Showing 145-156 of 444
Event Presentation
CxO Summit
Welcome Remarks, Laith Altimime, President, SEMI EuropeOpening Remarks, Ajit Manocha, President and CEO, SEMIThe Chips Act and Europe’s Path to a Stronger, Resilient Semiconductor EcosystemGustav...
Event Presentation
SEMICON EUROPA 2024 - PROCEEDINGS
Tuesday, November 12:CxO SummitEU Digital ForumChips, Checks and Balances: The Geopolitics of SemiconductorsEuropean Projects for a Diverse Talent PipelineITF Chip into the FutureEnd-to-End...
Member Press Release
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
MRSI Mycronic a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation high...
Member Press Release
Materials for Hybrid Bonding Presented by Brewer Science at IMAPS 2024
Boston, MA – September 24, 2024 – Brewer Science, Inc., a pioneer in temporary bonding and materials for the semiconductor industry, is presenting Materials for Hybrid Bonding at IMAPS Symposium...
Blog
From Intern to Innovator: How Kai Hahn is Shaping the Future of Semiconductors
The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20...
Member Press Release
Syensqo to debut at Semicon Taiwan 2024
Showcasing advanced material solutions for all semiconductor needs
Brussels, September 4, 2024 - Syensqo, previously part of Solvay Group, will debut at Semicon Taiwan 2024 in Taipei with the...
Blog
Cultivating a Thriving Silicon Carbide Market: Insights from Entegris
Silicon carbide (SiC), with its wide band gap and high thermal conductivity, is increasingly favored for semiconductor power applications across several fast-growing industries. Its ability to...
Member Press Release
Heidelberg Instruments Reports Several Installations of its ULTRA Semiconductor Mask Writer as Global Semiconductor Demand Surges
Heidelberg, Germany— Heidelberg Instruments, a world-leading provider of advanced laser lithography systems, is pleased to announce a continued stream of orders for the ULTRA Semiconductor Mask...
Member Press Release
Axiomise Showcases Value of Formal Verification at DVCon Japan and DVCon India
Axiomise launches Essential Introduction to Practical Formal Verification Training
• Self-Paced, On-Demand Training Program Includes Hands-On Best Practices for Practical Formal...
SEMI Press Release
MEMS & Imaging Sensors Summit to Highlight Innovations Driving the Next Generation of Connectivity
Munich, Germany – September 11, 2024 –The SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the world’s leading minds in sensor...
Member Press Release
ERS electronic Appoints Global Marketing Services, India as New Channel Partner
ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is expanding its global network of distributors by appointing Global Marketing Services (GMS),...
Member Press Release
Syensqo introduces more sustainable polymers on the new Trek Madone road bike
Syensqo’s novel sustainable solutions provide a lower carbon footprint for parts on Trek’s new Madone Gen 8 introduced at the 2024 Tour de France
Alpharetta, July 30, 2024 - Syensqo, a global leader...