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SEMI Press Release

SEMI Launches Leadership Accelerator to Cultivate Future-Ready Microelectronics Industry Leaders

BERLIN, Germany — December 6, 2023 — SEMI today announced the SEMI Leadership Accelerator to foster industry growth by assisting organizations in cultivating the next...
December 6, 2023
SEMI Press Release

SEMICON Europa 2023 Opens Tomorrow to Showcase Sustainability Innovation and Talent Strategies Shaping a $1 Trillion Era

MUNICH, Germany ─ November 13, 2023 ─ SEMICON Europa 2023 opens tomorrow with industry experts from across the electronics design and manufacturing supply chain gathering to...
November 13, 2023
Blog

Adopting Atomic Layer Deposition – Insights from Beneq, imec and Yole Intelligence

Atomic Layer Deposition (ALD) enables the scaling of logic and memory semiconductor devices and is currently experiencing rapid adoption in specialty device fabrication, such as for wide-bandgap...
By Serena Brischetto
November 2, 2023
Blog

Building the Pipeline – KLA’s Quest to Attract Top Talent

In this interview, we delve into the strategies and initiatives of a forward-thinking company committed to building a robust talent pipeline and enhancing the diversity of its workforce. In today’s...
By Cassandra Melvin
November 2, 2023
Event Presentation

Innovation Showcase

Increased Use of Chemical Process Control Taking as a Path to Increased Sustainability, Irene Popova, Nova Ltd Study of Diamond Coated Wire (DCW) Slicing Technique Process Parameters Impacting High...
October 25, 2023
Event Presentation

Film Premiere: Chip in

Demystifying Microelectronics: Innovative Strategies for Attracting New Talent, Michelle Williams-Vaden, Deputy Director, SEMI Foundation Chip in, A documentary film produced by Roadtrip Nation,...
October 25, 2023
Event Presentation

SOI for Automotive

SOI for HV and Power Management Applications, Piet Wessels, Fellow and senior director HV technologies, nxp semiconductors FD-SOI Technology scaling down to 10nm., Olivier Faynot, Executive VP and...
October 25, 2023
Event Presentation

Materials Innovation

Electronic Packaging Materials for SiC Power Modules, Michael Jörger, Head of Business Line Power Electronic Materials, Heraeus Electronics Designing Atomic Level Process Chemistries. The Role of...
October 25, 2023
Event Presentation

SEMI Industry Headwinds: European PFAS Restriction Proposal

Opening remarks by Session Chair, James Amano, Senior Director, EHS, SEMI Exemptions from the PFAS Restriction Proposal for Critical Sectors, Angelika Niebler, Member of the European...
October 25, 2023
Event Presentation

Fireside chat with Wolfspeed CFO, Neill Reynolds

Conversation with Neill Reynolds, Chief Financial Officer, Wolfspeed, Inc.
October 25, 2023
Event Presentation

EU Digital Future Forum

HiCONNECTS – An Introduction by NXP, Andrea Sanfilippo, Senior Manager Public Funding, NXP Semiconductors Germany GmbH HiCONNECTS - Photonics Heterogeneous Integration Pilot Line, Dimitrios Velenis,...
October 25, 2023
Event Presentation

Connecting Automotive To SiC Manufacturing

SiC: Paving the way for Sustainable Mobility, Marius Ruhnau, Manager, Porsche Consulting S.A.S. Disruptive System Design within the SiC Value Chain, André Blum, Project Manager, Progressive...
October 25, 2023