Showing 169-180 of 447
Member Press Release
Syensqo expands its bio-based portfolio with a new MTM® epoxy prepreg
A composite material choice that responds to sustainability goals in automotive
Brussels, February 27, 2024 - Syensqo, previously part of Solvay Group, has developed a new version of its flagship...
Member Press Release
Syensqo launches new Swyft-Ply™ brand of composites for electronic and smart devices
Multifunctional materials leveraging traditional benefits of composites while meeting unique manufacturing and performance requirements
Brussels, February 22, 2024 - Syensqo, previously part of...
Member Press Release
Syensqo invests in Bioeutectics, a start-up producing green solvents
The investment, made through Syensqo’s venture capital fund, will contribute to bring more sustainable products and processes to market
Brussels, January 23, 2024 - Syensqo Ventures, the group’s...
Member Press Release
Syensqo Paris site receives Trusted Information Security Assessment Exchange (TISAX®) certification
Syensqo R&I site recognized as a safe and trusted partner for the automotive value chain
Brussels, 9 January, 2024 - 9:00 CET/CEST - Syensqo’s research and innovation site in Paris...
SEMI Press Release
SEMICON Europa 2024 to Spotlight Innovation and Collaboration Powering Sustainable Growth
MUNICH, Germany ─ August 19, 2024 ─ Themed Innovation and Collaboration: Powering Sustainable Exponential Growth, SEMICON Europa 2024 will gather industry experts November 12-15 at Messe München in...
SEMI Press Release
SEMI EuroPAT Workshop to Highlight the Future of Semiconductor Packaging Manufacturing in Europe
BERLIN, Germany — August 6, 2024 —The EuroPAT Workshop, an annual event of the SEMI Integrated Packaging Assembly & Testing European Chapter Technology Community (ESiPAT-TC), taking place from...
Member Press Release
3D-Micromac Receives Laser-Trimming-System Order from Infineon for New Dresden Smart Power Fab
Laser micromachining expert exclusively supplies Infineon Dresden with the microVEGA FC laser-trimming systemHIGHLIGHTS3D-Micromac AG equips Infineon Technologies Dresden GmbH & Co. KG with...
SEMI Press Release
MEMS & Imaging Sensors Summit to Spotlight Sensor Revolution for a Connected Future
Munich, Germany – July 15, 2024 – Industry experts will gather November 14 at the SEMI MEMS & Imaging Sensors Summit to explore the latest MEMS and sensors...
Blog
SEMI Europe and ESIA Drive Positive Outcomes Through PFAS Advocacy
Per- and polyfluoroalkyl substances (PFAS) are a large class of thousands of synthetic chemicals that are used throughout the semiconductor industry in the form of gases, liquids, and solid...
Member Press Release
Scrona AG Introduces Digital GEN3 Printhead Platform to Kickstart Industrialization of its High-Resolution Printing Technology
Zurich, Switzerland, July 9, 2024 – Scrona AG, a startup specializing in additive microfabrication and holder of the world record for the smallest printed color picture, unveiled today the next...
Member Press Release
Breker Verification Systems Readies RISC-V CoreAssurance and SoCReady SystemVIP for Automated, Certification-level RISC-V Verification Coverage
Breker Verification Systems, whose product portfolio solves challenges across the functional and system verification process for large, complex semiconductors, today unwrapped its RISC-V...
Member Press Release
Axiomise Heads to RISC-V Summit Europe June 25-27 in Munich
LONDON –– June 13, 2024 –– Axiomise, a company noted for enabling formal verification adoption, is headed to the RISC-V Summit Europe to demonstrate formalISA, its automated formal RISC-V app, and...