacy, talent cultivation, sustainability development, supply chain management, and program assistance to empower members in facing industry challenges. For more information, visit www.semi.org or join SEMI Facebook and SEMI LinkedIn.

Media Contacts

• Read more about SEMICON Taiwan 2024 Grand Opening Nine Global Semiconductor Giants Gather to Witness Industry Prosperity

【2024年9月4日 – 新竹訊】SEMICON Taiwan 2024國際半導體展今(4)日於台北南港展覽館正式登場，行政院院長卓榮泰、SEMI 全球總裁暨執行長Ajit Manocha、TSIA常務理事暨鈺創科技董事長暨執行長盧超群以及多位政府及企業代表的親臨見證下揭開序幕。本屆展會共計吸引來自全球 56 國，超過 8 萬 5 千名國內外業界專家蒞臨參觀，展出超過 1,100 家領導廠商與 3,700 個展位。同期亦舉辦超過 20 場國際論壇，邀請多達 200 位重量級大師分享產業趨勢及洞察。

SEMI 全球總裁暨執行長 Ajit Manocha 表示：「台灣擁有完整且強大的半導體供應鏈，涵蓋從前端製造、封裝測試到設計研發的每個環節，在 AI 產業扮演舉足輕重的角色，為全球經濟成長作出重大貢獻。未來七年，預計超過50%的產業成長將源自 AI 相關應用，產業規模將從目前的 6,000 億美元提升至 1 兆美元，並在 2040 年至 2050 年間，有望在量子科技時代突破至 4 至 5 兆美元的規模。屆時，台灣仍持續發揮不可或缺的作用。如今，半導體產業面臨人才缺口、供應鏈中斷及管理、和永續發展等多重挑戰，需要全球攜手合作應對，而台灣憑藉其領先地位將在克服這些挑戰方面擔當關鍵角色。」 

行政院院長卓榮泰表示：「政府提出的五大信賴產業中，AI 與半導體無疑是最核心的部分。我們將持續提供良好的投資、製造與生產環境，並適時調整政策，以全力支持全球半導體的發展。SEMICON Taiwan 再次讓世界見證台灣的實力，讓我們在 AI 的浪潮中勇敢前行。世界需要台灣，政府將肩負起應有的責任，與業界及人民攜手合作，推動高科技產業邁向新的高峰。」

此外，經濟部郭智輝部長、數位發展部黃彥男部長及國科會蘇振綱副主委也親臨現場，展現政府對於半導體產業的高度重視。作為台灣政府五大重點產業之首，半導體產業不僅是推動台灣經濟成長的核心動力，更是未來技術創新與全球競爭力的關鍵所在。

隨著半導體產業應用愈趨廣泛，半導體等高科技應用已蓬勃發展，作為全球最具影響力半導體展覽，本屆 SEMICON Taiwan 展覽首度以雙主場形式展出，除了持續聚焦半導體熱門議題，包含先進製程、設備材料、異質整合、化合物半導體、智慧製造、綠色製造、資安與人才等指標企業於現場展示最新研發成果與技術應用，今年新增的「智慧移動創新概念區」、「AI 半導體技術概念區」、以及「矽光子專區」將展現半導體賦能 AI 的無限應用，協助所有與會者一探最新的半導體市場未來趨勢。

半導體九大巨擘齊聚大師論壇，四大天王現身 AI 晶片世紀對談

每年最受矚目的大師論壇同步於開展首日亮相，邀請台積電、Applied Materials、Google、imec、Marvell、 Micorsoft、Samsung Electronics、SK Hynix 等全球半導體供應鏈巨頭從製造、封測、記憶體與晶片設計四大關鍵領域剖析產業脈動、市場創新趨勢與前瞻半導體技術。此外，今年大師論壇首度於論壇中規劃「AI 晶片世紀對談」，邀請到日月光執行長吳田玉博士主持，由台積電執行副總經理暨營運長米玉傑博士、Samsung Electronics 記憶體業務總裁 Jung-Bae Lee 博士以及 Google生成式 AI 解決方案架構副總裁 Hamidou Dia 齊聚一堂，共同探討 AI時代下的各種議題，從技術整合、社會議題、產業鏈建構以及地緣政治的變化，探索 AI 技術如何影響未來世界。

異質整合引爆關注，3D IC/ CoWoS 熱門議題躍居業界焦點

迎接 HPC/AI 時代，SEMICON TAIWAN 異質整合國際高峰論壇議題更趨多元，連續四天論壇深入探討包含 HBM、矽光子、CPO、Hybrid Bonding、Liquid Cooling 等關鍵技術，並透過跨界合作及交流，帶動完整新興技術與應用面世。有鑒於台灣先進封裝在全球供應鏈的領先地位，今年度展會更首次舉辦3D IC/ CoWoS 驅動AI晶片創新論壇與面板級扇出型封裝創新論壇，針對各界關注的 3D IC 和 CoWoS 技術發展，在論壇中由台積電、日月光等領軍，共同探討封裝技術的最新發展與技術突破，並吸引超過 2500 人報名參與業界盛事。而面板級扇出型封裝（FOPLP）同為近期備受關注的下一代新技術，由日月光、群創、NXP 等業界先進一同探討加速技術突破與全面提升半導體製造量能。

功率暨光電半導體論壇以及量子台灣論壇深入探討核心科技，並邀請業界領袖分享前沿技術，吸引了業界人士爭相參加，現場座無虛席。今年的功率暨光電半導體論壇邀請到 Broadcom、Infineon Technologies、Texas Instruments 等領導廠商，共同探討在電力及光電領域的最新技術突破與應用趨勢。而量子台灣論壇則匯聚了 IBM、鴻海集團、Keysight 等量子計算領域的重要企業深入探討量子科技的前沿發展及其未來在半導體產業中的應用潛力，這些重量級的議程將持續引領全球半導體技術的進步，並加強台灣在國際半導體領域的影響力。

關於 SEMI 國際半導體產業協會

成立於 1970 年，SEMI 於全球設有 10 大營運據點，並於 1996 年正式成立 SEMI 國際半導體產業協會台灣分會，致力協助連結全球半導體和電子設計及製造供應鏈 3,000 多家會員企業，以及 150 萬名專業人士。自同年起固定舉辦年度 SEMICON^® Taiwan 國際半導體展、國際高峰會與各項大型技術論壇，持續推升台灣之國際影響力及競爭力。SEMI 國際半導體產業協會始終秉持客觀中立原則，為台灣企業會員提供半導體產業智庫角色，促進國際間產、官、學、研各界深度交流，推動台灣半導體產業與全球接軌，搭建雙向溝通對話機制。

SEMI 國際半導體產業協會目前在台灣成立十八大技術委員會，以持續推動設計、裝置、設備、材料、服務和軟體方面的產業成長和技術創新為目標，並竭力提供企業會員完整的市場產業情報、標準制定、政策倡議、人才培育、永續發展、供應鏈管理和各式計劃協助，助力會員應對產業挑戰。更多資訊歡迎瀏覽 www.semi.org，或加入 SEMI Facebook 粉絲團、SEMI LinkedIn。

新聞聯絡人

• Read more about SEMICON Taiwan 2024 盛大開幕 全球半導體九大巨擘齊聚見證產業榮景

聯盟由超過 30 家黃金陣容組成　對應資料中心需求　打造下一世代的關鍵技術

【2024年9月3日 – 新竹訊】SEMI國際半導體產業協會今(3)日於 SEMICON Taiwan 2024 國際半導體展矽光子國際論壇宣布，在經濟部的指導並於 SEMI 平台上，台積電與日月光號召半導體產業鏈自 IC 設計、製造封裝、應用模組至終端產品的企業及研究機構如：工研院、波若威 (Browave) 、上詮 (FOCI)、鴻海 (Foxconn)、聯發科技 (MediaTek)、廣達 (Quanta Computer) 到辛耘 (Scientech) 等超過 30 家共同參與，建構全台最完整的矽光子聚落生態系 ― SEMI矽光子產業聯盟 (SEMI Silicon Photonics Industry Alliance, SiPhIA)。

SEMI 預估 2030 年全球矽光子半導體市場規模將達到 78.6 億美元，年複合成長率 (CAGR) 達25.7%，可見矽光子市場的巨大潛力。SEMI 全球行銷長暨台灣區總裁曹世綸表示：「矽光子作為突破摩爾定律所面臨瓶頸的關鍵技術，SEMI 率先在台灣成立矽光晶片發展聯盟，積極推動產業協作，以期進一步掌握此波『光商機』及克服面臨的技術挑戰。相信在台積電及日月光帶領下，台灣半導體產業在矽光子領域能佔據領跑者地位的優勢。」

矽光子產業聯盟係由SEMI號召成立、台積電及日月光擔任聯盟倡議人，初始聯盟成員包括友達光電 (AUO)、鴻海 (Foxconn)、聯發科 (MediaTek)、旺矽 (MPI)、世界先進 (VIS)、穎崴 (Winway) 等 30 多家企業共襄盛舉，進一步促進業界合作並推動矽光子領域的發展，通過聯盟共享知識、資源和專業技術，建構台灣矽光子生態圈。矽光子潛力無窮，聯盟成員盼透過彼此間的合作，讓矽光子帶來效益能被廣泛應用於多種領域之中，同時透過SEMI 全球據點，加強與全球供應鏈的連結，強化台灣在下一世代關鍵技術中的領導地位。

政府高度重視，半導體大廠積極卡位，矽光子成為台灣半導體技術轉型關鍵

生成式 AI 伺服器需要進行大量運算，對於資料傳輸速率有著極高的要求，需要透過頻寬更大、功耗更低的介面技術來實現，矽光子也因此成為備受矚目的關鍵技術在半導體進入先進製程後，產業面臨功耗、頻寬等兩大挑戰，成為持續朝下一個先進製程邁進的挑戰。矽光子第三波浪潮渴望被應用在 3D 封裝之中，屆時可望提升 10 倍資料傳輸頻。此外，生態系的建構是矽光子產業未來發展的關鍵，台灣擁有完整的半導體聚落、成熟的矽晶圓加工技術，以及先進的封裝技術，加上整合「光學」，定調是下一世代的關鍵技術的論述，讓完整的矽光子供應鏈在台灣落地，將進一步穩固台灣在全球科技和製造領域的關鍵地位。

經濟部產業發展署長楊志清於成立大會上表示：「台灣向來是全球半導體產業的資優生，過去依靠晶圓代工包攬全球 96%的市佔率，為全球公認的半導體科技聚落。隨著AI浪潮在全球遍地開花，矽光子更是未來半導體產業最炙手可熱的技術，經濟部將竭盡全力協助台灣廠商穩固這波製造生產AI晶片及AI伺服器的機會，相信未來五十年台灣會繼續引領全球半導體產業發展。」

矽光子已成半導體產業下一個大事記，AI資料中心、高效能運算（HPC）等應用場景將大放異彩

矽光子因其低損耗、高傳輸量與高速度、高運算力等特性，非常適合應用在大量資料運算、傳輸的應用場景，例如需要高頻寬和低延遲數據傳輸的大型AI資料中心與HPC等，矽光子技術能夠減少功耗和熱量產生，同時提高節點之間的通訊效率。此外，採用矽光子技術能有效使光電元件整合化，製造更緊湊的光學模組，進而降低整體系統的體積和成本。

SEMI 全球董事會副主席吳田玉表示：「矽光子是下一世代半導體的發展重點，能有效鞏固台灣在全球半導體產業鏈的地位。SEMI 期望透過聯盟持續與政府通力合作，整合產業鏈上下游，進一步提升台灣在數據中心、電信設備和 AI 運算等領域的競爭力，從而建構出台灣的矽光子生態系。」

台積電副總經理徐國晉則表示：「台積電樂見台灣半導體產業能集結台灣過往豐富的半導體經驗與資源正面擁抱AI 浪潮。相信矽光子的研發製造量能會持續壯大，為台灣未來成為『AI 科技聚落』奠定良好的基礎。」

日月光洪志斌副總經理表示：「日月光看好新一代矽光子研發基地落腳台灣，作為『SEMI 矽光子產業聯盟』的倡議者之一，我們期望能攜手產業生態圈夥伴與客戶持續耕耘矽光子領域，共同開拓新的商業模式。」

關於SEMI國際半導體產業協會

成立於1970年，SEMI於全球設有10大營運據點，並於1996年正式成立SEMI國際半導體產業協會台灣分會，致力協助連結全球半導體和電子設計及製造供應鏈3,000多家會員企業，以及150萬名專業人士。自同年起固定舉辦年度SEMICON^® Taiwan國際半導體展、國際高峰會與各項大型技術論壇，持續推升台灣之國際影響力及競爭力。SEMI國際半導體產業協會始終秉持客觀中立原則，為台灣企業會員提供半導體產業智庫角色，促進國際間產、官、學、研各界深度交流，推動台灣半導體產業與全球接軌，搭建雙向溝通對話機制。

SEMI國際半導體產業協會目前在台灣成立十八大技術委員會，以持續推動設計、裝置、設備、材料、服務和軟體方面的產業成長和技術創新為目標，並竭力提供企業會員完整的市場產業情報、標準制定、政策倡議、人才培育、永續發展、供應鏈管理和各式計劃協助，助力會員應對產業挑戰。更多資訊歡迎瀏覽www.semi.org，或加入SEMI Facebook粉絲團、SEMI LinkedIn。

新聞聯絡人

• Read more about SEMI 成立矽光子產業聯盟 由台積電、日月光領軍 SEMICON Taiwan 前哨戰！聚焦半導體的「The Next Big Thing」

Minister of Economic Affairs, ASE, GlobalWafers, TAMI, and TMBA hold a pre-event discussion on the new industry landscape.

[September 2, 2024 – Hsinchu] This week, the global spotlight will once again turn to Taiwan, thanks to semiconductors. SEMICON Taiwan 2024, the world's largest and most influential annual semiconductor event, will take place from September 4 to 6 at the Nangang Exhibition Center Halls 1 and 2, marking the first time the event is held on such a grand scale. Today (Sept 2), a pre-show press conference featured prominent guests, including Jyh-Huei Kuo, Minister of Economic Affairs, Tien Wu, CEO of ASE., David Chuang, Chairman of TAMI, and Patrick P. Chen, Chairman of TMBA. These industry leaders gathered to analyze market outlooks and discuss how Taiwan's semiconductor industry can leverage its strengths to enhance economic spillover effects. Clark Tseng, Senior Director, Market Intelligence, SEMI also provided an in-depth overview of the global semiconductor equipment and materials market outlook and wafer fab investment trends.

Olympics of the Semiconductor Industry in Taiwan: Unprecedented Scale Showcases Taiwan's Central Role in the Global Semiconductor Landscape 

"Taiwan's semiconductor industry has become the most critical pillar of the global supply chain, encompassing key sectors such as IC design, wafer manufacturing, and component integration. With the advent of the Wafer Manufacturing 2.0, Taiwan has emerged as a global market leader," said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. This year's SEMICON Taiwan, themed 'Breaking Limits: Powering the AI Era,' delves into technological innovation, cross-industry integration, and the semiconductor industry's spillover effects, highlighting Taiwan's exceptional semiconductor capabilities that drive advancements in AI and global technology. The record-breaking scale of this year's event further underscores Taiwan's leadership in the global semiconductor sector."

AI Chips Propel Strong Semiconductor Market Growth, AI Semiconductor Market to Reach a 24% CAGR by 2030 

Driven by AI, geopolitical factors, and enhanced supply chain resilience, semiconductor investments and capacity expansion are set to diversify globally, ushering in a new growth phase for the semiconductor market. Clark Tseng, Senior Director, Market Intelligence, SEMI noted that while seasonal demand softness and declining consumer purchasing power led to a slight dip in electronics sales in Q1 2024, the recovery in the IC market has already reflected in a 79% surge in memory prices and sales in Q1, with robust growth expected to continue at a 27-29% annual growth rate through 2030. AI-driven demand for high-performance computing (HPC) chips is expected to accelerate the semiconductor industry's strong recovery, with the AI semiconductor market projected to achieve a 24% CAGR (Compound Annual Growth Rate) by 2030. This growth will also drive double-digit expansion in the semiconductor equipment market, with the market size likely to exceed $127 billion. Taiwan, China, and South Korea are expected to remain global leaders in equipment spending.

Industry, Government, and Academia Embrace the AI Wave to Propel Taiwan's Semiconductor Dominance 

Semiconductors are not only foundational to many current industries but also critical to the development of sectors such as satellites, drones, autonomous vehicles, AI, and security systems, where advanced processes and chips are crucial. Jyh-Huei Kuo, Minister of Economic Affairs stated that the next five years will be pivotal for Taiwan's semiconductor industry, with the government eager to see the continued expansion of semiconductor spillover effects and the SEMICON Taiwan 2024 platform connecting the global semiconductor industry to reinforce Taiwan's semiconductor ecosystem and global leadership. The government will continue to promote various initiatives to build Taiwan's semiconductor strategy, leveraging Taiwan's critical influence in advanced AI technologies.

Tien Wu, CEO of ASE., Vice Chairman of SEMI International Board of Directors shared insights on how semiconductor technology breakthroughs are creating a golden era for the industry. He mentioned that AI is becoming a major driver of semiconductor innovation, with the industry at a crucial moment for reshaping the future. The growing demand for software is challenging hardware and technology integration, and the supply chain must address geopolitical realignments. Through diversified R&D integration, the efficiency of chips, packaging, system design, and materials and equipment will be significantly enhanced, which is crucial for AI applications. Facing future challenges and opportunities, choosing the right partners and development directions will be key to a company's success.

Doris Hsu, Chairperson & CEO Of GlobalWafers CO. Ltd., Member of SEMI, also stated that Taiwan's leadership in advanced processes and materials will drive breakthroughs in the global market. Taiwanese companies should seize AI expansion opportunities, promote upstream and downstream cooperation, and enhance competitiveness. Continuous R&D and collaboration will lay the foundation for technological development and create greater value.

Joining Forces with Taiwan’s Machinery and Tooling Industries to Drive AI Innovation, Semiconductor Spillover Effects Fuel Taiwan’s New Growth Engine 

As the core driver of global technological development, Taiwan's semiconductor industry is pushing innovation and transformation across various fields, from the electric vehicle and data center supply chains to machinery and tooling industries. This year, SEMICON Taiwan is partnering with the Taiwan Association of Machinery Industry (TAMI) and the Taiwan Machine Tool & Accessory Builders’ Association (TMBA) to showcase advanced smart manufacturing technologies and solutions that integrate semiconductors with AI, as well as the results of smart and green transformations. The event will emphasize the joint efforts of these three parties to accelerate Taiwan's new growth engine and jointly tackle the challenges of smart and sustainable global manufacturing.

About SEMI

Founded in 1970, SEMI operates 10 major offices globally and established the SEMI Taiwan in 1996. It connects over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. Since its inception, SEMI Taiwan has annually hosted SEMICON® Taiwan, international summits, and various major technical forums, enhancing Taiwan's international influence and competitiveness. SEMI upholds the principles of objectivity and neutrality, acting as a semiconductor industry think tank for Taiwanese member companies. It fosters deep global exchanges among industry, government, academia, and research sectors, promoting Taiwan's semiconductor industry to align with global standards, and establishing a two-way communication platform.

SEMI Taiwan currently hosts 18 technical committees to drive industry growth and innovation in design, devices, equipment, materials, services, and software. It provides comprehensive market intelligence, standardization, policy advocacy, talent cultivation, sustainability development, supply chain management, and program assistance to empower members in facing industry challenges. For more information, visit www.semi.org or join SEMI Facebook and SEMI LinkedIn.

Media Contacts

• Read more about The semiconductor industry drives Taiwan's economic spillover. Industry and government join forces as SEMICON Taiwan's influence and scale reach new heights. AI fuels a strong semiconductor recovery, with a projected 24% growth by 2030.

經濟部長、日月光、環球晶、TAMI、TMBA，展前暖身共議產業新格局

【2024年9月2日 – 新竹訊】本周全球目光將因半導體再度聚焦台灣。全球最大且最具影響力半導體年度盛會 SEMICON Taiwan 2024 國際半導體展將於 9 月 4 日至 6 日三天，於南港展覽館一、二館首次以雙主館規模盛大登場。今(2)日召開的展前記者會則迎來了重量級嘉賓，包括經濟部長郭智輝、日月光執行長吳田玉，以及台灣機械工業同業公會（TAMI）理事長莊大立與台灣工具機暨零組件工業同業公會（TMBA）理事長陳伯佳等多位產業領袖共襄盛舉，剖析市場前景展望，探討台灣半導體如何運用產業優勢強化外溢效應，而SEMI產業研究資深總監曾瑞榆則深入分享全球半導體設備及材料市場展望及晶圓廠投資動態。

半導體界奧林匹克在台灣：展會規模空前，彰顯台灣在全球半導體版圖中的核心角色

SEMI  全球行銷長暨台灣區總裁曹世綸​表示：「台灣半導體產業已成為全球供應鏈最重要的核心支柱，涵蓋IC設計、晶圓製造及元件整合等關鍵環節。隨著晶圓製造 2.0 時代的來臨，台灣半導體已成為全球市場的領跑者。今年的 SEMICON Taiwan 以『Breaking Limits：Powering the AI Era. 賦能AI 無極限』為主題，深入探討技術創新、跨界整合及半導體外溢效應，讓世界看見台灣憑藉卓越的半導體技術實力，推動 AI 及全球科技的進步，而今年展會規模創新高，也再次彰顯台灣在全球半導體領域的領導地位。」

AI晶片引領半導體市場強勢成長，2030年AI半導體市場年複合成長率將高達24% 

受AI、地緣政治、供應鏈韌性強化等措施，半導體投資和產能增長將在全球範圍內實現多元化，並推動半導體市場進入新一輪增長期。SEMI產業研究資深總監曾瑞榆於會中表示，受季節性需求疲軟及消費者購買力下降影響，2024年第一季電子產品銷售雖然微幅下滑，然而IC市場的回溫，已迅速反應在第一季記憶體價格與市場銷售，並大幅攀升79%，預期至2030年以前仍將持續強勁增長達到27-29%的年成長率。而由AI驅動的高效能運算（HPC）晶片需求更將加速帶領半導體產業進入強勁的復甦期，預計至2030年以前，AI半導體市場年複合成長率將高達24%，並持續帶動半導體設備市場實現兩位數增長，市場規模有望超過1270億美元，其中台灣、中國和韓國將繼續在設備支出部分保持全球領先。

產官學共擁 AI 浪潮，全力衝刺台灣半導體霸主地位

半導體業不僅是當前許多行業的基礎，對於發展衛星、無人機、自駕車、人工智慧、安控等產業，掌握先進製程與晶片至關重要。經濟部長郭智輝表示，未來五年將成為台灣半導體衝刺關鍵，政府樂見半導體外溢效益持續擴大影響力，以及SEMICON Taiwan 2024 平台串聯全球半導體產業，鞏固台灣半導體生態主體性和全球領導地位，政府也將持續推動各項計畫，積極建構台灣半導體總體戰略，發揮台灣在先進AI  技術的關鍵影響力。

日月光執行長暨 SEMI 全球董事會副主席吳田玉，於會中分享半導體技術如何突破瓶頸以創造半導體產業的黃金時刻。他提及 AI 正成為半導體創新的主要動力，產業正處於重塑未來的關鍵時刻。軟體需求的增長對硬體和技術整合提出挑戰，供應鏈面對地緣政治重組也需提出因應之道。通過多元化的研發整合，晶片、封裝、系統設計及材料設備的效率將顯著提升，這對 AI 應用至關重要。面對未來挑戰與機會，選擇合適的合作夥伴和發展方向將是企業成功的關鍵。

環球晶圓集團董事長暨執行長暨 SEMI 全球董事會董事徐秀蘭也表示台灣在先進製程和材料領域的領先地位將推動全球市場突破，台灣企業應把握AI擴展機遇，推動上下游合作，提升競爭力。持續的研發和合作將奠定科技發展基礎，並創造更大價值。

攜手台灣機械工業及工具機業驅動產業AI創新，半導體外溢效應助攻台灣新成長引擎

台灣半導體產業作為全球科技發展的核心驅動力，其經濟外溢效應正推動各領域的創新轉型，從電動車、資料中心相關供應鏈到機械工業和工具機業等領域，今年SEMICON Taiwan也攜手台灣機械工業同業公會 (TAMI)和台灣工具機暨零組件工業同業公會 (TMBA)，分別展示半導體與AI整合各項智慧製造的先進技術與解決方案，以及推動智慧化和綠色轉型成果。會中強化三方攜手共同加速推動台灣經濟的新成長引擎，與共同應對全球製造業的智慧化和永續化挑戰。

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• Read more about SEMICON Taiwan 2024 Countdown Begins! Semiconductor Industry Giants Gather to Showcase the Latest in AI and Advanced Technologies

Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing.

Taipei, Taiwan – August 28, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, shares its expertise on the impact materials have on sustainable lithography processes. Additionally, Brewer Science presents the role innovative materials have in the critical advanced packaging markets, including artificial intelligence (AI) and high-performance computing. Brewer Science’s presentations and exhibition will be at SEMICON Taiwan, from September 4th – 6th, 2024.
Material Efforts Towards Sustainable Processes

Dr. Douglas Guerrero, Brewer Science’s Senior Technologist, presents “Material Efforts Towards Sustainable Processes” addressing the industry’s most critical questions when it comes to balancing technology innovation with environmental stewardship, including:

- How can the semiconductor industry enhance sustainability while meeting growing consumer demands for eco-friendly practices?
- What innovative solutions are available to reduce energy consumption in EUV lithography processes?
- Can transitioning from thermal baking to UV curing improve both energy efficiency and lithographic performance?
- What are the benefits of optical crosslinking in semiconductor manufacturing, and how does it optimize material design, process efficiency, and tool throughput?

With 30 years of R&D experience in patterning materials and processes, over 20 patents, and 60 publications, Dr. Guerrero combines material expertise and industry leadership to present how sustainable processes can lead to energy savings, while improving tool throughput and maintaining lithographic performance. Attend Dr. Guerrero’s presentation on September 6 at 2:20pm in 401, 4F at SEMCION Taiwan, as part of the IC Forum – Advanced Chip Technology and Manufacturing.

The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance Computing

Mr. Alexander Smith, Brewer Science’s Executive Director of Semiconductor Materials Business Unit, presents “The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance Computing”, providing an insightful review of the challenges and advancements in packaging materials enabling more efficient and cost-effective flows. Mr. Smith will highlight chemical properties and customizable structures that will offer the most innovative solutions to pressing industry challenges. Attend Mr. Smith’s presentation on September 6 at 12:00pm in 701GH, 7F at SEMCION Taiwan, a part of the Heterogeneous Integration Global Summit 2024 – Day 3.

Explore New Innovations in Advanced Packaging at Booth I2116

Throughout the events, Brewer Science’s experts will be stationed at booth I2116 in the SEMICON Taiwan Exhibit Hall and available for discussions on how Brewer Science’s materials assist with advanced-node patterning and wafer thinning. A list of Brewer Science’s PFAS-Free Materials is also available.
- Wednesday, September 4 : 10:00am–5:00pm
- Thursday, September 5 : 10:00am–5:00pm
- Friday, September 6 : 10:00am–4:00pm

For those unable to attend, Brewer Science extends an open invitation to explore its Packaging Solutions and Advanced Lithography webpages. You can also request datasheets or schedule expert-led consultations on Brewer Science’s website. www.brewerscience.com.

About Brewer Science

Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at www.brewerscience.com.

• Read more about Brewer Science Presents Materials’ Impact in Sustainable Processes, AI, High-Performance Computing