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台灣

聯盟由超過 30 家黃金陣容組成 對應資料中心需求 打造下一世代的關鍵技術

 

202493 – 新竹訊】SEMI國際半導體產業協會今(3)日於 SEMICON Taiwan 2024 國際半導體展矽光子國際論壇宣布,在經濟部的指導並於 SEMI 平台上,台積電與日月光號召半導體產業鏈自 IC 設計、製造封裝、應用模組至終端產品的企業及研究機構如:工研院、波若威 (Browave) 、上詮 (FOCI)、鴻海 (Foxconn)、聯發科技 (MediaTek)、廣達 (Quanta Computer) 到辛耘 (Scientech) 等超過 30 家共同參與,建構全台最完整的矽光子聚落生態系 ― SEMI矽光子產業聯盟 (SEMI Silicon Photonics Industry Alliance, SiPhIA)

 

SEMI 預估 2030 年全球矽光子半導體市場規模將達到 78.6 億美元,年複合成長率 (CAGR) 25.7%,可見矽光子市場的巨大潛力。SEMI 全球行銷長暨台灣區總裁曹世綸表示:「矽光子作為突破摩爾定律所面臨瓶頸的關鍵技術,SEMI 率先在台灣成立矽光晶片發展聯盟,積極推動產業協作,以期進一步掌握此波『光商機』及克服面臨的技術挑戰。相信在台積電及日月光帶領下,台灣半導體產業在矽光子領域能佔據領跑者地位的優勢。」

 

矽光子產業聯盟係由SEMI號召成立、台積電及日月光擔任聯盟倡議人,初始聯盟成員包括友達光電 (AUO)、鴻海 (Foxconn)、聯發科 (MediaTek)、旺矽 (MPI)、世界先進 (VIS)、穎崴 (Winway)  30 多家企業共襄盛舉,進一步促進業界合作並推動矽光子領域的發展,通過聯盟共享知識、資源和專業技術,建構台灣矽光子生態圈。矽光子潛力無窮,聯盟成員盼透過彼此間的合作,讓矽光子帶來效益能被廣泛應用於多種領域之中,同時透過SEMI 全球據點,加強與全球供應鏈的連結,強化台灣在下一世代關鍵技術中的領導地位。

 

政府高度重視,半導體大廠積極卡位,矽光子成為台灣半導體技術轉型關鍵

生成式 AI 伺服器需要進行大量運算,對於資料傳輸速率有著極高的要求,需要透過頻寬更大、功耗更低的介面技術來實現,矽光子也因此成為備受矚目的關鍵技術在半導體進入先進製程後,產業面臨功耗、頻寬等兩大挑戰,成為持續朝下一個先進製程邁進的挑戰。矽光子第三波浪潮渴望被應用在 3D 封裝之中,屆時可望提升 10 倍資料傳輸頻。此外,生態系的建構是矽光子產業未來發展的關鍵,台灣擁有完整的半導體聚落、成熟的矽晶圓加工技術,以及先進的封裝技術,加上整合「光學」,定調是下一世代的關鍵技術的論述,讓完整的矽光子供應鏈在台灣落地,將進一步穩固台灣在全球科技和製造領域的關鍵地位。

 

經濟部產業發展署長楊志清於成立大會上表示:「台灣向來是全球半導體產業的資優生,過去依靠晶圓代工包攬全球 96%的市佔率,為全球公認的半導體科技聚落。隨著AI浪潮在全球遍地開花,矽光子更是未來半導體產業最炙手可熱的技術,經濟部將竭盡全力協助台灣廠商穩固這波製造生產AI晶片及AI伺服器的機會,相信未來五十年台灣會繼續引領全球半導體產業發展。」

 

矽光子已成半導體產業下一個大事記,AI資料中心、高效能運算(HPC)等應用場景將大放異彩

矽光子因其低損耗、高傳輸量與高速度、高運算力等特性,非常適合應用在大量資料運算、傳輸的應用場景,例如需要高頻寬和低延遲數據傳輸的大型AI資料中心與HPC等,矽光子技術能夠減少功耗和熱量產生,同時提高節點之間的通訊效率。此外,採用矽光子技術能有效使光電元件整合化,製造更緊湊的光學模組,進而降低整體系統的體積和成本。

 

SEMI 全球董事會副主席吳田玉表示:「矽光子是下一世代半導體的發展重點,能有效鞏固台灣在全球半導體產業鏈的地位。SEMI 期望透過聯盟持續與政府通力合作,整合產業鏈上下游,進一步提升台灣在數據中心、電信設備和 AI 運算等領域的競爭力,從而建構出台灣的矽光子生態系。」

 

台積電副總經理徐國晉則表示:「台積電樂見台灣半導體產業能集結台灣過往豐富的半導體經驗與資源正面擁抱AI 浪潮。相信矽光子的研發製造量能會持續壯大,為台灣未來成為『AI 科技聚落』奠定良好的基礎。」

 

日月光洪志斌副總經理表示:「日月光看好新一代矽光子研發基地落腳台灣,作為『SEMI 矽光子產業聯盟』的倡議者之一,我們期望能攜手產業生態圈夥伴與客戶持續耕耘矽光子領域,共同開拓新的商業模式。」

關於SEMI國際半導體產業協會

成立於1970年,SEMI於全球設有10大營運據點,並於1996年正式成立SEMI國際半導體產業協會台灣分會,致力協助連結全球半導體和電子設計及製造供應鏈3,000多家會員企業,以及150萬名專業人士。自同年起固定舉辦年度SEMICON® Taiwan國際半導體展、國際高峰會與各項大型技術論壇,持續推升台灣之國際影響力及競爭力。SEMI國際半導體產業協會始終秉持客觀中立原則,為台灣企業會員提供半導體產業智庫角色,促進國際間產、官、學、研各界深度交流,推動台灣半導體產業與全球接軌,搭建雙向溝通對話機制。

SEMI國際半導體產業協會目前在台灣成立十八大技術委員會,以持續推動設計、裝置、設備、材料、服務和軟體方面的產業成長和技術創新為目標,並竭力提供企業會員完整的市場產業情報、標準制定、政策倡議、人才培育、永續發展、供應鏈管理和各式計劃協助,助力會員應對產業挑戰。更多資訊歡迎瀏覽www.semi.org,或加入SEMI Facebook粉絲團SEMI LinkedIn

 

新聞聯絡人

SEMI 國際半導體產業協會

高誠公關

Elma Fang

Carmen Wooi

Roselie Chen

[email protected]

03-560-1777 #211

[email protected]

0901-007-939

[email protected]

0984-349-379

Minister of Economic Affairs, ASE, GlobalWafers, TAMI, and TMBA hold a pre-event discussion on the new industry landscape.

[September 2, 2024 – Hsinchu] This week, the global spotlight will once again turn to Taiwan, thanks to semiconductors. SEMICON Taiwan 2024, the world's largest and most influential annual semiconductor event, will take place from September 4 to 6 at the Nangang Exhibition Center Halls 1 and 2, marking the first time the event is held on such a grand scale. Today (Sept 2), a pre-show press conference featured prominent guests, including Jyh-Huei Kuo, Minister of Economic Affairs, Tien Wu, CEO of ASE., David Chuang, Chairman of TAMI, and Patrick P. Chen, Chairman of TMBA. These industry leaders gathered to analyze market outlooks and discuss how Taiwan's semiconductor industry can leverage its strengths to enhance economic spillover effects. Clark Tseng, Senior Director, Market Intelligence, SEMI also provided an in-depth overview of the global semiconductor equipment and materials market outlook and wafer fab investment trends.

 

 

Olympics of the Semiconductor Industry in Taiwan: Unprecedented Scale Showcases Taiwan's Central Role in the Global Semiconductor Landscape 

"Taiwan's semiconductor industry has become the most critical pillar of the global supply chain, encompassing key sectors such as IC design, wafer manufacturing, and component integration. With the advent of the Wafer Manufacturing 2.0, Taiwan has emerged as a global market leader," said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. This year's SEMICON Taiwan, themed 'Breaking Limits: Powering the AI Era,' delves into technological innovation, cross-industry integration, and the semiconductor industry's spillover effects, highlighting Taiwan's exceptional semiconductor capabilities that drive advancements in AI and global technology. The record-breaking scale of this year's event further underscores Taiwan's leadership in the global semiconductor sector."

 

AI Chips Propel Strong Semiconductor Market Growth, AI Semiconductor Market to Reach a 24% CAGR by 2030 

Driven by AI, geopolitical factors, and enhanced supply chain resilience, semiconductor investments and capacity expansion are set to diversify globally, ushering in a new growth phase for the semiconductor market. Clark Tseng, Senior Director, Market Intelligence, SEMI noted that while seasonal demand softness and declining consumer purchasing power led to a slight dip in electronics sales in Q1 2024, the recovery in the IC market has already reflected in a 79% surge in memory prices and sales in Q1, with robust growth expected to continue at a 27-29% annual growth rate through 2030. AI-driven demand for high-performance computing (HPC) chips is expected to accelerate the semiconductor industry's strong recovery, with the AI semiconductor market projected to achieve a 24% CAGR (Compound Annual Growth Rate) by 2030. This growth will also drive double-digit expansion in the semiconductor equipment market, with the market size likely to exceed $127 billion. Taiwan, China, and South Korea are expected to remain global leaders in equipment spending.

 

Industry, Government, and Academia Embrace the AI Wave to Propel Taiwan's Semiconductor Dominance 

Semiconductors are not only foundational to many current industries but also critical to the development of sectors such as satellites, drones, autonomous vehicles, AI, and security systems, where advanced processes and chips are crucial. Jyh-Huei Kuo, Minister of Economic Affairs stated that the next five years will be pivotal for Taiwan's semiconductor industry, with the government eager to see the continued expansion of semiconductor spillover effects and the SEMICON Taiwan 2024 platform connecting the global semiconductor industry to reinforce Taiwan's semiconductor ecosystem and global leadership. The government will continue to promote various initiatives to build Taiwan's semiconductor strategy, leveraging Taiwan's critical influence in advanced AI technologies.

 

Tien Wu, CEO of ASE., Vice Chairman of SEMI International Board of Directors shared insights on how semiconductor technology breakthroughs are creating a golden era for the industry. He mentioned that AI is becoming a major driver of semiconductor innovation, with the industry at a crucial moment for reshaping the future. The growing demand for software is challenging hardware and technology integration, and the supply chain must address geopolitical realignments. Through diversified R&D integration, the efficiency of chips, packaging, system design, and materials and equipment will be significantly enhanced, which is crucial for AI applications. Facing future challenges and opportunities, choosing the right partners and development directions will be key to a company's success.

 

Doris Hsu, Chairperson & CEO Of GlobalWafers CO. Ltd., Member of SEMI, also stated that Taiwan's leadership in advanced processes and materials will drive breakthroughs in the global market. Taiwanese companies should seize AI expansion opportunities, promote upstream and downstream cooperation, and enhance competitiveness. Continuous R&D and collaboration will lay the foundation for technological development and create greater value.

 

Joining Forces with Taiwan’s Machinery and Tooling Industries to Drive AI Innovation, Semiconductor Spillover Effects Fuel Taiwan’s New Growth Engine 

As the core driver of global technological development, Taiwan's semiconductor industry is pushing innovation and transformation across various fields, from the electric vehicle and data center supply chains to machinery and tooling industries. This year, SEMICON Taiwan is partnering with the Taiwan Association of Machinery Industry (TAMI) and the Taiwan Machine Tool & Accessory Builders’ Association (TMBA) to showcase advanced smart manufacturing technologies and solutions that integrate semiconductors with AI, as well as the results of smart and green transformations. The event will emphasize the joint efforts of these three parties to accelerate Taiwan's new growth engine and jointly tackle the challenges of smart and sustainable global manufacturing.

 

 

About SEMI

Founded in 1970, SEMI operates 10 major offices globally and established the SEMI Taiwan in 1996. It connects over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. Since its inception, SEMI Taiwan has annually hosted SEMICON® Taiwan, international summits, and various major technical forums, enhancing Taiwan's international influence and competitiveness. SEMI upholds the principles of objectivity and neutrality, acting as a semiconductor industry think tank for Taiwanese member companies. It fosters deep global exchanges among industry, government, academia, and research sectors, promoting Taiwan's semiconductor industry to align with global standards, and establishing a two-way communication platform.

 

SEMI Taiwan currently hosts 18 technical committees to drive industry growth and innovation in design, devices, equipment, materials, services, and software. It provides comprehensive market intelligence, standardization, policy advocacy, talent cultivation, sustainability development, supply chain management, and program assistance to empower members in facing industry challenges. For more information, visit www.semi.org or join SEMI Facebook and SEMI LinkedIn.

 

Media Contacts

SEMI

Elma Fang

[email protected]

03-560-1777 #211

GOLIN

Roselie Chen

[email protected]

0984-349-379

GOLIN

Alice Lin

[email protected]

0919-552-589

經濟部長、日月光、環球晶、TAMI、TMBA,展前暖身共議產業新格局

 

【2024年9月2日 – 新竹訊】本周全球目光將因半導體再度聚焦台灣。全球最大且最具影響力半導體年度盛會 SEMICON Taiwan 2024 國際半導體展於 9 月 4 日至 6 日三天,於南港展覽館一、二館首次以雙主館規模盛大登場。今(2)日召開的展前記者會則迎來了重量級嘉賓,包括經濟部長郭智輝、日月光執行長吳田玉,以及台灣機械工業同業公會(TAMI)理事長莊大立與台灣工具機暨零組件工業同業公會(TMBA)理事長陳伯佳等多位產業領袖共襄盛舉,剖析市場前景展望,探討台灣半導體如何運用產業優勢強化外溢效應,而SEMI產業研究資深總監曾瑞榆則深入分享全球半導體設備及材料市場展望及晶圓廠投資動態。

 

 

半導體界奧林匹克在台灣:展會規模空前,彰顯台灣在全球半導體版圖中的核心角色

SEMI  全球行銷長暨台灣區總裁曹世綸​表示:「台灣半導體產業已成為全球供應鏈最重要的核心支柱,涵蓋IC設計、晶圓製造及元件整合等關鍵環節。隨著晶圓製造 2.0 時代的來臨,台灣半導體已成為全球市場的領跑者。今年的 SEMICON Taiwan 以『Breaking Limits:Powering the AI Era. 賦能AI 無極限』為主題,深入探討技術創新、跨界整合及半導體外溢效應,讓世界看見台灣憑藉卓越的半導體技術實力,推動 AI 及全球科技的進步,而今年展會規模創新高,也再次彰顯台灣在全球半導體領域的領導地位。」

 

AI晶片引領半導體市場強勢成長,2030年AI半導體市場年複合成長率將高達24% 

受AI、地緣政治、供應鏈韌性強化等措施,半導體投資和產能增長將在全球範圍內實現多元化,並推動半導體市場進入新一輪增長期。SEMI產業研究資深總監曾瑞榆於會中表示,受季節性需求疲軟及消費者購買力下降影響,2024年第一季電子產品銷售雖然微幅下滑,然而IC市場的回溫,已迅速反應在第一季記憶體價格與市場銷售,並大幅攀升79%,預期至2030年以前仍將持續強勁增長達到27-29%的年成長率。而由AI驅動的高效能運算(HPC)晶片需求更將加速帶領半導體產業進入強勁的復甦期,預計至2030年以前,AI半導體市場年複合成長率將高達24%,並持續帶動半導體設備市場實現兩位數增長,市場規模有望超過1270億美元,其中台灣、中國和韓國將繼續在設備支出部分保持全球領先。

 

產官學共擁 AI 浪潮,全力衝刺台灣半導體霸主地位

半導體業不僅是當前許多行業的基礎,對於發展衛星、無人機、自駕車、人工智慧、安控等產業,掌握先進製程與晶片至關重要。經濟部長郭智輝表示,未來五年將成為台灣半導體衝刺關鍵,政府樂見半導體外溢效益持續擴大影響力,以及SEMICON Taiwan 2024 平台串聯全球半導體產業,鞏固台灣半導體生態主體性和全球領導地位,政府也將持續推動各項計畫,積極建構台灣半導體總體戰略,發揮台灣在先進AI  技術的關鍵影響力。

 

日月光執行長暨 SEMI 全球董事會副主席吳田玉,於會中分享半導體技術如何突破瓶頸以創造半導體產業的黃金時刻。他提及 AI 正成為半導體創新的主要動力,產業正處於重塑未來的關鍵時刻。軟體需求的增長對硬體和技術整合提出挑戰,供應鏈面對地緣政治重組也需提出因應之道。通過多元化的研發整合,晶片、封裝、系統設計及材料設備的效率將顯著提升,這對 AI 應用至關重要。面對未來挑戰與機會,選擇合適的合作夥伴和發展方向將是企業成功的關鍵。

 

環球晶圓集團董事長暨執行長暨 SEMI 全球董事會董事徐秀蘭也表示台灣在先進製程和材料領域的領先地位將推動全球市場突破,台灣企業應把握AI擴展機遇,推動上下游合作,提升競爭力。持續的研發和合作將奠定科技發展基礎,並創造更大價值。

 

 

攜手台灣機械工業及工具機業驅動產業AI創新,半導體外溢效應助攻台灣新成長引擎

台灣半導體產業作為全球科技發展的核心驅動力,其經濟外溢效應正推動各領域的創新轉型,從電動車、資料中心相關供應鏈到機械工業和工具機業等領域,今年SEMICON Taiwan也攜手台灣機械工業同業公會 (TAMI)和台灣工具機暨零組件工業同業公會 (TMBA),分別展示半導體與AI整合各項智慧製造的先進技術與解決方案,以及推動智慧化和綠色轉型成果。會中強化三方攜手共同加速推動台灣經濟的新成長引擎,與共同應對全球製造業的智慧化和永續化挑戰。

 

關於 SEMI 國際半導體產業協會 

成立於 1970 年,SEMI 於全球設有 10 大營運據點,並於 1996 年正式成立 SEMI 國際半導體產業協會台灣分會,致力協助連結全球半導體和電子設計及製造供應鏈 3,000 多家會員企業,以及 150 萬名專業人士。自同年起固定舉辦年度 SEMICON® Taiwan 國際半導體展、國際高峰會與各項大型技術論壇,持續推升台灣之國際影響力及競爭力。SEMI 國際半導體產業協會始終秉持客觀中立原則,為台灣企業會員提供半導體產業智庫角色,促進國際間產、官、學、研各界深度交流,推動台灣半導體產業與全球接軌,搭建雙向溝通對話機制。

 

SEMI 國際半導體產業協會目前在台灣成立十八大技術委員會,以持續推動設計、裝置、設備、材料、服務和軟體方面的產業成長和技術創新為目標,並竭力提供企業會員完整的市場產業情報、標準制定、政策倡議、人才培育、永續發展、供應鏈管理和各式計劃協助,助力會員應對產業挑戰。更多資訊歡迎瀏覽 www.semi.org,或加入 SEMI Facebook 粉絲團SEMI LinkedIn 

 

新聞聯絡人 

SEMI 國際半導體產業協會 

高誠公關 

Elma Fang 

Roselie Chen 

Alice Lin 

03-560-1777 #211 

0984-349-379 

0919-552-589 

 

TSMC, ASE, MediaTek, NVIDIA, and Others Collaborate to Propel the Semiconductor Industry Toward Trillion-Dollar Milestones 

 

[August 28, 2024 – Hsinchu] The global semiconductor industry is experiencing significant growth, with SEMI predicting that the market will reach $1 trillion by the end of 2030. The AI-driven sector of the semiconductor industry, in particular, is set to play a crucial role in this expansion. In response to this trend, SEMICON Taiwan 2024 has adopted the theme "Breaking Limits: Powering the AI Era" for this year’s event, which is now in its final countdown stage before the official opening on September 4. This year’s exhibition will be larger in scale than ever before, featuring dual main venues for the first time, and introducing the debut of the "AI Technology Zone," the "AI Virtual Lab," and several international forums showcasing the latest AI technologies.  

 

New "AI Technology Zone" Debuts. Major Companies like ASE and NVIDIA Showcase AI Capabilities at the Exhibition. 

For the first time, SEMICON Taiwan 2024 will unveil the " AI Technology Zone," gathering key players such as ASE, Cadence, the Heterogeneous Integration and Chiplet System Package Alliance (Hi-CHIP), NVIDIA, Samsung Electronics, and Zhen Ding Tech. Group. This area will highlight the latest advancements and products in AI chip manufacturing, design, specialized hardware, and integrated services. Experts from Advantech, ASE, AWS, Delta Electronics, Hi-CHIP, and NVIDIA will deliver presentations exploring generative AI, edge AI solutions, and the application of AI in cloud services and IC substrates, offering attendees the opportunity to engage with these experts. Additionally, the event will feature the "AI Virtual Lab" for the first time, where visitors can use generative AI technology to revisit the history of transistor invention, witness the evolution of semiconductor technology, and explore the boundless possibilities of the AI era. 

 

Industry Leaders Provide In-Depth Analysis of AI Technologies at SEMICON Taiwan Forums 

SEMICON Taiwan 2024 will host a series of international forums that explore how semiconductors empower AI, leading to new applications and breakthroughs in areas such as MEMS, silicon photonics, advanced packaging, chip design, and smart manufacturing. Kicking off on September 3, the MEMS & Sensors Forum will feature industry experts from Microsoft, Lam Research, NXP, and STM, who will discuss the latest AI applications and trends in the MEMS and sensors sector. On the same day, the Silicon Photonics Global Summit will cover topics such as the potential of silicon photonics technology in AI-driven data centers and cloud computing, with insights from experts at TSMC, ASE, Broadcom, MediaTek, and Yole Group. The 3D IC/CoWoS for AI Summit on September 4 will include discussions by TSMC and ASE experts on the importance of advanced packaging technologies for AI chips. On September 5, the Advanced Testing Forum will feature experts from TSMC, Intel, and Qualcomm discussing innovations in chip design, manufacturing, and applications, including the development of "AI testing AI chips." The same day, the Smart Manufacturing Forum will focus on "Generative AI Transforming Semiconductor Manufacturing," with AWS, Micron Technology, and NVIDIA experts discussing how AI is revolutionizing manufacturing and enhancing production efficiency, automation, and quality management. 

 

This year, a new "Smart Mobility Innovation Zone" has been established to address the evolving automotive market, which is increasingly centered on software-defined vehicles (SDVs). This zone will feature a series of expert talks and has attracted participation from major companies like Ford and Kia. 

 

Walter Chen, Ford Lio Ho President stated, "Despite the challenging market outlook, Ford Lio Ho remains committed to the Taiwan market, continuing local production of Ford's global strategic models, and introducing a diverse range of products, including new energy vehicles, to meet consumer demand." 

 

Calvin Lee, Managing Director KIA Taiwan Sime Darby commented, "Over the next 3 to 5 years, the electric vehicle industry will undergo a significant transformation, shifting focus from the '3E' elements of battery, electric motor, and electronic control, to the '3A' elements of Artificial Intelligence (AI), Autonomous Drive, and Amusement. The development of related software applications will be a decisive factor for automakers in this electric vehicle revolution." 

 

Final Countdown for Exhibition and Forum Registration. For more details, please visit the official website: Link 

 

About SEMI 

Founded in 1970, SEMI operates 10 major offices globally and established the SEMI Taiwan in 1996. It connects over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. Since its inception, SEMI Taiwan has annually hosted SEMICON® Taiwan, international summits, and various major technical forums, enhancing Taiwan's international influence and competitiveness. SEMI upholds the principles of objectivity and neutrality, acting as a semiconductor industry think tank for Taiwanese member companies. It fosters deep global exchanges among industry, government, academia, and research sectors, promoting Taiwan's semiconductor industry to align with global standards, and establishing a two-way communication platform. 

 

SEMI Taiwan currently hosts 18 technical committees to drive industry growth and innovation in design, devices, equipment, materials, services, and software. It provides comprehensive market intelligence, standardization, policy advocacy, talent cultivation, sustainability development, supply chain management, and program assistance to empower members in facing industry challenges. For more information, visit www.semi.org or join SEMI Facebook and SEMI LinkedIn. 

 

Media Contacts 

SEMI 

Elma Fang 

03-560-1777 #211 

GOLIN 

Roselie Chen 

0984-349-379 

GOLIN 

Alice Lin 

0919-552-589 

 

Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing.

Taipei, Taiwan – August 28, 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, shares its expertise on the impact materials have on sustainable lithography processes. Additionally, Brewer Science presents the role innovative materials have in the critical advanced packaging markets, including artificial intelligence (AI) and high-performance computing. Brewer Science’s presentations and exhibition will be at SEMICON Taiwan, from September 4th – 6th, 2024.
Material Efforts Towards Sustainable Processes

Dr. Douglas Guerrero, Brewer Science’s Senior Technologist, presents “Material Efforts Towards Sustainable Processes” addressing the industry’s most critical questions when it comes to balancing technology innovation with environmental stewardship, including:

- How can the semiconductor industry enhance sustainability while meeting growing consumer demands for eco-friendly practices?
- What innovative solutions are available to reduce energy consumption in EUV lithography processes?
- Can transitioning from thermal baking to UV curing improve both energy efficiency and lithographic performance?
- What are the benefits of optical crosslinking in semiconductor manufacturing, and how does it optimize material design, process efficiency, and tool throughput?

With 30 years of R&D experience in patterning materials and processes, over 20 patents, and 60 publications, Dr. Guerrero combines material expertise and industry leadership to present how sustainable processes can lead to energy savings, while improving tool throughput and maintaining lithographic performance. Attend Dr. Guerrero’s presentation on September 6 at 2:20pm in 401, 4F at SEMCION Taiwan, as part of the IC Forum – Advanced Chip Technology and Manufacturing.

The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance Computing

Mr. Alexander Smith, Brewer Science’s Executive Director of Semiconductor Materials Business Unit, presents “The Role of Cutting-edge Materials in Advanced Packaging in AI and High-Performance Computing”, providing an insightful review of the challenges and advancements in packaging materials enabling more efficient and cost-effective flows. Mr. Smith will highlight chemical properties and customizable structures that will offer the most innovative solutions to pressing industry challenges. Attend Mr. Smith’s presentation on September 6 at 12:00pm in 701GH, 7F at SEMCION Taiwan, a part of the Heterogeneous Integration Global Summit 2024 – Day 3.

Explore New Innovations in Advanced Packaging at Booth I2116

Throughout the events, Brewer Science’s experts will be stationed at booth I2116 in the SEMICON Taiwan Exhibit Hall and available for discussions on how Brewer Science’s materials assist with advanced-node patterning and wafer thinning. A list of Brewer Science’s PFAS-Free Materials is also available.
- Wednesday, September 4 : 10:00am–5:00pm
- Thursday, September 5 : 10:00am–5:00pm
- Friday, September 6 : 10:00am–4:00pm

For those unable to attend, Brewer Science extends an open invitation to explore its Packaging Solutions and Advanced Lithography webpages. You can also request datasheets or schedule expert-led consultations on Brewer Science’s website. www.brewerscience.com.

About Brewer Science

Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at www.brewerscience.com.

Tech Giants Share the Stage. Witnessing the Pinnacle of AI and Semiconductor Innovation 

 

(August 29, 2024 – Hsinchu) Under the influence of Artificial Intelligence (AI) and High-Performance Computing (HPC), the global semiconductor market is gradually returning to a growth trajectory. SEMICON Taiwan 2024, the world's most influential international semiconductor event, has chosen "Empowering AI with Semiconductors" as its theme this year, igniting excitement. Today, it was officially announced that for the first time ever, the highly anticipated CEO Summit will feature a historic fireside chat focusing on innovation and the future of the semiconductor industry in the AI era. This fireside chat will bring together TSMC, ASE, Samsung Electronics, and Google to establish a new competitive landscape for the global semiconductor industry, which is on the verge of reaching a trillion-dollar milestone.  

 

In a first for the event, the "CEO Summit," scheduled for September 4th, will feature the " AI Chip Fireside Chat." This discussion, titled "Long-term Opportunity and Synergy for AI," will be moderated by Dr. Tien Wu, CEO, ASE, and will include Dr. Y.J. Mii, Executive Vice President and COO at TSMC; Dr. Jung-Bae Lee, Corporate President/Head of Memory Business, Samsung Electronics Co., Ltd; and Mr. Hamidou Dia, Vice President, Generative AI Solution Architecture, Google. A highlight of the forum is the highly anticipated appearance of a speaker from Samsung Electronics, marking their first-ever talk in Taiwan. In addition to presenting Samsung Electronics’ latest technologies at the CEO Summit, he will also join the AI Chip Fireside Chat to have a face-to-face discussion with TSMC. This news has sent shockwaves through the industry, promising an unforgettable and historic moment.  

 

The AI Chip Fireside Chat will cover three critical topics: "Technology, Cross-Industry Collaboration, and Future Industry Dynamics" in the realm of semiconductors and AI. Discussions will include how semiconductors are driving global economic growth through AI; the technical challenges and opportunities in chips, algorithms, memory, software, bandwidth, power consumption, and system integration; and how different industries can accelerate cross-sector collaboration within the semiconductor ecosystem to create new competitive relationships in the face of boundless AI development. These discussions will be key to driving industry applications and unlocking AI's potential.  

 

The "CEO Summit" is set to launch on the opening day of the event, September 4th. It will focus on four key areas: manufacturing, packaging and testing, memory, and chip design. The event will feature nine global leaders from TSMC, ASE Group, Applied Materials, Google, Samsung Electronics, SK hynix, Microsoft, imec, and Marvell. Together, they will delve into how semiconductors are positioned as the driving force behind global technological innovation amidst the AI revolution. 

 

Breaking Boundaries in Semiconductors: Expanding Global Impact with a Focus on Taiwan 

SEMICON Taiwan 2024 will gather over 85,000 industry professionals from around the world. As AI continues to gain momentum, reinforcing the semiconductor supply chain to support AI development has become crucial, prompting international giants to increasingly focus on Taiwan. Taiwan is the core of the global semiconductor industry, leading in IC design, software development, semiconductor manufacturing, and hardware-software integration. SEMICON Taiwan has consistently focused on high-value semiconductor technologies, extending into related fields such as memory, software, machinery, and electronics. The themes of recent exhibitions have become increasingly diverse, covering critical areas such as semiconductor manufacturing, packaging and testing, AI, and applications. The four-day forum will feature over 200 global semiconductor industry leaders. As one of the world's premier tech events, this gathering will connect experts across various fields to deeply explore how semiconductors serve as the driving force behind global technological innovation in the era of AI.  

 

Last Call for Exhibition and Forum Registration. For more information, please visit the official website.  

 

About SEMI 

Founded in 1970, SEMI operates 10 major offices globally and established the SEMI Taiwan in 1996. It connects over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. Since its inception, SEMI Taiwan has annually hosted SEMICON® Taiwan, international summits, and various major technical forums, enhancing Taiwan's international influence and competitiveness. SEMI upholds the principles of objectivity and neutrality, acting as a semiconductor industry think tank for Taiwanese member companies. It fosters deep global exchanges among industry, government, academia, and research sectors, promoting Taiwan's semiconductor industry to align with global standards, and establishing a two-way communication platform.  

 

SEMI Taiwan currently hosts 18 technical committees to drive industry growth and innovation in design, devices, equipment, materials, services, and software. It provides comprehensive market intelligence, standardization, policy advocacy, talent cultivation, sustainability development, supply chain management, and program assistance to empower members in facing industry challenges. For more information, visit www.semi.org or join SEMI Facebook and SEMI LinkedIn.  

 

Media Contacts 

SEMI  

Elma Fang  

03-560-1777 #211  

GOLIN  

Roselie Chen  

0984-349-379  

GOLIN  

Alice Lin  

0919-552-589  

科技巨擘風雲聚首,見證 AI 與半導體的巔峰時刻 

 

2024 8 29 日 – 新竹訊】在人工智慧 (AI) 與高效能運算 (HPC) 的帶動下,全球半導體市場逐步恢復成長趨勢。全球最具影響力的國際半導體盛會 — SEMICON Taiwan 2024 國際半導體展在今 (29) 日正式宣布在備受矚目的大師論壇中,首度增加「AI 晶片世紀對談 AI Chip Fireside Chat」的環節,為整場論壇拉開精彩序幕。「AI 晶片世紀對談 AI Chip Fireside Chat」將聚焦討論半導體產業在 AI 時代下的創新與未來,並邀請到台積電、日月光、Samsung ElectronicsGoogle 同台,為即將邁向破兆美元的全球半導體產業奠定全新賽局。 

 

而每年各界引頸期盼的大師論壇預計將於開展首日94日盛大登場,演講主題涵蓋製造、封測、記憶體與晶片設計四大關鍵領域,共計邀請9位天王級貴賓,來自台積電、日月光、Applied MaterialsGoogleSamsung ElectronicsSK hynixMicrosoftimecMarvell的企業領袖同台開講,創新交鋒突破摩爾定律極限,深度探討在 AI 潮流下半導體如何作為驅動全球技術創新的核心力量。 

 

不同於往年,將於94日登場的大師論壇首度安排「AI 晶片世紀對談 AI Chip Fireside Chat」環節。「AI 晶片世紀對談 AI Chip Fireside Chat」以「Long-term Opportunity and Synergy for AI」為題,不僅邀請到日月光執行長吳田玉博士作為主持,更與台積電執行副總經理暨營運長米玉傑博士、Samsung Electronics 記憶體業務總裁 Jung-Bae Lee 博士以及 Google生成式AI解決方案架構副總裁 Hamidou Dia 等四大半導體巨擘展開對談。半導體四大天王在「大師論壇」首度面對面同台,消息一出震撼業界,世紀畫面精彩可期。 

 

本次AI 晶片世紀對談 AI Chip Fireside Chat中將涵蓋半導體與 AI 的技術、跨界、未來格局三大重要議題。除了探討半導體對於 AI 如何促動全球經濟;AI在晶片、演算法、記憶體、軟體、頻寬、功耗與系統整合等技術與挑戰;此外,在面對全球 AI 無極限的發展下,不同產業間如何加速半導體生態系的跨界合作與建立新競合關係,都將成為未來主導產業應用與激發 AI 潛在可能的關鍵。 

 
半導體突破極限,擴大發揮影響力,全球聚焦台灣 

SEMICON Taiwan 2024 國際半導體展今年將匯聚全球超過 85,000 產業人士集結台灣,而隨著 AI 持續發酵,持續鞏固半導體供應鏈以奠定 AI 發展強力後盾,更是促使近年國際大廠積極來台關鍵。台灣是全球半導體產業的中心,從 IC 設計、軟體開發到半導體製造及軟硬體整合,都是全球領先。SEMICON Taiwan 始終以高含金量的半導體技術為展覽核心,持續外溢到相關記憶體、軟體、機械、電子等產業,而近年的展出主題也越趨多元,涵蓋半導體製造、封測、AI、應用等關鍵領域,在四天論壇中更吸引超過 200 位全球半導體產業巨擘同台開講,作為世界頂級科技盛會之一,串聯各界深度探討在 AI 潮流下半導體如何作為驅動全球技術創新的核心力量。 

 

展會及論壇報名最後倒數,詳情請參考官方網站:連結 

 

關於 SEMI 國際半導體產業協會 

成立於 1970 年,SEMI 於全球設有 10 大營運據點,並於 1996 年正式成立 SEMI 國際半導體產業協會台灣分會,致力協助連結全球半導體和電子設計及製造供應鏈 3,000 多家會員企業,以及 150 萬名專業人士。自同年起固定舉辦年度 SEMICON® Taiwan 國際半導體展、國際高峰會與各項大型技術論壇,持續推升台灣之國際影響力及競爭力。SEMI 國際半導體產業協會始終秉持客觀中立原則,為台灣企業會員提供半導體產業智庫角色,促進國際間產、官、學、研各界深度交流,推動台灣半導體產業與全球接軌,搭建雙向溝通對話機制。 

SEMI 國際半導體產業協會目前在台灣成立十八大技術委員會,以持續推動設計、裝置、設備、材料、服務和軟體方面的產業成長和技術創新為目標,並竭力提供企業會員完整的市場產業情報、標準制定、政策倡議、人才培育、永續發展、供應鏈管理和各式計劃協助,助力會員應對產業挑戰。更多資訊歡迎瀏覽 www.semi.org,或加入 SEMI Facebook 粉絲團SEMI LinkedIn 

 

新聞聯絡人 

SEMI 國際半導體產業協會 

高誠公關 

Elma Fang 

Roselie Chen 

Alice Lin 

03-560-1777 #211 

0984-349-379 

0919-552-589 

台積電、日月光、聯發科、NVIDIA 等大廠攜手助推半導體邁向破兆美元 

 

2024828日 – 新竹訊】全球半導體產業顯著增長,SEMI預測至2030年底市場規模將達1兆美元,其中尤以半導體驅動人工智慧(AI)驅動領域更受其影響深遠。今年SEMICON Taiwan 2024 國際半導體展也呼應AI趨勢,以「Breaking Limits : Powering the AI Era. 賦能AI無極限」為主題,開幕進入倒數階段,將於94日正式開幕,今年展覽更擴大規模,不僅首次以雙主場形式展出,也首次推出「AI 半導體技術概念區」、「AI 互動體驗區以及多場國際級論壇展示最新AI技術。 

 

全新「AI 半導體技術概念區」首度登場,日月光與NVIDIA等大廠參展大秀AI實力 

SEMICON Taiwan 2024AI半導體技術概念區」首次亮相,集結日月光、益華電腦、異質整合系統級封裝聯盟、NVIDIASamsung Electronics及臻鼎科技集團等關鍵廠商,從AI晶片製造、設計、專用硬體及整合服務等面向展示最新研發技術與產品。此區亦邀請來自研華科技、日月光、AWS、台達電子、異質整合系統級封裝聯盟及NVIDIA等企業專家進行演說,深入探討生成式AI、邊緣AI解決方案,以及AI如何驅動雲服務及IC載板等領域的應用,開放觀展者隨時加入並與專家進行互動。此外,SEMICON Taiwan 2024還首度規劃「AI 互動體驗區」,利用生成式AI技術邀請觀展者回顧電晶體發明歷史,見證半導體技術的演進,探索AI時代的無限可能。 

 

業界大咖AI技術全面解析 SEMICON Taiwan多場論壇探索新趨勢 

2024SEMICON Taiwan盛會中,一系列國際論壇百花齊放,探討半導體如何賦能AI,使其在MEMS、矽光子、先進封裝、晶片設計和智慧製造等領域中的最新應用與突破。搶先在93日開跑的微機電暨感測器論壇將由MicrosoftLam ResearchNXPSTM等企業產業專家探討AIMEMS與感測器領域的最新應用與發展趨勢;同日舉辦首度推出的矽光子國際論壇將涵蓋矽光子技術在AI驅動的資料中心與雲端運算中的發展潛力等議題,來自台積電、日月光、Broadcom、聯發科技與Yole Group的技術專家將分享見解。94日的3D IC/ CoWoS 驅動AI晶片創新論壇則邀請到包含台積電和日月光的專家探討先進封裝技術對AI晶片的重要性。95日的先進測試論壇將有來自台積電、IntelQualcomm的專家探討AI在晶片設計、製造以及應用中的創新,包含「用AI測試AI晶片」的發展性;同日的高科技智慧製造論壇則將圍繞「Generative AI Transforming Semiconductor Manufacturing」,AWS、美光科技和NVIDIA的專家將探討AI如何革新製造業,提高生產效率、自動化和品質管理。 

 

為了迎接車電市場新賽局,今年亦特別設立全新「智慧移動創新概念區」,該展區將聚焦在逐漸轉向以軟體為核心的SDV,並預計帶來多場專家開講活動,吸引福特六和汽車(Ford)、台灣森那美起亞(Kia)等大廠參與。 

 

福特六和汽車總經理陳文芳表示:「面對未來充滿挑戰的市場前景,福特六和仍會秉持對台灣市場的承諾,持續於主力級距落實Ford全球戰略車款在地生產不中斷,持續導入豐富多元的產品陣容與新能源車款滿足消費者。」 

 

台灣森那美起亞李昌益總裁表示:「在未來35年內,電動車發展將歷經重大革命,從3電:電池、電機、電控,轉移至3A:人工智慧(AI)、自動駕駛(Autonomous Drive)和娛樂體驗(Amusement)。這轉變的過程中,如何發展相關的軟體應用,則將是各大車廠在面對電動變革的決勝關鍵。 

 

展會及論壇報名最後倒數,詳情請參考官方網站:連結 

 

關於SEMI國際半導體產業協會 

成立於1970年,SEMI於全球設有10大營運據點,並於1996年正式成立SEMI國際半導體產業協會台灣分會,致力協助連結全球半導體和電子設計及製造供應鏈3,000多家會員企業,以及150萬名專業人士。自同年起固定舉辦年度SEMICON® Taiwan國際半導體展、國際高峰會與各項大型技術論壇,持續推升台灣之國際影響力及競爭力。SEMI國際半導體產業協會始終秉持客觀中立原則,為台灣企業會員提供半導體產業智庫角色,促進國際間產、官、學、研各界深度交流,推動台灣半導體產業與全球接軌,搭建雙向溝通對話機制。 

SEMI國際半導體產業協會目前在台灣成立十八大技術委員會,以持續推動設計、裝置、設備、材料、服務和軟體方面的產業成長和技術創新為目標,並竭力提供企業會員完整的市場產業情報、標準制定、政策倡議、人才培育、永續發展、供應鏈管理和各式計劃協助,助力會員應對產業挑戰。更多資訊歡迎瀏覽www.semi.org,或加入SEMI Facebook粉絲團SEMI LinkedIn 

 

新聞聯絡人 

 

SEMI 國際半導體產業協會 

高誠公關 

Elma Fang 

Roselie Chen 

Alice Lin 

03-560-1777 #211 

0984-349-379 

0919-552-589 

 

TSMC, ASE, Applied Materials, Google, Samsung Electronics, SK hynix, Microsoft, imec, and Marvell Collaborate to Push the Limits of Moore's Law 

 

(August 22, 2024 – Hsinchu) The countdown has begun for SEMICON Taiwan 2024, the world's most influential international event for the semiconductor industry, set to take place from September 4-6 at the TaiNEX 1&2, over 200 global high-tech and semiconductor industry leaders are expected to attend. This year's SEMICON Taiwan will feature the strongest industry lineup to date, showcasing the complete supply chain process and drawing global attention to Taiwan once again for its pivotal role in the semiconductor industry. 

 

CEO Summit Highlights: TSMC, ASE, and Applied Materials focus on AI, shaping the future of semiconductors 

This year's SEMICON Taiwan 2024 CEO Summit will be themed "Breaking the Limits, Powering Infinite Possibilities," bringing together nine industry giants, including TSMC, ASE, Applied Materials, Google, Samsung Electronics, SK hynix, Microsoft, imec, and Marvell. Many of these masters are participating in the event in Taiwan for the first time, setting a record for the event. The keynote topics will cover four key areas: manufacturing, packaging and testing, memory, and chip design, with in-depth discussions on how semiconductors drive global technological innovation in the AI era. Mastering advanced semiconductor technologies and capacities will be crucial for AI chips and will be the core advantage for the next decade's development. 

 

High-Demand for Advanced Memory: Samsung Electronics and SK hynix Face Off 

The demand for generative AI has surged, leading to a shortage of high-bandwidth memory (HBM) and other advanced memory products. The global memory leader, Samsung Electronics, and the top HBM producer, SK hynix, are both set to present at the upcoming CEO Summit on the critical trends of advanced memory in the AI era, likely sparking a new wave of technological innovation. 

 

The convergence of software and hardware is unstoppable: Microsoft and Google are actively positioning themselves in the new AI competition 

Notably, as AI and semiconductor chip technologies become increasingly integrated, industries related to memory and software are making strong advances in the semiconductor field. For instance, software and hardware giants Microsoft and Google will appear at this year's CEO Summit, highlighting the irreversible trend of crossing over into the hardware industry. The enormous demand for chips in AI data centers has also drawn key players from the equipment and ASIC sectors, like Applied Materials and Marvell, along with imec, Europe’s leading semiconductor research institute, to the event. The gathering of these cross-industry giants signifies a shift in industry focus from traditional semiconductor hardware manufacturers to more diverse and highly integrated discussions, further enhancing the overall influence of Taiwan's semiconductor industry and SEMICON Taiwan. 

 

Registration for SEMICON Taiwan 2024 and forums is now open for free. Register for the international forums for a super early-bird discount of 20%. For more information, please visit the official website. 

 

About SEMI 

Founded in 1970, SEMI operates 10 major offices globally and established the SEMI Taiwan in 1996. It connects over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. Since its inception, SEMI Taiwan has annually hosted SEMICON® Taiwan, international summits, and various major technical forums, enhancing Taiwan's international influence and competitiveness. SEMI upholds the principles of objectivity and neutrality, acting as a semiconductor industry think tank for Taiwanese member companies. It fosters deep global exchanges among industry, government, academia, and research sectors, promoting Taiwan's semiconductor industry to align with global standards, and establishing a two-way communication platform. 

 

SEMI Taiwan currently hosts 18 technical committees to drive industry growth and innovation in design, devices, equipment, materials, services, and software. It provides comprehensive market intelligence, standardization, policy advocacy, talent cultivation, sustainability development, supply chain management, and program assistance to empower members in facing industry challenges. For more information, visit www.semi.org or join SEMI Facebook and SEMI LinkedIn. 

 

Media Contacts 

SEMI 

Elma Fang 

03-560-1777 #211 

GOLIN 

Roselie Chen 

0984-349-379 

GOLIN 

Alice Lin 

0919-552-589 

 

2024 8 22 日–新竹訊】全球最具影響力的國際半導體盛會——SEMICON Taiwan 2024 國際半導體展開展倒數計時,將於 9 4 日至 6 日南港展覽館一、二館登場。預計將有超過 200 位來自全球高科技與半導體領域的產業領袖與會,此次 SEMICON Taiwan 匯聚歷來最強產業陣容,透過揭示完整的供應鏈進程,全球目光將因半導體再次聚焦台灣。 

 

大師論壇年度鉅獻:台積電、日月光、Applied Materials 等重量級嘉賓聚焦AI,共譜半導體未來 

本屆 SEMICON Taiwan 2024 大師論壇將以「Breaking the Limits, Powering Infinite Possibilities」為主題匯聚九位產業巨擘:台積電、日月光、Applied MaterialsGoogleSamsung ElectronicsSK hynixMicrosoft、imec、Marvell,其中多位大師為首次來台參與大師論壇,創下歷年之最。演講主題涵蓋製造、封測、記憶體與晶片設計四大關鍵領域,深入探討在 AI 潮流下,半導體如何作為驅動全球技術創新的核心力量。而掌握半導體先進技術與產能,將是實現此波 AI 晶片加速運算的關鍵與下一個十年發展的核心優勢。 

 

高階記憶體供不應求:Samsung Electronics SK hynix 同場切磋 

生成式 AI 需求爆發,高頻寬記憶體(HBM)等高階記憶體產品供不應求。全球記憶體龍頭—Samsung Electronics HBM一哥—SK hynix 今年也將於大師論壇同場發表 AI 時代下高階記憶體的關鍵走向,預計將帶動一場技術革命的新高潮。 

 

軟硬跨界勢不可擋:MicrosoftGoogle 積極佈局 AI 新競合 

值得關注的是,隨著 AI 與半導體晶片技術的高度整合,記憶體與軟體等相關產業正強勢進軍半導體領域,例如:軟硬體巨頭 Microsoft Google 今年也將在在大師論壇上同場亮相,展現出跨界進軍硬體產業的不可逆趨勢;此外,AI 資料中心對晶片的龐大需求,已引領 Applied MaterialsMarvell 等設備與ASIC 領域的代表性企業,以及歐洲最強大半導體研究前瞻機構—imec 現身大師論壇。跨界巨頭齊聚對談,顯示產業焦點已從傳統半導體硬體大廠,轉向更具多元性和高度整合性的論述,進一步提升台灣半導體及 SEMICON Taiwan 的全面影響力。 

 

展會及論壇即日起開放免費觀展報名、國際論壇早鳥報名可享8折優惠,詳情請參考官方網站:連結 

關於 SEMI 國際半導體產業協會 

成立於 1970 年,SEMI 於全球設有 10 大營運據點,並於 1996 年正式成立 SEMI 國際半導體產業協會台灣分會,致力協助連結全球半導體和電子設計及製造供應鏈 3,000 多家會員企業,以及 150 萬名專業人士。自同年起固定舉辦年度 SEMICON® Taiwan 國際半導體展、國際高峰會與各項大型技術論壇,持續推升台灣之國際影響力及競爭力。SEMI 國際半導體產業協會始終秉持客觀中立原則,為台灣企業會員提供半導體產業智庫角色,促進國際間產、官、學、研各界深度交流,推動台灣半導體產業與全球接軌,搭建雙向溝通對話機制。 

SEMI 國際半導體產業協會目前在台灣成立十八大技術委員會,以持續推動設計、裝置、設備、材料、服務和軟體方面的產業成長和技術創新為目標,並竭力提供企業會員完整的市場產業情報、標準制定、政策倡議、人才培育、永續發展、供應鏈管理和各式計劃協助,助力會員應對產業挑戰。更多資訊歡迎瀏覽 www.semi.org,或加入 SEMI Facebook 粉絲團SEMI LinkedIn 

 

新聞聯絡人 

SEMI 國際半導體產業協會 

高誠公關 

Elma Fang 

Roselie Chen 

Alice Lin 

03-560-1777 #211 

0984-349-379 

0919-552-589