BERLIN, Germany — August 6, 2024 —The EuroPAT Workshop, an annual event of the SEMI Integrated Packaging Assembly & Testing European Chapter Technology Community (ESiPAT-TC), taking place from 9-10 September, 2024 in Berlin, will feature manufacturing and supply chain trends for semiconductor packaging, assembly, and test in Europe. Themed Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing? , the third edition of the workshop will showcase collaboration among Outsourced Semiconductor Assembly and Test (OSAT) providers and Semiconductor Packaging, Assembly, and Test Service Providers (SPAT-SPs) that is instrumental for the resilience of Europe’s microelectronics industry. Registration is open.
As the complexity of semiconductor technologies increases, collaborative Chip-Package-Board-System co-design is becoming a focal point for Integrated Device Manufacturers (IDMs) and Original Equipment Manufacturers (OEMs). Workshop attendees will deep dive into this complex framework and explore the future of electronics packaging, assembly, and test. Additionally, the workshop will disseminate results of the Pack4EU, a European funded project assessing the current status and evolving needs of packaging, assembly, and test in Europe.
"SEMI Europe looks forward to welcoming leading packaging, assembly and test experts to the EuroPAT Workshop in Berlin," said Laith Altimime, President of SEMI Europe. “The exceptional lineup of speakers will offer insights into vital trends for semiconductor packaging manufacturing.”
This year’s EuroPAT Workshop will be hosted by Swissbit Germany AG on day one and the Mercure Hotel MOA on day two. The workshop will present a broad scope of topics including:
- Packaging, assembly and test manufacturing in Europe
- The role of European OSATs and SPAT-SPs
- Semiconductor packaging supply chain
- EU Chips Act updates for packaging
- Coordination and Support Action (CSA) and Pack4EU Chips Joint Undertaking (Chips JU) updates
- European markets and applications strengths and weaknesses
- Technology transfer from pilot lines in RTO and industrial pilot lines
- Collaboration in open advanced packaging piloting facilities
Global Industry Leaders to Attend
The EuroPAT Workshop participating companies include experts from global leaders:
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Networking
This year’s networking dinner cruise will be held on the Spree River on the first day of the summit at Restaurantschiff Capt’n Schillow .
Registration for the dinner cruise is reserved exclusively for workshop participants. Tickets may be purchased by completing the registration form.
Premium sponsors
- Platinum Sponsors: Swissbit
- Gold Sponsors: Koh Young Europe, MST Micro Systems Technologies
- Silver Sponsors: Colandis, Gebr. Schmid GmbH , Schott
- Bronze Sponsors: BESI, Cimetrix by PDF Solutions , Disco, EV Group , PacTech, Racyics
EuroPAT Workshop attendees are invited to participate at the upcoming SEMI 3D & Systems Summit on June 25-27 in Dresden and the Advanced Packaging Conference (APC) on November 13 at SEMICON Europa 2024 in Munich. To learn more about participation, sponsorship and exhibition opportunities, please contact [email protected].
For more details, please visit the EuroPAT Workshop website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#EuroPAT).
About SEMI
SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
Association Contacts
Sitong He / SEMI Europe
Phone: +49 151 5546 2638
Email: [email protected]
Samer Bahou/SEMI US
Phone: 1.408.943.7870
Email: [email protected]
